CN104618842A - Packages and methods for packaging microphone devices - Google Patents

Packages and methods for packaging microphone devices Download PDF

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Publication number
CN104618842A
CN104618842A CN201510079607.8A CN201510079607A CN104618842A CN 104618842 A CN104618842 A CN 104618842A CN 201510079607 A CN201510079607 A CN 201510079607A CN 104618842 A CN104618842 A CN 104618842A
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CN
China
Prior art keywords
outer cover
board
flexible base
terminal
sonic transducer
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Granted
Application number
CN201510079607.8A
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Chinese (zh)
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CN104618842B (en
Inventor
C.利勒伦德
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Analog Devices Inc
InvenSense Inc
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InvenSense Inc
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Publication of CN104618842A publication Critical patent/CN104618842A/en
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

Packages for electronic amplification include a packaged microphone device that includes a housing and an acoustic transducer disposed therein. The housing includes an exterior top surface and an exterior bottom surface that includes electrical terminals disposed thereon. The package microphone device can include a flexible substrate having a top portion, a bottom portion and a flexible middle portion. The flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to the exterior top surface of the housing and the bottom portion at least partially overlays and attaches to the exterior bottom surface of the housing.

Description

Encapsulation and the method for encapsulating microphone equipment
The divisional application of the patent application of " encapsulation and the method for encapsulating microphone equipment " that the application is application number is 201110421770.X, the applying date, to be December 16, denomination of invention in 2011 be.
Technical field
Embodiments of the present invention relate to microphone equipment and for encapsulating its method.
Background technology
Usually, the sonic transducer component configuration of relative small size becomes to install, to set up electrical contact between sonic transducer parts and the electronic circuit system on this carrier board at the carrier board upper surface of such as printed circuit board.Sonic transducer parts have sound port, are generally in the form of a hole, pass through at this component outer and the acoustic pressure between the sonic transducer of this sonic transducer components interior for allowing.
Traditionally, sound port provides as top port or bottom port.In top port configuration, transducer element or encapsulation have and are positioned at electrode in the lower surface adjacent with carrier board or bond pads, and sound port is positioned on end face.On the contrary, in bottom port configuration, sound port is positioned in lower surface, and electrode or bond pads are arranged around this sound port opening.So, bottom port is encapsulated in the same side with package lead has sound port, and top port is encapsulated in from package lead different (being generally relative) side has sound port.Bottom port design sonic transducer parts be generally arranged on there is the hole aimed at sound port opening carrier board on, to allow this component outer and the acoustic pressure between the sonic transducer of this sonic transducer components interior to pass through.
In general, MEMS (micro electro mechanical system) (MEMS) microphone equipment is configured to have bottom port, to help to provide enough large back space after sonic transducer movable member.Condenser microphone or electret capcitor microphone (ECM) have different structures, and are generally configured to have top port, to allow enough large back space.
Depend on installation region to be more suitable for bottom port or to be more suitable for top port installing, utilize the structure of the product of sonic transducer (such as, mobile phone) that the use of MEMS device or ECM equipment may be specified.But, microphone equipment due to this two type has different attributes and quality, therefore, in some implementation, such as in those implementations needing relative high s/n ratio, the structure that undesirably may comprise the product of microphone package specifies the type of sonic transducer.
Traditionally, sonic transducer parts or encapsulation comprise sonic transducer and comprise the outer cover of lid and rigid substrates, and wherein rigid substrates has the first and second surfaces respect to one another.Outer cover has exterior top surface, and the second surface of rigid substrates is arranged to the outside bottom surface as outer cover.Electric terminal is positioned on the second surface of rigid substrates.Sonic transducer parts also represent microphone package.
At such as U.S. Patent Publication No.2010/0090295 and U.S. Patent No. 7,202, in 552, disclose the example of sonic transducer parts or encapsulation.Need the microphone package improved and the method forming it.
Summary of the invention
In one embodiment, a kind of assembly comprises sonic transducer parts and flexible base, board.Sonic transducer parts comprise outer cover and the sonic transducer be positioned at wherein.Outer cover comprises the rigid substrates with the first and second surfaces respect to one another, and this outer cover has exterior top surface.The second surface of rigid substrates is arranged to the outside bottom surface as outer cover, and electric terminal is positioned on the second surface of rigid substrates.Flexible base, board has Part I and Part II, and is at least flexible between this first and second part.Each part comprises relative side.Described flexible base, board folds around sonic transducer parts, and its Part I covers and is attached to exterior top surface, and its Part II covers at least in part and is attached to outside bottom surface.Flexible base, board is provided with and exposes on the side of Part I away from outer cover and to be connected to the conductive trace of at least one electric terminal.
In another embodiment, a kind of method manufacturing assembly is provided.The method comprises the sonic transducer parts providing and have outer cover, and wherein outer cover has exterior top surface and outside bottom surface.Electric terminal is positioned on outside bottom surface.The method also comprises sonic transducer parts is attached to the flexible base, board with Part I and Part II, and wherein Part I has relative side with each in Part II.Described flexible base, board folds around sonic transducer parts, and its Part I covers exterior top surface, and its Part II covers outside bottom surface at least in part.This flexible base, board is provided with and exposes on the side of Part I away from outer cover and to be connected to the conductive path of at least one electric terminal.
In another embodiment, a kind of assembly comprises microphone equipment and the flexible base, board of encapsulation.The microphone equipment of this encapsulation comprises outer cover and the sonic transducer be positioned at wherein.Outer cover has exterior top surface and the outside bottom surface relative with this exterior top surface.The outer bottom face of outer cover comprises the electric terminal be located thereon.Flexible base, board has the mid portion of top section, base section and flexibility.The mid portion of this flexibility is between top and bottom.The mid portion of described flexibility folds around outer cover, top section is covered at least in part and is attached to the end face of outer cover, and base section covers at least in part and is attached to the outside bottom surface of outer cover.Described flexible base, board comprises the trace being electrically connected at least one electric terminal.
In another embodiment, a kind of assembly comprises microphone equipment and the electronic unit of encapsulation.The microphone equipment of this encapsulation comprises outer cover and the sonic transducer be positioned at wherein.Outer cover has exterior top surface and the outside bottom surface relative with this exterior top surface.The outer bottom face of outer cover comprises the electric terminal be located thereon.Outer cover comprises the sound port by it.Electronic unit and described electric terminal are adjacent to be installed in shroud floor.
In another embodiment, a kind of assembly comprises conversion baseplate and sonic transducer parts, and these sonic transducer parts have outer cover and are positioned at sonic transducer wherein.Outer cover comprises exterior top surface and the outside bottom surface relative with this exterior top surface.Outer cover comprises the multiple electric terminals be positioned on the outside bottom surface of this outer cover.Conversion baseplate comprises the Part I being attached to outer cover exterior top surface.The Part I of conversion baseplate comprises the multiple electrical bonding pads be positioned on this conversion baseplate side relative with outer cover.At least one in described multiple electrical bonding pads is electrically connected at least one in described multiple electric terminal.
Accompanying drawing explanation
Figure 1A shows the top and bottom perspective view of top port sonic transducer parts or encapsulation.
Figure 1B shows the top and bottom perspective view of bottom port sonic transducer parts.
Fig. 2 A shows the viewgraph of cross-section of an example of bottom port sonic transducer parts.
Fig. 2 B shows the viewgraph of cross-section of an example of top port sonic transducer parts.
Fig. 3 A shows the viewgraph of cross-section of a kind of execution mode of the assembly comprising bottom port sonic transducer parts and convert thereof into the flexible base, board that top port configures.
Fig. 3 B shows the perspective view of the bottom port sonic transducer parts of Fig. 3 A.
Fig. 4 A shows and comprises top port sonic transducer parts and convert thereof into the viewgraph of cross-section that bottom port configures a kind of execution mode of the assembly of flexible base, board.
Fig. 4 B shows the perspective view of the top port sonic transducer parts of Fig. 4 A.
Fig. 5 illustrates a kind of execution mode of top port parts and flexible base, board with exploded perspective.
Fig. 6 shows a kind of execution mode of bottom port parts and flexible base, board with decomposition view, and wherein bottom port parts also illustrate from its bottom side.
Fig. 7 shows a kind of execution mode of top port parts and flexible base, board with exploded top perspective view.
Fig. 8 A shows the another kind of execution mode of top port parts and flexible base, board with exploded top perspective view.
Fig. 8 B shows the top port parts of Fig. 8 A and the exploded bottom perspective view of flexible base, board, and wherein flexible base, board comprises semiconductor element.
Fig. 9 shows top and the bottom perspective view of a kind of execution mode of the assembly comprising flexible base, board and be arranged on the parts on the rigid substrates bottom surface of transducer element.
Figure 10 shows the exploded bottom perspective view of a kind of execution mode of the assembly comprising transducer element and flexible base, board, bottom perspective view and top perspective, and wherein flexible base, board has the semiconductor element being arranged on this flexible base, board and being embedded into glop top (glob-top).
Figure 11 shows flexible base, board and a kind of exploded top perspective view of execution mode of transducer element and the bottom perspective view with two the ground connection reference electrodes being configured to annular shape.
