CN201455487U - Precision desktop reflow soldering machine with temperature testing and analyzing system - Google Patents
Precision desktop reflow soldering machine with temperature testing and analyzing system Download PDFInfo
- Publication number
- CN201455487U CN201455487U CN200920106472XU CN200920106472U CN201455487U CN 201455487 U CN201455487 U CN 201455487U CN 200920106472X U CN200920106472X U CN 200920106472XU CN 200920106472 U CN200920106472 U CN 200920106472U CN 201455487 U CN201455487 U CN 201455487U
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- reflow machine
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- 238000005476 soldering Methods 0.000 title abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims description 23
- 238000010835 comparative analysis Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 238000003466 welding Methods 0.000 description 31
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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Abstract
The utility model discloses a precision desktop reflow machine with a temperature testing and analyzing system, which comprises a reflow soldering machine body, a temperature detector, a temperature collector and a temperature testing and analyzing system, wherein the temperature detector is connected to the upper portion of a heater which is positioned inside the reflow soldering machine, and the temperature testing and analyzing system is connected to the temperature collector, the temperature detector and the heater. Actual temperature change on a pad of a to-be-soldered circuit board placed inside a heating chamber of the reflow soldering machine is collected by the temperature collector, and the temperature information collected by the temperature collector and the temperature detector is tested and analyzed in real time by the temperature testing and analyzing system to form an appropriate temperature profile in order to control the heater to work. Soldering is controlled according to the temperature profile, thereby more stable and reliable soldering quality is obtained, and fast and highly efficient soldering process is achieved. The same temperature controlling profile is repeatedly used to perform unified control, and accordingly simple operation and convenient usage are obtained. The precision desktop reflow soldering machine with a temperature testing and analyzing system is particularly applicable to lead-free soldering with small amount and rich varieties.
Description
Technical field
The utility model relates to a kind of reflow machine, particularly has the accurate desk-top reflow machine of temperature detection analytical system.
Background technology
Accurate desk-top reflow machine is a kind of welding equipment commonly used in SMT (the Surface Mount Technology surface mounting technology) industry, and its process mainly comprises: 1, will need soldered PCB wiring board evenly to be placed in the heating chamber of accurate desk-top reflow machine; 2, by heater the soldered PCB wiring board of needs is carried out even heating under the hot environment in the heating chamber, finish the disposable welding of soldered PCB PCB surface solder joint.Soldered PCB wiring board temperature in welding process is spent up to more than 200, because the heating process during welding is the progressive process of a preheating, welding, cooling, be subjected to welding material welding performance and the restriction of operation principle and improving constantly such as solder(ing) paste to the welding quality requirement, control the variation of actual temperature in the heating chamber, adjusting heating-up temperature at any time is an important step that guarantees welding quality.The desk-top reflow machine of existing precision is when grasping the heating cavity temperature, hygrosensor of main dependence carries out cavity temperature and surveys, in time understanding cavity temperature changes, control heater heats, but the detecting head of hygrosensor all is positioned near the heater in chamber, the temperature of its reflection mainly concentrates on the heater, owing to have exhaust in the chamber, heat-exchanger rig, temperature on the soldered PCB wiring board can not get directly, real reflection, more can not carry out effectively along with the temperature curve of solder(ing) paste welding performance, heating with guaranteeing both quality and quantity, the welding performance of solder(ing) paste is not in full use, even influences welding quality.For addressing this problem, adapt to the new processing request under the new technology condition, be fit to more and more accurate welding requirements, grasp and control heating-up temperature at any time, adjust heating-up temperature and just become the problem of the required solution of the utility model.
Summary of the invention
In view of above-mentioned shortcoming and defect of the prior art, the utility model aims to provide a kind of actual heating-up temperature that can grasp at any time on the PCB wiring board soldered in the Reflow Soldering heating chamber, and can adjust, set the accurate desk-top reflow machine that has the temperature detection analytical system of heating curves as required arbitrarily.
