CN201425593Y - Switching device and vertical conductive adhesive test structure for test of circuit board to be tested - Google Patents
Switching device and vertical conductive adhesive test structure for test of circuit board to be tested Download PDFInfo
- Publication number
- CN201425593Y CN201425593Y CN200920132702XU CN200920132702U CN201425593Y CN 201425593 Y CN201425593 Y CN 201425593Y CN 200920132702X U CN200920132702X U CN 200920132702XU CN 200920132702 U CN200920132702 U CN 200920132702U CN 201425593 Y CN201425593 Y CN 201425593Y
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- mounting hole
- probe
- hole site
- measured
- wiring board
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Abstract
The utility model relates to a vertical conductive adhesive test structure for the test of a circuit board to be tested. The structure comprises a test jig, vertical conductive adhesive, a gird pointcomponent and a switching device, wherein the switching device comprises a base plate and a positioning plate arranged on the upper side of the base plate; a probe is detachably mounted on the base plate; an open hole for the out extending of the probe and a mounting hole position corresponding to the positioning hole of a circuit board to be tested are arranged on the positioning plate; an elastic positioning pin component matched with the positioning hole and a via hole is mounted in the mounting hole position; and probes on the base plate and the probe mounting hole corresponding to the mounting hole position are removed. The elastic positioning pin component of the switching device is taken as a positioning piece to be matched with the positioning hole on the circuit board to be testedto position the circuit board to be tested. The extending part of the elastic positioning pin component can be longer to facilitate the positioning of the circuit board to be tested. In addition, theelastic return action of the elastic positioning pin component can drive the circuit board to be tested to be separated from the vertical conductive adhesive, facilitate the taking down of the circuit board to be tested, and improve work efficiency.
Description
[technical field]
The utility model relates to the electric performance test device, relates in particular to the short circuit of testing printed circuit and proving installation that opens circuit and tool.
[background technology]
Wiring board to be measured manufacturer opens circuit and short-circuit test all will treating the circuit of surveying on the wiring board behind the wiring board to be measured that completes.The test structure of existing a kind of wiring board to be measured comprises the net point assembly, be arranged on the measurement jig on the net point assembly and be located at vertical conductive adhesive on the measurement jig.Net point on this net point assembly is corresponding one by one with the test point of the drum of test machine; This measurement jig upper surface is furnished with the protruding test point corresponding with the pilot to be measured of wiring board to be measured, and lower surface is provided with the conductiving point that is electrically connected with projection test electricity by the lead in the measurement jig.A net point of the corresponding net point assembly of each conductiving point, thus can rationally use net point by the position of reasonable Arrangement conductiving point.
Upper surface at measurement jig is typically provided with the location protruded stigma, and corresponding wiring board to be measured is provided with corresponding perforate.By cooperating of location protruded stigma and perforate, with wiring board to be measured and measurement jig contraposition.When testing, at first the perforate of wiring board to be measured is aimed at the protruded stigma of measurement jig; Press down the upper holder block of test machine then, wiring board to be measured is pressed on the vertical conductive adhesive, the break-make of carrying out wiring board to be measured detects.Yet the height of the location protruded stigma of this measurement jig must be less, if the location protruded stigma is long, is easy to after the upper holder block of test machine presses down, and wiring board to be measured can't compress vertical conductive adhesive, and can't detect.In addition, therefore existing this test structure must be placed wiring board to be measured by hand one by one and test because wiring board to be measured needs manual the aligning with the contraposition of measurement jig, can't realize the quick test of continuous pipeline system, inefficiency.And because wiring board to be measured and measurement jig are stacked together basically, after the test, taking off wiring board to be measured from measurement jig often needs the workman twining paster etc. on hand, and wiring board to be measured is glued, and takes off again again, and it is very inconvenient to operate.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of automatic contraposition of wiring board to be measured, switching device and vertical conductive adhesive test structure of being used for wiring board test to be measured rational in infrastructure be convenient to.
The technical scheme that its technical matters that solves the utility model adopts is: a kind of switching device that is used for wiring board test to be measured is provided; The location-plate that comprises substrate and be located at described substrate upside;
Described substrate is provided with some probe mounting holes, on the described probe mounting hole probe is installed removably;
Described location-plate is provided with in the perforate of stretching out for described probe, the mounting hole site corresponding with the pilot hole of described wiring board to be measured, the described mounting hole site elastic positioning pin assembly is installed; The described probe of the probe mounting hole that described substrate is corresponding with described mounting hole site is removed.
In switching device described in the utility model, the size of described probe mounting hole is less than the size of described mounting hole site.
In switching device described in the utility model, a back-moving spring and an end that described elastic positioning pin assembly comprises shell in the described mounting hole site of being installed in of a side opening, install in the enclosure insert in the described mounting hole site and promote the other end by described back-moving spring and stretch out the register pin of described mounting hole site.
In switching device described in the utility model, the end that described register pin stretches out described mounting hole site is a back taper.
The utility model also provides a kind of vertical conductive adhesive test structure that is used for wiring board test to be measured, comprises measurement jig, is arranged on vertical conductive adhesive and net point assembly between described wiring board to be measured and the measurement jig; Also comprise the switching device that is arranged on the described net point assembly;
Described wiring board to be measured is provided with pilot hole;
Described measurement jig is arranged between described vertical conductive adhesive and the described switching device, and is provided with the via hole relative with described pilot hole;
The location-plate that described switching device comprises substrate and is located at described substrate upside; Described substrate is provided with some probe mounting holes, and the probe corresponding with the net point of described net point assembly removably is installed on the described probe mounting hole; Described location-plate is provided with in the perforate of stretching out for described probe, the mounting hole site corresponding with the pilot hole of described wiring board to be measured, the described mounting hole site elastic positioning pin assembly that cooperates with described pilot hole and described via hole is installed; The described probe of the probe mounting hole that described substrate is corresponding with described mounting hole site is removed.
In vertical conductive adhesive test structure described in the utility model, the size of described probe mounting hole is less than the size of described mounting hole site.
In vertical conductive adhesive test structure described in the utility model, a back-moving spring and an end that described elastic positioning pin assembly comprises shell in the described mounting hole site of being installed in of a side opening, install in the enclosure insert in the described mounting hole site and promote the other end by described back-moving spring and stretch out the register pin of described mounting hole site.
In vertical conductive adhesive test structure described in the utility model, the end that described register pin stretches out described mounting hole site is a back taper.
In vertical conductive adhesive test structure described in the utility model, described substrate is two-layer or above substrate.
Compare with prior art, the beneficial effects of the utility model are:
Because the utility model is by having increased switching device, the elastic positioning pin assembly that utilizes switching device is as keeper, cooperates with pilot hole on the wiring board to be measured, locatees wiring board to be measured; Utilize the elasticity of elastic positioning pin assembly, and the length that the elastic positioning pin assembly stretches out can be longer, the location of convenient wiring board to be measured need not manual alignment, can realize the follow-on test of polylith wiring board to be measured; And, after finishing test, under the elastic recovery effect of elastic positioning pin assembly, can drive wiring board to be measured and leave vertical conductive adhesive, taking off of convenient wiring board to be measured improved work efficiency.
[description of drawings]
Fig. 1 is the cross-sectional schematic that is used to test wiring board vertical conductive adhesive test structure to be measured of an embodiment of the utility model;
Fig. 2 is the local enlarged diagram of A portion among Fig. 1;
Fig. 3 is the exploded that is used to test wiring board vertical conductive adhesive test structure to be measured of an embodiment of the utility model synoptic diagram when cuing open.
[embodiment]
Below in conjunction with each accompanying drawing the utility model is described in further detail.
Referring to Fig. 1 to Fig. 3, be the specific embodiment that the utility model is used for the vertical conductive adhesive test structure of wiring board 10 tests to be measured.This vertical conductive adhesive test structure comprises measurement jig 30, vertical conductive adhesive 20, switching device 40 and net point assembly 50 etc.
On wiring board 10 to be measured, be provided with pilot hole 11, be used for cooperating, the location of wiring board 10 to be measured with the elastic positioning pin assembly 44 of switching device 40.Certainly, the position of the pilot hole 11 of different wiring boards to be measured 10 is normally different, and the mounting hole site 422 of switching device 40 also needs to adjust.
This vertical conductive adhesive 20 is arranged between wiring board 10 to be measured and the measurement jig 30, as long as the protruding test point 31 that size can coverage test tool 30 upper surfaces.This vertical conductive adhesive 20 when being subjected to the pressure of vertical direction, pressure spot/be in the vertical direction conducting, and not conducting of horizontal direction, thus play the effect of unidirectional continuity test.
This measurement jig 30 is arranged between vertical conductive adhesive 20 and the switching device 40, and is provided with and the corresponding via hole 32 of pilot hole 11 on the wiring board 10 to be measured, passes assignment test tool 30 for elasticity pin assembly 44.These measurement jig 30 upper surfaces are provided with the protruding test point 31 corresponding with the pilot to be measured of wiring board 10 to be measured, and lower surface is provided with conductiving point 33.Projection test point 31 and conductiving point 33 are electrically connected by the lead 34 of measurement jig 30 inside.A net point 51 on each conductiving point 33 corresponding net point assembly 50 can rationally use net point 51, thereby can realize pilot to be measured intensive on the wiring board 10 to be measured is rationally disperseed by adjusting the position of conductiving point 33, is convenient to test.Understandable, the protruding test point 31 of measurement jig 30 is corresponding with wiring board to be measured 10, carries out design arrangement according to the pilot to be measured of different wiring boards to be measured 10; The position of via hole 32 also with different wiring board 10 to be tested to be measured on the pilot hole 11 of diverse location corresponding.
This net point assembly 50 is installed on the base of test machine, is provided with a plurality of net points 51 that include conducting element, and each net point 51 is electrically connected to the test machine main frame.This conducting element can be elastic conductive component; Certainly, also whole net point assembly 50 can be made elastic insulated plate,, mix, have electrically conductive particles and elastic insulated hardening to close the formation conducting element as electrically conductive particles in the position of net point 51.This net point assembly 50 can adopt existing various net point assembly 50.
This switching device 40 is arranged between net point assembly 50 and the measurement jig 30, measurement jig 30 can be realized being electrically connected with net point assembly 50.The location-plate 42 that this switching device 40 comprises substrate 41 and is located at substrate 41 upsides.This substrate 41 is provided with some probe mounting holes 411, and probe 43 removably is installed on probe mounting hole 411, the net point 51 corresponding electrical connections of this probe 43 and net point assembly 50.In order to guarantee the verticality of probe 43, this substrate 41 can be for two-layer at least, thereby can realize the assurance to the verticality of probe 43.The substrate 41 that installs probe 43 forms one and connects dials, and measurement jig 30 is realized being electrically connected with net point assembly 50.
This location-plate 42 is provided with the perforate 421 of stretching out for probe 43 and the mounting hole site 422 corresponding with the pilot hole 11 of wiring board 10 to be measured.This perforate 421 can be a larger-size perforate 421 that is opened in location-plate 42 centre positions; Also can offer a plurality of perforates 421 according to the situation of arranging of probe 43, the probe 43 of correspondence position stretches out from the perforate 421 of correspondence.The top of probe 43 is stretched out the upper surface of location-plate 42 or is remained basically stable with the upper surface of location-plate 42, is convenient to be connected with the contact conduction of the conductiving point 33 of the lower surface of measurement jig 30.Certainly, when the conductiving point 33 of the lower surface of measurement jig 30 was outstanding downwards, the top of probe 43 also can be lower than the upper surface of location-plate 42 slightly.
The mounting hole site 422 of this location-plate 42 is used to install elastic positioning pin assembly 44, and the position of this mounting hole site 422 is corresponding with the position of the pilot hole 11 of wiring board 10 to be measured, positions thereby can treat survey wiring board 10 by elastic positioning pin assembly 44.And the probe 43 of the corresponding probe mounting hole 411 of substrate 41 and mounting hole site 422 is removed, and avoids elastic positioning pin assembly 44 installation influence.The size of this probe mounting hole 411 is less than the size of mounting hole site 422, thereby elastic positioning pin assembly 44 can adopt larger-size register pin 443, and can not have influence on structure of the probe mounting hole 411 on the substrate 41 etc.This mounting hole site 422 can connect location-plate 42, is convenient to the installation of elastic positioning pin assembly 44; When location-plate 42 thickness were enough big, this mounting hole site 422 also can be blind hole, and elastic positioning pin assembly 44 inserts and is installed in the mounting hole site 422.
Further, can to pass through dismountable syndeton fixed combination such as bolt, screw in aggregates for substrate 41 and location-plate 42.When needs carry out the test of wiring board of another type, only need unclamp syndeton, again make new location-plate 42, and the corresponding probe of adjusting on the substrate 41 43, for example fill probe 43, pull down probe 43 corresponding etc., then, by syndeton new location-plate 42 is installed to again and gets final product on the substrate 41 with mounting hole site 422, avoid the waste that repeats to make of substrate 41, saved cost.
In the present embodiment, this elastic positioning pin assembly 44 comprise a side opening shell 441, be installed in back-moving spring 442 in the shell 441 and the register pin 443 that is located at open side.These back-moving spring 442 these register pins 443 of promotion stretch out from the opening part of shell 441, and stretch out the via hole 32 of mounting hole site 422 and measurement jig 30, play the effect into wiring board 10 guiding to be measured.
This shell 441 is installed in the mounting hole site 422 of location-plate 42, because probe 43 herein is removed, therefore can not influence the installation of shell 441.When the upper holder block of test machine presses down, when compressing wiring board 10 to be measured, can suppress register pin 443 downwards simultaneously, make register pin 443 be pressed in the shell 441, can not influence the pressing down of upper holder block of test machine, guarantee reliably wiring board 10 to be measured to be pressed on the vertical conductive adhesive 20; Simultaneously, register pin 443 compression reseting springs 442, make back-moving spring 442 have the trend of recovery of elasticity, after unclamping upper holder block, back-moving spring 442 recovery of elasticity promote register pin 443 and move up, at this moment, drive wiring board 10 to be measured and move upward, form certain slit with vertical conductive adhesive 20, thereby conveniently wiring board 10 to be measured takes off.
Further, location for the ease of wiring board 10 to be measured, the end that this register pin 443 stretches out mounting hole site 422 is a back taper, and the size of the pilot hole 11 of wiring board 10 to be measured is slightly less than the external diameter of register pin 443, thereby when wiring board 10 to be measured falls, as long as when its pilot hole 11 drops into the scope of back taper, can realize automatic centering, can accurate in locating wiring board 10 to be measured.And can drive wiring board 10 to be measured moves upward away from vertical conduction rubber.Like this, just can satisfy stream line operation, the continuous detection of carrying out wiring board.At first pass through gear train, as feed belt, sucker etc., wiring board 10 to be measured is sent to the position roughly relative with switching device 40, put down wiring board 10 to be measured then, under the cooperation of pilot hole 11 and register pin 443, make that wiring board 10 to be measured can accurate in locating, and then carry out the following press operation of the upper holder block of test machine, detect.
Further, the edge of net point assembly 50, substrate 41, location-plate 42, measurement jig 30 can be provided with through hole, utilizes bolt etc., can easily they be installed together, and the correspondence of holding position.
Understandable, elastic positioning pin assembly 44 can also adopt other version, for example, omit shell 441, and register pin 443 directly is inserted in the mounting hole site 422, and the direct roof pressure of back-moving spring 442 1 ends is at the upper surface of substrate 41, the other end directly promotes register pin 443.Also the locating piece with pit can be installed on the pilot hole 11 of wiring board 10 to be measured, guarantee effectively to suppress register pin 443.The thickness of location-plate 42 can be complementary with the length of the shell 441 of elastic positioning pin assembly 44; Certainly, also can be by increasing cushion block etc., the location-plate 42 that raises is to satisfy the installation of elastic positioning pin assembly 44.
Above embodiment has only expressed preferred implementation of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim; Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model; Therefore, all equivalents and modifications of being done with the utility model claim scope all should belong to the covering scope of the utility model claim.
Claims (9)
1. one kind is used for the switching device that wiring board to be measured is tested; It is characterized in that: the location-plate (42) that comprises substrate (41) and be located at described substrate (41) upside;
Described substrate (41) is provided with some probe mounting holes (411), and probe (43) removably is installed on the described probe mounting hole (411);
Described location-plate (42) is provided with in described probe (43) perforate (421) of stretching out, the mounting hole site (422) corresponding with the pilot hole (11) of described wiring board to be measured (10), the described mounting hole site (422) elastic positioning pin assembly (44) being installed; The described probe (43) of the probe mounting hole (411) that described substrate (41) is corresponding with described mounting hole site (422) is removed.
2. switching device according to claim 1 is characterized in that, the size of described probe mounting hole (411) is less than the size of described mounting hole site (422).
3. switching device according to claim 2, it is characterized in that described elastic positioning pin assembly (44) comprises shell (441) in the described mounting hole site of being installed in of a side opening (422), be installed in back-moving spring (442) in the shell (441) and an end inserts in the described mounting hole site (422) and promote the other end by described back-moving spring (442) and stretch out the register pin (443) of described mounting hole site (422).
4. switching device according to claim 3 is characterized in that, the end that described register pin (443) stretches out described mounting hole site (422) is a back taper.
5. a vertical conductive adhesive test structure that is used for wiring board test to be measured comprises measurement jig (30), is arranged on vertical conductive adhesive (20) and net point assembly (50) between described wiring board to be measured (10) and the measurement jig (30); It is characterized in that, also comprise the switching device (40) that is arranged on the described net point assembly (50);
Described wiring board to be measured (10) is provided with pilot hole (11);
Described measurement jig (30) is arranged between described vertical conductive adhesive (20) and the described switching device (40), and is provided with the via hole (32) relative with described pilot hole (11);
Described switching device (40) comprises substrate (41) and the location-plate that is located at described substrate (41) upside; Described substrate (41) is provided with some probe mounting holes (411), and the probe (43) corresponding with the net point (51) of described net point assembly (50) removably is installed on the described probe mounting hole (411); Described location-plate is provided with in described probe (43) perforate (421) of stretching out, the mounting hole site (422) corresponding with the pilot hole (11) of described wiring board to be measured (10), the described mounting hole site (422) the elastic positioning pin assembly (44) that cooperates with described pilot hole (11) and described via hole (32) being installed; The described probe (43) of the probe mounting hole (411) that described substrate (41) is corresponding with described mounting hole site (422) is removed.
6. vertical conductive adhesive test structure according to claim 5 is characterized in that, the size of described probe mounting hole (411) is less than the size of described mounting hole site (422).
7. vertical conductive adhesive test structure according to claim 6, it is characterized in that described elastic positioning pin assembly (44) comprises shell (441) in the described mounting hole site of being installed in of a side opening (422), be installed in back-moving spring (442) in the shell (441) and an end inserts in the described mounting hole site (422) and promote the other end by described back-moving spring (442) and stretch out the register pin (443) of described mounting hole site (422).
8. vertical conductive adhesive test structure according to claim 7 is characterized in that, the end that described register pin (443) stretches out described mounting hole site (422) is a back taper.
9. vertical conductive adhesive test structure according to claim 1 is characterized in that, described substrate (41) is two-layer or above substrate (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920132702XU CN201425593Y (en) | 2009-06-08 | 2009-06-08 | Switching device and vertical conductive adhesive test structure for test of circuit board to be tested |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920132702XU CN201425593Y (en) | 2009-06-08 | 2009-06-08 | Switching device and vertical conductive adhesive test structure for test of circuit board to be tested |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201425593Y true CN201425593Y (en) | 2010-03-17 |
Family
ID=42025044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920132702XU Expired - Fee Related CN201425593Y (en) | 2009-06-08 | 2009-06-08 | Switching device and vertical conductive adhesive test structure for test of circuit board to be tested |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201425593Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595774A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | FPC high density circuit board convenient for being tested and test method thereof |
| CN107102179A (en) * | 2017-06-02 | 2017-08-29 | 深圳市同创精密自动化设备有限公司 | A kind of test fixture of PCB soft boards |
| CN109471011A (en) * | 2017-09-07 | 2019-03-15 | 新加坡商美亚国际电子有限公司 | Test circuit board and its operating method |
| CN112034327A (en) * | 2020-08-29 | 2020-12-04 | 捷映凯电子（昆山）有限公司 | Flexible circuit board test switching device for electric connector |
| CN117288991A (en) * | 2023-10-10 | 2023-12-26 | 苏州微飞半导体有限公司 | Probe and vertical conductive adhesive combined test equipment and application method thereof |
-
2009
- 2009-06-08 CN CN200920132702XU patent/CN201425593Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595774A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | FPC high density circuit board convenient for being tested and test method thereof |
| CN107102179A (en) * | 2017-06-02 | 2017-08-29 | 深圳市同创精密自动化设备有限公司 | A kind of test fixture of PCB soft boards |
| CN107102179B (en) * | 2017-06-02 | 2023-09-29 | 深圳市同创精密自动化设备有限公司 | Test fixture of PCB soft board |
| CN109471011A (en) * | 2017-09-07 | 2019-03-15 | 新加坡商美亚国际电子有限公司 | Test circuit board and its operating method |
| CN112034327A (en) * | 2020-08-29 | 2020-12-04 | 捷映凯电子（昆山）有限公司 | Flexible circuit board test switching device for electric connector |
| CN117288991A (en) * | 2023-10-10 | 2023-12-26 | 苏州微飞半导体有限公司 | Probe and vertical conductive adhesive combined test equipment and application method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100317 Termination date: 20120608 |