CN203748098U - Flexible circuit board structure improving heat dissipation performance of flashlight of camera - Google Patents
Flexible circuit board structure improving heat dissipation performance of flashlight of camera Download PDFInfo
- Publication number
- CN203748098U CN203748098U CN201320693306.0U CN201320693306U CN203748098U CN 203748098 U CN203748098 U CN 203748098U CN 201320693306 U CN201320693306 U CN 201320693306U CN 203748098 U CN203748098 U CN 203748098U
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- China
- Prior art keywords
- heat
- circuit board
- camera
- flexible circuit
- photoflash lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 25
- 239000010439 graphite Substances 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 11
- 238000005728 strengthening Methods 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The utility model relates to a flexible circuit board structure improving heat dissipation performance of a flashlight of a camera. The flexible circuit board structure includes a flexible circuit board. A camera is arranged on one side of the upper surface of the flexible circuit board. The flashlight is arranged on the other side of the upper surface of the flexible circuit board. The flexible circuit board structure is characterized in that heat-conducting graphite flakes used for dissipating heat quickly and therefore reducing heat of a light cup of the flashlight are adhered to the lower surface of the flexible circuit board of the flashlight through heat-conducting glue. According to the utility model, a condition of excessive temperature rise when the flashlight is working for a long term can be avoided, so that electric safety of a mobile terminal can be guaranteed. At the same time, since the use level of the heat-conducting graphite is comparatively low and the size of the heat-conducting graphite is comparatively small, influence on antenna signals of the mobile terminal can be neglected and a wireless communication function of the mobile terminal is not affected.
Description
Technical field
The utility model relates to a kind of flexible circuit board structure of strengthening the heat radiation of camera photoflash lamp, is applicable to the mobile terminal with camera function.
Background technology
The same with conventional light source, semiconductor light emitting diode (LED) also can produce heat during operation, even if flash of light Lamp cup body has been the material that adopts the heat-conducting plastics such as PPS, how many its caloric values depends on overall luminous efficiency.Heat concentrates in small-sized chip, and chip temperature raises, and causes the sharp decrease in efficiency of penetrating of non-uniform Distribution, chip light emitting efficiency and phosphor powder of thermal stress; In the time that temperature exceedes certain value, component failure rate is exponential law to be increased.ASSOCIATE STATISTICS data shows, 2 DEG C of the every risings of component temperature, reliability decrease 10%.
With the flexible PCBs that have LED low pressure trigger flashing lamp and camera combination that use on the mobile terminal of camera function more, because the end face of LED photoflash lamp and camera need be in sustained height, LED photoflash lamp is to separate with camera and cloth is placed on board two ends onboard, less being not easy to of area in photoflash lamp Lamp cup region dispelled the heat, when photoflash lamp is worked in continuity, body heat can continue to rise, even may be with limiting voltage work at software anomaly, cause the heat of mobile terminal inside sharply to rise, the flexible PCB of photoflash lamp and camera combination board may melt distortion because of overheated, affect electrical safety.
Utility model content
For the problem that solves on existing mobile terminal flash unit continuous firing on photoflash lamp and camera compoboard and generate heat, the utility model provides a kind of flexible circuit board structure of strengthening the heat radiation of camera photoflash lamp, increase thermal component conductive graphite sheet for photoflash lamp region, temperature rise while effectively avoiding photoflash lamp continuous firing is excessive, ensure the electrical safety of mobile terminal, consumption and the volume of conductive graphite are all less simultaneously, can ignore the aerial signal impact on mobile terminal, not affect the wireless communication function of mobile terminal.
Of the present utility model being characterised in that: a kind of flexible circuit board structure of strengthening the heat radiation of camera photoflash lamp, comprise flexible PCB, one side of described flexible PCB upper surface is laid camera, opposite side is laid photoflash lamp, it is characterized in that: the lower surface that is positioned at the flexible PCB at photoflash lamp place is bonded with the conductive graphite sheet that reduces photoflash lamp Lamp cup heat in order to quick heat radiating through heat-conducting glue.
