CN201623012U - Wafer ventilation bar and wire-bonding device - Google Patents
Wafer ventilation bar and wire-bonding device Download PDFInfo
- Publication number
- CN201623012U CN201623012U CN 201020104170 CN201020104170U CN201623012U CN 201623012 U CN201623012 U CN 201623012U CN 201020104170 CN201020104170 CN 201020104170 CN 201020104170 U CN201020104170 U CN 201020104170U CN 201623012 U CN201623012 U CN 201623012U
- Authority
- CN
- China
- Prior art keywords
- plate body
- base plate
- top board
- ventilation
- compressing tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Wire Bonding (AREA)
Abstract
The utility model belongs to the field of chip wire-bonding and particularly discloses a wafer ventilation bar and a wire-bonding device. The wafer ventilation bar comprises a top plate and a bottom plate, wherein the top plate comprises a top plate body and a gas nozzle which is arranged on the top plate body and is capable of guiding gas towards the lower part of the top plate body; the bottom plate comprises a bottom plate body, and a plurality of gas holes penetrating the bottom plate body are formed on the bottom plate body; the bottom plate body is located under the top plate body and mounted onto the top plate body; and the top plate body is connected with the bottom plate body in a sealing manner at the periphery of the gas hole. By mounting two wafer ventilation bars on the track of the wire-bonding device, and introducing the mixture of hydrogen and nitrogen into the track, the product can be protected in the presence of the mixture.
Description
Technical field
The utility model relates to employed parts and device in chip routing (wire bond) process, relates in particular to a kind of compressing tablet ventilation row and the wire bonder that this compressing tablet ventilation is arranged is installed.
Background technology
The chip surface aluminium lamination of MOSFET series of products is thinner, and the aluminium wire explained hereafter efficient of traditional routing is lower, and occurs the crater phenomenon when producing easily.As then can providing production efficiency by automatic wire bonder (copper wire routing) routing, but copper wire is oxidized easily when burning ball, and this will influence the quality of routing largely.
The utility model content
First purpose of the present utility model is a problem easily oxidized in order to solve copper wire and to burn ball, provides a kind of compressing tablet ventilation to arrange.
The technical solution adopted in the utility model is: a kind of compressing tablet ventilation row, comprise top board and base plate, described top board comprise the top board body and be arranged on the top board body can be with the valve of gas channeling top board body below; Described base plate comprises the base plate body, and described base plate body is provided with the pore of a plurality of perforation base plate bodies; Described base plate body is positioned at the below of top board body, and is installed on the described top board body; Described top board body and base plate body are tightly connected around described pore.
3. another purpose of the present utility model provides a kind of wire bonder oxidized can prevent effectively that copper wire from burning ball the time.
The technical solution adopted in the utility model is: a kind of wire bonder, two above-mentioned compressing tablet ventilation rows are installed on the track of described wire bonder, and two compressing tablet ventilation rows lay respectively at the both sides of the routing head of wire bonder; Described compressing tablet ventilation row's base plate all is equipped with the tracheae that is used to transport nitrogen and hydrogen gas mixture towards described track on described compressing tablet ventilation row's the valve, and described tracheae is communicated with the gas supply device of described wire bonder.
The beneficial effects of the utility model are: after adding hydrogen and nitrogen protection on the track; product is just protected after the product injection from the beginning, by Buchholz protection, burns ball bonding point and just can reduce power and pressure behind the burning ball; and rosin joint can not appear in product yet, bad phenomenon such as crater.In addition, the electric conductivity of copper wire is better than aluminium wire, can adopt the lead-in wire with less line footpath during backguy, can reduce welding spot size like this, further reduces to occur the probability in crater.
Description of drawings
Fig. 1 is a compressing tablet ventilation row's described in the utility model perspective view;
Fig. 2 is the vertical view of compressing tablet ventilation row's shown in Figure 1 top board;
Fig. 3 is the upward view of compressing tablet ventilation row's shown in Figure 1 base plate;
Fig. 4 is the partial structurtes schematic diagram of routing described in the utility model.
