CN107660104B - Liquid cooling liquid homogenizing device and liquid cooling radiator using same - Google Patents
Liquid cooling liquid homogenizing device and liquid cooling radiator using same Download PDFInfo
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- CN107660104B CN107660104B CN201710924545.5A CN201710924545A CN107660104B CN 107660104 B CN107660104 B CN 107660104B CN 201710924545 A CN201710924545 A CN 201710924545A CN 107660104 B CN107660104 B CN 107660104B
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- collecting box
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- 239000007788 liquid Substances 0.000 title claims abstract description 132
- 238000001816 cooling Methods 0.000 title claims abstract description 69
- 239000000110 cooling liquid Substances 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 230000009471 action Effects 0.000 claims abstract description 19
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000005489 elastic deformation Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 description 40
- 230000017525 heat dissipation Effects 0.000 description 17
- 239000007921 spray Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Abstract
The application discloses a liquid cooling liquid equalizer, which comprises an open liquid collecting box for collecting liquid cooling working medium, wherein a bottom plate of the liquid collecting box is a capillary liquid equalizing plate for equalizing the liquid cooling working medium, the capillary liquid equalizing plate is plate-shaped and is of a capillary structure with a plurality of holes, a fixing part for fixing on a radiator of a heating device is arranged on the liquid collecting box, and the liquid cooling liquid equalizer is arranged right above a radiating fin of the radiator of the heating device, so that the liquid cooling working medium in the liquid collecting box flows onto the radiating fin through the holes under the action of gravity and then is uniformly distributed downwards to each radiating fin through the capillary action and flows along the surface of the radiating fin, and the heat on the surface of the radiating fin is uniformly and quickly taken away. According to the application, the liquid cooling working medium is rapidly, comprehensively and uniformly distributed on the radiating fins of the radiator of the heating device through capillary action, the utilization rate of the liquid cooling working medium can reach 100%, and the liquid cooling working medium can realize targeted, concentrated and uniform spraying of the heating device.
Description
Technical Field
The application belongs to the liquid cooling heat dissipation field of heating devices, in particular to a liquid cooling liquid equalizer and a liquid cooling heat radiator using the liquid cooling liquid equalizer, which are mainly applied to heat dissipation of the heating devices in a data center server.
Background
Nowadays, with rapid development of network technology, electronic components are increasingly integrated, miniaturized and high-power, which puts higher demands on heat dissipation of the electronic components. The traditional air cooling technology can not meet the heat dissipation requirement of the existing data center in the high-power occasion, and the existing data center gradually dissipates heat in a liquid cooling mode.
The application patent application (application number: 201610439358.3) of the inventor discloses a working medium contact type cooling system of a high-power electromagnetic wave generator, which comprises a nozzle, a spray branch pipe, a working medium pump, a filter and a working medium box containing insulating liquid heat-conducting working medium, wherein the working medium pump is submerged in the insulating liquid heat-conducting working medium, the filter is arranged at an inlet of the working medium pump, the working medium pump is connected with a spray header pipe, a plurality of spray branch pipes are connected with the spray header pipe in parallel, each spray branch pipe is provided with a plurality of nozzles, and the nozzles spray the front and the back of the high-power electromagnetic wave generator to form a relatively open spray structure.
Although the working medium spray contact type cooling system effectively solves the heat dissipation problem of the high-power device, the cooling system and other existing liquid spray modes have the following defects: when the liquid working medium sprays and contacts the heating element, the targeted and concentrated and uniform spraying of the heating element cannot be ensured, the liquid working medium is accumulated at the non-heating main body part, the heating main body part cannot perform good heat dissipation, the cooling effect is poor, the cooling efficiency is low, and the heat dissipation effect of the cooling system and the running quality of the heating element are directly influenced. In addition, the liquid working medium is not fully utilized, so that phase change waste is caused.
Disclosure of Invention
The first aim of the application is to provide a liquid cooling homogenizer which has simple structure, low manufacturing cost, good cooling effect and improved cooling efficiency.
A second object of the present application is to provide a liquid-cooled radiator using the above liquid-cooled homogenizer.
The first object of the present application is achieved by the following technical measures: the utility model provides a liquid cooling liquid equalizer which characterized in that: the liquid cooling device comprises a liquid collecting box with an opening, wherein the liquid collecting box is used for collecting liquid cooling working media, a bottom plate of the liquid collecting box is a capillary liquid homogenizing plate used for uniformly dividing the liquid cooling working media, the capillary liquid homogenizing plate is of a plate-shaped capillary structure with a plurality of holes, a fixing part used for being fixed on a radiator of a heating device is arranged on the liquid collecting box, and the liquid cooling liquid homogenizing device is arranged right above a radiating fin of the radiator of the heating device, so that the liquid cooling working media in the liquid collecting box flow onto the radiating fin through the holes under the action of gravity and then flow to each radiating fin through the capillary action and flow along the surface of the radiating fin, and heat on the surface of the radiating fin is uniformly and quickly taken away.
According to the application, the capillary liquid-homogenizing plate is densely provided with the holes with various apertures, the liquid cooling working medium gathered in the liquid-collecting box can be rapidly, comprehensively and uniformly distributed on the radiating fins of the radiator of the heating device through capillary action, the utilization rate of the liquid cooling working medium can reach 100%, the targeted, concentrated and uniform spraying of the liquid cooling working medium on the heating device can be realized, the cooling effect is good, the cooling efficiency is high, and the radiating effect of the cooling system and the running quality of the heating device are improved. In addition, the application can be applied to rapid heat transfer under different power and different heat flux density, has wide application range and changeable appearance, and can be used for radiators with different structures; the application has simple structure and low cost, is easy to realize industrialized mass production, and is suitable for wide popularization and application.
As one implementation mode of the application, the pore is a capillary through hole formed on the flat plate, the capillary through hole is in fit with the shape of the radiating fin and corresponds to the radiating fin one by one up and down, and a gap is formed between the bottom surface of the capillary liquid-homogenizing plate and the top end of the radiating fin.
As a recommended mode of the application, the capillary through holes are strip-shaped holes, and a plurality of capillary through holes are arranged in parallel at intervals.
The width of the capillary through hole is 0.5-5 mm.
According to the application, the distance between the capillary through holes on the capillary liquid-homogenizing plate and the radiating fins is limited, so that the liquid cooling working medium in the liquid collecting box is uniformly distributed on the surface of each radiating fin through capillary action, and when the width of the capillary through holes is larger than that of the radiating fins, the distance between the lower hole of the capillary through holes and the top ends of the radiating fins corresponding to the capillary through holes is 0-1 mm; when the width of the capillary through hole is smaller than or equal to the width of the radiating fin, the distance between the lower hole of the capillary through hole and the top end of the radiating fin corresponding to the capillary through hole is 0.5-5 mm.
The capillary liquid-homogenizing plate is mainly composed of at least one layer of capillary porous material, when the number of the capillary porous materials is more than two, the capillary liquid-homogenizing plate is formed by sequentially paving a plurality of layers of capillary porous materials, wherein the pores are the pores of the capillary porous materials, and the bottom surface of the capillary liquid-homogenizing plate is contacted with the top ends of the radiating fins. The capillary porous material can be selected from metal material, inorganic nonmetallic material or high polymer material, etc. The pore diameter and the laying thickness of the capillary porous material depend on the selected liquid cooling working medium, and in general, the pore diameter of the capillary porous material selected by the liquid cooling working medium with small surface tension is small, and the laying thickness is large; the capillary porous material selected by the liquid cooling working medium with high surface tension has large pore diameter and small laying thickness.
As a preferred embodiment of the application, the thickness of the capillary liquid-homogenizing plate is 0.2-2 mm, and the pore diameter of the capillary porous material is 30 um-5 mm.
The second object of the present application is achieved by the following technical measures: the liquid cooling radiator using the liquid cooling homogenizer is characterized in that: the liquid cooling device comprises a liquid cooling liquid homogenizing device and a heating device radiator positioned under the liquid cooling liquid homogenizing device, wherein the heating device radiator mainly comprises a base plate and radiating fins arranged on the base plate, gaps are reserved between the adjacent radiating fins, and holes on a capillary liquid homogenizing plate are vertically corresponding to the radiating fins, so that liquid cooling working medium positioned in a liquid collecting box flows onto the radiating fins through the holes under the action of gravity and then flows to each radiating fin and flows along the surfaces of the radiating fins through capillary action, and heat on the surfaces of the radiating fins is uniformly and rapidly taken away.
As a preferred embodiment of the present application, the fixing component adopts elastically deformable fastening pieces, the fastening pieces are distributed on the periphery of the bottom surface of the liquid collecting box, and the fastening pieces are fastened on the radiating fins of the radiator of the heating device through restoring force caused by elastic deformation.
Compared with the prior art, the application has the following remarkable effects:
the capillary liquid-homogenizing plate has the advantages that the capillary liquid-homogenizing plate is densely provided with holes with various apertures, liquid cooling working media gathered in the liquid-collecting box can be rapidly, comprehensively and uniformly distributed on radiating fins of a radiator of a heating device through capillary action, the utilization rate of the liquid cooling working media can reach 100%, the liquid cooling working media can spray the heating device in a targeted and concentrated mode uniformly, the cooling effect is good, the cooling efficiency is high, and the radiating effect of a cooling system and the running quality of the heating device are improved.
The radiator can be applied to rapid heat transfer under different power and different heat flux densities, has a wide application range and a changeable appearance, and can be used for radiators with different structures.
The application has simple structure, low cost, easy realization of industrialized mass production and wide popularization and application.
Drawings
The application will now be described in further detail with reference to the drawings and to specific examples.
FIG. 1 is a schematic view showing the overall structure of embodiment 1 of the present application;
FIG. 2 is an exploded view of the structure of embodiment 1 of the present application;
FIG. 3 is an axial cross-sectional view of embodiment 1 of the present application;
FIG. 4 is an axial cross-section of example 1 of the present application (showing a liquid cooling medium);
fig. 5 is an axial sectional view of embodiment 2 of the present application.
Detailed Description
Example 1
As shown in fig. 1 to 4, the liquid cooling liquid equalizer 4 of the application comprises an open liquid collecting box 2 for collecting liquid cooling working medium 1, wherein the liquid collecting box 2 is a rectangular box body made of plastic, the liquid cooling liquid equalizer 4 is arranged right above a radiating fin 6 of a heating device radiator 5, a fixing part for fixing the heating device radiator 5 is arranged on the liquid collecting box 2, a bottom plate of the liquid collecting box 2 is a capillary liquid equalizing plate 3 for equally dividing the liquid cooling working medium 1, the capillary liquid equalizing plate 3 is arranged at the bottom of the liquid collecting box 2 in a sealing way, the capillary liquid equalizing plate 3 is in a plate shape and is in a capillary structure with a plurality of holes, and the capillary liquid equalizing plate 3 is a key component part of the liquid cooling liquid equalizer 4. In this embodiment, the capillary liquid-homogenizing plate 3 is made of a plate material with the same material as the liquid-collecting box 2, the pores are capillary through holes 7 formed in the plate, the capillary through holes 7 are elongated holes, the capillary through holes 7 are adapted to the shape of the heat-dissipating fins 6 and vertically correspond to each other, and the plurality of capillary through holes 7 are arranged in parallel at intervals. The width of the capillary through-hole 7 is 0.5 to 5mm. In this embodiment, the width D of the capillary through hole 7 is smaller than the width D of the heat dissipation fins 6, and the distance l=0.5-5 mm between the lower hole of the capillary through hole 7 and the top end of the heat dissipation fin 6 corresponding to the capillary through hole 7, so that after the liquid cooling medium 1 in the liquid collecting box 2 flows onto the heat dissipation fins 6 through the capillary through hole 7 under the action of gravity, the liquid cooling medium is uniformly distributed downwards to the surface of each heat dissipation fin 6 and flows along the surface of the heat dissipation fin 6 according to the direction a, and the heat on the surface of the heat dissipation fin 6 is uniformly and rapidly taken away. By limiting the distance between the capillary through holes on the capillary liquid-homogenizing plate and the radiating fins, the liquid cooling working medium in the liquid-collecting box can be ensured to be uniformly distributed on the surface of each radiating fin through capillary action.
In other embodiments, when the width of the capillary through hole is greater than the width of the heat dissipation fins, the distance between the lower holes of the capillary through hole and the top ends of the heat dissipation fins corresponding to the capillary through hole is 0-1 mm, so as to ensure that the liquid cooling working medium in the liquid collecting box is uniformly distributed on the surface of each heat dissipation fin through capillary action.
The liquid cooling radiator using the liquid cooling liquid homogenizing device comprises the liquid cooling liquid homogenizing device 4 and the heating device radiator 5 positioned right below the liquid cooling liquid homogenizing device 4, wherein the shapes of the liquid cooling liquid homogenizing device 4 and the heating device radiator 5 are cuboid, the heating device radiator 5 mainly comprises a rectangular base plate 10 and radiating fins 6 arranged on the base plate 10, gaps 8 are reserved between the adjacent radiating fins 6, capillary through holes 7 on the capillary liquid homogenizing plate 3 are adaptive to the shapes of the radiating fins 6 and correspond to each other up and down, so that after the liquid cooling working medium 1 positioned in the liquid collecting box 2 flows onto the radiating fins 6 through the capillary through holes 7 under the action of gravity, the liquid cooling working medium flows down evenly to each radiating fin 6 through the capillary action and flows along the surfaces of the radiating fins 6, and heat on the surfaces of the radiating fins 6 is uniformly and rapidly taken away.
In this embodiment, the fixing component adopts the sheet snap fastener 11 that can take place elastic deformation, the snap fastener 11 distributes on the bottom surface periphery of liquid collecting box 2, it and liquid collecting box 2 injection molding integrated into one piece, when snap fastener 11 block on radiating fin 6, snap fastener 11 takes place elastic deformation, at this moment, outward little displacement can take place for snap fastener 11, snap fastener 11 utilizes self elastic restoring force to block tightly on radiating fin 6, fix liquid cooling liquid equalizer 4 in the top of heating device radiator 5 through snap fastener 11, with the interval between the bottom of guaranteeing capillary liquid equalizing plate 3 and radiating fin 6 is 0.5 ~ 5mm.
The working process of the application is as follows: in a working medium spray contact type cooling system of a data center server, a liquid cooling liquid equalizer 4 is arranged above each heating device of the server, when the working medium contact type cooling system works, liquid cooling working medium 1 is converged into a liquid collecting box 2 at first, then reaches the outer surface of a radiating fin 6 through a capillary liquid equalizing plate 3 at the bottom, rapidly and comprehensively flows through the surface of the radiating fin through capillary action, and the effect of rapidly and efficiently cooling the heating devices is realized. After flowing over the heat radiating fin surface 6, the liquid cooling working medium is converged at the bottom of the heat generating device radiator 5, and then flows back to the outside for cooling through the working medium contact type cooling system, and is circulated in this way.
Example 2
As shown in fig. 5, the difference between the present embodiment and embodiment 1 is that the capillary liquid-homogenizing plate has a different structure, and in embodiment 1, capillary through holes are required to be formed on the capillary liquid-homogenizing plate, and the positions of the pores of the capillary liquid-homogenizing plate need to be determined according to the arrangement mode of the heat dissipation fins, so that the manufacturing process is relatively complex. In this embodiment, the capillary liquid-homogenizing plate 3 is mainly formed by laying at least one layer of capillary porous material, when the number of the capillary porous materials is more than two, the capillary liquid-homogenizing plate 3 is formed by sequentially laying multiple layers of capillary porous materials, and the pores are the pores of the capillary porous materials, so that the manufacturing process can be simplified, and the block-shaped capillary porous materials are adopted to replace the capillary liquid-homogenizing plate provided with the capillary through holes. The thickness of the capillary liquid-homogenizing plate 3 is 0.2-2 mm, and the pore diameter of the capillary porous material is 30 um-5 mm. The capillary porous material can be porous metal material, inorganic nonmetallic material or polymer material, such as foamy copper, aluminum, nickel, ceramic, carbon fiber, etc. The pore diameter and the laying thickness of the capillary porous material depend on the selected liquid cooling working medium, and in general, the pore diameter of the capillary porous material selected by the liquid cooling working medium with small surface tension is small, and the laying thickness is large; the capillary porous material selected by the liquid cooling working medium with high surface tension has large pore diameter and small laying thickness.
The massive capillary porous material is arranged at the bottom of the liquid collecting box 2 in a sealing way, the liquid cooling liquid homogenizing device 4 is clamped on the radiating fins 6 of the heating device radiator 5 through the clamping pieces 11, and the bottom surface of the capillary liquid homogenizing plate 3 is contacted with the top ends of the radiating fins 6. Because the capillary porous material is internally densely distributed with capillary structures with a plurality of pores, capillary action is directly formed at the contact part of the capillary porous material and the radiating fins 6, liquid working medium in the liquid collecting box is directly and uniformly distributed on the outer surface of the radiating fins 6 through the pores in the capillary porous material, and flows uniformly and rapidly along the outer surface, so that the radiating effect is realized.
The embodiments of the present application are not limited thereto, and according to the above-described aspects of the present application, the present application may be modified, replaced or altered in various other ways without departing from the basic technical spirit of the present application, all of which fall within the scope of the claims of the present application, according to the general technical knowledge and conventional means of the present art.
Claims (7)
1. The utility model provides a liquid cooling liquid equalizer which characterized in that: the liquid cooling working medium cooling device comprises an open liquid collecting box for collecting liquid cooling working medium, wherein a bottom plate of the liquid collecting box is a capillary liquid homogenizing plate for uniformly dividing the liquid cooling working medium, the capillary liquid homogenizing plate is in a plate shape and is of a capillary structure with a plurality of holes, the capillary liquid homogenizing plate is made of a plate material which is the same as that of the liquid collecting box, a fixing part for fixing the liquid collecting box on a radiator of a heating device is arranged on the liquid collecting box, and the liquid cooling liquid homogenizing box is arranged right above a radiating fin of the radiator of the heating device, so that the liquid cooling working medium in the liquid collecting box flows onto the radiating fin through the holes under the action of gravity and then uniformly distributes the liquid cooling working medium downwards to the surface of each radiating fin through the capillary action and flows along the surface of the radiating fin, and heat on the surface of the radiating fin is uniformly and quickly taken away; the holes are capillary through holes formed in the flat plate, the capillary through holes are in fit with the shape of the radiating fins and correspond to the radiating fins one by one up and down, and gaps are formed between the bottom surface of the capillary liquid homogenizing plate and the top ends of the radiating fins.
2. The liquid-cooled homogenizer of claim 1, wherein: the capillary through holes are strip-shaped holes, and a plurality of the capillary through holes are arranged in parallel at intervals.
3. The liquid-cooled homogenizer of claim 2, wherein: the width of the capillary through hole is 0.5-5 mm.
4. A liquid-cooled homogenizer according to claim 3, wherein: the width of the capillary through hole is larger than that of the radiating fins, and the distance between the lower hole of the capillary through hole and the top ends of the radiating fins corresponding to the capillary through hole is 0-1 mm.
5. A liquid-cooled homogenizer according to claim 3, wherein: the width of the capillary through hole is smaller than or equal to that of the radiating fins, and the distance between the lower hole of the capillary through hole and the top ends of the radiating fins corresponding to the capillary through hole is 0.5-5 mm.
6. A liquid-cooled radiator using the liquid-cooled homogenizer of claim 1, characterized in that: the liquid cooling device comprises a liquid cooling liquid homogenizing device and a heating device radiator positioned under the liquid cooling liquid homogenizing device, wherein the heating device radiator mainly comprises a base plate and radiating fins arranged on the base plate, gaps are reserved between adjacent radiating fins, and holes on a capillary liquid homogenizing plate correspond to the radiating fins vertically.
7. The liquid-cooled heat sink of claim 6, wherein: the fixing part adopts a clamping part capable of elastically deforming, the clamping part is distributed on the periphery of the bottom surface of the liquid collecting box, and the clamping part is clamped on the radiating fins of the radiator of the heating device through restoring force brought by elastic deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710924545.5A CN107660104B (en) | 2017-09-30 | 2017-09-30 | Liquid cooling liquid homogenizing device and liquid cooling radiator using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710924545.5A CN107660104B (en) | 2017-09-30 | 2017-09-30 | Liquid cooling liquid homogenizing device and liquid cooling radiator using same |
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| Publication Number | Publication Date |
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| CN107660104A CN107660104A (en) | 2018-02-02 |
| CN107660104B true CN107660104B (en) | 2023-10-31 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109673142B (en) * | 2019-02-27 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Heat transfer block for spray type liquid cooling server heating device |
| CN112002958B (en) * | 2020-08-27 | 2022-04-26 | 重庆金康动力新能源有限公司 | Battery pack spraying and cooling system |
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