On the basis of such scheme, be positioned on the lower surface of flexible PCB at camera place and be pasted with the stainless steel thin slice in order to support circuit plate bulk strength.
On the basis of such scheme, described flexible PCB is also connected with connector through flexible FPC winding displacement.
Advantage of the present utility model: the LED photoflash lamp on flexible PCB because of continuity work produce heat can be delivered on conductive graphite sheet by heat-conducting glue timely, in conductive graphite plate plane, there is the super-high heat-conductive performance within the scope of 150~1500 W/m-K, utilize the heat of the graphite flake fast reducing flash of light Lamp cup with high heat-conducting effect;
Simultaneously, the materials of conductive graphite sheet are only the sizes of same LED photoflash lamp Lamp cup, the machinability of graphite material is good, consumption is less but radiating effect is better than traditional material such as aluminium and copper, concerning inside can be beneficial to the less mobile terminal in space, practicality is better, avoid adopting large-area aluminium alloy post to conduct the heat of LED photoflash lamp, cause wireless communication function fault because large-area aluminium alloy post easily absorbs the aerial signal on mobile terminal.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
With reference to figure 1, the utility model relates to a kind of flexible circuit board structure of strengthening the heat radiation of camera photoflash lamp, comprise flexible PCB 5, one side of described flexible PCB 5 upper surfaces is laid camera 1, opposite side is laid photoflash lamp 2, and the lower surface that is positioned at the flexible PCB 5 at photoflash lamp place is bonded with the conductive graphite sheet 4 that reduces photoflash lamp Lamp cup heat in order to quick heat radiating through heat-conducting glue 3.
Be positioned on the lower surface of flexible PCB 5 at camera place and be pasted with the stainless steel thin slice 6 in order to support circuit plate bulk strength.
Above-mentioned flexible PCB 5 is also connected with connector 8 through flexible FPC winding displacement 7.
The utility model cloth on flexible PCB is placed with LED photoflash lamp and camera element, below the flexible parent metal region of photoflash lamp, with a heat-conducting glue high conductive graphite sheet of bonding (hard block), the heat of photoflash lamp Lamp cup is transmitted on graphite flake by heat-conducting glue, the ultra-high conducting that is beneficial to graphite flake self is hot by air quick heat radiating, on mobile terminal, supporting the structure member of fixing this flexible PCB must have local contact to locate with graphite flake simultaneously, shares heat auxiliary temperature-reducing by local contact site conduction portion heat to corresponding structure member.Conductive graphite sheet is strengthening, on the basis of heat radiation, can also playing the effect of supporting LED photoflash lamp.(this flexible PCB supports fixing with plastic rubber bracket or front and back shell in addition on mobile terminal)
Heat-conducting glue can be filled up the out-of-flatness on conductive graphite sheet surface, and can fit to close and firm flexible parent metal and graphite flake, conduct heat in the past fast.Heat-conducting glue has remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability.And thering is excellent protection against the tide, antidetonation, resistance to corona, anti-electric creepage performance and chemical mediator-resitant property, sustainable use is not-60~280 DEG C and retention, swelling and most metals and nonmetallic materials are had to good cementability.
Conductive graphite sheet is a kind of brand-new heat conduction and heat radiation material, has unique grain orientation, along both direction uniform heat conduction, laminar structuredly can adapt to well any surface, improves the performance of consumer electronics product when shielding thermal source and assembly.Heat isolation is also provided when product Homogeneouslly-radiating aspect thickness.The outstanding material that the heat radiation of graphite heat conducting solution uniqueness and heat-proof quality combination allow conductive graphite become thermal management solution is selected, and has the super-high heat-conductive performance within the scope of 150~1500 W/m-K in conductive graphite plate plane.
Specific implementation process:
On flexible PCB, be furnished with camera and LED photoflash lamp, be pasted with stainless steel thin slice at the flexible parent metal back side in camera region, in order to the bulk strength of support circuit plate; Be beneficial to a conductive graphite sheet of heat-conducting glue bonding at photoflash lamp regional flexibility substrate backside, utilize the heat that there is the graphite flake quick heat radiating of high heat-conducting effect and reduce photoflash lamp Lamp cup.
