CN201392834Y - Multilayer microwave integrated circuit - Google Patents
Multilayer microwave integrated circuit Download PDFInfo
- Publication number
- CN201392834Y CN201392834Y CN 200920040612 CN200920040612U CN201392834Y CN 201392834 Y CN201392834 Y CN 201392834Y CN 200920040612 CN200920040612 CN 200920040612 CN 200920040612 U CN200920040612 U CN 200920040612U CN 201392834 Y CN201392834 Y CN 201392834Y
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- CN
- China
- Prior art keywords
- microwave
- circuit
- pcb
- layer
- multiplayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a multilayer microwave integrated circuit which comprises a multilayer microwave circuit master plate and a multilayer microwave circuit slave plate; a microwave printed circuit and a microwave chip are connected with each other and are integrated with the multilayer microwave circuit master plate. The multilayer microwave circuit master plate is connected with the multilayer microwave circuit slave plate through a metal welding layer; the multilayer microwave circuit slave plate adopts a multilayer printed circuit board PCB, the top layer and bottom layer of the PCB are all provided with thin metal layers, the edge of PCB is provided with metal binding, a vertical grounding hole in the PCB is connected with the top and bottom metal layers of the PCB, a vertical interconnecting hole is also used for connecting the top metal layer with a middle metal layer, and mutually connecting the middle layers of PCB; and the area of the multilayer microwave circuit master plate is smaller than the area of the multilayer microwave circuit slave plate. The multilayer microwave integrated circuit has the advantages that the multilayer microwave integrated circuit has low cost, simple process and reliable microwave grounding, the multilayer microwave circuit master plate can be integrated with microwave printed circuit, microwave chip, semiconductor chip and powerless element; besides, the slave plate also can be integrated with semiconductor chip and powerless element, so the multilayer microwave integrated circuit has greater flexibility.
Description
Technical field
The utility model relates to a kind of multiplayer microwave integrated circuit, specifically is a kind of main leaf and the multiplayer microwave integrated circuit that is welded to connect from sheet.
Background technology
The microwave multilevel integration is the integrated circuit that is made of discrete active device and multilayer passive component, interconnection line.From the development course of microwave circuit, the multiplayer microwave integrated circuit be after microwave stereo circuit (Waveguide coaxial line), microwave hybrid integrated circuit (planar circuit), monolithic integrated circuit the 4th generation microwave circuit version.The requirement of electronic equipment high-performance, high integration, miniaturization has been complied with in the development of multiplayer microwave integrated circuit and multi-chip module (MCM), is widely used in all kinds of electronic systems.
LTCC (LTCC) is a kind of multiplayer microwave integrated circuit commonly used.The employing potsherd is a baseplate material, is printed as cabling and packed layer border through-hole interconnection, piles up hot pressed sintering and form with electrocondution slurry.Can in substrate, realize resistance, electric capacity, inductance, microstrip element, filter etc., but because complex process adopts material all to need import at present, manufacturing cost is higher.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of multiplayer microwave integrated circuit is provided, its main leaf and be welded to connect from sheet, and cost is low and have a good ground connection performance.
The technical scheme that provides according to the utility model, a kind of multiplayer microwave integrated circuit comprises multiplayer microwave circuit main leaf and multiplayer microwave circuit from sheet, integrated interconnective microwave printed circuit and microwave chip MMIC on the described multiplayer microwave circuit main leaf (Microwave Monolithic Integrated Circuit).
Multiplayer microwave circuit main leaf and multiplayer microwave circuit are from connecting by the metal solder layer between the sheet; The multiplayer microwave circuit adopts multilayer printed board PCB from sheet, and described PCB top layer and bottom all have thin metal layer, and the PCB edge is surrounded by metal edges; Top layer metallic layer and bottom metal layer that vertical ground hole connection PCB is arranged among the PCB, the top layer metallic layer that also has the vertical interconnect hole connection PCB is with the metallic intermediate layer layer or be connected each metallic intermediate layer layer; Multiplayer microwave circuit main leaf area less than the multiplayer microwave circuit from sheet.
The multiplayer microwave circuit also is integrated with microwave chip semiconductor chip, sticking-element or passive component in addition from the sheet the superiors, and printed circuit board.
Multiplayer microwave circuit main leaf adopts microwave soft base plate material, and is placed in the superiors.
Multiplayer microwave circuit main leaf also is integrated with semiconductor chip and the passive component beyond the microwave chip.
Advantage of the present utility model is:
1, main leaf and adopt conventional welding procedure to finish from sheet, not only technology is simple, and main leaf is finished to bottom grounding through hole and box body welding by metal bound edge and top layer from sheet multi-layer PCB edge, thereby guarantee that main leaf microwave ground connection is reliable, adopt than main leaf with from sheet and glued joint the multiplayer microwave circuit ground superior performance that the lamination mode constitutes;
But 2, except that main leaf integrated micro printed circuit, microwave chip, semiconductor chip and passive component, but, has bigger flexibility from sheet also integrated semiconductor chip and passive component;
3, adopt multilayer printed board PCB can compare with LTCC from sheet, be particularly suitable for emission, received RF circuit application, also can embed the lumped parameter passive component in addition in its performance of microwave low side;
4, along with printed board PCB technology constantly improves, by making the laser micro through hole, improve wiring density, attenuate buffer layer, entered the high density interconnect ranks, integrated level improves greatly, but cost is compared low magnitude with LTCC.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
The utility model is a kind of integrated circuit of multiplayer microwave cheaply, comprises that multiplayer microwave circuit main leaf 1 (abbreviation main leaf) and multiplayer microwave circuit are from sheet 2 (being called for short from sheet).Multiplayer microwave circuit main leaf 1 integrated all kinds of microwave chips 4, microwave printed circuit 3 also can integrated other semiconductor chips and passive components, and main leaf adopts the lower microwave soft base plate material of price, and is placed in the superiors.The multiplayer microwave circuit adopts multilayer printed board PCB from sheet 2.By the perpendicular interconnection mode all kinds of chips and element are interconnected.Main leaf 1 area is less than from sheet 2, classes of semiconductors chip 12 and passive component 13 beyond also can integrated main leaf microwave chip from sheet 2 the superiors.
As shown in Figure 1: integrated interconnective microwave printed circuit 3 and microwave chip 4 on the multiplayer microwave circuit main leaf 1; Microwave printed circuit 3 is used for functions such as impedance matching, filtering; Microwave chip 4 is finished functions such as microwave amplification, phase shift, decay, switch.Multiplayer microwave circuit main leaf 1 and multiplayer microwave circuit are from connecting by metal solder layer 5 between the sheet 2.The multiplayer microwave circuit adopts multilayer printed board PCB from sheet 2, and described PCB top layer and bottom all have thin metal layer, and there is metal bound edge 6 at the PCB edge.Top layer metallic layer 8 and bottom metal layer 9 that vertical ground hole 7 connection PCB are arranged among the PCB also have vertical interconnect hole 10 to carry out the interconnection of the metal interlevel of PCB.
The multiplayer microwave circuit also is integrated with microwave chip semiconductor chip 12, sticking-element or passive component 13 in addition from sheet 2 the superiors, and printed circuit board.Described sticking-element or passive component 13 comprise resistance, electric capacity, inductance etc.
Utilize the plate effects of coupling between can constitute electric capacity from sheet multilayer printed board PCB, can also constitute inductance, resistance, can be made into microwave circuits such as built-in microwave filter, also can embed the lumped parameter passive component in addition.
Claims (4)
1, a kind of multiplayer microwave integrated circuit, comprise that multiplayer microwave circuit main leaf (1) and multiplayer microwave circuit are from sheet (2), integrated interconnective microwave printed circuit (3) and microwave chip (4) on the described multiplayer microwave circuit main leaf is characterized in that: multiplayer microwave circuit main leaf (1) and multiplayer microwave circuit are from connecting by metal solder layer (5) between the sheet (2); The multiplayer microwave circuit adopts multilayer printed board PCB from sheet (2), and described PCB top layer and bottom all have thin metal layer, and the PCB edge is surrounded by metal edges (6); Top layer metallic layer (8) and bottom metal layer (9) that vertical ground hole (7) connection PCB is arranged among the PCB, the top layer metallic layer (8) that also has vertical interconnect hole (10) connection PCB is with metallic intermediate layer layer (11) or be connected each metallic intermediate layer layer (11); Multiplayer microwave circuit main leaf (1) area less than the multiplayer microwave circuit from sheet (2).
2, multiplayer microwave integrated circuit as claimed in claim 1 is characterized in that: the multiplayer microwave circuit also is integrated with microwave chip semiconductor chip (12), sticking-element or passive component (13) in addition from sheet (2) the superiors, and printed circuit board.
3, multiplayer microwave integrated circuit as claimed in claim 1 is characterized in that: multiplayer microwave circuit main leaf (1) adopts microwave soft base plate material, and is placed in the superiors.
4, multiplayer microwave integrated circuit as claimed in claim 1 is characterized in that: multiplayer microwave circuit main leaf (1) also is integrated with semiconductor chip and the passive component beyond the microwave chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920040612 CN201392834Y (en) | 2009-04-21 | 2009-04-21 | Multilayer microwave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920040612 CN201392834Y (en) | 2009-04-21 | 2009-04-21 | Multilayer microwave integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201392834Y true CN201392834Y (en) | 2010-01-27 |
Family
ID=41599655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920040612 Expired - Fee Related CN201392834Y (en) | 2009-04-21 | 2009-04-21 | Multilayer microwave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201392834Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338731A (en) * | 2015-12-02 | 2016-02-17 | 成都锦江电子***工程有限公司 | Small strip-shaped linear power amplification module |
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN110337175A (en) * | 2019-07-05 | 2019-10-15 | 上海航天电子通讯设备研究所 | X-band four-way TR component multilayer board |
| CN112103665A (en) * | 2020-11-09 | 2020-12-18 | 成都天锐星通科技有限公司 | Radio frequency feed network, phased array antenna and communication equipment |
-
2009
- 2009-04-21 CN CN 200920040612 patent/CN201392834Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338731A (en) * | 2015-12-02 | 2016-02-17 | 成都锦江电子***工程有限公司 | Small strip-shaped linear power amplification module |
| CN105338731B (en) * | 2015-12-02 | 2018-05-22 | 成都锦江电子***工程有限公司 | A kind of miniaturization strip line power amplifier module |
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN110337175A (en) * | 2019-07-05 | 2019-10-15 | 上海航天电子通讯设备研究所 | X-band four-way TR component multilayer board |
| CN112103665A (en) * | 2020-11-09 | 2020-12-18 | 成都天锐星通科技有限公司 | Radio frequency feed network, phased array antenna and communication equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20150421 |
|
| EXPY | Termination of patent right or utility model |