CN201312475Y - Liquid cooling porous foam metal radiator - Google Patents
Liquid cooling porous foam metal radiator Download PDFInfo
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- CN201312475Y CN201312475Y CNU2008202155473U CN200820215547U CN201312475Y CN 201312475 Y CN201312475 Y CN 201312475Y CN U2008202155473 U CNU2008202155473 U CN U2008202155473U CN 200820215547 U CN200820215547 U CN 200820215547U CN 201312475 Y CN201312475 Y CN 201312475Y
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- porous foam
- foam metal
- liquid
- cooling
- heat
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Abstract
The utility model relates to a liquid cooling porous foam metal radiator, which solves the problem of insufficient heat exchange when large specific heat capacity liquid serves as a heat exchanging medium. The utility model comprises a tank body and a tank cover. Porous foam metal is arranged on the middle portion inside the tank body, one side of the tank body of the porous foam metal is an inlet static press cavity, and another side of the tank body is an outlet static press cavity. A cooling liquid inlet is disposed on the tank cover corresponding to the inlet static press cavity, and a cooling liquid outlet is arranged on the tank cover corresponding to the outlet static press cavity. A base plate with thickness of 0.5mm of the tank body is made of copper or aluminum, and the porous foam metal is porous foam copper or porous foam aluminum with a specific surface area ranging from 10 to 100 ppi and 95% porosity. The utility model utilizes the porous foam metal with various porosities and specific surface areas to expand heat exchanging surface to achieve even liquid temperature when the liquid is cooled and to increase heat exchange amount. In addition, 100-200w/cm<2> heat can be removed under comparatively low surface temperature (no higher than 75 DEG C) circumstances, and unit area heat dissipating capacity is improved by 2-4 times when compared with that of a wind cooling radiator.
Description
Technical field
The utility model relates to microsize heat transfer, heat abstractor.
Background technology
Along with constantly reducing of electronic chip characteristic size, integrated level, the operating frequency of chip improve constantly, and the density of heat flow rate of chip is raise rapidly, and the density of heat flow rate of some present high-power components has reached 50W/cm
2, have in addition reach 200W/cm
2Simultaneously, also point out in U.S. air force corporate plan analysis report: the inefficacy of electronic equipment has 55% to be caused by temperature.Famous " 10 ℃ of rules " also pointed out: 10 ℃ of the every risings of the temperature of semiconductor device, its reliability will reduce by 50%.These data have all illustrated the importance of effective thermal control in advanced electronic equipment.The cooling capacity of the air-cooled CPU of existing computer has only 30-40W/cm
2, do not satisfy the heat radiation requirement of this high performance components.
Porous media is the heterogeneous coexistence space by porosu solid skeleton and interpore fluid phase composition, the hole that immobile phase forms in the porous media has bendability, astaticism and randomicity characteristics, cause fluid to flow and have dispersion effect at porous media, simultaneously because the existence of loose structure, specific area increases, and causes the mobile and heat transfer in the porous media to have particularity and complexity.Many in recent years researchers have carried out experiment and numerical value research at the convective heat transfer in the porous media.
Summary of the invention
The inadequate problem of heat exchange when solving big specific heat capacity liquid as heat transferring medium, the utility model provides a kind of liquid cooling porous foam metal radiator.
Concrete structural design scheme is as follows:
Liquid cooling porous foam metal radiator comprises casing, case lid and cooling working medium, and the middle part is provided with porous foam metal in the described casing, and a side box body of porous foam metal is import static pressure chamber, and the opposite side casing is outlet static pressure chamber; Be provided with the cooling liquid import with the corresponding case lid in import static pressure chamber, be provided with the cooling liquid outlet with the corresponding case lid in outlet static pressure chamber.
Described box height is the 5-30 millimeter, and the baseboard material of casing is copper or aluminium, 0.5 millimeter of base plate thickness.
Foam metal and casing connected mode are welding or plating or sintering processing.
Described porous foam metal is the porous foam copper or the foamed aluminium of specific area 10-100ppi, porosity 95%.
Described cooling working medium is deionized water or alcohols or fluorine liquid cooled electronics (3M
TMFluorinert
TMElectronic Liquids).
Because characteristics such as the bendability of porous media and astaticism, the utility model adopts porous foam metal when increasing area of dissipation fluid is fully contacted as spreader surface when flowing through porous media with solid porous medium, temperature gradient reduces in the fluid thereby make, increase heat, improve heat exchange efficiency, finely solved the inadequate problem of heat exchange when adopting big specific heat capacity liquid as heat transferring medium.
Effect of the present utility model is to adopt the porous foam metal expansion heat-transfer surface of different porosities and specific area, fluid temperature is even when reaching liquid cools, reduce liquid in the vertical direction temperature gradient, in liquid cooling, improve the mean temperature of liquid, increase heat; Adopt the method for sintering (welding or plating) to reduce contact heat resistance simultaneously, radiator internal temperature gradient is reduced, under the lower surface temperature situation of (not being higher than 75 ℃), can take away 100-200W/cm in the test
2Heat; Can improve 2-4 doubly than the air-cooled radiator heat flow rate per unit area.
Description of drawings
Fig. 1 is the utility model structural representation,
Fig. 2 is the utility model user mode figure.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described by embodiment.
Embodiment:
Referring to Fig. 1, liquid cooling porous foam metal radiator comprises casing 7 and case lid 8, and box height is 10 millimeters (the height-adjustable scope is the 5-30 millimeter), and base plate 6 materials of casing are copper, 0.5 millimeter of base plate thickness, length and width are determined according to the shape on different dissipation from electronic devices surfaces with shape; The middle part is welded to connect the porous foam copper 5 of specific area 50ppi, porosity 95% in the casing 7, and a side box body of porous foam copper 5 is import static pressure chamber 3, and the opposite side casing is outlet static pressure chamber 4; Be provided with cooling liquid import 1 with import static pressure chamber 3 corresponding case lids 8, be provided with cooling liquid outlet 2 with outlet static pressure chamber 4 corresponding case lids 8.
During use, see Fig. 2, the import of outside big radiator 9 is being communicated with the cooling liquid outlet 2 of liquid cooling porous foam metal radiator, and the outlet of outside big radiator 9 is being communicated with the little pump 10 of liquid driven, and the little pump 10 of liquid driven is being communicated with the cooling liquid import 1 of liquid cooling porous foam metal radiator; Outside big radiator 9 one sides are provided with radiator fan 11.Adopt deionized water as fluid working substance, also can adopt alcohols or fluorine liquid cooled electronics (3M
TMFluorinert
TMElectronic Liquids); Test this radiator and under the lower surface temperature situation of (not being higher than 75 ℃), can take away 100-200W/cm
2Heat.
The form of plenum chamber is adopted in cooling liquid import and cooling liquid outlet, make liquid uniform flow better before flowing into porous foam metal, thereby make the fluid in the porous foam metal more even, reduce the overheated problem of local surfaces that causes because of fluid distribution is inhomogeneous.When the contacting of porous foam metal and base plate, adopt the method for welding (sintering or plating) to reduce the contact heat resistance of radiator inside, thereby take away more heat.Simultaneously because characteristics such as the bendability of porous media and astaticisms, fluid can fully be contacted with the porous foam metal surface when flowing through porous foam metal, and fluid is mobile because the bendability of porous media becomes disorderly and unsystematic, thereby the heat exchange of accelerating fluid inside, reduce fluid temperature inside gradient, break the adverse effect of fluid boundary layer heat exchanging, make the fluid internal temperature more even, thereby improve the average heat of unit volume fluid.
Claims (5)
1, liquid cooling porous foam metal radiator is characterized in that: comprise casing, case lid and cooling working medium, the middle part is provided with porous foam metal in the described casing, and a side box body of porous foam metal is import static pressure chamber, and the opposite side casing is outlet static pressure chamber; Be provided with the cooling liquid import with the corresponding case lid in import static pressure chamber, be provided with the cooling liquid outlet with the corresponding case lid in outlet static pressure chamber.
2, liquid cooling porous foam metal radiator according to claim 1, it is characterized in that: described box height is the 5-30 millimeter, the baseboard material of casing is copper or aluminium, 0.5 millimeter of base plate thickness.
3, liquid cooling porous foam metal radiator according to claim 1 is characterized in that: described porous foam metal and casing connected mode are welding or plating or sintering processing.
4, liquid cooling porous foam metal radiator according to claim 1 is characterized in that: described porous foam metal is the porous foam copper or the foamed aluminium of specific area 10-100ppi, porosity 95%.
5, liquid cooling porous foam metal radiator according to claim 1 is characterized in that: described cooling working medium is deionized water or alcohols or fluorine liquid cooled electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202155473U CN201312475Y (en) | 2008-12-05 | 2008-12-05 | Liquid cooling porous foam metal radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202155473U CN201312475Y (en) | 2008-12-05 | 2008-12-05 | Liquid cooling porous foam metal radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201312475Y true CN201312475Y (en) | 2009-09-16 |
Family
ID=41109731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202155473U Expired - Fee Related CN201312475Y (en) | 2008-12-05 | 2008-12-05 | Liquid cooling porous foam metal radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201312475Y (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856779A (en) * | 2012-09-10 | 2013-01-02 | 华中科技大学 | Microporous metal cooling mirror and production method thereof |
| CN103117258A (en) * | 2013-01-24 | 2013-05-22 | 上海交通大学 | High-hole-density through hole metal foam electronic element heat-dissipation device based on impact jet flow |
| CN103170812A (en) * | 2011-12-23 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method for aluminum vapor chamber |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
| CN103203606A (en) * | 2012-01-12 | 2013-07-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
| CN104201160A (en) * | 2014-09-09 | 2014-12-10 | 东南大学 | Enhanced boiling heat exchange structure with porous foam metal |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
| CN105097733A (en) * | 2015-08-27 | 2015-11-25 | 电子科技大学 | Paraffin-based air-cooled and water-cooled combined cooling device |
| CN105188311A (en) * | 2015-08-23 | 2015-12-23 | 李增珍 | Liquid cooling plate |
| CN107660104A (en) * | 2017-09-30 | 2018-02-02 | 广东合新材料研究院有限公司 | A kind of cold liquid homogenizer of liquid and the liquid cooling heat radiator using the cold liquid homogenizer of the liquid |
| CN108130516A (en) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | A kind of Vacuum Deposition cathode target using foam metal enhancing cooling |
| CN108418545A (en) * | 2018-04-28 | 2018-08-17 | 华南理工大学 | A kind of micro jet flow coldplate and its manufacturing method that porous heating surface is added |
| CN109548363A (en) * | 2018-10-30 | 2019-03-29 | 山东超越数控电子股份有限公司 | A kind of porous media liquid cooling device for cooling, production method and application method |
| CN112244378A (en) * | 2020-10-23 | 2021-01-22 | 贵州中医药大学 | Medical protective clothing cooling inside lining |
| CN113423244A (en) * | 2021-06-28 | 2021-09-21 | 哈尔滨工业大学 | Preparation method and application of aluminum-based liquid cooling heat dissipation structure |
| TWI765341B (en) * | 2020-09-10 | 2022-05-21 | 英業達股份有限公司 | Heat sink and thermal dissipation system |
-
2008
- 2008-12-05 CN CNU2008202155473U patent/CN201312475Y/en not_active Expired - Fee Related
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170812A (en) * | 2011-12-23 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method for aluminum vapor chamber |
| CN103170812B (en) * | 2011-12-23 | 2016-01-20 | 国研高能（北京）稳态传热传质技术研究院有限公司 | A kind of preparation method of aluminum vapor chamber |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
| CN103203606A (en) * | 2012-01-12 | 2013-07-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
| CN103203606B (en) * | 2012-01-12 | 2015-06-24 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Method for producing multi-cavity phase change temperature-equalization plate |
| CN102856779A (en) * | 2012-09-10 | 2013-01-02 | 华中科技大学 | Microporous metal cooling mirror and production method thereof |
| CN103117258B (en) * | 2013-01-24 | 2016-01-13 | 上海交通大学 | Based on the high density holes open-pore metal foam electronic device radiating device of impact jet flow |
| CN103117258A (en) * | 2013-01-24 | 2013-05-22 | 上海交通大学 | High-hole-density through hole metal foam electronic element heat-dissipation device based on impact jet flow |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
| CN104201160A (en) * | 2014-09-09 | 2014-12-10 | 东南大学 | Enhanced boiling heat exchange structure with porous foam metal |
| CN105188311A (en) * | 2015-08-23 | 2015-12-23 | 李增珍 | Liquid cooling plate |
| CN105188311B (en) * | 2015-08-23 | 2017-06-16 | 杭州玄冰科技有限公司 | A kind of liquid cooling plate |
| CN105097733A (en) * | 2015-08-27 | 2015-11-25 | 电子科技大学 | Paraffin-based air-cooled and water-cooled combined cooling device |
| CN105097733B (en) * | 2015-08-27 | 2017-09-05 | 电子科技大学 | A kind of air-cooled water cooling combined radiating device based on paraffin |
| CN107660104A (en) * | 2017-09-30 | 2018-02-02 | 广东合新材料研究院有限公司 | A kind of cold liquid homogenizer of liquid and the liquid cooling heat radiator using the cold liquid homogenizer of the liquid |
| CN107660104B (en) * | 2017-09-30 | 2023-10-31 | 广东西江数据科技有限公司 | Liquid cooling liquid homogenizing device and liquid cooling radiator using same |
| CN108130516A (en) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | A kind of Vacuum Deposition cathode target using foam metal enhancing cooling |
| CN108418545A (en) * | 2018-04-28 | 2018-08-17 | 华南理工大学 | A kind of micro jet flow coldplate and its manufacturing method that porous heating surface is added |
| CN109548363A (en) * | 2018-10-30 | 2019-03-29 | 山东超越数控电子股份有限公司 | A kind of porous media liquid cooling device for cooling, production method and application method |
| TWI765341B (en) * | 2020-09-10 | 2022-05-21 | 英業達股份有限公司 | Heat sink and thermal dissipation system |
| CN112244378A (en) * | 2020-10-23 | 2021-01-22 | 贵州中医药大学 | Medical protective clothing cooling inside lining |
| CN113423244A (en) * | 2021-06-28 | 2021-09-21 | 哈尔滨工业大学 | Preparation method and application of aluminum-based liquid cooling heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20101205 |