CN104511703A - Ceramic head and lead wire bonder - Google Patents
Ceramic head and lead wire bonder Download PDFInfo
- Publication number
- CN104511703A CN104511703A CN201410233716.6A CN201410233716A CN104511703A CN 104511703 A CN104511703 A CN 104511703A CN 201410233716 A CN201410233716 A CN 201410233716A CN 104511703 A CN104511703 A CN 104511703A
- Authority
- CN
- China
- Prior art keywords
- ceramic head
- pore
- burning ball
- passage
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides a ceramic head and a lead wire bonder. The ceramic head is internally provided with a burning ball chamber for forming a burning ball, a first surface is provided with a first vent in communication with the burning ball chamber, the inside of the ceramic head is also provided with a first channel for filling protective gas into the burning ball chamber, the first surface is further provided with a second vent, and the inside of the ceramic head is further provided with a second channel for filling protective gas into the second vent. The lead wire bonder comprises the ceramic head. According to the ceramic head, two ways of gas are used for respectively protecting a burning ball area and a bonding wire area and respectively controlling the gas use amount for further achieving the best protection effect with minimal gas consumption. When the ceramic head is used for copper wire welding, the protective gas forms an inert reducing atmosphere at the position of the burning ball to prevent a copper wire from being oxidized, and meanwhile, the protective gas forms an annular gas flow and reaches the bonding wire area to prevent the copper wire from being oxidized, so that the two ways of protective gas are used together for ensuring the quality of copper wire welding.
Description
Technical field
The present invention relates to the welding of essential electronic element, particularly relate to a kind of ceramic head and lead-in wire bonding equipment.
Background technology
Full-automatic lead bonding equipment is the semiconductor production equipment connecting chip bonding pad and package pins with metal lead wire.At present along with the requirement of semi-conductor market to cost is more and more harsher, mainstream vendor carrys out alternative gold thread at the cheaper bonding wire material of searching.Through great many of experiments, find that copper cash has better electric property compared with gold thread, and cost is well below gold thread, copper wire welding becomes a kind of development trend thus.
But there is a critical defect in copper wire welding---be easily oxidized.When the ceramic head by prior art utilizes conventional method to carry out copper wire welding, weld bonds face easily forms oxide layer film, affects adhesion strength, and then affects product quality.The main flow way solved the problem at present blows protective gas to bonding wire region; welding quality is ensured with this, but owing to being single channel gas, so gas flow can not control the protection requirement adapting to different parts respectively; gas consumption is large, and protected effect is undesirable.
Summary of the invention
The object of the present invention is to provide a kind of ceramic head and the lead-in wire bonding equipment that more fully can ensure welding quality.
Ceramic head of the present invention; the inside of described ceramic head is provided with the burning ball chamber for the formation of burning ball; the first surface of described ceramic head is provided with the first pore be communicated with described burning ball chamber; the inside of described ceramic head is also provided with the first passage for passing into protective gas to described burning ball chamber; described first surface is also provided with the second pore, and the inside of described ceramic head is also provided with the second channel for passing into protective gas to described second pore.
Ceramic head of the present invention, wherein, the second surface corresponding with first surface of described ceramic head is provided with the 3rd pore be communicated with described burning ball chamber.
Ceramic head of the present invention, wherein, described first pore is not communicated with described second pore.
Ceramic head of the present invention, wherein, described second pore is multiple, multiple second pore at described first surface around described first pore, multiple second pore all with the cavity connects of inside being positioned at described ceramic head, described cavity is communicated with described second channel.
Ceramic head of the present invention, wherein, described second channel is parallel with described first passage.
Ceramic head of the present invention, wherein, is provided with igniting needle in described first passage, and described igniting needle stretches to described burning ball chamber.
Ceramic head of the present invention, wherein, is provided with keeper between the inwall of described igniting needle and described first passage, with the center keeping described igniting needle to be positioned at described first passage.