The foregoing is only preferred embodiment of the present utility model, all equalizations of doing according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (3)
1. strengthen the flexible circuit board structure of camera photoflash lamp heat radiation for one kind, comprise flexible PCB, one side of described flexible PCB upper surface is laid camera, opposite side is laid photoflash lamp, it is characterized in that: the lower surface that is positioned at the flexible PCB at photoflash lamp place is bonded with the conductive graphite sheet that reduces photoflash lamp Lamp cup heat in order to quick heat radiating through heat-conducting glue.
2. a kind of flexible circuit board structure of strengthening camera photoflash lamp heat radiation according to claim 1, is characterized in that: be positioned on the lower surface of flexible PCB at camera place and be pasted with the stainless steel thin slice in order to support circuit plate bulk strength.
3. a kind of flexible circuit board structure of strengthening the heat radiation of camera photoflash lamp according to claim 1 and 2, is characterized in that: described flexible PCB is also connected with connector through flexible FPC winding displacement.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320693306.0U CN203748098U (en) | 2013-11-06 | 2013-11-06 | Flexible circuit board structure improving heat dissipation performance of flashlight of camera |
Applications Claiming Priority (1)
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CN201320693306.0U CN203748098U (en) | 2013-11-06 | 2013-11-06 | Flexible circuit board structure improving heat dissipation performance of flashlight of camera |
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Publication Number | Publication Date |
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CN203748098U true CN203748098U (en) | 2014-07-30 |
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Family Applications (1)
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CN201320693306.0U Expired - Fee Related CN203748098U (en) | 2013-11-06 | 2013-11-06 | Flexible circuit board structure improving heat dissipation performance of flashlight of camera |
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CN (1) | CN203748098U (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105050360A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal provided with camera cooling structure and ESD (Electro-Static Discharge) interference resistant structure |
CN106324946A (en) * | 2016-10-31 | 2017-01-11 | 维沃移动通信有限公司 | Heat dissipation device for flash lamp |
CN107515506A (en) * | 2017-09-30 | 2017-12-26 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
CN107608161A (en) * | 2017-09-13 | 2018-01-19 | 广东欧珀移动通信有限公司 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
CN107660065A (en) * | 2017-09-30 | 2018-02-02 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
CN107703700A (en) * | 2017-09-13 | 2018-02-16 | 广东欧珀移动通信有限公司 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
CN109803493A (en) * | 2019-03-18 | 2019-05-24 | 深圳市沃特沃德股份有限公司 | Circuit board assemblies and mobile terminal |
CN111316626A (en) * | 2017-11-03 | 2020-06-19 | Zf主动安全和电子美国有限公司 | Driver assistance system |
-
2013
- 2013-11-06 CN CN201320693306.0U patent/CN203748098U/en not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105050360A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal provided with camera cooling structure and ESD (Electro-Static Discharge) interference resistant structure |
CN105050360B (en) * | 2015-07-14 | 2018-01-19 | 广东欧珀移动通信有限公司 | A kind of mobile terminal with camera radiating and anti-ESD interference structures |
CN106324946A (en) * | 2016-10-31 | 2017-01-11 | 维沃移动通信有限公司 | Heat dissipation device for flash lamp |
CN107608161A (en) * | 2017-09-13 | 2018-01-19 | 广东欧珀移动通信有限公司 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
CN107703700A (en) * | 2017-09-13 | 2018-02-16 | 广东欧珀移动通信有限公司 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
CN107608161B (en) * | 2017-09-13 | 2020-01-17 | Oppo广东移动通信有限公司 | Terminal device, circuit board assembly, flash lamp assembly and manufacturing method thereof |
CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
CN107515506A (en) * | 2017-09-30 | 2017-12-26 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
CN107660065A (en) * | 2017-09-30 | 2018-02-02 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
CN111316626A (en) * | 2017-11-03 | 2020-06-19 | Zf主动安全和电子美国有限公司 | Driver assistance system |
CN109803493A (en) * | 2019-03-18 | 2019-05-24 | 深圳市沃特沃德股份有限公司 | Circuit board assemblies and mobile terminal |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 |