Embodiment
Shown in Fig. 1,2 and 3, compressing tablet ventilation row 10 described in the utility model comprises top board 11 and the base plate 12 that is installed on the top board bottom surface, wherein, described top board 11 comprise top board body 111 and be arranged on the top board body can be with the valve 112 of gas channeling top board below; Described base plate 12 comprises base plate body 121, and described base plate body 121 is provided with the pore 122 of a plurality of perforation base plate bodies.Described top board body 111 and base plate body 121 are tightly connected around pore 122, make the gas that enters through valve 112 can pass through pore 122 discharges fully.
Described top board body 111 can be made of plastics, and described base plate body 121 can be made of metal.
As shown in Figure 4, wire bonder described in the utility model, two compressing tablet ventilation rows 10 described in the utility model are installed on its track 20, the substrate 50 that routing is used is installed on the track 20, described substrate 50 is arranged in the below of routing head (Fig. 4 is not shown), and two compressing tablet ventilation rows 10 then lay respectively at the both sides of routing head.On described compressing tablet ventilation row's 10 the valve 112 tracheae 30 that is used to transport nitrogen and hydrogen gas mixture is installed all.Described compressing tablet ventilation row 10 can not occur crooked and problem that upwarp in the time of can guaranteeing product screening in orbit.In addition, mist is injected by the valve of top board 11, and is imported in the track by the pore on the base plate 12 122, protects product with this; Wherein, the main effect of nitrogen is that the air on the track is discharged, and protects product not oxidated with this; The main effect of hydrogen is to utilize its reduction characteristic, reduces after copper wire burns ball, makes it not oxidized.Wire bonder described in the utility model does not improve design in other parts, does not therefore specify.
Being the utility model preferred embodiment only in sum, is not to be used for limiting practical range of the present utility model.Be that all equivalences of doing according to the content of the utility model claim change and modification, all should belong to technology category of the present utility model.
Claims (2)
1. compressing tablet ventilation row is characterized in that: comprise top board and base plate, described top board comprise the top board body and be arranged on the top board body can be with the valve of gas channeling top board body below; Described base plate comprises the base plate body, and described base plate body is provided with the pore of a plurality of perforation base plate bodies; Described base plate body is positioned at the below of top board body, and is installed on the described top board body; Described top board body and base plate body are tightly connected around described pore.
2. a wire bonder is characterized in that: the two described compressing tablet ventilation of claim 1 rows are installed, two both sides that the routing head that lays respectively at wire bonder is arranged in the compressing tablet ventilation on the track of described wire bonder; Described compressing tablet ventilation row's base plate all is equipped with the tracheae that is used to transport nitrogen and hydrogen gas mixture towards described track on described compressing tablet ventilation row's the valve, and described tracheae is communicated with the gas supply device of described wire bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020104170 CN201623012U (en) | 2010-01-29 | 2010-01-29 | Wafer ventilation bar and wire-bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020104170 CN201623012U (en) | 2010-01-29 | 2010-01-29 | Wafer ventilation bar and wire-bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623012U true CN201623012U (en) | 2010-11-03 |
Family
ID=43026468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020104170 Expired - Fee Related CN201623012U (en) | 2010-01-29 | 2010-01-29 | Wafer ventilation bar and wire-bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623012U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104511703A (en) * | 2013-09-30 | 2015-04-15 | 北京中电科电子装备有限公司 | Ceramic head and lead wire bonder |
-
2010
- 2010-01-29 CN CN 201020104170 patent/CN201623012U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104511703A (en) * | 2013-09-30 | 2015-04-15 | 北京中电科电子装备有限公司 | Ceramic head and lead wire bonder |
| CN104511703B (en) * | 2013-09-30 | 2017-02-15 | 北京中电科电子装备有限公司 | Ceramic head and lead wire bonder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20170129 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |