CN201637797U - Testing machine - Google Patents
Testing machine Download PDFInfo
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- CN201637797U CN201637797U CN2010201482598U CN201020148259U CN201637797U CN 201637797 U CN201637797 U CN 201637797U CN 2010201482598 U CN2010201482598 U CN 2010201482598U CN 201020148259 U CN201020148259 U CN 201020148259U CN 201637797 U CN201637797 U CN 201637797U
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a testing machine which comprises a plurality of testing heads, and also a control module which is connected with the testing heads by a data interface, wherein the control module receives a testing signal and indicates the testing heads to start testing sequentially by the data interface; each testing head sends the testing result to the control module by the data interface after the testing is finished; and after all the testing heads finish one time of testing, all the testing results are output in a concentrated way by the control module. The testing machine is provided with the plurality of testing heads, after a wafer moves and contacts with a probe clip each time, chips with the number the same as that of the testing heads can be tested; and compared with the testing machine for traditional single chip testing that only one chip can be tested after the wafer moves and contacts with the probe clip each time, the testing machine greatly improves the testing speed and efficiency. Furthermore, the testing machine only needs to be matched with one probe station to conduct testing, and can save the cost compared with the testing machine which needs to be matched with two probe stations to conduct ping-pong testing.
Description
[technical field]
The utility model relates to the measuring technology in the semi-conductor industry, particularly relates to a kind of test machine.
[background technology]
(Automatic Test Equipment is a kind of specialized equipment that is used for wafer and other finished product tests ATE) to test machine, can realize that the measurement of various electrical quantitys and probe station cooperate the test that can finish the wafer electrical quantity.It has a plurality of interfaces that are connected with probe station.
Probe station (prober) is a kind of equipment that is used for wafer sort in the semiconductor production process, mainly finishes wafer sort middle probe card and moves and probe station and functions such as the signal of test machine is connected with the reliable contact of wafer, the fixedly step pitch of wafer.
Measuring head is a kind of test conversion device on the test machine, by this device, can give different test cells with the signal allocation of test machine, so that improve the efficient of test.
Traditional test machine has only a measuring head, cooperates with probe station when wafer tested, and can only carry out the single-chip test, i.e. the each displacement of wafer also contacts with probe and can only test a chip, and testing efficiency is lower.
In order to improve testing efficiency, the test machine that has, the DTS-1000 as JUNOTeseter company produces is equipped with two measuring heads, can connect two probe stations and realize the table tennis test, as shown in Figure 1.Test machine 100 comprises first measuring head 110 and second measuring head 120, respectively linking probe platform 200 and probe station 300.Behind the chip of the wafer of probe station of first measuring head, 110 tests 200 carryings, obtain test result; The displacement of the 200 pairs of wafers of probe station and with process that probe contact in, a chip of the wafer that second measuring head, 120 test probe platforms 300 carry, and obtain test result.So just can save displacement and the time that contacts with probe.
Though improved test speed like this, need a test machine and two probe stations to cooperate test, the equipment that needs is more, has therefore improved testing cost.
[utility model content]
Based on this, be necessary to provide a kind of needs and a probe machine to cooperate test, but still can guarantee the test machine of test speed faster.
A kind of test machine, comprise a plurality of measuring heads, also comprise the control module that is connected with described a plurality of measuring heads by data-interface, described control module acceptance test signal, indicate described a plurality of measuring head to begin test in turn by data-interface, after the test of each measuring head is finished test result is sent to control module by data-interface, treat that all measuring heads have all been finished once test after, all test results are concentrated output by control module.
Preferably, described a plurality of measuring head is two measuring heads.
Preferably, described data-interface is the parallel port.
Preferably, described control module comprises CPLD.
Preferably, described control module also comprises serial ports, receives described test signal or outputs test result by serial ports.
Preferably, described control module also comprises the power module that working power is provided to CPLD.
Preferably, described control module also comprises the clock module that work clock is provided to CPLD.
Above-mentioned test machine is equipped with a plurality of measuring heads, after all measuring heads have all been finished once test, test result is concentrated output, therefore wafer whenever moves and contacts once with probe, can test the chip that equates with measuring head quantity, test machine with respect to whenever moving and contact with probe the traditional single-chip test that once can only test a chip has improved test speed and efficient greatly.And only need cooperate and test,, can save cost with respect to the test machine that need cooperate the test of rattling with two probe stations with a probe station.
[description of drawings]
Fig. 1 is the structural representation of the traditional test machine that two measuring heads are arranged;
Fig. 2 is the structural representation of the utility model test machine among the embodiment;
Fig. 3 is the structural representation of the utility model test machine among another embodiment;
Fig. 4 is the structural representation of control module among the embodiment.
[embodiment]
Fig. 2 is the structural representation of the utility model test machine among the embodiment.The test machine 100 that is connected with probe station 200 comprises a plurality of measuring heads and control module 130.Control module 130 receives and transmits the beginning test signal that probe station 200 sends by data-interface (figure does not show), indicates described a plurality of measuring head to begin test in turn, after each measuring head test is finished test result is sent to control module by data-interface.After treating that all measuring heads have all been finished once test, convert all test results to form that probe station can be discerned, concentrate then and export to probe station 200; Test machine 100 indication probe stations 200 move to next position with wafer and contact with probe simultaneously, begin to carry out the next round test.
Fig. 3 is the structural representation of the utility model test machine among another embodiment, and this embodiment is the situation that test machine is equipped with two measuring heads.The test machine 100 that is connected with probe station 200 comprises first measuring head 110, second measuring head 120 and control module 130.
