CN205488205U - Piece formula support, piece formula device array and piece formula device - Google Patents
Piece formula support, piece formula device array and piece formula device Download PDFInfo
- Publication number
- CN205488205U CN205488205U CN201620097762.2U CN201620097762U CN205488205U CN 205488205 U CN205488205 U CN 205488205U CN 201620097762 U CN201620097762 U CN 201620097762U CN 205488205 U CN205488205 U CN 205488205U
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- China
- Prior art keywords
- chip
- cribbing
- carrier unit
- sheet
- row
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a piece formula support, piece formula device array and piece formula, a piece formula support, include the lead frame that constitutes by a full wafer metal sheet, it has a plurality of support unit to arrange on the lead frame, a plurality of support unit forms the support cellular array of the capable N of M row, M wherein, and N >= 1, be provided with respectively below the support unit that the higher authority of the 1st line support unit and M are capable with the 1st line and the capable support unit of M are the peripheral frame of a body structure, and will the support unit connection of same row becomes the longitudinal tie portion of a body structure, its characterized in that: adjacent two allocate is provided with an at least connecting strip between the unit, the connecting strip with the link that longitudinal tie portion is connected is located between the adjacent support unit of same row. So only need across cutting piece formula device array and needn't carry out fore -and -aft cutting and can form individualistic piece formula device, improved production efficiency widely.
Description
Technical field
This utility model relates to LED technology field, particularly relate to a kind of sheet cribbing, chip device array and
Chip device.
Background technology
Traditional chip device structure is using PCB circuit board as substrate, metal as wire support, as it is shown in figure 1,
Wire support 20 extends to bottom, form lateral electrode and bottom electrode respectively from the side of PCB substrate 10.This traditional structure
The shortcoming of LED device more, specifically include that 1, structure complicated, manufacture process is complicated, cost is high.2, traditional chip device
Structure is limited by wiring board, and air-tightness is bad, is easily caused PCB circuit board and produces gap with packing colloid, makes outside
Steam penetrates into LED chip by gap, causes LED chip impaired, increases the fraction defective of product and reduces the reliability of device.
3, traditional chip device, owing to the thermal conductance of PCB circuit board is not fine, is unfavorable for the heat radiation of device.
In view of the defect that traditional chip device is intrinsic, need a kind of structure of design and manufacturing process is simple, air-tightness is good,
Thermal diffusivity is good, the sheet cribbing of low cost, chip device array and chip device.
Summary of the invention
The purpose of this utility model is the deficiency for current chip device structure, it is provided that a kind of structure and manufacturing process
Simply, air-tightness is good, thermal diffusivity is good, the sheet cribbing of low cost, chip device array and chip device.
This utility model is to adopt the following technical scheme that to be attained in that
A kind of sheet cribbing, including the lead frame being made up of whole piece metallic plate, described lead frame is arranged with several
Carrier unit, several carrier units described form the carrier unit array of M row × N row, wherein M, N >=1, described 1st row
Being provided with separately below and described 1st row and M row carrier unit of carrier unit of above and M row of carrier unit
Peripheral frame in integrative-structure, and the carrier unit of described same string is connected and into a single integrated structure longitudinally connected portion,
It is characterized in that: be provided with at least one connection strap between described two adjacent row carrier units, described connection strap is vertical with described
End is connected between the carrier unit that same string is adjacent to what connecting portion was connected.
Preferably, described connection strap is level connection joint, and between colleague, described two adjacent row carrier units are respectively arranged with
Article one, connection strap.
Preferably, the width of described connection strap is less than or equal to 0.2mm.
Preferably, the width of described connection strap is less than or equal to 0.1mm.
Preferably, it is the stiffener of integrative-structure that the centre of described connection strap is provided with described connection strap, described reinforcement
The two ends of bar connect described peripheral frame respectively.
Preferably, described carrier unit includes that the substrate of at least two mutually insulated, described substrate are provided with bending part.
Preferably, described bending part includes that electrode portion and chip mount portion, described chip mount portion and electrode portion are by even
The portion of connecing connects, and described connecting portion forms bending, described chip mount portion and described electrode with chip mount portion and electrode portion respectively
Having difference in height h between portion, described chip mount portion is higher than described electrode portion.
Preferably, described electrode portion is provided with protuberance.
Preferably, difference in height h between described chip mount portion and electrode portion is not more than 1.0 mm.
