CN203012088U - Integrated circuit testing system - Google Patents
Integrated circuit testing system Download PDFInfo
- Publication number
- CN203012088U CN203012088U CN 201220485308 CN201220485308U CN203012088U CN 203012088 U CN203012088 U CN 203012088U CN 201220485308 CN201220485308 CN 201220485308 CN 201220485308 U CN201220485308 U CN 201220485308U CN 203012088 U CN203012088 U CN 203012088U
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- wireless communication
- communication module
- integrated circuit
- tester
- load board
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Abstract
The utility model discloses an integrated circuit testing system which comprises control equipment, a tester, a load plate, an automatic test machine and a tested device, wherein the tester is connected with the control equipment, the load plate is connected with the tester, the automatic test machine is connected with the load plate, and the tested device is connected with the automatic test machine; a load plate array with wireless communication modules comprises N load plates with the wireless communication module, an automatic test machine array comprises N automatic test machines, and a tested device array comprises N tested devices. The integrated circuit testing system has the advantages that the wiring problem between the tester and the test load plate is solved, the testing cost is lowered, and the testing efficiency and accuracy of output testing results are improved.
Description
Technical field
The utility model relates to ic test technique, is specifically related to a kind of integrated circuit test system based on wireless communication module.
Background technology
Current traditional integrated circuit testing is divided into middle survey and becomes to survey two classes, the test macro comparing class seemingly, all adopt tester to receive the test vector code, and control probe station or mechanical arm mobile test load board, chip Die or the packaged chip of finished product on the contact wafer, test and receive test result, tester is connected the connection of mechanical arm and test load plate and is all adopted the mode of winding displacement with probe station.
Above-mentioned test macro uses winding displacement aspect communication, benefit is that cost is lower, but disadvantage is also arranged, and is embodied in every tester and adopts the serial testing process, only can dock separate unit probe station, mechanical arm or test load plate; And because tester winding displacement mouth is limited, can't adopt the multidiameter delay test for the more chip of pin during test; Because consider that winding displacement has electrical loss, length is generally shorter, makes tester generally put near equipment such as probe stations, is unfavorable for space management, strengthens the wiring difficulty, and can't realize Long-distance Control.
Summary of the invention
a kind of integrated circuit test system, comprise an opertaing device, one tester with wireless communication module that is connected with described opertaing device, the one load board array with wireless communication module that is connected with described tester with wireless communication module, one with the described automatic test machine array that is connected with the load board array of wireless communication module, the one measured device array that is connected with described automatic test machine array, described load board array with wireless communication module comprises N with the load board of wireless communication module, described automatic test machine array comprises N automatic test machine, described measured device array comprises N measured device, N 〉=1 wherein.
In the tester main control chip of described tester with wireless communication module, one first wireless communication module driver has been installed, has been used for controlling the wireless communication module work of described tester with wireless communication module; The built-in load board main control chip of described load board with wireless communication module, and one second wireless communication module driver has been installed in described load board main control chip is used for controlling the wireless communication module work of described load board with wireless communication module; Described automatic test machine is that probe station, mechanical arm or other can be completed the equipment of autorun; Described measured device is that wafer, chip or other can be used for tested components and parts; Described with wireless communication module tester and described be the wireless communication module that GPRS, WIFI, CDMA etc. realize wireless communication function with the built-in wireless communication module of the load board array of wireless communication module; Described load board with wireless communication module, described automatic test machine and described measured device be corresponding the series connection one by one.
Relative prior art, a kind of integrated circuit test system of the utility model replaces by wireless communication signal the transmission that traditional winding displacement carries out control information, have better dirigibility, avoided the decay mistake of high speed transmission of signals, improved the correctness of test result output.In addition, due to can Long-distance Control, avoided the wiring difficulty brought because of test space, industrial building, also solved because the limited introducing of winding displacement pin can't a plurality of chips of concurrent testing problem, give full play to the high-level efficiency of test, saved greatly testing cost.
Description of drawings
Fig. 1 is the technical solutions of the utility model block diagram.
Fig. 2 is the utility model better embodiment block diagram.
