CN102143646A - Stiffening plate for printed circuit board - Google Patents
Stiffening plate for printed circuit board Download PDFInfo
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- CN102143646A CN102143646A CN2010101030612A CN201010103061A CN102143646A CN 102143646 A CN102143646 A CN 102143646A CN 2010101030612 A CN2010101030612 A CN 2010101030612A CN 201010103061 A CN201010103061 A CN 201010103061A CN 102143646 A CN102143646 A CN 102143646A
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- circuit board
- printed circuit
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Abstract
The invention discloses a stiffening plate for a printed circuit board, which consists of an ink layer, a polyimide compound membrane and an adhesive layer for sticking the polyimide compound membrane to the printed circuit board. A polyimide compound membrane fixing clamp is arranged between the ink layer and the adhesive layer. The polyimide compound membrane consists of a plurality of polyimide membranes and adhesion agent layers for sticking the adjacent polyimide membranes. The ink layer with specific thickness can lower the warping height of the compound membrane stuck to the circuit board, and contributes to protection of circuit patterns of electronic products. In addition, the ink layer of the stiffing plate comprises developers, wherein white developers can endow the compound membrane with good reflectivity and black developers can improve the shielding effect of circuit patterns, and the ink layer of the stiffing plate also comprises heat radiation powder bodies which can enhance heat radiation.
Description
Technical field
The present invention relates to a kind of stiffening plate that is used for printed circuit board (PCB), especially a kind ofly be difficult for warpage and have the stiffening plate that covers the circuit effect.
Background technology
The polyimide resin thermal stability is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As be used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for the electronics spare part further, for example the reinforcement purposes of printed circuit board (PCB).
Polyimide film has been widely used in electronic material, wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into the polyimides stiffening plate of individual layer slab or combined type, and the stiffening plate of combined type, the polyimides plate structure of being announced as TaiWan, China patent I257898, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, the problem that polyimide composite film meets with on using is to be subject to the thickness of polyimide film cost and composite membrane, can't cover the circuit layout pattern and is easy to be plagiarized by the same trade.In addition, composite membrane is by the combination of polyimide film and adhesion agent layer and get, but the composite membrane that its two thermal expansion coefficient difference often causes being used for reinforcement is pasting to flexible circuit board the phenomenon of generation warpage.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of stiffening plate that is used for printed circuit board (PCB), this stiffening plate has the advantage of covering the circuit effect and the reduction depth of camber being arranged.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of stiffening plate that is used for printed circuit board (PCB), by ink lay, polyimide composite film be used for the adhesion coating that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film is made of the bond adhesion agent layer of adjacent polyimide film of several layers polyimide film and being used to, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil, is preferably 1.5 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.Wherein, the ink lay of specific thicknesses can reduce composite membrane and paste depth of camber to the circuit board, helps the protective circuit pattern simultaneously.
Further technical scheme of the present invention is:
The thickness of described ink lay is 13～15 μ m.
The thickness of described adhesion coating is 10～40 μ m.
Described ink lay comprises epoxy resin and developer.
Described developer is a kind of in white developer and the black developer.
Described white developer is to comprise at least a in the Chinese white of titanium dioxide, by weight percentage, described white developer accounts for 60～95% of described epoxy resin solid content, and wherein white developer has excellent reflectivity with making composite membrane after epoxy resin mixes.
Described black developer is at least a in black pigment, carbon dust and the carbon nanotube, by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content, and preferably 4～8%, wherein black developer circuit pattern screening effect is better.
Described ink lay is made of epoxy resin, developer and heat radiation powder, can improve heat dispersion like this.
Described heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
The invention has the beneficial effects as follows: the ink lay that the present invention is used for the stiffening plate specific thicknesses of printed circuit board (PCB) can reduce composite membrane and paste depth of camber to the circuit board, helps the protective circuit pattern simultaneously.In addition, the ink lay of stiffening plate of the present invention can comprise developer, and white developer can make stiffening plate have excellent reflectivity, and the black developer can make the circuit pattern screening effect better, ink lay can also comprise the heat radiation powder simultaneously, can improve heat dispersion like this.
Description of drawings
Fig. 1 is the stiffening plate profile that is used for printed circuit board (PCB) of the present invention.
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those of ordinary skills can understand advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented by other different mode, promptly under not departing from the category that this creation disclosed, can carry out different modifications and change.
Embodiment: a kind of stiffening plate 1 that is used for printed circuit board (PCB), as shown in Figure 1, by ink lay 10, polyimide composite film be used for the adhesion coating 13 that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film by several layers polyimide film 11 and the adhesion agent layer 12 of the adjacent polyimide film that is used to bond constitute, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil, is preferably 1.5 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.During concrete enforcement, when Z is 3, then m be 2 and X be 1mil; When Z is 4, then m is 2 or 3; When Z is 5, then m is 2 or 3; When Z is 6, then m is 3 or 4; When Z is 7, then m is 3 or 4; When Z is 8, then m is selected from one of 3,4 and 5; When Z is 9, then m is 4 or 5.Wherein, the ink lay of specific thicknesses can reduce composite membrane and paste depth of camber to the circuit board, helps protecting the circuit pattern of consumption electronic products simultaneously.
