CN201541414U - Heat sink device - Google Patents
Heat sink device Download PDFInfo
- Publication number
- CN201541414U CN201541414U CN2009200340417U CN200920034041U CN201541414U CN 201541414 U CN201541414 U CN 201541414U CN 2009200340417 U CN2009200340417 U CN 2009200340417U CN 200920034041 U CN200920034041 U CN 200920034041U CN 201541414 U CN201541414 U CN 201541414U
- Authority
- CN
- China
- Prior art keywords
- heat
- components
- conducting strip
- circuit board
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002787 reinforcement Effects 0.000 claims description 12
- 239000004519 grease Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 4
- 239000010974 bronze Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 230000005855 radiation Effects 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a mainly use heat abstractor for high-power device who works under the poor or vacuum environment of air mobility has mainly solved prior art, the unable normal radiating problem of high-power device of working under the poor or vacuum environment of air mobility. The heat dissipation device comprises a circuit board provided with components, the circuit board is arranged in a case, reinforcing ribs are also arranged in the case, and the components are parallel to the outer surface of the circuit board and connected with the reinforcing ribs through heat conducting fins; and a heat-conducting insulating pad is arranged between the component and the heat-conducting fin. The heat dissipation device has the advantages of good heat dissipation effect, good insulation performance, good resistance to mechanical environment and high reliability.
Description
Technical field
The utility model relates to a kind of heat abstractor, is specifically related to a kind of high power device heat abstractor, is mainly used in the high power device of working under air flow property difference or the vacuum environment.
Background technology
Along with technology constantly develops, the operating frequency of electronic devices and components is in continuous increase, and the heat that has so directly caused electronic devices and components to produce in the course of the work sharply raises.Be applied in the electronic devices and components of working under air flow property difference or the vacuum environment for it, original natural heat dissipation mode can't meet the demands.
At present, most heat abstractor adopts the mode of air-flow heat radiation also can not be applicable to vacuum environment; The mode that adopts return and add cooling agent is also arranged in addition, be subjected to the circuit board space restriction also can't application in practice; Particularly consider particular job environment such as vacuum, shock resistance, also must take into account the requirement and the restriction of electronics (avoiding occurring disturbing), quality, size.Therefore, need take special cooling mechanism design to big power consumption device.
Summary of the invention
The utility model provides a kind of high power device heat abstractor, has mainly solved in the prior art problem that the high power device of working under air flow property difference or vacuum environment can't normally dispel the heat.
Technical solution of the present utility model is as follows:
This heat abstractor comprises the circuit board that components and parts are installed, and circuit board is arranged at cabinet inside, and cabinet inside also is provided with reinforcement, and the outer surface that components and parts are parallel to circuit board is connected by conducting strip with reinforcement; Be provided with the heat conductive insulating pad between components and parts and the conducting strip.
Connect by insulating heat-conductive is gluing between the contact-making surface of described heat conductive insulating pad, components and parts, conducting strip and reinforcement.
The thickness of the above insulating heat-conductive pad can be 0.2mm～0.35mm.
The above conducting strip can be " Z " type or " U " type structure.
The above conducting strip is beryllium-bronze or red copper conducting strip.
The above insulating heat-conductive glue is D-3 thermal grease conduction, GD414 thermal grease conduction or GD414C thermal grease conduction.Insulating heat-conductive glue is good with the D-3 thermal grease conduction.
Advantage of the present utility model is:
1, the utility model transmits the heat that electronic devices and components produce by multistage heat radiation, has not only kept the performance by circuit board heat radiation and heat loss through radiation, has also increased conducting strip and has been connected to reinforcement and the heat sink radiating mode of cabinet.Be coated with thermal grease conduction between each connector, improved radiating effect greatly.
2, the insulating heat-conductive pad is installed between the utility model components and parts and conducting strip, has been improved insulating properties, fail safe, the antijamming capability of electronic devices and components greatly.
3, the used conducting strip of the utility model is set to elastic buffer structures such as " Z " type or " U " type, has improved electronic devices and components drag performance, has improved reliability of products simultaneously.
Description of drawings
Fig. 1 is the utility model concrete structure schematic diagram;
Fig. 2 is the utility model heat dissipation path schematic diagram.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail:
This heat abstractor comprises the circuit board 2 that components and parts 1 are installed, and circuit board is arranged at cabinet inside, and cabinet inside also is provided with reinforcement 3, and the outer surface that components and parts 1 are parallel to circuit board is connected by conducting strip 4 with reinforcement 3; Be provided with heat conductive insulating pad 5 between components and parts 1 and the conducting strip 4.
Heat conductive insulating pad 5 is bonded on components and parts 1, conducting strip 4 and the reinforcement 3 by insulating heat-conductive glue 6, and the thickness of insulating heat-conductive pad can be 0.2mm～0.35mm, and insulating heat-conductive glue is good with the D-3 thermal grease conduction.This measure has guaranteed the insulation of components and parts shells, pin, lead-in wire and conducting strip on the one hand, is beneficial to guarantee electronics reliability and fail safe; Reduce the contact heat resistance between components and parts shell and conducting strip, strengthened radiating effect; The softness characteristics of heat conductive insulating pad also helps improving the mechanical environment of components and parts.
Conducting strip is " Z " type or " U " type structure, is good with " Z " type structure, and conducting strip adopts elasticity beryllium-bronze QBe2.The pliability of beryllium-bronze makes conducting strip contact with the components and parts surface flexible, can play the effect of buffering, helps improving the mechanical environment of components and parts.
During work, the heat dissipation path of this heat abstractor as shown in Figure 2:
Be delivered to conducting strip with heat-conducting mode from the components and parts encapsulating shell, conducting strip is delivered to reinforcement, and reinforcement is delivered to the aluminium frame, and the aluminium frame is delivered to cabinet.This is the main effect that the utility model reaches.
Be delivered to printed board with heat-conducting mode from the components and parts installed surface and the pin that is welded, be delivered to the aluminium frame from printed board again, the aluminium frame is delivered to cabinet.
Be delivered to cabinet inner surface and other element surfaces with radiation mode from components and parts.
Claims (6)
1. a heat abstractor comprises the circuit board that components and parts are installed, and circuit board is arranged at cabinet inside, and described cabinet inside also is provided with reinforcement, it is characterized in that: the outer surface that described components and parts are parallel to circuit board is connected by conducting strip with reinforcement; Be provided with the insulating heat-conductive pad between described components and parts and the conducting strip.
2. heat abstractor according to claim 1 is characterized in that: connect by insulating heat-conductive is gluing between described insulating heat-conductive pad, components and parts, conducting strip and the reinforcement.
3. heat abstractor according to claim 1 and 2 is characterized in that: the thickness of described insulating heat-conductive pad is 0.2mm～0.35mm.
4. heat abstractor according to claim 3 is characterized in that: described conducting strip is " Z " type or " U " type structure.
5. heat abstractor according to claim 4 is characterized in that: described conducting strip is beryllium-bronze or red copper conducting strip.
6. heat abstractor according to claim 5 is characterized in that: described insulating heat-conductive glue is D-3 thermal grease conduction, GD414 thermal grease conduction or GD414C thermal grease conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200340417U CN201541414U (en) | 2009-07-28 | 2009-07-28 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200340417U CN201541414U (en) | 2009-07-28 | 2009-07-28 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201541414U true CN201541414U (en) | 2010-08-04 |
Family
ID=42592861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200340417U Expired - Fee Related CN201541414U (en) | 2009-07-28 | 2009-07-28 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201541414U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107086011A (en) * | 2017-05-12 | 2017-08-22 | 惠州三华工业有限公司 | Display |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN110226131A (en) * | 2017-01-19 | 2019-09-10 | 卡尔蔡司Smt有限责任公司 | The component of projection exposure |
| CN113985950A (en) * | 2021-11-22 | 2022-01-28 | 中国电子技术标准化研究院 | High vacuum environment test piece temperature control device |
-
2009
- 2009-07-28 CN CN2009200340417U patent/CN201541414U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110226131A (en) * | 2017-01-19 | 2019-09-10 | 卡尔蔡司Smt有限责任公司 | The component of projection exposure |
| CN110226131B (en) * | 2017-01-19 | 2021-08-31 | 卡尔蔡司Smt有限责任公司 | Component of a projection exposure apparatus |
| CN107086011A (en) * | 2017-05-12 | 2017-08-22 | 惠州三华工业有限公司 | Display |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN113985950A (en) * | 2021-11-22 | 2022-01-28 | 中国电子技术标准化研究院 | High vacuum environment test piece temperature control device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100804 Termination date: 20140728 |
|
| EXPY | Termination of patent right or utility model |