Figure 12 A-12H shows the viewgraph of cross-section of the assembly according to various execution mode.
Figure 13 shows a kind of execution mode of the electronic circuit for transducer device.
Figure 14 shows the viewgraph of cross-section of the assembly according to another kind of execution mode.
Embodiment
Encapsulation and the method encapsulating microphone equipment is disclosed at this.In one aspect, a kind of assembly comprises sonic transducer parts or encapsulation, has outer cover and is positioned at sonic transducer wherein.Outer cover comprises the rigid substrates with the first and second surfaces respect to one another.This outer cover has exterior top surface, and the second surface of described rigid substrates is arranged to the outside bottom surface as outer cover.Electric terminal is positioned on the second surface of rigid substrates.This assembly also comprises flexible base, board, and this flexible base, board has Part I and Part II, and is at least flexible between this Part I and Part II, and each part has relative side.Described flexible base, board folds around sonic transducer parts, its Part I covers and is attached to exterior top surface, and its Part II covers at least in part and is attached to outside bottom surface, and this flexible base, board is provided with and exposes on the side of Part I away from outer cover and to be connected to the conductive trace of at least one electric terminal.
Therefore, the more multiduty utilization of sonic transducer parts (can be traditional sonic transducer) is achieved.Such as, be disposed for top to install and the sonic transducer parts being provided with flexible base, board in assembly can be used in the Install and configure of bottom.Equally, the parts being disposed for installing bottom may be used for top Install and configure.Effectively, flexible base, board can be used for the top mounted package designed or produced to convert bottom mounted package to, and vice versa.So, when not needing the change of sonic transducer piece construction, more multiduty utilization is also possible.
Because can use thus, there is the assembly of top port transducer element as bottom port parts (otherwise still), therefore can overcome and lock onto existing design a kind of in use two type.So, the use of top port type microphone (being generally electret capcitor microphone) or bottom port type microphone (being generally MEMS device) can be decided by its attribute different separately and quality.
Flexible base, board can be manufactured by one or more rete, and comprises one or more conductive layers with conductive trace.Flexible base, board, at least between the first and second, has the modulus that specific rigidity substrate is much lower.Such as, but not limited to this, flexible base, board can have the Young's modulus of 5GPa, and rigid substrates can have the Young's modulus of 25GPa.Flexible base, board can its whole length be all flexible or, as selection, in the first and second part relative stiffnesses between the first and second parts that it is folded relative flexibility.In the part of flexible base, board flexibility, it can bend with the radius of curvature being such as less than about 5mm.But in some implementation, radius of curvature can be less, such as, be less than about 1mm, or more particularly, be less than about 0.6mm.
Sonic transducer parts are also expressed as microphone package.The outer cover of sonic transducer parts can comprise rigid substrates and cap, and described cap can be the form of jar or box, and its bottom side is closed by rigid substrates.Described cap can by metal, alloy or the plastic material manufacture being coated with metal or alloy layer, to be provided for protecting by faraday's casing of electrostatic interference (EMI).Those skilled in the art will recognize that, structure and method disclosed herein can be applied to the case for packaging (such as, pottery) of other type numerous.In one implementation, lid is included in the middle printed circuit board (PCB) on base plate for packaging, has the hole by it, so that definition encapsulation cavity, also comprises and to be positioned on middle PCB and top PCB on described hole.Described middle PCB can as the wall of lid, and top PCB can as the top of lid.
Sonic transducer can be the microphone of MEMS or condenser type or electret capacitor type or piezo type, but is not limited thereto.Such as, sonic transducer can be pressure sensor or loud speaker.
The electric terminal of sonic transducer parts can be configured to have bond pads, and this bond pads can utilize any suitable technology, such as, by using surface mounting technology (SMT), is welded to the electric terminal on carrier board or pad.
Conductive trace is connected to the electric terminal of sonic transducer predefined position (such as, passing through bond pads), thus sets up electrical connection.In addition, conductive trace exposes, to help handle component to be installed to carrier board predefined position (such as, passing through bond pads).
The Part I of flexible base, board with any suitable approach, such as, by adhesive, can be attached to the exterior top surface of sonic transducer parts.The Part II of flexible base, board can by being positioned at the welding of the bond pads on adjacently situated surfaces and/or passing through application adhesive or utilize other suitable technology any to be attached to the outside bottom surface of sonic transducer parts.Adhesive can be the electroconductive binder such as on pad or the nonconductive adhesive between at least some pad.Also the combination of soldering paste and nonconductive adhesive can be used.
Assembly can be the assembly of relative small size, is used in the mobile electronic product of such as mobile phone, smart phone, on knee or panel computer, camera or miscellaneous equipment.In some embodiments, assembly is less than 13mm × 13mm × 13mm, or is less than 5mm × 4mm × 2mm or is less than 4mm × 3mm × 1mm.
In some embodiments, assembly has the sound port extending through its outer cover, as the acoustic pressure path between component external and sonic transducer.
This sound port also refers to environment hole, and can have such as circular or square opening at the outer surface of outer cover, but other shape is also possible.Sound port can adopt the form of hole or passage.Sound port allows the interphase interaction of acoustic energy or acoustic pressure or the air of sound pressure variations outside the sonic transducer and outer cover of outer cover inside.Such as, for microphone, sound port can allow entering of acoustic energy or sound pressure variations, or, for loud speaker, allow going out of acoustic energy or sound pressure variations.For top port equipment, sound port extends through the end face of outer cover, or the surface except forming the surface of package lead thereon, and for bottom port equipment, sound port extends through the rigid substrates of the bottom side forming outer cover or the surface identical with the surface forming package lead.
In some embodiments, assembly has sound port and the hole by flexible base, board, this sound port has the opening by assembly outer cover, wherein the opening of sound port and aligned with each other by the hole of flexible base, board, for transmitting acoustic pressure between the outside and sonic transducer of assembly.
For bottom port equipment, this configuration allows the Part II of flexible base, board to cover whole bottom surface or its major part of sonic transducer parts, and this can contribute to the structural support improving sonic transducer parts.Such as, the Part II of the flexible base, board covered on the major part of sonic transducer bottom surface can allow the Part II of flexible base, board to provide enough large also stable thus support for carrying this assembly.
The opening of sound port can have substantially similar to the hole in flexible base, board size.As selection, the opening of sound port can be greater than or less than the hole in flexible base, board.
In some embodiments, conductive trace extends between first side and the opposite side of Part II of the Part I of flexible base, board, and this trace route is by perpendicular interconnection passage (VIA).
As used in this, VIA is the vertical electrical connection in Printed Circuit Board Design between different conductor layer.VIA can be the pad with electroplating hole, provides electrical connection between its trace on the different layers of plate.
The electrical connectivity that VIA can help to provide in assembly is comprised at the Part I of flexible base, board.Such as, can provide a pair pad, a pad is positioned on the Part I of flexible base, board, and another pad is positioned on the Part II of flexible base, board.This on the side that flexible base, board is relative, and can be connected with VIA by trace pad, avoids any needs distortion flexible base, board being carried out to suitably electrical connection thus.
In some embodiments, assembly comprises the semiconductor element on the first surface being arranged in outer cover rigid substrates.
In some implementation, semiconductor element can by the outer cover electric shield of assembly.In addition, can adopt the connection of wire-bonded (wirebonding) form can be relative short between element of transducer with semiconductor element, to help reduction can cause the parasitic capacitance of the loss of signal.
In some embodiments, assembly comprises and is positioned at flexible base, board and covers outside bottom surface and semiconductor element in part therefore outside outer cover.This semiconductor element is positioned on the flexible base, board side relative with outer cover.
Carry out configuring semiconductor tube core with this configuration and can improve flexibility in component application.In some embodiments, the semiconductor element be arranged on flexible base, board is electrically connected to the semiconductor element being positioned at outer cover, to allow the communication between tube core.
In some embodiments, on flexible base, board, the semiconductor element of (outside outer cover) is encapsulated in glop top.
Described glop top is that semiconductor element provides the protection preventing moisture and mechanical collision.And in some implementation, the protection of this glop top can be connected to semiconductor element the wire-bonded of pad in flexible base, board and/or trace.This glop top can comprise the resin material of such as epoxy resin.
The metal shield that semiconductor element is enclosed in faraday's casing can be loaded in described glop top, and this can help the EMI providing semiconductor element to shield.
In some embodiments, assembly comprise be arranged in outer cover rigid substrates first surface on the first semiconductor element be positioned at flexible base, board and cover in the part of the outside bottom surface of outer cover, the second semiconductor element on the side that this flexible base, board is relative with outer cover.In some implementation, the first semiconductor element comprises the circuit being configured to Analog signals, and the second semiconductor element is configured to processing digital signal, and described first and second semiconductor elements are electrically connected to together.
Arrange that the first and second semiconductor elements can improve signal quality with this configuration.Such as, digital circuit can be arranged to there is larger distance with analog circuit, and digital circuit can be arranged in the outside of the outer cover arranging analog circuit, improves signal to noise ratio thus by reducing digital signal coupling on the impact of analog circuitry system.The semiconductor element be arranged on flexible base, board is electrically connected to the semiconductor element being positioned at outer cover, to allow the communication between them.