A kind of accurate desk-top reflow machine that has the temperature detection analytical system, comprise reflow machine main body and the hygrosensor that is connected reflow machine internal heater top, also comprise Temperature sampler and the temperature detection analytical system that is connected with Temperature sampler, hygrosensor and heater; Temperature sampler is gathered the actual temperature change on the soldered board pads in the reflow machine heating chamber; The temperature detection analytical system is carried out real-time check and analysis and control heater work to the temperature information that Temperature sampler and hygrosensor collect.
Detecting head on the described Temperature sampler is positioned on the soldered PCB wiring board of reflow machine heating chamber.
The quantity of described Temperature sampler is more than one.
Described temperature detection analytical system comprises monitor and temperature analysis control module, detection, the analysis result of monitor displays temperature analysis and Control module, the temperature analysis control module to the temperature information that Temperature sampler and hygrosensor collect detect in real time, comparative analysis, and work according to the comparing result control heater.
Detection, the analysis result that described monitor shows comprises collecting temperature curve, reduced temperature curve, temperature detective curve and the temperature control curve of setting arbitrarily according to the reduced temperature curve.
Also be provided with memory module on the described temperature analysis control module, memory module is used to store reduced temperature curve and temperature control curve.
The Temperature sampler that utilization is connected on the accurate desk-top reflow machine is gathered the interior temperature of heating chamber at any time, particularly directly gather the temperature on the soldered PCB wiring board, and utilize actual temperature around the heater that hygrosensor detects, the temperature information that collects is shown with curve form on the monitor of temperature detection analytical system, after contrasting with solder(ing) paste welding temperature curve, relative set again, adjust temperature control curve, to realize adjustment at any time to heter temperature, at any time control requirement, the heating needs in each stage when making the heating-up temperature of heater meet soldered PCB wiring board welding more.
The accurate desk-top reflow machine that has the temperature detection analytical system described in the utility model, welding quality stable, reliable, welding process is quick, efficient, weld control according to temperature curve, the temperature adjustment is flexible, precise control, to the requirement of variations in temperature, give full play to the welding performance of solder(ing) paste when the diversity of curve setting can effectively satisfy the solder(ing) paste welding, guarantee welding quality.In small lot, many kinds welding process, can carry out meticulous adjustment, the control of temperature curve easily according to the welding requirements of different product, and in welding process in enormous quantities, can reuse heter temperature control curve especially and unify control, control simple, easy to use.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
The utility model will be further described below in conjunction with accompanying drawing 1:
A kind of accurate desk-top reflow machine that has the temperature detection analytical system comprises accurate desk-top reflow machine main body 1, the hygrosensor 3 that is positioned at reflow machine internal heater 2 tops, temperature detection analytical system 6 and Temperature sampler.Temperature sampler mainly comprises collector main body 7 and the detecting head 4 that is connected with main body, and collector main body 7 is fixed on the housing of accurate desk-top reflow machine main body 1, and detecting head 4 is fixed on soldered PCB wiring board 5 tops in the reflow machine heating chamber.Temperature detection analytical system 6 comprises the monitor 8 and the temperature analysis control module 9 that is connected with monitor 8 of integrative-structure, temperature analysis control module 9 has memory function, and collector main body 7, hygrosensor 3 and heater 2 are connected with temperature analysis control module 9 respectively.
Detecting head 4 can be gathered the heating-up temperature on the soldered PCB wiring board 5 at any time, by collector main body 7 temperature information is delivered in the temperature analysis control module 9, but and on monitor 8, form the soldered PCB wiring board collecting temperature curve of a real time inspection, thereby make the information such as intensification slope, temperature uniformity and temperature retention time of the soldered PCB wiring board 5 in operator's grasp work at any time.Simultaneously, the temperature information that is positioned at around the heater that the hygrosensor 3 of heater top also can detect it passes to temperature analysis control module 9, temperature analysis control module 9 can form an other real-time heter temperature detective curve according to heater 2 temperature informations that receive on monitor 8, make the operator can recognize heater 2 actual temperature on every side at any time, by two temperature curves of the contrast on monitor 8, can clearly recognize the difference between heating-up temperature and the actual welding temperature.