The thickness of described ink lay is 13～15 μ m.
The thickness of described adhesion coating is 10～40 μ m.
Described ink lay comprises epoxy resin and developer.
Described developer is a kind of in white developer and the black developer.
Described white developer is to comprise at least a in the Chinese white of titanium dioxide, by weight percentage, described white developer accounts for 60～95% of described epoxy resin solid content, even if white developer content is up to 95% of resin solid content, but still can make ink lay be unlikely to come off 5～50 microns the time THICKNESS CONTROL of ink lay, wherein white developer with can make composite membrane have excellent reflectivity after epoxy resin mixes.
Described black developer is at least a in black pigment, carbon dust and the carbon nanotube, by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content, and preferably 4～8%, wherein black developer circuit pattern screening effect is better.
In this specification, the toner that pigment is contained dyestuff or is commonly called as, and pigment can be obtained by the organic or inorganic material.
Described ink lay is made of epoxy resin, developer and heat radiation powder, can improve heat dispersion like this.
Described heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
Described solid and sticky material typically use the epoxide resin type resin.
Described polyimide film and solid kind are also without particular limitation, are preferably not halogen-containing polyimide material of use and solid, and better being to use has from stickiness and not halogen-containing solid.
The stiffening plate that the present invention is used for printed circuit board (PCB) can make by following method: at first, at polyimide film surface coated one deck thermmohardening solid, after placing the baking oven heat drying, with hot roller and another polyimide film pressing, by that analogy, to the thickness of required polyimide composite film; Then, slaking 1 hour under 180 ℃ condition; At last, apply ink lay and adhesion coating at these polyimide composite film two lateral surfaces respectively, be formed for the stiffening plate sample of printed circuit board (PCB).
Prepare stiffening plate of the present invention according to the data in the following table 1, wherein, the composition of ink lay comprises epoxy resin, account for the epoxy resin mass percent is 6% carbon dust.Other prepares the reference examples sample, and the stiffening plate of this reference examples sample does not comprise ink lay, and all the other are the same with embodiment.The pure glue (trade name D3430) that the sticky material of the stiffening plate of embodiment and reference examples sample all is to use Sony Corporation to be produced.Then, stiffening plate is cut into the size of 25cm * 25cm, and on the 3-Layer double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1 μ m under 180 ℃ the condition, carry out slaking with 160 ℃ condition again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 1.
Table 1
Prepare stiffening plate of the present invention according to the data in the following table 2, wherein, the composition of ink lay comprises epoxy resin, account for the epoxy resin mass percent is 60% titanium dioxide powder.Other prepares the reference examples sample, and the stiffening plate of this reference examples sample does not comprise ink lay, and all the other are the same with embodiment.The pure glue (trade name D3430) that the sticky material of the stiffening plate of embodiment and reference examples sample all is to use Sony Corporation to be produced.Then, stiffening plate is cut into the size of 25cm * 25cm, and on the 3-Layer double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1 μ m under 180 ℃ the condition, carry out slaking with 160 ℃ condition again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 2.
Table 2
Shown in table 1 and table 2 result, under the identical condition of gross thickness, compared to the stiffening plate sample that does not paste ink lay, the depth of camber of stiffening plate of the present invention is less relatively, thereby has preferable flatness, and along with gross thickness increases, flatness is more obvious.
Above-mentioned specification and embodiment only are exemplary illustration principle of the present invention and effect thereof, are not to be limitation of the present invention.The scope that any creation that falls in the claim scope of the present invention all belongs to the present invention to be protected.
Claims (9)
1. stiffening plate that is used for printed circuit board (PCB), it is characterized in that: by ink lay, polyimide composite film be used for the adhesion coating that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film is made of the bond adhesion agent layer of adjacent polyimide film of several layers polyimide film and being used to, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.
2. the stiffening plate that is used for printed circuit board (PCB) according to claim 1 is characterized in that: the thickness of described ink lay is 13～15 μ m.
3. the stiffening plate that is used for printed circuit board (PCB) according to claim 1 is characterized in that: the thickness of described adhesion coating is 10～40 μ m.
4. the stiffening plate that is used for printed circuit board (PCB) according to claim 1 is characterized in that: described ink lay comprises epoxy resin and developer.
5. the stiffening plate that is used for printed circuit board (PCB) according to claim 4 is characterized in that: described developer is a kind of in white developer and the black developer.