In some embodiments, the circuit being configured to Analog signals comprises being coupled into and receives the signal of telecommunication from sonic transducer and provide the preamplifier of analog output signal.The circuit being configured to processing digital signal can comprise being coupled into and receives described analog output signal and provide modulus (A-D) transducer of digital output signal.
In some embodiments, semiconductor element comprises the circuit of the simulation part having and be configured to Analog signals and the numerical portion being configured to processing digital signal, and the electric terminal be positioned on the second surface of rigid substrates comprises the first terminal being electrically connected to described simulation part and the second terminal being electrically connected to described numerical portion.
In some implementations, the electric terminal be positioned on rigid substrates second surface is configured as analog-and digital-system and provides independently grounding connection.So, the grounding system of analog signal and the grounding system for digital signal can be provided for.There is provided grounding system can help to reduce noise by this way, improve the signal-to-noise performance of microphone equipment thus.Described grounding system can electricity access independently on the second surface of rigid substrates.Such as, in some implementations, each grounding system can utilize the Different electrodes or pad access that are positioned on flexible base, board Part I on the side that described flexible base, board is relative with outer cover.Although each grounding system can electric insulation, in some embodiments, numeral and analogue ground system interconnect in outer cover.
In some embodiments, the first annular electrode or pad are positioned on the second surface of rigid substrates, and this first annular electrode retaining collar is around the second annular electrode or pad.Digital grounding system can be electrically connected to the second electrode or pad, and analogue ground system can be electrically connected to the first electrode or pad, and vice versa.
In some embodiments, the electric terminal be positioned on rigid substrates second surface also comprises the 3rd terminal, and conductive path on flexible base, board or trace are connected to and expose the 3rd terminal.
In some embodiments, digital grounding system provides as just the grounding system on the pad on flexible base, board Part I.
In some embodiments, the Part II of flexible base, board has the little area of specific rigidity second substrate surface.
Thus, the Part II of flexible base, board only covers the less part of the second surface of rigid substrates, and exposes the free part of the second surface of rigid substrates.Therefore, the Part II of flexible base, board does not occupy the whole second surface of rigid substrates, allows one or more electronic unit to be arranged in the free part of second surface thus.
In some embodiments, the electric terminal be arranged on rigid substrates second surface also comprises the 4th electric terminal of the semiconductor element being electrically connected to outer cover.4th electric terminal exposes in the part that do not covered by flexible base, board in other words of freedom part of the second surface of rigid substrates, and at least one electric component outside outer cover is electrically connected to the 4th terminal.
Therefore, in some implementations, rigid substrates can in both sides all load bearing components.Such as, one or more parts can be arranged into rigid substrates towards on the first side of outer cover inside, and one or more parts can be arranged into serve as the outside bottom surface of outer cover second or opposite side on.This allows circuit to have the layout of the part in outer cover and the another part outside outer cover.Such as, at least one parts being connected to described 4th terminal when manufacture outer cover, namely can be installed when it is closed and seal.These parts can be the parts that its value can change, or these parts can be selected from the parts that a group has different value, based on the measurement of circuit in outer cover, to make the performance of the circuit on semiconductor element be applicable to predetermined specification.
In some embodiments, described 4th terminal, by rigid substrates, such as, by using VIA, is connected to the semiconductor element in outer cover.
In some embodiments, 5th electric terminal is electrically connected to the semiconductor element in outer cover and covers at flexible base, board in the part of outside bottom surface and exposes on the side that this flexible base, board is relative with outer cover, and at least one electronic unit is electrically connected to this Five-terminals.
Therefore, in some implementations, the circuit for transducer device is provided with the part in outer cover and the another part outside outer cover.Because at least one parts being connected to described Five-terminals can when manufacture outer cover, namely install when it is closed and seal, therefore this is easily.So parts can be selected from the parts that a group has different value, based on the measurement of circuit, to make the performance of the circuit on the semiconductor element in outer cover be applicable to predetermined specification.As selection, parts can be units of variance, such as adjustable resistor, and this parts can have the value selected based on circuit measuring.In some implementations, these parts are for controlling the sensitivity of microphone.
In some embodiments, described Five-terminals utilizes such as VIA to be connected to the semiconductor element in outer cover by rigid substrates and by flexible base, board.
In some embodiments, sonic transducer is MEMS (micro electro mechanical system) (MEMS) microphone equipment.
In some embodiments, sonic transducer is condenser microphone or electret capcitor microphone equipment.
the general introduction of the microphone equipment of encapsulation
The microphone equipment of encapsulation is described with reference to accompanying drawing with the method encapsulating it.In order to the convenience of reader, identical part and parts indicate with identical label.Accompanying drawing is schematic, does not draw in proportion.
Figure 1A shows top and the bottom perspective view of top port sonic transducer parts or encapsulation.In figure ia, shown sonic transducer parts are top port microphone package 101, have the outer cover comprising cap 110 and rigid substrates 103.Label 102 indicates the exterior top surface of outer cover, relative with lead-in wire or terminal.Sound port 104 extends through outer cover, as the sound pressure channel between the outside of outer cover and the sonic transducer (this figure does not illustrate) being arranged in outer cover.
Rigid substrates 103 has the second surface of the outside bottom surface towards the first surface of outer cover inside and and definition outer cover outside towards outer cover.Electrical lead or terminal are positioned on the second surface of rigid substrates.In the illustrated configuration, electric terminal comprises five terminals, and wherein four are arranged as square post 106, and the 5th terminal is arranged as ring terminal 105.Described terminal is connected to the sonic transducer (not shown) being positioned at outer cover inside by substrate 103.Sonic transducer can directly and/or utilize the circuit be arranged on the semiconductor element (not shown) that is positioned on the first side of substrate 103 to connect.
Sonic transducer parts also refer to the microphone encapsulating or encapsulate.
Figure 1B shows top and the bottom perspective view of bottom port sonic transducer parts.In fig. ib, shown sonic transducer parts are bottom port microphone package 107, have the outer cover comprising cap 111 and rigid substrates 112.Cap 111 comprises exterior top surface 113.Bottom port microphone package 107 has the sound port 108 being arranged through shroud floor (being by rigid substrates 112 in this case).In the illustrated configuration, the electric terminal on bottom surface comprises five terminals, and wherein four are arranged as square post 106, and the 5th is arranged as ring terminal 109, and this Five-terminals has the circular portion of the opening around sound port one 08.
Fig. 2 A shows the viewgraph of cross-section of an example of bottom port sonic transducer parts.Fig. 2 B shows the viewgraph of cross-section of an example of top port sonic transducer parts.Bottom port parts 107 shown in Fig. 2 A are arranged on the carrier board 201 of printed circuit board (PCB) form, and wherein this carrier board can be rigidity PCB, such as FR-4 template.Bottom port parts 107 comprise cap 111 and rigid substrates 112.Sound port 108 extends through the rigid substrates 112 of parts, that is, by the bottom surface of outer cover, pass through to make the acoustic pressure between outer cover outside and the sonic transducer 204 in outer cover.Semiconductor element 207 is also positioned at outer cover inside, and utilizes bonding wire 210 to be electrically connected to sonic transducer 204.Carrier board 201 comprises the hole or opening 203 aimed at the opening of the sound port 108 of parts, to allow acoustic pressure to pass through.Sonic transducer 204 is MEMS types, but is not limited thereto; Can also be such as condenser type or electret capacitor type type or piezo type.Lead-in wire or terminal 211 illustrate on the rigid substrates 112 of forming member dorsal part, install and are connected to the pad 212 on carrier board 201.
Although clear in order to different piece, Fig. 2 A shows the space between terminal 211 and pad 212, and terminal 211 and pad 212 are together with being attached to one another in bottom port parts 107 are installed on carrier board 201.Such as, after bottom port parts 107 are installed on carrier board 201, terminal 211 and pad 212 directly can be attached each other or be attached to one another by middle (conduction) adhesive (such as solder).Here other figure, comprises such as Fig. 2 B, 3A, 4A, 12A-12E and 12H, the space between that also show attachment in order to the clear of different piece and in order to reader is convenient or adjacent parts.But, persons of ordinary skill in the art will recognize that being described as that be attached or adjacent parts at this can directly or by middle adhesive physically contact with each other.
Top port parts 101 shown in Fig. 2 B are installed on carrier board 202.Sonic transducer is electret capacitor type type, and comprises backboard 205 and diaphragm 206, and described diaphragm 206 responds and is applied to the acoustic pressure on it by the sound port 104 in lid 110 and moves.As selection, sonic transducer can be condenser type, MEMS or piezo type.Backboard 205 and diaphragm 206 show for being supported by bearing 215.Lead-in wire or terminal 213 illustrate on the rigid substrates 103 of forming member dorsal part, install and are connected to the pad 214 on carrier board 202.Semiconductor element 208 is also seated on the rigid substrates 103 in the outer cover of top port parts 101.Use bonding wire 209 that this semiconductor element 208 is electrically connected rigid substrates 103.