During welding, the heating-up temperature of heater 2 realizes control by the temperature control curve of new settings in the temperature analysis control module 9. because the reduced temperature curve of solder(ing) paste has been stored or has been set in the memory of temperature analysis control module 9 before the welding, the collecting temperature curve of the soldered PCB wiring board 5 that arrives by monitor 8 comparison actual acquisition is different with the reduced temperature curve, just can be well understood to the temperature of PCB wiring board 5 soldered in the heating chamber and the difference of actual needs temperature, corresponding adjustment temperature control curve, just can change the heating-up temperature of heater 2 by temperature analysis control module 9, reach the purpose of revising heater 2 heating-up temperatures, realize heating-up temperature and accurately consistent requirement of actual temperature required maintenance, make welding process accurately, reliably, control is efficiently finished down smoothly. certainly, the temperature control curve of the heater 2 that adjustment is finished also can be stored in the memory of temperature analysis control module 9, temperature control curve as next time with batch soldered PCB wiring board welding the time uses. and in conjunction with the difference of the actual temperature detective curve shape of temperature control curve and heater 2, also can provide reference for temperature control curve is set next time in advance, make temperature control curve can satisfy the welding needs of solder(ing) paste at the very start substantially in welding job, improve the accuracy that temperature control curve is provided with, shorten process and the time of adjusting temperature. for further understanding and grasping the accurate temperature of each position on the PCB circuit board 5, assurance PCB circuit board 5 is finished welding process under the even temperature environment, above PCB circuit board 5, also can place a plurality of detecting heads 4, thereby in monitor 8, form many collecting temperature curves, for more even, the finer temperature control curve that is provided with provides foundation.
Claims (5)
1. accurate desk-top reflow machine that has the temperature detection analytical system, comprise reflow machine main body and the hygrosensor that is connected reflow machine internal heater top, it is characterized in that, also comprise Temperature sampler and the temperature detection analytical system that is connected with Temperature sampler, hygrosensor and heater;
Described Temperature sampler is gathered the actual temperature change on the soldered board pads in the reflow machine heating chamber;
Described temperature detection analytical system is carried out real-time check and analysis and control heater work to the temperature information that Temperature sampler and hygrosensor collect.
2. the accurate desk-top reflow machine that has the temperature detection analytical system according to claim 1 is characterized in that, the detecting head on the described Temperature sampler is positioned on the soldered PCB wiring board of reflow machine heating chamber.
3. the accurate desk-top reflow machine that has the temperature detection analytical system according to claim 1 and 2 is characterized in that the quantity of described Temperature sampler is more than one.
4. the accurate desk-top reflow machine that has the temperature detection analytical system according to claim 1, it is characterized in that, described temperature detection analytical system comprises monitor and temperature analysis control module, detection, the analysis result of described monitor displays temperature analysis and Control module; Described temperature analysis control module to the temperature information that Temperature sampler and hygrosensor collect detect in real time, comparative analysis, and work according to the comparing result control heater.
5. the accurate desk-top reflow machine that has the temperature detection analytical system according to claim 4 is characterized in that, also is provided with memory module on the described temperature analysis control module, and memory module is used to store reduced temperature curve and temperature control curve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920106472XU CN201455487U (en) | 2009-03-26 | 2009-03-26 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920106472XU CN201455487U (en) | 2009-03-26 | 2009-03-26 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201455487U true CN201455487U (en) | 2010-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920106472XU Expired - Lifetime CN201455487U (en) | 2009-03-26 | 2009-03-26 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