Embodiment
See also Fig. 3, the utility model integrated circuit test system better embodiment comprise an opertaing device, a tester with the GPRS module that is connected with this opertaing device, a load board array with the GPRS module that is connected with this tester with the GPRS module, one with this mechanical arm array that is connected with the load board array of GPRS module, a chip array that is connected with this mechanical arm array, this load board array with the GPRS module comprises N with the load board of GPRS module, this mechanical arm array comprises N mechanical arm, this chip array comprises N chip, wherein N 〉=1.
In this tester main control chip with the tester of GPRS module, one the one GPRS driver of modules has been installed, has been used for controlling this with the GPRS module work of the tester of GPRS module; The built-in load board main control chip of this load board with the GPRS module, and one the 2nd GPRS driver of modules has been installed in this load board main control chip, be used for controlling this with the GPRS module work of the load board of GPRS module; This mechanical arm can replace with the equipment that probe station etc. can be completed autorun; This chip can replace with wafer etc. can be used for tested components and parts; This tester with the GPRS module can replace with the built-in GPRS module of the load board array of GPRS module the wireless communication module that WIFI, CDMA etc. realize wireless communication function with this; This load board with the GPRS module, this mechanical arm and this chip be corresponding the series connection one by one.
The utility model integrated circuit test system has been avoided the decay mistake of high speed transmission of signals, has improved the correctness of test result output.In addition, due to can Long-distance Control, avoided the wiring difficulty brought because of test space, industrial building, also solved because the limited introducing of winding displacement pin can't a plurality of chips of concurrent testing problem, give full play to the high-level efficiency of test, saved greatly testing cost.
Claims (8)
1. integrated circuit test system, comprise an opertaing device, one tester with wireless communication module that is connected with described opertaing device, the one load board array with wireless communication module that is connected with described tester with wireless communication module, one with the described automatic test machine array that is connected with the load board array of wireless communication module, the one measured device array that is connected with described automatic test machine array, described load board array with wireless communication module comprises N with the load board of wireless communication module, described automatic test machine array comprises N automatic test machine, described measured device array comprises N measured device, N 〉=1 wherein.
2. a kind of integrated circuit test system according to claim 1, it is characterized in that: in the tester main control chip of described tester with wireless communication module, one first wireless communication module driver has been installed, has been used for controlling the wireless communication module work of described tester with wireless communication module.
3. a kind of integrated circuit test system according to claim 1, it is characterized in that: the built-in load board main control chip of described load board with wireless communication module, and one second wireless communication module driver has been installed in described load board main control chip, be used for controlling the wireless communication module work of described load board with wireless communication module.
4. a kind of integrated circuit test system according to claim 1 is characterized in that: described load board with wireless communication module, described automatic test machine and described measured device be corresponding the series connection one by one.
5. a kind of integrated circuit test system according to claim 1, it is characterized in that: described automatic test machine is probe station.
6. a kind of integrated circuit test system according to claim 1, it is characterized in that: described automatic test machine is mechanical arm.
7. a kind of integrated circuit test system according to claim 1, it is characterized in that: described measured device is wafer.
8. a kind of integrated circuit test system according to claim 1, it is characterized in that: described measured device is chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220485308 CN203012088U (en) | 2012-09-21 | 2012-09-21 | Integrated circuit testing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220485308 CN203012088U (en) | 2012-09-21 | 2012-09-21 | Integrated circuit testing system |
Publications (1)
Publication Number | Publication Date |
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CN203012088U true CN203012088U (en) | 2013-06-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201220485308 Expired - Fee Related CN203012088U (en) | 2012-09-21 | 2012-09-21 | Integrated circuit testing system |
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CN (1) | CN203012088U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854455A (en) * | 2012-09-21 | 2013-01-02 | 成都市中州半导体科技有限公司 | Integrated circuit testing system and control method for same |
-
2012
- 2012-09-21 CN CN 201220485308 patent/CN203012088U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854455A (en) * | 2012-09-21 | 2013-01-02 | 成都市中州半导体科技有限公司 | Integrated circuit testing system and control method for same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20140921 |
|
EXPY | Termination of patent right or utility model |