CN201590897U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
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- CN201590897U CN201590897U CN2010200001285U CN201020000128U CN201590897U CN 201590897 U CN201590897 U CN 201590897U CN 2010200001285 U CN2010200001285 U CN 2010200001285U CN 201020000128 U CN201020000128 U CN 201020000128U CN 201590897 U CN201590897 U CN 201590897U
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Abstract
The utility model provides an MEMS microphone, which comprises a circuit board and an outer casing fixedly connected with the circuit board. The circuit board is combined with an opening end of the outer casing to form a packaging structure of the MEMS microphone, an annular insulating adhesive glue layer is arranged between the circuit board and the opening end of the outer casing, and a capacitor is formed by the surface of the opening end of the outer casing, the annular insulating adhesive glue layer and a position, combined with the opening end of the outer casing, on the circuit board. The MEMS microphone adopts insulating adhesive glue between the outer casing and the circuit board without using conductive adhesive with high limitation and cost and poor adhesive effect, has simple adhesive technique in the technical scheme, lowers production cost and favors large-scale popularization of the MEMS microphone.
Description
Technical field
The utility model relates to a kind of microphone, relates in particular to a kind of MEMS microphone.
Background technology
In recent years, utilize the integrated MEMS microphone of MEMS (MEMS (micro electro mechanical system)) technology to begin to be applied in batches in the electronic products such as mobile phone, notebook, the high-temperature resistant result of this microphone is good, can withstand the high temperature test of SMT technology.The general structure of this product is exactly to utilize a wiring board and shell to constitute a cavity and the encapsulation that becomes the MEMS microphone, on the outer surface of wiring board, pad can be set, be used for fixing the MEMS microphone and be electrically connected to external circuit, MEMS acoustics chip is installed in the inside of cavity, and the encapsulation of microphone is provided with the permeate chamber inside and outside and is used to receive the sound hole of external sound signal.Be subjected to the influence of outside electromagnetic interference for fear of the MEMS microphone, general design is by shell that adopts the metallic conduction material or nonmetallic materials metal conducting layer to be set to constitute shell, and the conduction of the metal level on shell and the wiring board is joined together to form a shielding cavity resists electromagnetic interference, for example patent documentation 1 discloses a kind of structure of this series products.
The structure of patent documentation 1 disclosed a kind of silicon microphone as depicted in figs. 1 and 2, the circular groove shape metal shell 110 of MEMS microphone is welded to by two interim solder joints 130 of laser on the square wiring board 120 that MEMS acoustics and asic chip are installed, and with adhesive 140 shell 110 and wiring board 120 is bonded together the encapsulating structure that forms the MEMS microphone then.
This structure at first utilizes interim solder joint 130 that shell and wiring board is tentatively fixing and be electrically connected, and utilizes adhesive 140 to link together between the two then.The manufacturing process of obvious this structure is comparatively complicated, is unfavorable for the control of cost.
In addition, also have some designs directly shell and wiring board to be fixed, bonded together, but conducting resinl does not generally have too strong caking property and firmness, causes the anti-push-pull effort between shell and the wiring board not enough with conducting resinl; If shell and wiring board are welded together with solder(ing) paste, then the MEMS microphone is when being applied to the client product, the process that also needs a high-temperature soldering, in the process of temperature acute variation, thereby solder(ing) paste melts and is subjected to the impact distortion of the air-flow of MEMS microphone inside and outside balance easily, MEMS microphone even can produce the harmful effect of gas leakage.
Given this, need a kind of electromagnetic interference that should resist respond well, with low cost, can make things convenient for SMT to install again, and the good MEMS microphone of reliability.
Patent documentation 1: Chinese invention patent discloses CN1933680 number.
The utility model content
In order to realize above-mentioned utility model purpose, the utility model proposes following solution.
The utility model provides a kind of MEMS microphone, comprise wiring board and the shell of fixedlying connected with described wiring board, the openend of described wiring board and described shell is combined together to form the encapsulating structure of MEMS microphone, and: be provided with annular insulation adhesive glue-line between the openend of wiring board and described shell, position three parts that combine with the openend of described shell on the openend surface of described shell, annular insulation adhesive glue-line and the described wiring board constitute a capacitor.
Wherein, the position that wiring board combines with the openend of described shell is provided with the annular conductive layer of ground connection, and the openend surface of shell is annular conductive surface.
In addition, preferably, the openend of described shell is provided with the flange of bending.
In addition, preferably, the thickness of described annular insulation adhesive glue-line is 5 microns-50 microns.
In addition, preferably, the thickness of described annular insulation adhesive glue-line is 10 microns-50 microns.
In addition, preferably, described shell is a metal shell.
In addition, preferably, described glue line is a low temperature bonding glue.
In addition, preferably, described glue line is an epoxide-resin glue.
According to aforesaid MEMS microphone, after the openend of wiring board and groove form casing combines, annular insulation adhesive glue-line becomes the medium between the annular conductive layer of ground connection of shell aperture end ring shape conductive layer and PCB surface, thereby, the two forms a capacitor, when extraneous electromagnetic signal transmission arrives external conductive casing, because shell aperture end and PCB surface have formed a capacitor, AC signal is transferred on the ground connection annular metal level of PCB surface by this capacitor, finally absorbed, can't have influence on the MEMS microphone by the grounding electrode of MEMS microphone.
And the utility model adopts insulation adhesive glue between shell and wiring board, can adopt various adhesive properties material preferably, does not need to adopt the conducting resinl that limitation is stronger, with high costs and bond effect is bad; The technical solution of the utility model bonding process is simple, has reduced production cost, helps the large-scale promotion of MEMS microphone.
Description of drawings
By below in conjunction with accompanying drawing embodiment being described, above-mentioned feature of the present utility model and technological merit will become apparent and understand easily.
Fig. 1 is a structural representation of representing MEMS microphone in the past;
Fig. 2 is a decomposing schematic representation of representing MEMS microphone in the past;
Fig. 3 is the structural representation of the MEMS microphone that relates to of expression first embodiment of the present utility model;
Fig. 4 is the structural representation of the square wiring board in expression the utility model;
Fig. 5 is the schematic diagram of the structure of the MEMS microphone that relates to of expression second embodiment of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is done further detailed description.
First embodiment:
Fig. 3 is the schematic diagram of the concrete structure of the MEMS microphone that relates to of expression first embodiment of the present utility model.As shown in Figure 3, the MEMS microphone that the utility model relates to, comprise a square groove shape shell 1 and a square wiring board 3, the openend 11 of described shell 1 and square wiring board 3 bond together the square cavity that forms the MEMS microphone, are provided with the MEMS acoustics chip 2 and an ASIC 4 who is used for amplification signal that voice signal can be converted to the signal of telecommunication in cavity.Shell 1 is provided with the sound hole 5 that is used to receive the external voice signal.And the position that wiring board 3 combines with the openend 11 of shell 1 is provided with the annular conductive layer 31 of ground connection, and openend 11 surface design of shell are annular conductive surface, is provided with annular insulation adhesive glue-line 6 between the openend 11 of wiring board 3 and shell 1.
Wherein, the structure of square wiring board 3 as shown in Figure 3, the annular conductive layer 31 of ground connection is arranged on the peripheral position on the wiring board 3, is convenient to agree with bonding with shell 1.
By this design, combine by annular insulation adhesive glue-line 6 at the openend 11 of wiring board 3 with shell 1, medium between the openend 11 that annular insulation adhesive glue-line 6 becomes shell 1 and the annular conductive layer 31 of ground connection on wiring board 3 surfaces, thereby, the two forms a capacitor, when extraneous electromagnetic signal transmission arrives external conductive casing, because shell aperture end and PCB surface have formed a capacitor, AC signal is transferred on the ground connection annular metal level of PCB surface by this capacitor, finally absorbed, can't have influence on the MEMS microphone by the grounding electrode of MEMS microphone.
Need to prove, in the present embodiment, be to utilize ground connection annular conductive layer to be set on wiring board 3, annular conductive surface and the middle annular bonding glue-line that insulate is set on the surface of the openend of shell forms capacitor, but can also other mode form the surface of conduction in the insulate both sides of bonding glue-line of annular, thereby in conjunction with forming capacitor arrangement, such as increasing modes such as endless metal pad, surface metalation or semi-metal,, the bonding glue-line that can insulate with the annular that is used for bonding shell and wiring board forms capacitor as long as being medium.
General all is conduction to connect for the requirement of electromagnetic interference shield in the industry, the utility model is created the ground connection of then utilizing a capacitor that forms naturally to realize electromagnetic interference signal, so not only avoided the harmful effect of high-temperature soldering to the MEMS microphone generating, also avoided since the caking property of conducting resinl and firmness not enough the not enough defective of anti-push-pull effort between the shell that causes and the wiring board; And anti-electromagnetic interference is respond well, and insulating binder is with low cost, and its requirement to technique for sticking is also simple than conducting resinl, and convenient SMT installs.
In the implementation case, shell is preferably metal shell, in fact, also can adopt for example shell of resin material of insulation material, in case surface or inside metal level formation shielding construction is set.
In the implementation case, glue line preferably adopts low temperature bonding glue, can avoid the harmful effect of high temperature bonding to the MEMS microphone generating, and can be so that the technology when combining between shell and the wiring board is simple.More preferably epoxide-resin glue, adhesive property is good under its low temperature, and bonding can not be subjected to the influence of high temperature impact after fixing, and the later stage that is fit to the MEMS microphone is installed application requirements.
In the implementation case, the thickness of glue line is preferably 5 microns-100 microns, and designer of the present utility model draws the effect that can realize that under this thickness the utility model is created through multiple authentication; In addition, the thickness of glue line is 10 microns-50 microns can access better anti-electromagnetic interference effect, and the more or less freely realization of the bonding process under this thickness.
Second embodiment:
Fig. 5 is the schematic diagram of the concrete structure of the MEMS microphone that relates to of expression second embodiment of the present utility model.As shown in Figure 5, the MEMS microphone, comprise a groove form casing 1 and a wiring board 3, the openend 11 of shell 1 and wiring board 3 bond together the cavity that forms the MEMS microphone, are provided with the MEMS acoustics chip 2 and an ASIC 4 who is used for amplification signal that voice signal can be converted to the signal of telecommunication in cavity.Shell 1 is provided with the sound hole 5 that is used to receive the external voice signal.And, the position that wiring board 3 combines with the openend 11 of shell 1 is provided with the annular conductive layer 31 of ground connection, the surface of the openend 11 of shell is set to annular conductive surface, is provided with the annular insulation adhesive glue-line 6 that is used for bonding shell 1 and wiring board 3 between the openend 11 of wiring board 3 and shell 1.
Different with first embodiment is that the openend 11 of MEMS microphone case 1 is provided with the flange 12 of outside bending.This design can be so that the contact area between the openend 11 of shell 1 and the wiring board 3 increases, the corresponding bond area that increased, can so that the mechanical structure of product more fastness, reduce the bonding process difficulty, also can make anti-electromagnetic interference better effects if in addition.
This second embodiment combines by annular insulation adhesive glue-line 6 and forms a capacitor at the openend 11 of wiring board 3 and shell 1 equally, medium between the openend 11 that annular insulation adhesive glue-line 6 becomes shell 1 and the annular conductive layer 31 of ground connection on wiring board 3 surfaces, when extraneous electromagnetic signal transmission arrives external conductive casing, the ground connection of realizing electromagnetic interference signal with a capacitor that forms naturally, AC signal is transferred on the ground connection annular metal level of PCB surface by this capacitor, finally absorbed, can't have influence on the MEMS microphone by the grounding electrode of MEMS microphone.
Equally, further be, the harmful effect of high-temperature soldering to the MEMS microphone generating not only avoided in such design, also avoided because caking property and the shell that restriction causes of firmness deficiency and the not enough defective of anti-push-pull effort between the wiring board of conducting resinl; And this anti-electromagnetic interference of capacitor conduction of utilizing is respond well, and insulating binder is with low cost, and its requirement to technique for sticking is also simple than conducting resinl, and convenient SMT installs.
In the implementation case, shell is preferably metal shell equally, also can adopt for example shell of resin material of insulation material, in case surface or inside metal level formation shielding construction is set.
Glue line preferably adopts low temperature bonding glue, can be so that the technology when combining between shell and the wiring board is simple.More preferably epoxide-resin glue, adhesive property is good under its low temperature, and bonding can not be subjected to the influence of high temperature impact after fixing, and the later stage that is fit to the MEMS microphone is installed application requirements.
The thickness of glue line is preferably 5 microns-100 microns, can realize the effect that the utility model is created under this thickness; More preferably, the thickness setting of glue line is 10 microns-50 microns, and this thickness can access better anti-electromagnetic interference effect, and the bonding process that this thickness is implemented is down realized more easily.
In addition, in the various embodiments described above, the position in the sound hole 5 of MEMS microphone is not limited to a certain ad-hoc location of shell or wiring board, also is not to be defined in only to be provided with one, and its position and quantity can be determined flexibly according to the actual demand of MEMS microphone products.
Under above-mentioned instruction of the present utility model; those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description; and these improvement and distortion; all drop in the protection range of the present utility model; those skilled in the art should be understood that; above-mentioned specific descriptions are just better explained the purpose of this utility model, and protection range of the present utility model is limited by claim and equivalent thereof.
Claims (8)
1. a MEMS microphone comprises wiring board (3) and the shell (1) of fixedlying connected with described wiring board, and the openend of described wiring board and described shell (11) is combined together to form the encapsulating structure of MEMS microphone, it is characterized in that,
Be provided with annular insulation adhesive glue-line (6) between the openend of described wiring board and described shell, the openend of described shell (11) surface, annular insulation adhesive glue-line (6) and described wiring board (3) are gone up position three parts that combine with the openend of described shell and are constituted a capacitor.
2. according to the described MEMS microphone of claim 1, it is characterized in that,
Described wiring board (3) is gone up the annular conductive layer (31) that the position that combines with the openend of described shell is provided with ground connection, and the openend of described shell (11) surface is annular conductive surface.
3. according to the described MEMS microphone of claim 2, it is characterized in that,
The openend of described shell (11) is provided with the flange (12) of bending.
4. according to claim 2 or 3 described MEMS microphones, it is characterized in that,
The thickness of described annular insulation adhesive glue-line is 5 microns-100 microns.
5. according to claim 2 or 3 described MEMS microphones, it is characterized in that,
The thickness of described annular insulation adhesive glue-line is 10 microns-50 microns.
6. according to the described MEMS microphone of claim 5, it is characterized in that,
Described glue line is a low temperature bonding glue.
7. according to claim 2 or 3 described MEMS microphones, it is characterized in that,
Described glue line is an epoxide-resin glue.
8. according to claim 2 or 3 described MEMS microphones, it is characterized in that,
Described shell (1) is a metal shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200001285U CN201590897U (en) | 2010-01-05 | 2010-01-05 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200001285U CN201590897U (en) | 2010-01-05 | 2010-01-05 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201590897U true CN201590897U (en) | 2010-09-22 |
Family
ID=42750691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200001285U Expired - Lifetime CN201590897U (en) | 2010-01-05 | 2010-01-05 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201590897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118674A (en) * | 2010-01-05 | 2011-07-06 | 歌尔声学股份有限公司 | MEMS microphone and encapsulation method thereof |
| CN113194369A (en) * | 2021-03-25 | 2021-07-30 | 闻泰通讯股份有限公司 | Microphone |
-
2010
- 2010-01-05 CN CN2010200001285U patent/CN201590897U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118674A (en) * | 2010-01-05 | 2011-07-06 | 歌尔声学股份有限公司 | MEMS microphone and encapsulation method thereof |
| CN102118674B (en) * | 2010-01-05 | 2016-02-10 | 歌尔声学股份有限公司 | A kind of MEMS microphone and method for packing thereof |
| CN113194369A (en) * | 2021-03-25 | 2021-07-30 | 闻泰通讯股份有限公司 | Microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20100922 Effective date of abandoning: 20100105 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |