CN106454669B

CN106454669B - MEMS microphone encapsulation

Info

Publication number: CN106454669B
Application number: CN201611110804.2A
Authority: CN
Inventors: 王志超
Original assignee: Wuxi Red Microelectronics Corp Co ltd
Current assignee: Wuxi Red Microelectronics Corp Co ltd
Priority date: 2016-12-06
Filing date: 2016-12-06
Publication date: 2022-05-27
Anticipated expiration: 2036-12-06
Also published as: CN106454669A

Abstract

The invention provides an MEMS microphone package which is simple in structure, adopts a general MEMS chip and an ASIC chip, does not increase the package cost, enables the transmission loss and interference of electric signals to be reduced to the minimum, has good transmission performance, and ensures the reliability of electric signal transmission, and comprises an upper PCB and a lower PCB, wherein the upper PCB is provided with the MEMS chip and the ASIC chip, the MEMS chip and the ASIC chip are connected through a lead, the ASIC chip is connected with an upper bonding pad arranged on the upper PCB through a lead, and a copper layer is arranged between the upper PCB and the lower PCB, and the MEMS microphone package is characterized in that: through holes are respectively arranged to sequentially penetrate through the upper PCB, the copper layer and the lower PCB, and the through holes are connected with back bonding pads arranged on the back of the lower PCB.

Description

MEMS microphone encapsulation

Technical Field

The invention relates to the technical field of acoustoelectric products, in particular to an MEMS microphone package.

Background

With the rapid development of electronic technology, MEMS (micro electro mechanical system) microphones are increasingly widely used due to their advantages of small size, convenience for SMT (surface mount technology) installation, high temperature resistance, good stability, high degree of automation, and suitability for mass production.

The schematic diagram of the existing MEMS microphone PCB in the prior art is shown in fig. 1, a MEMS chip 2 and an ASIC (application specific integrated circuit) chip 3 are connected to each other on the PCB, an output port, a GND port, and a VDD port of the ASIC chip are connected to a front pad 13 of the PCB, and the front pad is connected to an external component after being connected to a back pad 11 of the PCB through a copper layer 14 disposed in the PCB.

Disclosure of Invention

In view of the above problems, the present invention provides an MEMS microphone package, which has a simple structure, uses a general MEMS chip and an ASIC chip, does not increase the package cost, minimizes the transmission loss and interference of electrical signals, has good transmission performance, and ensures the reliability of electrical signal transmission.

The technical scheme is as follows: the utility model provides a MEMS microphone package, includes upper PCB board and lower floor's PCB board, be provided with MEMS chip and ASIC chip on the upper PCB board, the MEMS chip with connect through the wire between the ASIC chip, the ASIC chip passes through the wire and connects the setting and be in upper pad on the upper PCB board, the upper PCB board with be equipped with the copper layer between the lower floor's PCB board, its characterized in that: through holes are respectively arranged to sequentially penetrate through the upper PCB, the copper layer and the lower PCB, and the through holes are connected with back bonding pads arranged on the back of the lower PCB.

Furthermore, the BIAS port of the MEMS chip is connected with the BIAS port of the ASIC chip through a wire, and the VOUT port of the MEMS chip is connected with the MICIN port of the ASIC chip through a wire.

Further, the VDD port of ASIC chip sets up through the wire connection the positive VDD pad of upper PCB board, the OUT port of ASIC chip sets up through the wire connection the positive output pad of upper PCB board, the GND port of ASIC chip sets up through the wire connection the positive ground pad of upper PCB board.

Furthermore, the VDD pad is connected and arranged on a first copper layer between the upper PCB and the lower PCB, and a first through hole sequentially penetrates through the upper PCB, the first copper layer and the lower PCB and is connected with a back pad arranged on the back of the lower PCB.

Furthermore, the output pad is connected with a second copper layer arranged between the upper PCB and the lower PCB, and a second through hole sequentially penetrates through the upper PCB, the second copper layer and the lower PCB and is connected with a back pad arranged on the back of the lower PCB.

Furthermore, the wire is a gold wire.

According to the MEMS microphone package, the through hole is formed in the PCB, so that electric signals are conducted out of the ASIC chip and then conducted to the back bonding pad from the front bonding pad of the PCB through the copper layer between the PCBs and then conducted to the back bonding pad through the through hole, the electric signals can be directly transmitted through the through hole, extra packaging cost is not required to be added, the production cost is low, and the market release period is short. Each functional module can be designed in advance respectively, and can adopt a large number of existing general MEMS chips and ASIC chips in the market, so that the cost is effectively reduced, the design period is shortened, the market is fast, the development requirements of miniaturization and miniaturization in the current electronic industry are met, compared with the existing MEMS microphone, the MEMS microphone conducts electric signals through a whole copper layer, the electric signal transmission consumption is low, the signals are small in interference, the electric signal distortion cannot be caused, the heat productivity is greatly reduced, and the performance and the reliability of the product are greatly improved; it comprehensively utilizes a plurality of process technologies such as microelectronics, solid electronics and the like, and fully exerts the advantages of various processes. Thereby improving the comprehensive performance of the system; the electronic system is easy to realize miniaturization, light weight, high performance and high reliability, and is particularly suitable for occasions with strict requirements on volume, weight and environment, such as mobile phones, computers, portable electronic wearable equipment and the like.

Drawings

FIG. 1 is a schematic diagram of a conventional MEMS microphone package structure;

fig. 2 is a schematic view of a MEMS microphone package structure according to the present invention.

Detailed Description

Referring to fig. 2, a MEMS microphone package, including an upper PCB 1 and a lower PCB, the upper PCB 1 is provided with a MEMS chip 2 and an ASIC chip 3, the ASIC chip is NJU72082G, the MEMS chip is NJD3005e, a BIAS port of the MEMS chip 2 is connected to a BIAS port of the ASIC chip 3 through a gold wire 4, a VOUT port of the MEMS chip 2 is connected to a mini port of the ASIC chip 3 through a gold wire, a VDD port of the ASIC chip 3 is connected to a VDD pad 5 provided on a front surface of the upper PCB 1 through a gold wire, an OUT port of the ASIC chip 3 is connected to an output pad 6 provided on a front surface of the upper PCB 1 through a gold wire, a GND port of the ASIC chip 3 is provided on a front surface of the upper PCB 1 through a gold wire, a first copper layer 8 and a second copper layer 9 are provided between the upper PCB 1 and the lower PCB, the VDD 5 is connected to a first copper layer 8 provided between the upper PCB 1 and the lower PCB, and the first through hole 10 sequentially passes through the upper PCB 1, and the lower PCB 1, The first copper layer 8 and the lower PCB are connected with a back pad 11 arranged on the back of the lower PCB, the output pad 6 is connected with a second copper layer 9 arranged between the upper PCB 1 and the lower PCB, and the second through hole 12 sequentially penetrates through the upper PCB 1, the second copper layer 9 and the lower PCB to be connected with the back pad 11 arranged on the back of the lower PCB.

Sound is converted into the signal of telecommunication through MEMS chip 2 and is passed through the gold thread and transmit ASIC chip 3, the output of ASIC chip 3 is exported from the OUT port to output pad 6 through the gold thread, output pad 6 connects first copper layer 8, the signal of telecommunication exports back pad 11 from first through-hole 10 after through first copper layer 8, be connected to other external device through back pad 11, Vdd exports VDD 5 to VDD pad from the VDD port of ASIC chip 3 through the gold thread, VDD pad 5 connects second copper layer 8, export back pad 11 from second through-hole 12 after through second copper layer 9.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims

1. The utility model provides a MEMS microphone package, includes upper PCB board and lower floor's PCB board, be provided with MEMS chip and ASIC chip on the upper PCB board, the MEMS chip with connect through the wire between the ASIC chip, the ASIC chip passes through the wire and connects the setting and be in upper pad on the upper PCB board, the upper PCB board with be equipped with the copper layer between the lower floor's PCB board, its characterized in that: through holes are respectively arranged to sequentially penetrate through the upper PCB, the copper layer and the lower PCB, the through holes are connected with a back bonding pad arranged on the back of the lower PCB, and the lead is a gold wire;

the VDD port of the ASIC chip is connected with a VDD bonding pad arranged on the front surface of the PCB through a lead, the OUT port of the ASIC chip is connected with an output bonding pad arranged on the front surface of the PCB through a lead, and the GND port of the ASIC chip is connected with a grounding bonding pad arranged on the front surface of the PCB through a lead;

the VDD welding disc is connected with a first copper layer arranged between the upper PCB and the lower PCB, and a first through hole sequentially penetrates through the upper PCB, the first copper layer and the lower PCB to be connected with a back welding disc arranged on the back of the PCB;

the output bonding pad is connected with a second copper layer arranged between the upper PCB and the lower PCB, and a second through hole penetrates through the upper PCB, the second copper layer and the lower PCB in sequence and is connected with a back bonding pad arranged on the back of the PCB.

2. A MEMS microphone package according to claim 1, wherein: the BIAS port of the MEMS chip is connected with the BIAS port of the ASIC chip through a wire, and the VOUT port of the MEMS chip is connected with the MICIN port of the ASIC chip through a wire.