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| CN (1) | CN201455487U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263042A (en) * | 2010-05-28 | 2011-11-30 | 台湾积体电路制造股份有限公司 | Wafer level reflow device and manufacture of soldering flux sphere and flipped chip assembling body |
| CN102566625A (en) * | 2010-12-09 | 2012-07-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for reflux welder |
| CN102728917A (en) * | 2011-03-31 | 2012-10-17 | 英飞凌科技股份有限公司 | Soldering method |
| CN103034266A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control system and method for reflow soldering machine |
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN104139226A (en) * | 2013-05-07 | 2014-11-12 | 珠海格力电器股份有限公司 | Elbow welding system and method of refrigerating system |
| CN104252189A (en) * | 2013-06-26 | 2014-12-31 | 旭达电脑（昆山）有限公司 | Circuit board repairing solder machine |
| CN107639316A (en) * | 2016-07-21 | 2018-01-30 | 鸿骐新技股份有限公司 | Chamber profile reflow oven board and its temperature self-compensation control method |
| CN107717168A (en) * | 2017-09-29 | 2018-02-23 | 合肥埃科光电科技有限公司 | A kind of infrared reflow of thermal imaging in real time weldering system and detection method |
| CN108873970A (en) * | 2018-06-29 | 2018-11-23 | 深圳市捷汇多科技有限公司 | A kind of furnace temperature monitoring system, device and method |
| CN109773299A (en) * | 2019-02-21 | 2019-05-21 | 厦门高比特电子有限公司 | A kind of reflow soldering stability detector and detection method |
| CN112872526A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace stability detection method |
| CN113059248A (en) * | 2021-04-23 | 2021-07-02 | 深圳市华瑞自动化***有限公司 | Welding observation simulation device with 3D vision measuring instrument, method and welding device |
| CN115178825A (en) * | 2022-07-06 | 2022-10-14 | 武汉倍普科技有限公司 | High-efficient display device of reflow oven temperature |
-
2009
- 2009-03-26 CN CN200920106472XU patent/CN201455487U/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263042B (en) * | 2010-05-28 | 2014-12-31 | 台湾积体电路制造股份有限公司 | Wafer level reflow device and manufacture of soldering flux sphere and flipped chip assembling body |
| CN102263042A (en) * | 2010-05-28 | 2011-11-30 | 台湾积体电路制造股份有限公司 | Wafer level reflow device and manufacture of soldering flux sphere and flipped chip assembling body |
| CN102566625A (en) * | 2010-12-09 | 2012-07-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for reflux welder |
| CN102728917A (en) * | 2011-03-31 | 2012-10-17 | 英飞凌科技股份有限公司 | Soldering method |
| CN102728917B (en) * | 2011-03-31 | 2015-08-26 | 英飞凌科技股份有限公司 | Welding method |
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN103034266A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control system and method for reflow soldering machine |
| CN104139226A (en) * | 2013-05-07 | 2014-11-12 | 珠海格力电器股份有限公司 | Elbow welding system and method of refrigerating system |
| CN104252189A (en) * | 2013-06-26 | 2014-12-31 | 旭达电脑（昆山）有限公司 | Circuit board repairing solder machine |
| CN107639316A (en) * | 2016-07-21 | 2018-01-30 | 鸿骐新技股份有限公司 | Chamber profile reflow oven board and its temperature self-compensation control method |
| CN107717168A (en) * | 2017-09-29 | 2018-02-23 | 合肥埃科光电科技有限公司 | A kind of infrared reflow of thermal imaging in real time weldering system and detection method |
| CN108873970A (en) * | 2018-06-29 | 2018-11-23 | 深圳市捷汇多科技有限公司 | A kind of furnace temperature monitoring system, device and method |
| CN108873970B (en) * | 2018-06-29 | 2024-05-24 | 深圳市捷汇多科技有限公司 | Furnace temperature monitoring system, equipment and method |
| CN109773299A (en) * | 2019-02-21 | 2019-05-21 | 厦门高比特电子有限公司 | A kind of reflow soldering stability detector and detection method |
| CN112872526A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace stability detection method |
| CN113059248A (en) * | 2021-04-23 | 2021-07-02 | 深圳市华瑞自动化***有限公司 | Welding observation simulation device with 3D vision measuring instrument, method and welding device |
| CN115178825A (en) * | 2022-07-06 | 2022-10-14 | 武汉倍普科技有限公司 | High-efficient display device of reflow oven temperature |
| CN115178825B (en) * | 2022-07-06 | 2023-09-26 | 武汉倍普科技有限公司 | High-efficient display device of backward flow stove temperature |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING TORCH TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHAO YONGXIAN Effective date: 20120424 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 733000 WUWEI, GANSU PROVINCE TO: 100015 CHAOYANG, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120424 Address after: 100015 Beijing city Chaoyang District Township East Village eight rooms north second layer 2-2-5A Patentee after: Beijing torch Technology Co. Ltd. Address before: 733000, Lane 25-1-231, East Street, Gansu, Wuwei Patentee before: Zhao Yongxian |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |