CN203690280U - High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging - Google Patents
High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging Download PDFInfo
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- CN203690280U CN203690280U CN201420042589.7U CN201420042589U CN203690280U CN 203690280 U CN203690280 U CN 203690280U CN 201420042589 U CN201420042589 U CN 201420042589U CN 203690280 U CN203690280 U CN 203690280U
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- heat radiation
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Abstract
The utility model discloses a high-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging. The heat radiation module includes a cermet body used for fixing a chip, a high-thermal-conductivity ceramic body used for fixing an external heat radiator housing, and a brazing layer, wherein the high-thermal-conductivity ceramic body and the cermet body are fixedly connected through the brazing layer. Because the cermet has a high thermal conductivity close to that of aluminum metal and has a thermal expansion coefficient close to that of the chip material, and is light in weight, and therefore the cermet can match with the chip in thermal expansion coefficient, and can help to prolong the service life of the chip while having good heat radiation performance. The heat radiation module is low in thermal impedance, fast in heat radiation, high in resistance to high-tension breakdown and thermal shock and light in weight, and the chip has a long service life. According to the heat radiation module, because that the heat conduction is good, and thermal expansion coefficients of the chip the cermet mounted on the chip match with each other, the chip can always be in a good work temperature environment.
Description
Technical field
The utility model relates to microelectronics technology, relates in particular to a kind of chip package high-thermal conductive metal Ceramic Composite stratiform radiating module.
Background technology
Semiconductor integrated circuit technology advances with rapid changepl. never-ending changes and improvementsly, and chip package is just constantly to miniaturization, high-performance, high reliability and low cost future development.In chip package, how effectively to overcome thermal resistance, a large amount of heat energy is distributed to the external world, how to design chip package radiating module, more aobvious important.
Refer to Fig. 3, the outer chip package of Present Domestic is generally that chip A is directly attached to tellite B above, then by tellite B, heat is dispersed into outside body by aluminium radiator C.Such shortcoming is that chip is short useful life.Because chip is to be generally made up of semiconductor silicon, its thermal coefficient of expansion is low, and copper sheet thermal coefficient of expansion is three times of chip.Under the mal-condition of microelectronic device inferior cold cycling work up to ten thousand, because both thermal coefficient of expansions are inconsistent, cause chip failure.Use simultaneously to cover copper printed circuit board (PCB) thermal resistance large, dispel the heat bad, the heat that also easily causes chip to send distributes difficulty to the external world, thereby chip temperature rises, chip operation lost efficacy.
Utility model content
For the weak point existing in above-mentioned technology, the utility model provides one can improve the bad and unmatched problem of chip attachment material thermal expansion coefficient of current chip package cooling, thereby improves the chip technical scheme in useful life.
For achieving the above object, the utility model provides a kind of chip package high-thermal conductive metal Ceramic Composite stratiform radiating module, comprise that described highly heat-conductive carbon/ceramic porcelain body is fixedly connected with by brazing layer with cermet body for the cermet body of fixed chip, for highly heat-conductive carbon/ceramic porcelain body and the brazing layer of fixing outer radiator casing.
Wherein, the upper surface of described highly heat-conductive carbon/ceramic porcelain body is coated with and covers copper layer, described cermet body with on cover copper layer and be fixedly connected with.
Wherein, the lower surface of described highly heat-conductive carbon/ceramic porcelain body is coated with down and covers copper layer, described outer radiator casing with under cover copper layer and be fixedly connected with.
For achieving the above object, the utility model provides a kind of chip package high-thermal conductive metal Ceramic Composite stratiform radiating module, comprise that described highly heat-conductive carbon/ceramic porcelain body is fixedly connected with by high-heat-conductivity glue layer with cermet body for the cermet body of fixed chip, for highly heat-conductive carbon/ceramic porcelain body and the high-heat-conductivity glue layer of fixing outer radiator casing.
Wherein, the upper surface of described highly heat-conductive carbon/ceramic porcelain body is coated with and covers copper layer, described cermet body with on cover copper layer and be fixedly connected with.
Wherein, the lower surface of described highly heat-conductive carbon/ceramic porcelain body is coated with down and covers copper layer, described outer radiator casing with under cover copper layer and be fixedly connected with.
The beneficial effects of the utility model are: compared with prior art, high-thermal conductive metal Ceramic Composite stratiform radiating module for the chip package that the utility model provides, between chip and outer radiator casing, set up cermet body and highly heat-conductive carbon/ceramic porcelain body, and for fixing brazing layer or high-heat-conductivity glue layer, because cermet has the high thermal conductivity of the aluminum metal of approaching, there is the thermal coefficient of expansion approaching with chip material simultaneously, lightweight, thereby thermal coefficient of expansion that can matching chip, in thering is excellent heat dispersion performance, extend the chip life-span.
Say further, the radiating module of this case, thermal impedance is low, rapid heat dissipation, anti-high-voltage breakdown ability are strong, lightweight, thermal shock resistance is strong, chip long service life.Owing to conducting heat, with the cermet matched coefficients of thermal expansion of chip attachment, make chip can constantly be in good working temperature.
Brief description of the drawings
Fig. 1 is the structural representation of laminated heat radiation module the first embodiment of the present utility model;
Fig. 2 is the structural representation of laminated heat radiation module the second embodiment of the present utility model;
Fig. 3 is the structural representation of prior art.
Main element symbol description is as follows:
10, chip 11, cermet body
12, highly heat-conductive carbon/ceramic porcelain body 13, outer radiator casing
14A, brazing layer 14B, high-heat-conductivity glue layer
15, on, cover copper layer 16, under cover copper layer
A, chip B, tellite
C, aluminium radiator
Embodiment
In order more clearly to explain the utility model, below in conjunction with accompanying drawing, the utility model is further described.
Refer to Fig. 1, chip package of the present utility model is with in high-thermal conductive metal Ceramic Composite stratiform radiating module the first embodiment, comprise that highly heat-conductive carbon/ceramic porcelain body 12 is fixedly connected with by brazing layer 14A with cermet body 11 for the cermet body 11 of fixed chip 10, for highly heat-conductive carbon/ceramic porcelain body 12 and the brazing layer 14A of fixing outer radiator casing 13.
Between chip 10 and cermet body 11, paste by scolder, between outer radiator casing 13 and highly heat-conductive carbon/ceramic porcelain body 12, by the mechanical connection of screw or welded type, in order to strengthen radiating effect, also smear heat-conducting glue at seam crossing.Such modular design, eliminates the thermal resistance of each layer, has improved and the insulation of shell, and anti-high-voltage breakdown, can shed chip heat rapidly again simultaneously effectively, has ensured that whole microelectronic circuit can be in normal operating conditions well.Compared with the structure of Fig. 3, this case adopts high heat-conducting ceramic to overcome to cover the low and high shortcoming of thermal resistance of the anti-high-voltage breakdown ability of copper printed circuit board (PCB).
In the present embodiment, the upper surface of above-mentioned highly heat-conductive carbon/ceramic porcelain body 12 is coated with and covers copper layer 15, cermet body 11 with on cover copper layer 15 and be fixedly connected with.The lower surface of highly heat-conductive carbon/ceramic porcelain body 12 is coated with down and covers copper layer 16, outer radiator casing 13 with under cover copper layer 16 and be fixedly connected with.It is more firm in order to make to connect in the upper and lower surface of highly heat-conductive carbon/ceramic porcelain body 12, the object of covering copper layer being all set, and further improves thermal conduction effect.
Refer to Fig. 2, the chip package that the utility model provides is with in high-thermal conductive metal Ceramic Composite stratiform radiating module the second embodiment, and main structure member is all identical with the first embodiment, and difference is to utilize high-heat-conductivity glue layer 14B to substitute brazing layer 14A.As seen from the figure, it comprises that highly heat-conductive carbon/ceramic porcelain body 12 is fixedly connected with by high-heat-conductivity glue layer 14B with cermet body 11 for the cermet body 11 of fixed chip 10, for highly heat-conductive carbon/ceramic porcelain body 12 and the high-heat-conductivity glue layer 14B of fixing outer radiator casing 13.
In the present embodiment, the upper surface of above-mentioned highly heat-conductive carbon/ceramic porcelain body 12 is coated with equally and covers copper layer 15, cermet body 11 with on cover copper layer 15 and be fixedly connected with.The lower surface of highly heat-conductive carbon/ceramic porcelain body 12 is coated with down equally and covers copper layer 16, outer radiator casing 13 with under cover copper layer 16 and be fixedly connected with.It is more firm in order to make to connect in the upper and lower surface of highly heat-conductive carbon/ceramic porcelain body 12, the object of covering copper layer being all set, and further improves thermal conduction effect.
Advantage of the present utility model is: between chip and outer radiator casing, set up cermet body and highly heat-conductive carbon/ceramic porcelain body, and for fixing brazing layer or high-heat-conductivity glue layer, because cermet has the high thermal conductivity (200W/m-k) of the aluminum metal of approaching, there is the thermal coefficient of expansion approaching with chip material (8ppm/k) simultaneously, lightweight, thereby thermal coefficient of expansion that can matching chip, in thering is excellent heat dispersion performance, extend the chip life-span.The radiating module of this case, thermal impedance is low, rapid heat dissipation, anti-high-voltage breakdown ability are strong, lightweight, thermal shock resistance is strong, chip long service life.Owing to conducting heat, with the cermet matched coefficients of thermal expansion of chip attachment, make chip can constantly be in good working temperature.
Disclosed is above only several specific embodiment of the present utility model, but the utility model is not limited thereto, and the changes that any person skilled in the art can think of all should fall into protection range of the present utility model.
Claims (6)
1. a high-thermal conductive metal Ceramic Composite stratiform radiating module for chip package, it is characterized in that, comprise that described highly heat-conductive carbon/ceramic porcelain body is fixedly connected with by brazing layer with cermet body for the cermet body of fixed chip, for highly heat-conductive carbon/ceramic porcelain body and the brazing layer of fixing outer radiator casing.
2. radiating module according to claim 1, is characterized in that, the upper surface of described highly heat-conductive carbon/ceramic porcelain body is coated with and covers copper layer, described cermet body with on cover copper layer and be fixedly connected with.
3. radiating module according to claim 1 and 2, is characterized in that, the lower surface of described highly heat-conductive carbon/ceramic porcelain body is coated with down and covers copper layer, described outer radiator casing with under cover copper layer and be fixedly connected with.
4. a high-thermal conductive metal Ceramic Composite stratiform radiating module for chip package, it is characterized in that, comprise that described highly heat-conductive carbon/ceramic porcelain body is fixedly connected with by high-heat-conductivity glue layer with cermet body for the cermet body of fixed chip, for highly heat-conductive carbon/ceramic porcelain body and the high-heat-conductivity glue layer of fixing outer radiator casing.
5. radiating module according to claim 4, is characterized in that, the upper surface of described highly heat-conductive carbon/ceramic porcelain body is coated with and covers copper layer, described cermet body with on cover copper layer and be fixedly connected with.
6. according to the radiating module described in claim 4 or 5, it is characterized in that, the lower surface of described highly heat-conductive carbon/ceramic porcelain body is coated with down and covers copper layer, described outer radiator casing with under cover copper layer and be fixedly connected with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420042589.7U CN203690280U (en) | 2014-01-23 | 2014-01-23 | High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420042589.7U CN203690280U (en) | 2014-01-23 | 2014-01-23 | High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging |
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| Publication Number | Publication Date |
|---|---|
| CN203690280U true CN203690280U (en) | 2014-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420042589.7U Expired - Fee Related CN203690280U (en) | 2014-01-23 | 2014-01-23 | High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108428682A (en) * | 2018-04-13 | 2018-08-21 | 江西江铃集团新能源汽车有限公司 | A kind of power modules and preparation method thereof |
-
2014
- 2014-01-23 CN CN201420042589.7U patent/CN203690280U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108428682A (en) * | 2018-04-13 | 2018-08-21 | 江西江铃集团新能源汽车有限公司 | A kind of power modules and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20180123 |
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| CF01 | Termination of patent right due to non-payment of annual fee |