Ceramic head of the present invention, wherein, described keeper is circular, the center of described keeper is provided with the centre bore passed for described igniting needle, the periphery wall of described keeper and the inwall of described first passage are fitted, with the center keeping the described igniting needle in described centre bore to be positioned at described first passage.
Ceramic head of the present invention, wherein, the connection first surface of described ceramic head, the 3rd of second surface the is provided with the groove for connecting tracheae on the surface, the first end of described second channel and described cavity connects, and the first end of described second channel is communicated with the circular hole of the bottom land of described groove.
Lead-in wire bonding equipment of the present invention, comprises ceramic head, and described ceramic head is ceramic head of the present invention.
Ceramic head of the present invention adopts two-way gas to protect burning ball region and bonding wire region respectively, controls gas usage respectively, reaches best protected effect with minimum air consumption.
Lead-in wire bonding equipment of the present invention is because have employed lead-in wire bonding equipment of the present invention, and obtain better protected effect, its product quality is greatly improved.
When utilizing ceramic head of the present invention to carry out copper wire welding, protective gas forms inertia reduction atmosphere at burning ball position, prevents copper cash be oxidized, can also reduce the oxide layer of copper line surface, guarantees burning ball quality, prevents spherical situation about differing; Meanwhile, protective gas arrives ceramic head front end and forms annular airflow, and arrives bonding wire region, and when preventing from welding, copper cash is oxidized, and copper wire welding quality is guaranteed in this two-way protective gas acting in conjunction.
Accompanying drawing explanation
Fig. 1 is the front view of the structural representation of the embodiment of ceramic head of the present invention;
Fig. 2 is the main sectional view of the structural representation of the embodiment of ceramic head of the present invention;
Fig. 3 is the top view of the structural representation of the embodiment of ceramic head of the present invention;
Fig. 4 is the B-B sectional view of Fig. 3;
Fig. 5 is the C-C sectional view of Fig. 1.
Detailed description of the invention
The embodiment of lead-in wire bonding equipment of the present invention, comprises the embodiment of ceramic head of the present invention.
As shown in Figure 1, Figure 2, Figure 5, the embodiment of ceramic head of the present invention is cube structure, comprises first surface 11, the second surface 12 relative with first surface 11 and connects the side of first surface 11 and second surface 12.
The inside of the embodiment of ceramic head of the present invention is provided with the burning ball chamber 1 for the formation of burning ball; the first surface 11 of the embodiment of ceramic head of the present invention is provided with and the first pore 2 burning ball chamber 1 and be communicated with; the inside of the embodiment of ceramic head of the present invention is also provided with the first passage 21 for passing into protective gas to burning ball chamber 1; first surface 11 is also provided with the second pore 3, the inside of the embodiment of ceramic head of the present invention is also provided with the second channel 22 for passing into protective gas to the second pore 3.
Ceramic head of the present invention adopts two-way gas to protect burning ball region and bonding wire region respectively, controls gas usage respectively, reaches best protected effect with minimum air consumption.
When utilizing ceramic head of the present invention to carry out copper wire welding, protective gas arrives the burning ball chamber 1 for the formation of burning ball via the first passage 21 of ceramic head---burn ball position, inertia reduction atmosphere is formed at burning ball position, copper cash is prevented to be oxidized, can also reduce the oxide layer of copper line surface, guarantee to burn ball quality, prevent spherical situation about differing; Meanwhile, protective gas arrives ceramic head front end formation annular airflow via the second channel 22 of ceramic head, and arrives bonding wire region, and when preventing from welding, copper cash is oxidized.Copper wire welding quality is guaranteed in this two-way protective gas acting in conjunction.
The embodiment of ceramic head of the present invention, wherein, the second surface 12 corresponding with first surface 11 of ceramic head is provided with and the 3rd pore 4 burning ball chamber 1 and be communicated with.
The embodiment of ceramic head of the present invention, wherein, the diameter of the second pore 3 is less than the diameter burning ball chamber 1, and like this when utilizing ceramic head of the present invention to carry out copper wire welding, gas forms eddy airstream in burning ball chamber 1.Because the opening of the second pore 3 is less, can effectively prevent gas from flowing out fast, realize making full use of protection gas.
The embodiment of ceramic head of the present invention, wherein, the first pore 2 is not communicated with the second pore 3.
The embodiment of ceramic head of the present invention, wherein, the second pore 3 is multiple, multiple second pore 3 at first surface 11 around the first pore 2.In multiple second pore 3, the distance between the second adjacent pore 3 is all equal, ensures the uniform stream flowed out thus.Multiple second pore 3 is all communicated with the cavity 6 of the inside being positioned at ceramic head, and cavity 6 is communicated with second channel 22.
The embodiment of ceramic head of the present invention is flat box-like, and the area of first surface 11 second surface 12 is comparatively large, and the area of side is less.
Side comprise connect successively the 3rd surface 13, the 4th surface 16, the 5th surface 14 and the 6th surface 17, wherein the 3rd surface 13 is surperficial 14 corresponding with the 5th.Ceramic head of the present invention comprises for the formation of the burning burning pommel 10 of ball and the link 40 for passing into protective gas; 5th surface 14 is positioned at burns on pommel 10; 3rd surface 13 is positioned on link 40; 5th surface 14 is arc surface; the width burning pommel 10 is greater than the width of link 40; ensure the formation of eddy airstream thus, realize making full use of protection gas better.
The embodiment of ceramic head of the present invention; wherein; burn ball chamber 1, cavity 6 all in the inside of burning pommel 10, its cavity 6 is burning between ball chamber 1 and the 5th surface 14, accordingly; the line of the axis of multiple second pore 3 forms a circular arc; above-mentioned circular arc is between the first pore 2 and the 5th surface 14, and above-mentioned circular arc is to the first pore 2 semi-surrounding, ensures the formation of eddy airstream thus further; strengthen protected effect, realize making full use of protection gas better.
The embodiment of ceramic head of the present invention, wherein, second channel 22 is parallel with first passage 21.
The embodiment of ceramic head of the present invention, wherein, be provided with igniting needle 30 in first passage 21 is logical, igniting needle 30 stretches to and burns ball chamber 1.
The embodiment of ceramic head of the present invention, wherein, the extended line of igniting needle 30 is all crossing with the axis of the axis and the first pore 2 of burning ball chamber 1, and the extended line of igniting needle 30 is all vertical with the axis of the axis and the first pore 2 of burning ball chamber 1.
Shown in composition graphs 3, Fig. 4, the embodiment of ceramic head of the present invention, wherein, is provided with keeper 7 between the inwall of igniting needle 30 and first passage 21, for the center keeping igniting needle 30 to be positioned at first passage 21.Keeper 7 is circular, the center of keeper 7 is provided with the centre bore 71 passed for igniting needle 30, the periphery wall of keeper 7 and the inwall of first passage 21 are fitted, igniting needle 30, through the centre bore of keeper 7, keeps the igniting needle 30 in centre bore 71 to be positioned at the center of first passage 21 thus.
Devise keeper 7 in the embodiment of ceramic head of the present invention, under the prerequisite not affecting air-flow size, realize the location to igniting needle 30, the uniformity of protected effect and burning ball can be guaranteed under this design.
The embodiment of ceramic head of the present invention, wherein, the connection first surface 11 of ceramic head, the 3rd surface 13 of second surface 12 are provided with the groove 9 for connecting tracheae, the first end of second channel 22 is communicated with cavity 6, and the second end of second channel 22 is communicated with the circular hole of the bottom land 91 of groove 9.
Ceramic head of the present invention, effectively prevents copper cash to be oxidized at burning ball and bonding wire region, improves adhesion strength, and then improve bonding wire quality.
The burning pommel 10 of ceramic head of the present invention is opened two gas flows, ball region is burnt in a road protection, and the lower gas hole of hoop of separately leading up to arrangement is to protect welding region.
Ceramic head of the present invention and lead-in wire bonding equipment adopt two-way gas to protect burning ball region and bonding wire region respectively, control gas usage respectively, reach best protected effect with minimum air consumption.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a ceramic head; the inside of described ceramic head is provided with the burning ball chamber for the formation of burning ball; the first surface of described ceramic head is provided with the first pore be communicated with described burning ball chamber; the inside of described ceramic head is also provided with the first passage for passing into protective gas to described burning ball chamber; it is characterized in that; described first surface is also provided with the second pore, and the inside of described ceramic head is also provided with the second channel for passing into protective gas to described second pore.
2. ceramic head according to claim 1, is characterized in that, the second surface corresponding with first surface of described ceramic head is provided with the 3rd pore be communicated with described burning ball chamber.
3. ceramic head according to claim 1, is characterized in that, described first pore is not communicated with described second pore.
4. ceramic head according to claim 1, it is characterized in that, described second pore is multiple, multiple second pore at described first surface around described first pore, multiple second pore all with the cavity connects of inside being positioned at described ceramic head, described cavity is communicated with described second channel.
5. ceramic head according to claim 1, is characterized in that, described second channel is parallel with described first passage.
6. ceramic head according to claim 1, is characterized in that, is provided with igniting needle in described first passage, and described igniting needle stretches to described burning ball chamber.
7. ceramic head according to claim 6, is characterized in that, is provided with keeper between the inwall of described igniting needle and described first passage, with the center keeping described igniting needle to be positioned at described first passage.
8. ceramic head according to claim 7, it is characterized in that, described keeper is circular, the center of described keeper is provided with the centre bore passed for described igniting needle, the periphery wall of described keeper and the inwall of described first passage are fitted, with the center keeping the described igniting needle in described centre bore to be positioned at described first passage.
9. ceramic head according to claim 8, it is characterized in that, the connection first surface of described ceramic head, the 3rd of second surface the is provided with the groove for connecting tracheae on the surface, the first end of described second channel and described cavity connects, the first end of described second channel is communicated with the circular hole of the bottom land of described groove.
10. a lead-in wire bonding equipment, comprises ceramic head, and described ceramic head is the ceramic head as described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410233716.6A CN104511703B (en) | 2013-09-30 | 2014-05-29 | Ceramic head and lead wire bonder |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461710X | 2013-09-30 | ||
| CN201310461710 | 2013-09-30 | ||
| CN201410233716.6A CN104511703B (en) | 2013-09-30 | 2014-05-29 | Ceramic head and lead wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104511703A true CN104511703A (en) | 2015-04-15 |
| CN104511703B CN104511703B (en) | 2017-02-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410233716.6A Expired - Fee Related CN104511703B (en) | 2013-09-30 | 2014-05-29 | Ceramic head and lead wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104511703B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790977A (en) * | 2020-06-05 | 2020-10-20 | 陶勇彬 | Ceramic nozzle device for wire bonding machine |
| CN112756827A (en) * | 2020-12-26 | 2021-05-07 | 上海仪电智能电子有限公司 | Discharge gas protection device for wire bonding lead welding and welding method |
| CN117123984A (en) * | 2023-10-27 | 2023-11-28 | 宁波尚进自动化科技有限公司 | Binary channels nitrogen protection device |
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| CN102554526A (en) * | 2012-01-18 | 2012-07-11 | 福建福顺半导体制造有限公司 | Copper ball protection method for copper wire bonding of semiconductor device and protection device thereof |
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2014
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| CN112756827A (en) * | 2020-12-26 | 2021-05-07 | 上海仪电智能电子有限公司 | Discharge gas protection device for wire bonding lead welding and welding method |
| CN117123984A (en) * | 2023-10-27 | 2023-11-28 | 宁波尚进自动化科技有限公司 | Binary channels nitrogen protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104511703B (en) | 2017-02-15 |
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Granted publication date: 20170215 Termination date: 20180529 |