Test machine wafer behind two chips of test just need be shifted and contact once with probe among this embodiment, with respect to traditional single-chip test, can save the time of half in this link.The table tennis that connects two probe stations with respect to needs is tested, and can save next probe station, greatly reduces cost.
Fig. 4 is the structural representation of control module among the embodiment.Control module 130 comprise CPLD (Complex Programmable Logic Device, CPLD) 132, power module 134, clock module 136 and serial ports 138.
CPLD 132 all is connected with power module 134, clock module 136, serial ports 138, transmit the beginning test signal of probe station 200 transmissions and receive the test result that two measuring heads send to test machine 100 by parallel port (figure does not show), also be used for test result is sent to serial ports 138 by serial ports 138 after changing, feed back to probe station 200 by serial ports 138.
Power module 134 is used for providing working power to CPLD 132.
Clock module 136 is used for providing work clock to CPLD 132.
Serial ports 138 is the communication interfaces between control module 130 and the probe station 200, finishes to receive the beginning test signal that probe station 200 sends, and concentrates signal interactive function such as output test result to probe station 200.
Above-mentioned test machine is equipped with a plurality of measuring heads, after all measuring heads have all been finished once test, test result is concentrated output, therefore wafer whenever moves and contacts once with probe, can test the chip that equates with measuring head quantity, test machine with respect to whenever moving and contact with probe the traditional single-chip test that once can only test a chip has improved test speed and efficient greatly.And only need cooperate and test,, can save cost with respect to the test machine that need cooperate the test of rattling with two probe stations with a probe station.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (7)
1. test machine, comprise a plurality of measuring heads, it is characterized in that, also comprise the control module that is connected with described a plurality of measuring heads by data-interface, described control module acceptance test signal indicates described a plurality of measuring head to begin test in turn by data-interface, after each measuring head test is finished test result is sent to control module by data-interface, after treating that all measuring heads have all been finished once test, all test results are concentrated output by control module.
2. test machine according to claim 1 is characterized in that, described a plurality of measuring heads are two measuring heads.
3. test machine according to claim 1 is characterized in that described data-interface is the parallel port.
4. test machine according to claim 1 is characterized in that described control module comprises CPLD.
5. test machine according to claim 3 is characterized in that described control module also comprises serial ports, receives described test signal or outputs test result by serial ports.
6. test machine according to claim 3 is characterized in that described control module also comprises the power module that working power is provided to CPLD.
7. test machine according to claim 3 is characterized in that described control module also comprises the clock module that work clock is provided to CPLD.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201482598U CN201637797U (en) | 2010-03-24 | 2010-03-24 | Testing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201482598U CN201637797U (en) | 2010-03-24 | 2010-03-24 | Testing machine |
Publications (1)
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CN201637797U true CN201637797U (en) | 2010-11-17 |
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CN2010201482598U Expired - Fee Related CN201637797U (en) | 2010-03-24 | 2010-03-24 | Testing machine |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103064011A (en) * | 2012-12-27 | 2013-04-24 | 广州中大微电子有限公司 | Radio frequency identification devices (RFID) reader chip process testing system and method |
CN103777131A (en) * | 2012-10-25 | 2014-05-07 | 上海华岭集成电路技术股份有限公司 | Integrated circuit testing system and integrated circuit testing method |
CN109425760A (en) * | 2017-08-21 | 2019-03-05 | 汉民科技股份有限公司 | Plane correcting device and semiconductor test equipment comprising same |
CN109727882A (en) * | 2018-10-24 | 2019-05-07 | 深圳赛意法微电子有限公司 | The concurrent testing equipment of semiconductor power device |
CN111443321A (en) * | 2020-03-13 | 2020-07-24 | 上海泽丰半导体科技有限公司 | High-speed probe card test method and test system |
CN112230120A (en) * | 2020-12-17 | 2021-01-15 | 上海伟测半导体科技股份有限公司 | Multi-platform linkage effect-improving mechanism |
CN113589140A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Wafer test system and method of TOF chip |
CN114384287A (en) * | 2022-01-17 | 2022-04-22 | 上海华岭集成电路技术股份有限公司 | Probe card, probe test system and probe test method |
-
2010
- 2010-03-24 CN CN2010201482598U patent/CN201637797U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103777131A (en) * | 2012-10-25 | 2014-05-07 | 上海华岭集成电路技术股份有限公司 | Integrated circuit testing system and integrated circuit testing method |
CN103777131B (en) * | 2012-10-25 | 2016-07-06 | 上海华岭集成电路技术股份有限公司 | Integrated circuit test system and method for testing |
CN103064011A (en) * | 2012-12-27 | 2013-04-24 | 广州中大微电子有限公司 | Radio frequency identification devices (RFID) reader chip process testing system and method |
CN103064011B (en) * | 2012-12-27 | 2015-12-23 | 广州中大微电子有限公司 | Examining system and method in a kind of rfid interrogator chip |
CN109425760A (en) * | 2017-08-21 | 2019-03-05 | 汉民科技股份有限公司 | Plane correcting device and semiconductor test equipment comprising same |
CN109727882A (en) * | 2018-10-24 | 2019-05-07 | 深圳赛意法微电子有限公司 | The concurrent testing equipment of semiconductor power device |
CN111443321A (en) * | 2020-03-13 | 2020-07-24 | 上海泽丰半导体科技有限公司 | High-speed probe card test method and test system |
CN112230120A (en) * | 2020-12-17 | 2021-01-15 | 上海伟测半导体科技股份有限公司 | Multi-platform linkage effect-improving mechanism |
CN113589140A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Wafer test system and method of TOF chip |
CN114384287A (en) * | 2022-01-17 | 2022-04-22 | 上海华岭集成电路技术股份有限公司 | Probe card, probe test system and probe test method |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20190324 |