Fig. 3 A shows the viewgraph of cross-section of a kind of execution mode of the assembly comprising bottom port sonic transducer parts and flexible base, board, and wherein flexible base, board serves as the conversion baseplate for parts being converted to top port configuration.Fig. 3 B shows the perspective view of the bottom port sonic transducer parts of Fig. 3 A.Assembly 301 comprises the sonic transducer parts 107 with MEMS-type sonic transducer 204 and outer cover, and wherein outer cover comprises cap 111 and rigid substrates 112.Semiconductor element 207 is arranged on the first surface of substrate 112 of outer cover, and is electrically connected to sonic transducer 204 by the wire 210 joining tube core 207 and transducer 204 to.Electric terminal 211 is positioned on the bottom surface 291 of outer cover, on the outside of substrate or the second side.Electric terminal 211 can be electrically connected to semiconductor element 207 and/or sonic transducer 204.
In addition, transducer element comprises around the folding flexible base, board 304 of sonic transducer parts 107.Flexible base, board 304 adjoins the exterior top surface 113 of outer cover by its first side 177 in one end of this flexible base, board, and adjoined the outside bottom surface 291 of outer cover by its first side 177 at the other end of this flexible base, board.Flexible base, board 304 is in the exterior top surface of corresponding first and second part adjacent parts 107 and bottom surface 113,291.Flexible base, board 304 at least first or top section and second or base section between mid portion be flexible.As seen from figure, flexible base, board 304 can part is folded therebetween place bend.Flexible base, board shows the curve for having relative loose, has relatively large radius of curvature, but in some embodiments, it can have more tight curve, has relatively little radius of curvature.This flexible base, board also can be flexible in the first and second parts.Such as, flexible base, board 304 can run through its whole length is all flexible.
The end of flexible base, board 304 in its second side 178 at this flexible base, board comprises electric terminal 303, and comprises electric terminal 302 in its first side 177 in another end.In order to be electrically connected each terminal 303 and each terminal 302, flexible base, board 304 is provided with conductive trace (not shown), for the electrical connection between the terminal 214 of carrier board 202 and the terminal 211 of parts 107.As used in this, the trace being electrically connected to terminal can be called in this terminal " exposure ".
Flexible base, board 304 is attached to the exterior top surface 113 of outer cover in its first side 177 by adhesive.It is attached to the outside bottom surface 291 of outer cover at the electric terminal 211 of rigid substrates 112 by solder, soldering paste and/or conducting resinl in its first side 177.At least before setting up fixing electrical contact, it can also be attached around terminal by non-conductive adhesive.
Assembly 107 or encapsulation have sound port and the hole 305 by flexible base, board 304, this sound port has the opening 108 by assembly outer cover, the wherein opening 108 of sound port and aligned with each other by the hole 305 of flexible base, board 304, for transmitting acoustic pressure between the outside of assembly 107 and sonic transducer 204.
As seen from Fig. 3 B, flexible base, board 304 be included between its first and second part with the top of outer cover and the mid portion of bottom contiguous, wherein outer cover comprises lid 111 and rigid substrates 112.Flexible base, board 304 is folded at this mid portion.As shown in the figure, this mid portion can than described first and/or Part II narrow, make this mid portion do not resemble described first and/or Part II so wide.As selection, flexible base, board can pass through and have substantially the same width.At described mid portion, flexible base, board can be thinner or have identical thickness with it than end section.
Fig. 4 A shows the viewgraph of cross-section of a kind of execution mode of the assembly 401 comprising top port sonic transducer parts 417 and flexible base, board 404.Flexible base, board 404 serves as the conversion baseplate for these top port parts being converted to bottom port configuration.Fig. 4 B shows the perspective view of Fig. 4 A top port sonic transducer parts 401.
Assembly 401 comprises the sonic transducer parts 417 with outer cover and sonic transducer, and wherein outer cover comprises cap 110 and rigid substrates 103, and sonic transducer is condenser type or the electret capacitor type type with backboard 205 and diaphragm 206.On the inside that semiconductor element 208 is positioned at substrate 103 or the first side, and be electrically connected to sonic transducer by the wire 209 joining tube core and transducer to.Electric terminal 213 is positioned on rigid substrates 103, on the outside of substrate or the second side.Electric terminal 213 is electrically connected to semiconductor element 208 and/or sonic transducer.
In addition, transducer assemblies 401 comprises around the folding flexible base, board 404 of sonic transducer parts 417.Flexible base, board 404 adjoins the exterior top surface 102 of outer cover by its first side 477 in one end of this flexible base, board, and adjoined the outside bottom surface 291 of outer cover by its first side 477 at the other end of this flexible base, board.Flexible base, board 404 is respectively first or top section and second or the exterior top surface of base section adjacent part 417 and bottom surface 102,291.It is at least flexible at the mid portion between described first and second parts.
The end of flexible base, board in its second side 478 at this flexible base, board comprises electric terminal 402, and comprises electric terminal 403 in its first side 477 in another end.In order to be electrically connected each terminal 403 and each terminal 403, flexible base, board 404 is provided with conductive trace (not shown), for the electrical connection between the terminal 211 of carrier board 202 and the terminal 213 of parts 417.
Flexible base, board 404 is attached to the exterior top surface 102 of outer cover in its first side 477 by adhesive.Flexible base, board 404 is attached to the outside bottom surface 291 of outer cover at its electric terminal by solder, soldering paste and/or conducting resinl in its first side 477.At least before setting up fixing electrical contact, it can also be attached around terminal by non-conductive adhesive.
Assembly 401 has sound port and the hole 407 by flexible base, board 404, this sound port has the opening 104 by the outer cover of assembly, the wherein opening of sound port and aligned with each other by the hole of flexible base, board, transmits acoustic pressure between the outside and sonic transducer of assembly.In addition, carrier board 202 is configured to have hole 203, and this hole 203 is aimed at the opening 104 by outer cover and the hole 407 by flexible base, board 404.
As seen from Fig. 4 B, flexible base, board 404 comprises the mid portion of top with outer cover and bottom contiguous between its first and second part, and wherein outer cover comprises lid 110 and rigid substrates 103.Flexible base, board 404 is folded at this mid portion.As shown in the figure, this mid portion can than described first and/or Part II narrow, make this mid portion do not resemble described first and/or Part II so wide.As selection, flexible base, board can pass through and have substantially the same width.At described mid portion, flexible base, board can be thinner or have the thickness identical with it than end section.
Fig. 5 illustrates a kind of execution mode of top port parts 501 and flexible base, board 504 with exploded perspective.Flexible base, board 504 comprises two ends, and each end is provided with electric terminal, but is positioned at side respect to one another.Such as, first or tip portion 511 comprise the electric terminal be positioned on the flexible base, board side relative with parts 501 outer cover, and second or bottom part 512 comprise and be positioned at flexible base, board towards the electric terminal on the side of the outer cover of parts 501.Tip portion 511 comprises the hole 507 by flexible base, board 504, and when flexible base, board 504 is attached to top port parts 501, this hole 507 can be aimed at the hole 502 in the outer cover of parts 501.As shown in Figure 5, the mid portion 513 of the flexibility of flexible base, board 504 connects tip portion 511 and bottom part 512.Mid portion 513 can have the width less than the width of tip portion and bottom part 511,512.In some implementation, the outside bottom surface of the complete coating member 501 of bottom part 512.
Fig. 6 shows a kind of execution mode of bottom port parts 601 and flexible base, board 604 with decomposition view, and wherein bottom port parts 601 also illustrate from its bottom side.An end of flexible base, board 604 is less than another end.Such as, flexible base, board 604 comprises first or tip portion 611 and second or bottom part 612, and tip portion 611 has the area larger than bottom part 612.The electric terminal 602 of sonic transducer parts is arranged in the area less than the bottom surface of this transducer element.Correspondingly, the electric terminal 603 of the bottom part 612 of flexible base, board 604 is arranged in the comparatively small size of the layout of the terminal 602 at least substantially mating bottom port parts 601.Terminal 605 in the tip portion 611 of flexible base, board 604 be arranged in can have size substantially the same with the end face of parts 601 larger area on.The tip portion of flexible base, board is connected with the mid portion 613 of bottom part 611,612 by flexibility.
Fig. 7 shows a kind of execution mode of top port parts 701 and flexible base, board 704 with exploded top perspective view.Flexible base, board 704 comprises first or tip portion 711 and second or bottom part 712, and tip portion 711 has the area larger than bottom part 712.Tip portion 711 comprises electric terminal 705 on the side of flexible base, board 704 away from parts 701 outer cover.Bottom part comprises electric terminal 703 on the opposite side of flexible base, board 704 towards parts 701 outer cover.Relative to the area of the electric terminal 705 of tip portion 711, the electric terminal 703 of the bottom part 712 of flexible base, board 704 is arranged in less area.Tip portion and the bottom part 711,712 of flexible base, board are connected by the mid portion 713 of flexibility.In illustrated execution mode, flexible base, board 704 is combined with top port parts 701, comprises the hole 707 aimed at the sound port 702 of parts 701 when flexible base, board 704 is attached to parts 701 in tip portion 711.
Fig. 8 A shows the another kind of execution mode of top port parts 801 and flexible base, board 804 with exploded top perspective view.Fig. 8 B shows the top port parts 801 of Fig. 8 A and the exploded bottom perspective view of flexible base, board 804, and wherein flexible base, board comprises semiconductor element 851.Flexible base, board 804 comprises first or tip portion 811 and second or bottom part 812, and tip portion 811 has the area larger than bottom part 812.Tip portion 811 comprises electric terminal 805 on the side of flexible base, board 804 away from the outer cover of parts 801.Bottom part 812 comprises electric terminal 803 on second or the opposite side of flexible base, board 804 towards the outer cover of parts 801.Relative to the area of the electric terminal 805 of tip portion 811, the electric terminal 803 of the bottom part 812 of flexible base, board 804 is arranged in less area.Tip portion and the bottom part 811,812 of flexible base, board 804 are connected by the mid portion 813 of flexibility.In this embodiment, flexible base, board 804 is combined with top port parts 801, comprises the hole 807 aimed at the sound port 802 of parts 801 when flexible base, board 804 is attached to parts 801 in tip portion 811.
Assembly comprises the semiconductor element 851 in the part of the outside bottom surface being positioned at flexible base, board 804 coating member 801.In some implementations, glop top can seal semiconductor element 851.Semiconductor element 851 can utilize the terminal 803 be positioned on the bottom part 812 of flexible base, board 804 to be electrically connected to parts 801.Such as, the outside bottom surface of parts 801 can comprise the terminal 852 that the terminal 803 that is configured to and be positioned on base section 812 matches.
As previously mentioned, in some implementations, semiconductor element 851 can be enclosed in metal shield or other faraday's casing or shell, thus provides and shield the EMI of semiconductor element.Semiconductor element and metallic shield can additionally be enclosed in glop top.In one embodiment, one or more external component 806 is arranged on flexible base, board 804 first side adjacent with semiconductor element 851.The additional detail of external component 806 can described by the following external component 902 about Fig. 9.Although Fig. 8 B shows external component 806, in some implementations, do not need to comprise external component 806.
Fig. 9 shows top and the bottom perspective view of a kind of execution mode of the assembly comprising flexible base, board 904 and external component 902, and its outer member 902 is arranged on the bottom surface of the rigid substrates of transducer element 901.Parts 902 may be used for multiple object.Such as, parts 902 can be the electric components being selected from one group of electric component with different value (such as, resistance), so that amendment is arranged in the performance of the transducer of the outer cover of parts 901.In one embodiment, parts 902 have the value of the manufacture change being chosen to change transducer sensitivity thus compensating transducer.Such as, the sensitivity of transducer can be measured after closed and sealed transducer element 901, and the value of external component 902 can be chosen to the sensitivity adjustment of transducer to the value expected.In some implementation, external component 902 is adjustable electronic units.Such as, external component 902 can be to utilize laser to adjust to the resistor expecting resistance.In some implementations, such as, after parts are by adjustment, external component 902 can be encapsulated in glop top.
Except the illustrated external component 902 be arranged on the outside bottom surface of transducer element 901 or as selecting, semiconductor element and/or external component can be arranged on flexible base, board 904.Such as, described semiconductor element and/or external component can be arranged on flexible base, board 904 side relative with transducer element 901, and can be encapsulated in glop top 903.Correspondingly, in some implementations, external component can be arranged on flexible base, board 904 surface relative with the outside bottom surface of transducer element 901 and/or can be arranged on the outside bottom surface of transducer element 901.
Figure 10 shows the exploded bottom perspective view of a kind of execution mode of the assembly comprising transducer element 1001 and flexible base, board 1004, bottom perspective view and top perspective, and wherein flexible base, board 1004 has the semiconductor element being arranged on this flexible base, board and being embedded into glop top 1051.In exploded bottom perspective view, show the semiconductor element 1007 be packaged into before glop top 1051, wherein glop top 1051 is shown in bottom perspective view.In addition, electric component 1006 is depicted as and is arranged in glop top 1051.Although illustrated two external components 1006 in exploded bottom perspective view, more or less external component 1006 can be comprised, or external component 1006 can omit.The additional detail of external component 1006 can be described above.
Figure 11 shows exploded top perspective view and the bottom perspective view of a kind of execution mode of flexible base, board 1104 and transducer element 1101, and wherein transducer element 1101 has the ground connection reference electrode that two are configured to annular shape.Transducer element 1101 comprises outer cover, and this outer cover comprises lid 1111 and rigid substrates 1112.Transducer element 1101 comprises the exterior top surface defined by a part for lid 1111.In addition, transducer element also comprises the outside bottom surface defined by a part for rigid substrates 1112 and lid 1111.Rigid substrates 1112 comprises the outer surface with the terminal 1183 be positioned on outer surface.First earth terminal 1182 is around terminal 1183.Second earth terminal 1181 is around the first earth terminal 1182 and along the perimeter of rigid substrates 1112.
Figure 12 A-12H shows the viewgraph of cross-section of the assembly according to various execution mode.
In fig. 12, assembly comprises transducer element 1201 and flexible base, board 1204.Transducer element 1201 is bottom port microphones, and comprises and be positioned at pad on the outside bottom surface of transducer element 1201 or terminal 1293.Flexible base, board 1204 comprises this flexible base, board 1204 away from the first terminal 1291 on the first surface of transducer element 1201 outer cover.This flexible base, board also comprises the second terminal 1292 on this flexible base, board second surface relative with first surface.Second terminal 1292 is configured to match with the first terminal 1293 be positioned on the outside bottom surface of transducer element 1201.This flexible base, board also comprises the electronic unit 1205 be positioned on the flexible base, board second surface relative with the outer cover of transducer element 1201.This electronic unit 1205 can be semiconductor element and/or passive electrical components.In some implementation, electronic unit 1205 comprises the passive component of semiconductor element and installation adjacent with this semiconductor element.
In some implementation, transducer element comprises the first tube core 207 being arranged in outer cover, and electronic unit 1205 comprises the second tube core.First tube core 207 can be configured to Analog signals, and the second tube core can be configured to processing digital signal.By the second tube core being placed in the outside of transducer element 1201, the digital circuitry be positioned on this second tube core can be arranged to the analog circuit of offing normal on the first tube core 207 larger distance, the impact of analog circuitry system is improved to the signal to noise ratio encapsulating microphone equipment thus by reducing digital signal coupling.The semiconductor element be arranged on flexible base, board is electrically connected to the semiconductor element being positioned at outer cover, to allow the communication between them.Such as, flexible base, board 1204 can comprise trace (not shown) electronic unit 1205 being electrically connected to the second terminal 1292.In some embodiments, the first tube core 207 comprises being coupled into and receives the signal of telecommunication from sonic transducer and provide the preamplifier of analog output signal.Second tube core can comprise being coupled into and receives described analog output signal and provide modulus (A-D) transducer of digital output signal.In some implementations, installation semiconductor die package is on flexible substrates in glop top.
In Figure 12 B, assembly comprises transducer element 1202 and flexible base, board 1204.The component class of Figure 12 B is similar to the assembly of Figure 12 A.But in the configuration shown by Figure 12 B, transducer element 1202 also comprises additional second terminal 1294 in other words of layout adjacent with terminal 1293.In addition, electronic unit 1205 has been attached to the second terminal 1294, instead of is installed on flexible base, board 1204.In some implementations, electronic unit 1205 comprise be arranged on transducer element outside bottom surface on and the semiconductor element be encapsulated in glop top.In some implementation, electronic unit 1205 comprises the passive component of semiconductor element and installation adjacent with this semiconductor element.
In fig. 12 c, assembly comprises transducer element 1203 and flexible base, board 1204.The component class of Figure 12 C is similar to the assembly of Figure 12 A.But in the configuration shown by Figure 12 C, transducer element 1203 is the top port microphones comprising condenser microphone.In some implementations, electronic unit 1205 comprises installation on flexible substrates and the semiconductor element be encapsulated in glop top.In some implementation, electronic unit 1205 comprises the passive component of semiconductor element and installation adjacent with this semiconductor element.In other implementation, electronic unit 1205 only includes passive electrical components, such as adjustable resistor.
In fig. 12d, assembly comprises transducer element 1209 and flexible base, board 1204.The component class of Figure 12 D is similar to the assembly of Figure 12 B.But in the configuration shown by Figure 12 D, transducer element 1209 is the top port microphones comprising condenser microphone.In some implementations, electronic unit 1205 comprise be arranged on transducer element outside bottom surface on and the semiconductor element be encapsulated in glop top.In some implementation, electronic unit 1205 comprises the passive component of semiconductor element and installation adjacent with this semiconductor element.In other implementation, electronic unit 1205 only includes passive electrical components, such as adjustable resistor.
In fig. 12e, assembly comprises transducer element 1298 and flexible base, board 1204.The component class of Figure 12 E is similar to the assembly of Figure 12 A.But in the configuration shown by Figure 12 E, transducer element 1298 also comprises additional second terminal 1294 in other words of layout adjacent with the first terminal 1293.In addition, the second electronic unit 1206 has been attached to the second terminal 1294.So, Figure 12 E shows a kind of configuration, and wherein the first electronic unit 1205 has been attached to flexible base, board 1204, and the second electronic unit 1206 has been attached to the outside bottom surface of transducer element 1298.Described first and second electronic units 1205,1206 eachly can comprise passive component, eachly can comprise semiconductor element, eachly can comprise passive component and semiconductor element, or one can comprise semiconductor element and another can comprise passive component.In some implementations, the described first and/or second electronic unit 1205,1206 comprises the tube core be encapsulated in glop top.
In Figure 12 F, assembly comprises transducer element 1210 and electronic unit 1205.Transducer element 1210 is bottom port microphones, and comprises the first terminal 1281 and the second terminal 1282.The first terminal 1281 can be used for microphone to be installed to carrier substrate.Formed with the assembly of Figure 12 A-12E and contrast, the assembly of Figure 12 F does not comprise flexible base, board.Electronic unit 1205 can comprise semiconductor element and/or passive electrical components.Electronic unit 1205 is attached to the second terminal 1282.
In some implementation, transducer element 1210 comprises the first tube core 207 being arranged in outer cover, and electronic unit 1205 comprises the second tube core.First tube core 207 can be configured to Analog signals, and the second tube core can be configured to processing digital signal.By the second tube core being placed in the outside of transducer element 1210, the digital circuitry be positioned on this second tube core can be arranged to the analog circuit of offing normal on the first tube core 207 larger distance, by the coupling of reduction digital signal, the impact of analog circuitry system is improved to the signal to noise ratio of the microphone equipment of encapsulation thus.The semiconductor element be arranged on flexible base, board is electrically connected to the semiconductor element being positioned at outer cover, to allow the communication between them.In some embodiments, the first tube core 207 comprises being coupled into and receives the signal of telecommunication from sonic transducer and provide the preamplifier of analog output signal.Second tube core can comprise being coupled into and receives described analog output signal and provide modulus (A-D) transducer of digital output signal.
In Figure 12 G, assembly comprises transducer element 1212 and electronic unit 1205.The component class of Figure 12 G is similar to the assembly of Figure 12 F.But in the configuration shown by Figure 12 G, transducer element 1212 is the top port microphones comprising condenser microphone.
Figure 12 H shows the transducer element 1212 of Figure 12 G be arranged on carrier board 202.When the assembly 1212 of Figure 12 G is arranged on carrier board 202, electronic unit 1205 can be arranged in the opening 1220 of carrier board at least in part.This opening 1220 can be any suitable hole in carrier board, comprises the hole being used as sound port when bottom port microphone is installed to carrier board.But opening 1220 can be other hole or features.In some implementation, hole 1220 can be greater than the recess replacement of the height of electronic unit 1205 by the degree of depth.
Although 12H shows, the transducer element 1212 of Figure 12 G is installed on carrier substrate 202, the transducer element 1210 of Figure 12 F also can be installed on carrier board.Such as, transducer element 1210 can be installed to comprise the additional holes of aiming at transducer element 1212 bloomy sound port carrier board on.
Although Figure 12 A-12H shows electronic unit 1205,1206 and moves to terminal 1282,1294 or flexible base, board 1204, but in some configuration, electronic unit 1205 and/or electronic unit 1206 can be installed (such as, engage) on flexible base, board, and terminal 1282,1294 can such as utilize wire bond process to be electrically connected individually.
Figure 13 shows the electronic circuit comprising Part I 1301 and Part II 1302.Part I 1301 comprises the first semiconductor element, and Part II 1302 comprises the second semiconductor element.One IC 1304 can be the semiconductor element of the outer cover being positioned at transducer element.2nd IC 1305 can be the semiconductor element being positioned at (such as on the outer surface of the rigid substrates of outer cover) outside transducer element outer cover.But the 2nd IC 1305 can also be positioned on the side of flexible base, board away from sonic transducer parts.Transducer element is indicated by label 1303, and is electrically connected to an IC 1304 of electronic circuit.A 2nd IC 1305 and/or IC1304 can be electrically connected to the terminal of flexible base, board.
In one embodiment, in outer cover, the first semiconductor element comprises and is configured to Analog signals and the first circuit being electrically connected to the second semiconductor element, and the second semiconductor element comprises the second circuit being configured to processing digital signal.In one embodiment, the first circuit comprises being electrically connected to be connected into and receives analog signal from transducer element and provide the analog preamplifier of analog output signal, and wherein said analog output signal is as the single-ended or balanced signal being routed to the 2nd IC.2nd IC can comprise the analog to digital converter described analog output signal being converted to digital signal.This digital signal can be supplied to the Circuits System (not shown) on carrier board through the trace of flexible base, board.In some embodiments, the first circuit at least comprises a part for described analog to digital converter and/or receives for the digital controlled signal of control simulation circuit operation.
Figure 14 shows the viewgraph of cross-section of the assembly 1400 according to another kind of execution mode.Assembly 1400 comprises bottom port microphone package 107, conversion baseplate 1401 and carrier board 202.Bottom port microphone package 107 comprises the MEMS type sonic transducer 204 being arranged in case for packaging, and wherein outer cover comprises cap 111 and rigid substrates 112.Semiconductor element 207 is also arranged in case for packaging, and bonding wire 210 for providing electrical connection between MEMS type sonic transducer 204 and semiconductor element 207.Microphone package 107 has the sound port of band opening 108.As about execution mode described before, the structure of Figure 14 is also useful for the equipment of other type of encapsulation.Electric terminal 211 is positioned on the outside bottom surface of case for packaging.
Conversion baseplate 1401 is attached in the case for packaging exterior top surface relative with the outside bottom surface of case for packaging, and wherein the outer bottom face of case for packaging comprises electric terminal 211.Conversion baseplate 1401 comprises electric terminal 1403 on the side that this conversion baseplate 1401 is relative with case for packaging.In some implementation, adhesive is used for cap 111 to be attached to conversion baseplate 1401.
The electric terminal 1403 of conversion baseplate 1401 can be electrically connected to the electric terminal 211 of microphone package 107 in any suitable manner.Such as, in some implementations, wire 1402 may be used for providing electrical connection between one or more electric terminals 1403 and one or more electric terminals 211 of microphone package 107 of conversion baseplate 1401.Such as, conversion baseplate 1401 can comprise the electric trace being electrically connected to one or more electric terminals 1403, and wire 1402 may be used for the electric terminal 211 electric trace of conversion baseplate 1401 being electrically connected to microphone package 107.Although merely illustrate a wire in fig. 14, additional wire also may be used for providing additional connection between the electric terminal 1403 and the electric terminal 211 of microphone package 107 of conversion baseplate 1401.
The electric terminal 1403 of conversion baseplate 1401 with other approach except using wire 1402, such as, by using other suitable rigidity or fexible conductor, can be electrically connected to the electric terminal 211 of microphone package 107.
The side that case for packaging is relative with terminal 211 allows the case for packaging that substrate 1401 is attached to bottom port microphone package 107 to realize bottom port microphone package 107 in top port configures.Such as, by substrate 1401 being attached to the case for packaging side relative with terminal 211 and passing through to comprise electric terminal 1403 on the side that substrate 1401 is relative with case for packaging, bottom port microphone package 107 can be installed to carrier board 202 as top installing component.Correspondingly, substrate 1401 can be used for a bottom mounted package and convert top mounted package to.Utilize substrate 1401 that bottom port microphone package 107 is embodied as top port parts although Figure 14 shows, substrate 1401 also may be used for top port microphone package to be embodied as bottom port parts.Such as, turn back with reference to the top port microphone package 101 of figure 2B, substrate 1401 can be attached to cap 110 side relative with terminal 213, top port microphone package 101 is embodied as bottom port parts.In this configuration, substrate 1401 can comprise the hole aimed at the sound port 104 of top port microphone package.
Although disclose the present invention under the background of some preferred implementation and example, but, it will be understood by those skilled in the art that the present invention extends beyond other alternate embodiments of the present invention and/or purposes and apparent amendment thereof and equivalent from concrete disclosed execution mode.In addition, although several variant of the present invention has illustrated and has specifically described, based on present disclosure, other amendment within the scope of the invention will be also obviously for those skilled in the art.Also expect, the various combination of described execution mode specific features and aspect or sub-portfolio can be carried out and still belong to scope of the present invention.Should be appreciated that the changing pattern in order to form disclosed invention, the various feature of disclosed execution mode and aspect can combination with one another or replacements.So, scope of the present invention disclosed herein should not limited by above-described specific open execution mode, but can only by reading claims liberally to determine.

Claims (41)

1. an assembly, comprising:
Sonic transducer parts, its sonic transducer that there is outer cover and be arranged in described outer cover, described outer cover comprises the rigid substrates with each other relative first surface and second surface, wherein said outer cover has exterior top surface, the second surface of wherein said rigid substrates is arranged to the outside bottom surface as described outer cover, and wherein electric terminal is positioned on the second surface of described rigid substrates; And
Flexible base, board, it has Part I and Part II, and be at least flexible between described Part I and described Part II, each part has relative side, wherein said flexible base, board folds around described sonic transducer parts, its Part I covers and is attached to described exterior top surface, and its Part II covers at least in part and is attached to described outside bottom surface, and wherein said flexible base, board is provided with the first conductivity terminal exposed on the side of Part I away from described outer cover and the second conductivity terminal exposed on the side of Part II towards described outer cover, at least one in described second conductivity terminal is connected at least one electric terminal of described rigid substrates.
2. assembly as claimed in claim 1, wherein said assembly has the sound port extending through its outer cover, for passing through of acoustic pressure between the outside of described assembly and described sonic transducer.
3. assembly as claimed in claim 2, wherein said assembly has sound port and the hole by described flexible base, board, described sound port has the opening of the outer cover by described assembly, the opening of wherein said sound port and aligned with each other by the hole of described flexible base, board, to transmit acoustic pressure between the outside of described assembly and described sonic transducer.
4. assembly as claimed in claim 1, wherein conductive trace extends between first side and the opposite side of Part II of the Part I of described flexible base, board, and wherein said trace route is by perpendicular interconnection passage (VIA).
5. assembly as claimed in claim 1, also comprise semiconductor element, described semiconductor element is positioned on the Part II of described flexible base, board, at described Part II away from the side of outer cover.
6. assembly as claimed in claim 5, wherein said semiconductor die package is in glop top.
7. assembly as claimed in claim 1, the Part II of wherein said flexible base, board has the area less than the second surface of described rigid substrates.
8. an assembly, comprising:
Sonic transducer parts, its sonic transducer that there is outer cover and be arranged in described outer cover, described outer cover comprises the rigid substrates with each other relative first surface and second surface, wherein said outer cover has exterior top surface, the second surface of wherein said rigid substrates is arranged to the outside bottom surface as described outer cover, and wherein electric terminal is positioned on the second surface of described rigid substrates; And
Flexible base, board, it has Part I and Part II, and be at least flexible between described Part I and described Part II, each part has relative side, wherein said flexible base, board folds around described sonic transducer parts, its Part I covers and is attached to described exterior top surface, and its Part II covers at least in part and is attached to described outside bottom surface, and wherein said flexible base, board is provided with and exposes on the side of Part I away from described outer cover and to be connected to the conductive trace of at least one electric terminal; And
Semiconductor element, described semiconductor element is arranged in described outer cover, wherein said semiconductor element comprises the circuit of the simulation part having and be configured to Analog signals and the numerical portion being configured to processing digital signal, and the described electric terminal be wherein positioned on the second surface of described rigid substrates comprises the first terminal being connected to described simulation part and the second terminal being connected to described numerical portion.
9. assembly as claimed in claim 8, the electric terminal be wherein positioned on the second surface of described rigid substrates also comprises the 3rd terminal, and the conductive trace of wherein said flexible base, board is connected to described 3rd terminal and at the Part I of described flexible base, board away from the side of outer cover exposing described 3rd terminal.
10. assembly as claimed in claim 9, wherein said assembly also comprises the 4th electric terminal being electrically connected to described semiconductor element, the part that described 4th terminal is not covered by described flexible base, board at the second surface of described rigid substrates exposes, and wherein at least one electric component is electrically connected to described 4th terminal.
11. assemblies as claimed in claim 10, wherein said assembly also comprises the 5th electric terminal being electrically connected to described semiconductor element, described Five-terminals covers outside bottom surface on the side relative with the side being fixed to outside bottom surface part at flexible base, board exposes, and wherein at least one electric component is electrically connected to described Five-terminals.
12. assemblies as claimed in claim 1, wherein said sonic transducer is configured as micro-electromechanical system (MEMS) equipment.
13. assemblies as claimed in claim 1, wherein said sonic transducer is configured as condenser microphone or electret capcitor microphone.
14. 1 kinds of methods manufacturing assembly, comprising:
There is provided the sonic transducer parts with outer cover, wherein said outer cover has exterior top surface and outside bottom surface, and wherein electric terminal is positioned on described outside bottom surface; And
Subsequently, described sonic transducer parts are attached to the flexible base, board with Part I and Part II, wherein said Part I has relative side with described Part II is each, wherein said flexible base, board folds around described sonic transducer parts, its Part I covers described exterior top surface, and its Part II covers described outside bottom surface at least in part, and wherein said flexible base, board is provided with the first conductivity terminal exposed on the side of Part I away from described outer cover and the second conductivity terminal exposed on the side of Part II towards described outer cover, at least one in described second conductivity terminal is connected at least one electric terminal of described outer cover.
15. methods as claimed in claim 14, wherein provide sonic transducer parts to be included in described outer cover and provide the first semiconductor element.
16. methods as claimed in claim 15, the second semiconductor element is installed in the outside bottom surface being also included in described outer cover.
17. methods as claimed in claim 15, passive electrical components is installed in the outside bottom surface being also included in described outer cover.
18. methods as claimed in claim 15, the Part II being also included in described flexible base, board installs the second semiconductor element on the side that described Part II is relative with described outer cover.
19. 1 kinds of assemblies, comprising:
The microphone equipment of encapsulation, it sonic transducer comprising outer cover and be arranged in described outer cover, wherein said outer cover has exterior top surface and the outside bottom surface relative with described exterior top surface, and the outer bottom face of wherein said outer cover comprises the electric terminal be located thereon; And
Flexible base, board, it has top section, base section and flexible mid portion, the mid portion of described flexibility is between described top section and described base section, the mid portion of wherein said flexibility folds around described outer cover, described top section is covered at least in part and is attached to the exterior top surface of described outer cover, and described base section covers at least in part and is attached to the outside bottom surface of described outer cover, and wherein said flexible base, board comprises the first electric terminal away from described outer cover and the second electric terminal towards described outer cover, described second electric terminal is electrically connected at least one electric terminal of described outer cover.
20. assemblies as claimed in claim 19, wherein said outer cover comprises rigid substrates, and described rigid substrates comprises first surface and the second surface relative with described first surface, and the second surface of wherein said rigid substrates defines the outside bottom surface of described outer cover.
21. assemblies as claimed in claim 20, also comprise the sound port in the exterior top surface being positioned at described outer cover.
22. assemblies as claimed in claim 21, the Part I of wherein said flexible base, board comprises the hole aimed at described sound port.
23. assemblies as claimed in claim 20, also comprise the sound port be positioned on the outside bottom surface of described outer cover.
24. assemblies as claimed in claim 20, the width of the mid portion of the flexibility of wherein said flexible base, board is less than the width of described top section and described base section.
25. assemblies as claimed in claim 19, also comprise the second tube core on the first tube core be arranged in the described outer cover side relative with described outer cover with the Part II being arranged on described flexible base, board.
26. assemblies as claimed in claim 25, wherein said second die package is in glop top.
27. assemblies as claimed in claim 26, wherein said first tube core is configured to Analog signals, and wherein said second tube core is configured to processing digital signal.
28. assemblies as claimed in claim 25, also comprise be arranged on described flexible base, board Part II on, passive electrical components on the side that described Part II is relative with described outer cover.
29. assemblies as claimed in claim 19, also comprise the first tube core be arranged in described outer cover and the second tube core be arranged on the outside bottom surface of described outer cover.
30. 1 kinds of assemblies, comprising:
The microphone equipment of encapsulation, it sonic transducer comprising outer cover and be arranged in described outer cover, the microphone equipment of wherein said encapsulation has exterior top surface and the outside bottom surface relative with described exterior top surface, and the outer bottom face of the microphone equipment of wherein said encapsulation comprises the first electric terminal be located thereon, and wherein said outer cover comprises the sound port by it; And
To be arranged on the bottom surface of the microphone equipment of described encapsulation, with the electronic unit of described first electric terminal telecommunication; And
One or more second electric terminals on the described end face and described bottom surface of the microphone equipment of described encapsulation, described second electric terminal is configured to be electrically coupled to system board, wherein said system board is different from described electronic unit, and described second electric terminal is different from described first electric terminal.
31. assemblies as claimed in claim 30, also comprise phone plate, described phone plate comprises the opening by it, and the outside bottom surface of the microphone equipment of wherein said encapsulation is installed to described phone plate, and what make described electronic unit is arranged in described opening at least partially.
32. assemblies as claimed in claim 30, wherein said outer cover comprises rigid substrates, described rigid substrates comprises first surface and the second surface relative with described first surface, and the second surface of wherein said rigid substrates defines the outside bottom surface of the microphone equipment of described encapsulation.
33. assemblies as claimed in claim 32, also comprise the first tube core be arranged in described outer cover, on the first surface of described rigid substrates.
34. assemblies as claimed in claim 33, wherein said electronic unit comprises the second tube core.
35. assemblies as claimed in claim 34, wherein said first tube core is configured to Analog signals, and wherein said second tube core is configured to processing digital signal.
36. assemblies as claimed in claim 30, wherein said electronic unit comprises the passive component being electrically connected to described sonic transducer.
37. assemblies as claimed in claim 36, wherein said electronic unit comprises adjustable resistor, and the resistance of wherein said adjustable resistor determines the sensitivity of described sonic transducer.
38. 1 kinds of assemblies, comprising:
Sonic transducer parts, it has outer cover and is positioned at sonic transducer wherein, and described outer cover comprises exterior top surface and the outside bottom surface relative with described exterior top surface, and wherein said outer cover comprises the multiple electric terminals be positioned on the outside bottom surface of described outer cover; And
Conversion baseplate, comprise the Part I of the exterior top surface being attached to described outer cover, the Part I of wherein said conversion baseplate comprises more than first electrical bonding pads be positioned on the described conversion baseplate side relative with described outer cover, described conversion baseplate comprises and is positioned at described conversion baseplate towards more than second electrical bonding pads on the side of described outer cover, and at least one in wherein said more than second electrical bonding pads is electrically connected at least one in described multiple electric terminal of described outer cover.
39. assemblies as claimed in claim 38, wherein said conversion baseplate also comprises Part II, and be at least flexible between described Part I and described Part II, wherein said conversion baseplate folds around described sonic transducer parts, make described Part I be attached to the exterior top surface of described outer cover and described Part II is attached to the outside bottom surface of described outer cover, and wherein said conversion baseplate comprise the trace being electrically connected at least one electric terminal and at least one electrical bonding pads.
40. assemblies as claimed in claim 38, also comprise wire, and described wire comprises the first end being electrically connected at least one electric terminal and the second end being electrically connected at least one electrical bonding pads.
41. assemblies as claimed in claim 30, the microphone equipment of wherein said encapsulation also comprises flexible base, board, described flexible base, board has top section, base section and flexible mid portion, the mid portion of described flexibility is between described top section and described base section, the mid portion of wherein said flexibility folds around described outer cover, described top section is covered at least in part and the top side being attached to described outer cover to define described exterior top surface, and described base section cover at least partly and the bottom side being attached to described outer cover to define described outside bottom surface.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109644309A (en) * 2016-07-06 2019-04-16 美商楼氏电子有限公司 Transducer package with via hole
CN113747327A (en) * 2021-09-14 2021-12-03 广州蜂鸟传感科技有限公司 Chip sounding device based on piezoelectric film

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9236837B2 (en) 2011-08-25 2016-01-12 Infineon Technologies Ag System and method for low distortion capacitive signal source amplifier
KR101276353B1 (en) * 2011-12-09 2013-06-24 주식회사 비에스이 Multi-function microphone assembly and method of making the same
US8569808B1 (en) * 2012-04-06 2013-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature stabilitized MEMS
US8638249B2 (en) 2012-04-16 2014-01-28 Infineon Technologies Ag System and method for high input capacitive signal amplifier
US9210516B2 (en) * 2012-04-23 2015-12-08 Infineon Technologies Ag Packaged MEMS device and method of calibrating a packaged MEMS device
US8872288B2 (en) * 2012-08-09 2014-10-28 Infineon Technologies Ag Apparatus comprising and a method for manufacturing an embedded MEMS device
SE537793C2 (en) * 2012-08-29 2015-10-20 Jan Berglund Med Inco Innovation F Power conductor mounted on a circuit board
US9156680B2 (en) 2012-10-26 2015-10-13 Analog Devices, Inc. Packages and methods for packaging
CN103052015A (en) * 2012-12-06 2013-04-17 山东共达电声股份有限公司 Method for realizing sensitivity consistence of microphone and adjustable-gain microphone
US9212052B2 (en) * 2013-08-07 2015-12-15 Invensense, Inc. Packaged microphone with multiple mounting orientations
US9254995B2 (en) * 2013-09-17 2016-02-09 Analog Devices, Inc. Multi-port device package
WO2015099737A1 (en) * 2013-12-26 2015-07-02 Intel Corporation Method and apparatus for flexible electronic communicating device
JP6261438B2 (en) * 2014-04-14 2018-01-17 日本メクトロン株式会社 Printed wiring board and printed circuit manufacturing method
US9617144B2 (en) 2014-05-09 2017-04-11 Invensense, Inc. Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same
US9955246B2 (en) * 2014-07-03 2018-04-24 Harman International Industries, Incorporated Gradient micro-electro-mechanical systems (MEMS) microphone with varying height assemblies
KR20160021516A (en) * 2014-08-18 2016-02-26 삼성전자주식회사 Electronic device
US20150001649A1 (en) * 2014-09-18 2015-01-01 Brandon Harrington MEMS Apparatus On a Lid With Flexible Substrate
KR20160110861A (en) 2015-03-13 2016-09-22 삼성디스플레이 주식회사 Flexible circuit substrate and display device including the same
CN104717596A (en) * 2015-03-23 2015-06-17 惠州Tcl移动通信有限公司 Microphone audio testing system and method
US9475691B1 (en) 2015-06-26 2016-10-25 Infineon Technologies Ag Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
KR101681903B1 (en) * 2015-07-02 2016-12-02 (주)파트론 Microphone package
US10141245B2 (en) * 2016-08-24 2018-11-27 Qorvo Us, Inc. High-power acoustic device with improved performance
GB2554729A (en) * 2016-10-07 2018-04-11 Continental Automotive Gmbh Device and method for measuring a level of a fluid in a container
US11254560B2 (en) 2018-06-19 2022-02-22 Knowles Electronics, Llc Transconductance amplifier
US11095990B2 (en) * 2018-06-19 2021-08-17 Knowles Electronics, Llc Microphone assembly with reduced noise
TWM574274U (en) * 2018-08-20 2019-02-11 和碩聯合科技股份有限公司 Radio electronic device and its radio structure
US10777474B1 (en) * 2019-03-06 2020-09-15 Infineon Technologies Ag Pressure sensors on flexible substrates for stress decoupling
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
EP4175314A1 (en) * 2021-10-26 2023-05-03 Harman International Industries, Incorporated Microphone device with a closed housing and a membrane

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
CN101238060A (en) * 2005-08-11 2008-08-06 皇家飞利浦电子股份有限公司 Method for manufacturing a microelectronic package comprising a silicon MEMS microphone

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
US4752352A (en) 1986-06-06 1988-06-21 Michael Feygin Apparatus and method for forming an integral object from laminations
US4863538A (en) 1986-10-17 1989-09-05 Board Of Regents, The University Of Texas System Method and apparatus for producing parts by selective sintering
US5348693A (en) 1991-11-12 1994-09-20 Advanced Cardiovascular Systems, Inc. Formation of three dimensional objects and assemblies
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP4607863B2 (en) 2003-01-08 2011-01-05 エオプレックス テクノロジーズ インコーポレイテッド A system for mass printing
US7382048B2 (en) 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
EP1679858A4 (en) * 2003-10-31 2009-07-01 Panasonic Corp Connection device, electronic apparatus with the same, and folding portable terminal device
US20070071268A1 (en) 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
US7202552B2 (en) 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
KR100722686B1 (en) 2006-05-09 2007-05-30 주식회사 비에스이 Silicon condenser microphone having additional back chamber and sound hole in pcb
US7763488B2 (en) 2006-06-05 2010-07-27 Akustica, Inc. Method of fabricating MEMS device
TWI319690B (en) * 2006-09-08 2010-01-11 Ind Tech Res Inst Structure and manufacturing method of inversed microphone module and microphone chip component
US8295528B2 (en) 2006-11-23 2012-10-23 Epcos Ag Board mounting of microphone transducer
US20080175425A1 (en) 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
US8103027B2 (en) 2007-06-06 2012-01-24 Analog Devices, Inc. Microphone with reduced parasitic capacitance
US9078068B2 (en) 2007-06-06 2015-07-07 Invensense, Inc. Microphone with aligned apertures
US7888754B2 (en) * 2007-12-28 2011-02-15 Yamaha Corporation MEMS transducer
USD575056S1 (en) * 2008-02-19 2008-08-19 Incase Designs Corporation Portable electronic device case
US20090320698A1 (en) 2008-06-26 2009-12-31 Laperna Wong Michele Katherine Multiple-emusion print screen and method for making same
US8491830B2 (en) 2008-07-11 2013-07-23 Eoplex Limited Boundary configurations for multi-material print-forming
KR100963296B1 (en) * 2008-07-11 2010-06-11 주식회사 비에스이 A variable directional microphone assmebly and method of making the microphone assembly
US20100086146A1 (en) 2008-10-02 2010-04-08 Fortemedia, Inc. Silicon-based microphone package
US8013404B2 (en) 2008-10-09 2011-09-06 Shandong Gettop Acoustic Co. Ltd. Folded lead-frame packages for MEMS devices
US8199939B2 (en) 2009-01-21 2012-06-12 Nokia Corporation Microphone package
US8577063B2 (en) 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8809974B2 (en) 2010-02-26 2014-08-19 Ubotic Intellectual Property Company Limited Semiconductor package for MEMS device and method of manufacturing same
US8447057B2 (en) 2011-03-18 2013-05-21 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
CN101238060A (en) * 2005-08-11 2008-08-06 皇家飞利浦电子股份有限公司 Method for manufacturing a microelectronic package comprising a silicon MEMS microphone

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109644309A (en) * 2016-07-06 2019-04-16 美商楼氏电子有限公司 Transducer package with via hole
CN109644309B (en) * 2016-07-06 2020-03-20 美商楼氏电子有限公司 Transducer package with vias
CN113747327A (en) * 2021-09-14 2021-12-03 广州蜂鸟传感科技有限公司 Chip sounding device based on piezoelectric film

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CN102740205B (en) 2017-10-31

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