6. the stiffening plate that is used for printed circuit board (PCB) according to claim 5, it is characterized in that: described white developer is to comprise at least a in the Chinese white of titanium dioxide, by weight percentage, described white developer accounts for 60～95% of described epoxy resin solid content.
7. the stiffening plate that is used for printed circuit board (PCB) according to claim 5, it is characterized in that: described black developer is at least a in black pigment, carbon dust and the carbon nanotube, by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content.
8. the stiffening plate that is used for printed circuit board (PCB) according to claim 4 is characterized in that: described ink lay is made of epoxy resin, developer and heat radiation powder.
9. the stiffening plate that is used for printed circuit board (PCB) according to claim 8 is characterized in that: described heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103061 CN102143646B (en) | 2010-01-28 | 2010-01-28 | Stiffening plate for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103061 CN102143646B (en) | 2010-01-28 | 2010-01-28 | Stiffening plate for printed circuit board |
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| CN102143646A true CN102143646A (en) | 2011-08-03 |
| CN102143646B CN102143646B (en) | 2013-03-06 |
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| CN 201010103061 Active CN102143646B (en) | 2010-01-28 | 2010-01-28 | Stiffening plate for printed circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102501499A (en) * | 2011-11-04 | 2012-06-20 | 欣兴同泰科技（昆山）有限公司 | White covering film for flexible circuit board as well as preparation method and application for same |
| CN102800244A (en) * | 2012-03-15 | 2012-11-28 | 上海特镭宝材料科技有限公司 | Superhigh-temperature wear-resistant heat transfer label and preparation method thereof |
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
| CN103436066A (en) * | 2012-04-13 | 2013-12-11 | 普罗旺斯科技（深圳）有限公司 | Heat dissipation coating, heat dissipation fin and manufacturing method |
| CN103458607A (en) * | 2012-06-05 | 2013-12-18 | 昆山雅森电子材料科技有限公司 | Extinction stiffening plate used for printed circuit board |
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN103796419A (en) * | 2012-11-01 | 2014-05-14 | 昆山雅森电子材料科技有限公司 | Light-extinction black reinforcing plate used for printed circuit board |
| CN105992455A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Matting-effect black reinforcing plate used for printed circuit board |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
| WO2021120191A1 (en) * | 2019-12-20 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Polyimide composite metal plate |
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| JPH057065A (en) * | 1991-06-27 | 1993-01-14 | Nissha Printing Co Ltd | Manufacture of printed-circuit board, and transcribing foil for forming circuit |
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| JPH057065A (en) * | 1991-06-27 | 1993-01-14 | Nissha Printing Co Ltd | Manufacture of printed-circuit board, and transcribing foil for forming circuit |
| US7181838B2 (en) * | 2001-09-25 | 2007-02-27 | Benq Corporation | Method of fabricating identifiable flexible printed circuit board |
| JP2003124684A (en) * | 2001-10-10 | 2003-04-25 | Daikoo System:Kk | Electromagnetic wave shield tape for game machine |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
| CN102501499A (en) * | 2011-11-04 | 2012-06-20 | 欣兴同泰科技（昆山）有限公司 | White covering film for flexible circuit board as well as preparation method and application for same |
| CN102800244B (en) * | 2012-03-15 | 2014-08-27 | 上海特镭宝材料科技有限公司 | Superhigh-temperature wear-resistant heat transfer label and preparation method thereof |
| CN102800244A (en) * | 2012-03-15 | 2012-11-28 | 上海特镭宝材料科技有限公司 | Superhigh-temperature wear-resistant heat transfer label and preparation method thereof |
| CN103436066B (en) * | 2012-04-13 | 2017-02-15 | 普罗旺斯科技（深圳）有限公司 | Heat dissipation coating, heat dissipation fin and manufacturing method |
| CN103436066A (en) * | 2012-04-13 | 2013-12-11 | 普罗旺斯科技（深圳）有限公司 | Heat dissipation coating, heat dissipation fin and manufacturing method |
| CN103458607A (en) * | 2012-06-05 | 2013-12-18 | 昆山雅森电子材料科技有限公司 | Extinction stiffening plate used for printed circuit board |
| CN103796419A (en) * | 2012-11-01 | 2014-05-14 | 昆山雅森电子材料科技有限公司 | Light-extinction black reinforcing plate used for printed circuit board |
| CN103796419B (en) * | 2012-11-01 | 2017-08-01 | 昆山雅森电子材料科技有限公司 | Extinction black stiffening plate for printed circuit board (PCB) |
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN103747612B (en) * | 2013-12-31 | 2018-12-25 | 苏州中拓专利运营管理有限公司 | A kind of Champagne metal reinforcement sheet and preparation method thereof |
| CN105992455A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Matting-effect black reinforcing plate used for printed circuit board |
| WO2021120191A1 (en) * | 2019-12-20 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Polyimide composite metal plate |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
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