A kind of chip device array, including sheet cribbing, be arranged on described cribbing carrier unit on LED core
Sheet and the packing colloid encapsulated together to carrier unit, chip described in major general.
Preferably, the longitudinally connected portion of described chip device array is at least part of is exposed at outside packing colloid.
A kind of chip device array, including described cribbing, the LED that is arranged on the carrier unit of described cribbing
Chip and the packing colloid encapsulated together to carrier unit, chip described in major general；Described packing colloid covers described protuberance.
A kind of chip device, the LED chip including described carrier unit, being arranged on described carrier unit and by LED
The packing colloid that chip is encapsulated together.
A kind of chip device, including described cribbing, the LED core that is arranged on the carrier unit of described cribbing
Sheet and the packing colloid that LED chip is encapsulated together；Described packing colloid covers described protuberance.
This utility model has the advantage that
1, a kind of sheet cribbing, chip device array and the chip device simple in construction that this utility model provides, is manufactured into
This is low；Use metal basal board, improve the heat-sinking capability of device, use copper with low cost as producing material, reduce life
Produce cost；Being provided with at least one connection strap between described two adjacent row carrier units, described connection strap connects with described longitudinal direction
What the portion of connecing was connected connect end between the carrier unit that same string is adjacent, the most only need transverse cuts chip device array and
Longitudinal cutting need not be carried out and can form single chip device, can greatly improve production efficiency.
2, a kind of sheet cribbing, chip device array and the chip device that this utility model provides, by described electrode
District is provided with bending part, and the design of bending part adds the contact area of packing colloid and metal basal board, and so that encapsulation
Colloid coated metal substrate, hinders scolding tin, steam etc. and enters the inside of device, increase the air-tightness of device.
3, a kind of sheet cribbing, chip device array and the chip device that this utility model provides, described electrode of substrate portion
Bottom be also provided with protuberance, in follow-up packaging technology, the packing colloid of bottom by the obstruction of protuberance be difficult to into
Enter the bottom section to longitudinally connected portion, it is to avoid rosin joint phenomenon during paster occurs.
4, a kind of sheet cribbing, chip device array and the chip device that this utility model provides, adjacent two are disbursed from the cost and expenses frame
It is the stiffener of integrative-structure that the centre of the connection strap set by unit can be provided with described connection strap, described stiffener
Two ends connect described peripheral frame respectively, are possible to prevent support to deform in potting process, improve the yield of product.
Accompanying drawing explanation
Fig. 1 is background technology accompanying drawing of the present utility model；
Fig. 2 is the schematic diagram of a kind of cribbing in this utility model embodiment one；
Fig. 3 is the part A close-up schematic view shown in Fig. 2 in this utility model embodiment one；
Fig. 4 is the schematic diagram of a kind of cribbing in other embodiments in this utility model embodiment one；
Fig. 5 is the schematic top plan view of a kind of carrier unit in this utility model embodiment one；
Fig. 6 is the schematic cross-section of a kind of carrier unit in this utility model embodiment one；
Fig. 7 is the schematic cross-section of a kind of other embodiments of carrier unit in this utility model embodiment one；
Fig. 8 is the schematic cross-section of a kind of chip device of embodiment three of the present utility model；
Fig. 9 is the schematic cross-section of a kind of other embodiments of chip device of embodiment three of the present utility model.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, new below in conjunction with this practicality
Accompanying drawing in type embodiment, is clearly and completely described the technical scheme in this utility model embodiment, it is clear that retouched
The embodiment stated is a part of embodiment of this utility model rather than whole embodiments.Based on the enforcement in this utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained on the premise of not making creative work, all belong to
Scope in this utility model protection.
Embodiment one
As in figure 2 it is shown, a kind of sheet cribbing that this utility model provides, including the lead frame being made up of whole piece metallic plate
10, described lead frame 10 is arranged with several carrier units 1, several carrier units described form the support of M row × N row
Cell array, wherein M, N >=1, setting separately below of the carrier unit of the above and M row of the carrier unit of described 1st row
Being equipped with described 1st row and M row carrier unit is the peripheral frame 2 of integrative-structure, and the support list by described same string
Unit connects and into a single integrated structure longitudinally connected portion, is provided with at least one connection between described two adjacent row carrier units 1
Bar 3, what described connection strap 3 was connected with described longitudinally connected portion connects end between the carrier unit that same string is adjacent.
Described lead frame 10 can be the metal materials such as copper, ferrum or aluminum, in the present embodiment, preferably copper.
It is provided with at least one hole 4, location on described connection framework 2, by increasing hole, location in overall structure, improves
Accuracy in carrier unit separation process, reduces deviation when carrier unit separates.
The carrier unit 1 of described same column is connected by longitudinally connected portion, so can avoid leakage during follow-up packing colloid
Glue phenomenon.
Described connection strap 3 can be level connection joint or dislocation connection.
Fig. 3 is the part A close-up schematic view shown in Fig. 2, in the present embodiment, as it is shown on figure 3, several supports described
Unit 1 forms the carrier unit array of 3 row × 2 row, the above and support list of the 3rd row of the carrier unit of described 1st row
Be provided with separately below and described 1st row and the 3rd row carrier unit of unit are the peripheral frame 2 of integrative-structure.
The carrier unit 1 of described same column is connected by longitudinally connected portion 5.
Described connection strap 3 is level connection joint, and the connection end P that described connection strap 3 is connected with described longitudinally connected portion is positioned at
With between the carrier unit that string is adjacent.In the present embodiment, two row carrier units 1 adjacent between colleague are respectively arranged with one
Connection strap 3, in other embodiments, it is also possible to being separated by between two or more carrier unit and arrange connection strap, connection strap also may be used
There to be other set-up mode, it is not limited to the present embodiment.Follow-up complete packaging technology after, be used for cutting chip device battle array
The width of row blade, more than or equal to the width of connection strap, so only needs to cut chip device battle array along connection strap in a lateral direction
Arrange and can form single chip device without carrying out longitudinal cutting, so can greatly improve production efficiency.Typically
In the case of, the width of cutter blade is 0.1mm or 0.2mm, when the width of cutter blade is 0.2mm, and described connection
The width of bar be less than or equal to 0.2mm, when the width of cutter blade is 0.1mm, the width of described connection strap less than or
Person is equal to 0.1mm, and the width of described connection strap needs the width preset according to cutter blade to determine, the width of described connection strap
It is not limited to the width of the present embodiment.
In other embodiments, as shown in Figure 4, the centre of the adjacent connection strap 3 set by two row carrier units can
To be provided with and the described connection strap 3 stiffener 6 in integrative-structure, the two ends of described stiffener 6 connect described external surrounding frame respectively
Frame, is so possible to prevent support to deform in potting process, improves the yield of product.
Described carrier unit includes the substrate of at least two mutually insulated.In the present embodiment, as it is shown in figure 5, described support
Unit includes that the substrate 11 of two mutually insulateds, described substrate 11 are provided with bending part.As shown in Figure 6, in the present embodiment, described
Bending part uses the mode of punching press to be formed, and is not limited to the present embodiment.Described bending part bending forms three parts, as shown in Figure 6, institute
Stating bending part include chip electrode portion 111 and lay portion 113, described chip mount portion 113 and electrode portion 111 pass through connecting portion
112 connect, and described connecting portion 112 forms bending with chip mount portion 113 and electrode portion 111 respectively.This chip mount portion 113 with
There is between this electrode portion 111 difference in height h, and this chip mount portion 113 is higher than this electrode portion 111, the bending of described substrate
Portion's shape is downward bending from the inside to surface.Height in this utility model embodiment, between chip mount portion 113 and electrode portion 111
Degree difference h is not more than 1.0 mm, if the height h of connecting portion 112 is too high, substrate can be made deformation occur when encapsulation, most typical
It is to cause the metal basal board part for chip placement to tilt, follow-up chip is installed and bonding wire craft causes serious
Impact directly influences finished product rate.The design of bending part adds the contact area of follow-up packing colloid and metal basal board,
And so that packing colloid coated metal substrate so that scolding tin, steam penetrate into device inside from lower to upper by certain
Resistance, hinder scolding tin, steam etc. enter device inside, increase device air-tightness.
In other embodiments, as it is shown in fig. 7, the bottom in described electrode of substrate portion 111 is also provided with protuberance
1111, described protuberance 1111 is arranged on the region, electrode portion beyond longitudinally connected portion, and described protuberance can be in the way of using punching press
Formed, be not limited to the present embodiment.In follow-up packaging technology, the packing colloid of bottom is hardly entered by the obstruction of protuberance
The bottom section in longitudinally connected portion, it is to avoid rosin joint phenomenon during paster occurs.
In other embodiments, described bending part can also arrange at least one through hole or groove structure, through hole and groove
Design support and packing colloid can be made more closely to combine with firm, it is not easy to loosen, improve the reliability of device.
Embodiment two
Also providing for a kind of chip device array in the present embodiment, it is passed through by a kind of sheet cribbing in described embodiment one
Encapsulation forms.(being not drawn into chip, gold thread and packing colloid in figure) as shown in Figure 2, described chip device array includes chip
Support, the LED chip being arranged on the carrier unit of described cribbing and to carrier unit, chip and gold described in major general
The packing colloid that line is encapsulated together.In other embodiments, when described LED chip is flip-chip, it is not necessary to gold thread.
When sheet cribbing encapsulates, fixing support by the upper die and lower die of mould, described packing colloid covers and is propping up
Above frame unit.In the present embodiment, the longitudinally connected portion of described chip device array is at least part of is exposed at packaging plastic
Outside body, it is possible to prevent packing colloid to ooze out at the gap at the edge, longitudinally connected portion of carrier unit, it is to avoid leakage glue occurs
Phenomenon.
Described packing colloid covers described protuberance, the so packing colloid of bottom and is hardly entered by the obstruction of protuberance vertical
To the bottom section of connecting portion, it is to avoid rosin joint phenomenon occurs during paster.
Embodiment three
Also providing for a kind of chip device in the present embodiment, it is passed through by a kind of chip device array in described embodiment two
Cutter carry out cutting along horizontal direction on chip device array and form, and described chip device, including carrier unit, setting
LED chip on described carrier unit and the packing colloid that LED chip is encapsulated together with gold thread.In other embodiments
In, when described LED chip is flip-chip, it is not necessary to gold thread.
In the present embodiment, (being not drawn into chip, gold thread and packing colloid in figure) as shown in Figure 2, described connection strap is water
Flat connect, what described connection strap was connected with described longitudinally connected portion connect end between the carrier unit that same string is adjacent,
Two row carrier units adjacent between colleague are respectively arranged with a connection strap.For cutting the width of chip device array blade
More than or equal to the width of connection strap, transverse cuts chip device array is the most only needed to get final product shape without carrying out longitudinal cutting
Become single chip device, so can greatly improve production efficiency.
As shown in Figure 8, described chip device 20, including carrier unit 201, it is arranged on described carrier unit 201
LED chip 202 and the packing colloid (not identifying in figure) that LED chip 202 is encapsulated together with gold thread 203.Described chip device
The longitudinally connected portion of part is at least part of to be exposed at outside packing colloid, when carrier unit 201 encapsulates, and upper mold B of mould
Support is fixed, then plastic packaging packing colloid, owing to having mould to block on carrier unit limit, it is ensured that longitudinally connect with lower mold B1
Connect and in portion, be not coated with packing colloid, be possible to prevent packing colloid along at the gap at the edge in the longitudinally connected portion of carrier unit
Ooze out, it is to avoid leakage glue phenomenon occurs.
Described chip device is provided with bending part so that chip device is when paster, and scolding tin is along the direction of shown by arrow
A-b-c climbs the full longitudinally connected portion not covering packing colloid, improves the reliability of paster, it is to avoid chip device occurs when paster
The phenomenon of rosin joint, is subject to it addition, the design of bending part makes scolding tin penetrate into device inside along the direction of arrow d from lower to upper
To certain resistance, hinder scolding tin, steam etc. and enter the inside of chip device, increase the reliability of chip device.
As it is shown in figure 9, described packing colloid cover described protuberance, the packing colloid of bottom by the obstruction of protuberance be difficult to into
Enter to longitudinally connected portion bottom section, it is to avoid rosin joint phenomenon occurs during paster.
Above this utility model is described in detail, literary composition is applied specific case to principle of the present utility model and reality
The mode of executing is set forth, and the explanation of above example is only intended to help to understand that method of the present utility model and core thereof are thought
Think.It should be pointed out that, for those skilled in the art, on the premise of without departing from this utility model principle,
This utility model can also be carried out some improvement and modification, these improve and modify and also fall into this utility model claim
In protection domain.
Claims (14)
1. a sheet cribbing, including the lead frame being made up of whole piece metallic plate, described lead frame is arranged with several
Frame unit, the carrier unit array of several carrier units described formation M row × N row, wherein M, N >=1, described 1st row
The carrier unit of the above and M row of carrier unit be provided with separately below with described 1st row and M row carrier unit in
The peripheral frame of integrative-structure, and the carrier unit of described same string is connected and into a single integrated structure longitudinally connected portion, its
It is characterised by: between described two adjacent row carrier units, be provided with at least one connection strap, described connection strap and described longitudinal direction
What connecting portion was connected connects end between the carrier unit that same string is adjacent.
A kind of sheet cribbing the most according to claim 1, it is characterised in that: described connection strap is level connection joint, goes together it
Between described two adjacent row carrier units be respectively arranged with a connection strap.
A kind of sheet cribbing the most according to claim 1, it is characterised in that: the width of described connection strap is less than or equal to
0.2mm 。
A kind of sheet cribbing the most according to claim 1, it is characterised in that: the width of described connection strap is less than or equal to
0.1mm 。
A kind of sheet cribbing the most according to claim 1, it is characterised in that: the centre of described connection strap is provided with described
Connection strap is the stiffener of integrative-structure, and the two ends of described stiffener connect described peripheral frame respectively.
A kind of sheet cribbing the most according to claim 1, it is characterised in that: described carrier unit includes that at least two is mutual
The substrate of insulation, described substrate is provided with bending part.
A kind of sheet cribbing the most according to claim 6, it is characterised in that: described bending part includes electrode portion and chip peace
Putting portion, described chip mount portion and electrode portion are connected by connecting portion, described connecting portion respectively with chip mount portion and electrode portion
Forming bending, have difference in height h between described chip mount portion and described electrode portion, described chip mount portion is higher than described electricity
Pole portion.
A kind of sheet cribbing the most according to claim 7, it is characterised in that: described electrode portion is provided with protuberance.
A kind of sheet cribbing the most according to claim 7, it is characterised in that: between described chip mount portion and electrode portion
Difference in height h is not more than 1.0 mm.
10. a chip device array, it is formed, including sheet by the arbitrary described a kind of sheet cribbing encapsulation of claim 1 to 9
Cribbing, the LED chip being arranged on the carrier unit of described cribbing and to carrier unit, chip one described in major general
Play the packing colloid of encapsulating.
11. a kind of chip device arrays according to claim 10, it is characterised in that: the longitudinal direction of described chip device array
Connecting portion is at least part of to be exposed at outside packing colloid.
12. 1 kinds of chip device arrays, it is encapsulated by a kind of sheet cribbing described in claim 8 and forms, including described chip
Support, the LED chip being arranged on the carrier unit of described cribbing and to carrier unit, chip described in major general together
The packing colloid of encapsulating；Described packing colloid covers described protuberance.
13. 1 kinds of chip devices, it is cut by a kind of chip device array described in claim 10 and forms, including described support
Unit, the LED chip being arranged on described carrier unit and the packing colloid that LED chip is encapsulated together.
14. 1 kinds of chip devices, it is cut by a kind of chip device array described in claim 12 and forms, including described chip
Support, the LED chip being arranged on the carrier unit of described cribbing and the packing colloid that LED chip is encapsulated together；
Described packing colloid covers described protuberance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620097762.2U CN205488205U (en) | 2016-02-01 | 2016-02-01 | Piece formula support, piece formula device array and piece formula device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620097762.2U CN205488205U (en) | 2016-02-01 | 2016-02-01 | Piece formula support, piece formula device array and piece formula device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488205U true CN205488205U (en) | 2016-08-17 |
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ID=56672989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620097762.2U Active CN205488205U (en) | 2016-02-01 | 2016-02-01 | Piece formula support, piece formula device array and piece formula device |
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| Country | Link |
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| CN (1) | CN205488205U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060988A (en) * | 2019-04-15 | 2019-07-26 | 佛山市国星光电股份有限公司 | A kind of LED support array, LED support, LED component and display screen |
| CN110416392A (en) * | 2019-07-30 | 2019-11-05 | 深圳市永裕光电有限公司 | A kind of 360 ° of light emitting diodes of encapsulation |
-
2016
- 2016-02-01 CN CN201620097762.2U patent/CN205488205U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060988A (en) * | 2019-04-15 | 2019-07-26 | 佛山市国星光电股份有限公司 | A kind of LED support array, LED support, LED component and display screen |
| CN110416392A (en) * | 2019-07-30 | 2019-11-05 | 深圳市永裕光电有限公司 | A kind of 360 ° of light emitting diodes of encapsulation |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |