CN201294224Y - Open pore foamed metal hot pipe needle-fin-combined CPU radiator - Google Patents
Open pore foamed metal hot pipe needle-fin-combined CPU radiator Download PDFInfo
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- CN201294224Y CN201294224Y CNU2008201802527U CN200820180252U CN201294224Y CN 201294224 Y CN201294224 Y CN 201294224Y CN U2008201802527 U CNU2008201802527 U CN U2008201802527U CN 200820180252 U CN200820180252 U CN 200820180252U CN 201294224 Y CN201294224 Y CN 201294224Y
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Abstract
The utility model relates to a combined CPU radiator of a perforated foam metal heat pipe pin fin, which comprises a chassis, a perforated foam metal, a gas-collecting chamber and a hollow pin fin, wherein the chassis is hollow, the perforated foam metal is arranged in the hollow cavity of the chassis, the upper portion of the perforated foam metal is provided with a small segment of gas-collecting chamber, and the gas-collecting chamber is communicated with a plurality of hollow cavities of heat radiation areas on the upper portion. Liquid is injected in the hollow cavity of the chassis, and vacuum is pumped, thereby forming a combined heat pipe structure which uses the chassis and the perforated foam metal as heat ends and the hollow pin fin as a cold end. The combined CPU radiator integrates two highly-effective heat radiating techniques of the heat pipe and the foam metal, leads heat transfer, phase-change heat transfer, countercurrent heat transfer and radiating heat transfer to achieve in one device, and has light weight, small volume and high heat radiating efficiency.
Description
Technical field
The utility model relates to radiating device technical field, refers in particular to a kind of radiator that improves the computer CPU radiating efficiency.
Background technology
Electronic radiation is related to the reliability and the life-span of electronic equipment, is a bottleneck of the current electronics industry development of influence.Be accompanied by electronic industry high-performance, microminiaturization, integrated three great development trend, heat dissipation problem is more and more outstanding.Especially for the higher CPU of heat load susceptibility, heat will have a strong impact on its stability and useful life in the accumulation at chip place.There are some researches show that if the working temperature rising 10e of single electronic component, its reliability then can reduce 50%; And the CPU Problem of Failure 55% all because overheated causing.At present, the Pentium43.2E of high frequency has broken through 100W power consumption high point, and the power consumption of Smith-field core Pentium D dual core processor is climbed especially to 130W.Prediction according to the chief technology officer Patrick Gelsinger of Intel increases down with present speed as the number of transistors in the fruit chip always, to 2015 will be the same with sun surface hot, that yes is inconceivable for this.Therefore, in order to make CPU performance optimum performance and to guarantee its reliability, the CPU heat dissipating method of research practicality and high efficiency also becomes more and more important and urgent problem with regard to becoming.
Utilize the CPU heat abstractor of heat pipe rapid day by day as a kind of novel CPU heat dissipation technology development, the advantage of heat pipe is thermal conductivity and the isothermal that it is good, and thermal response speed is fast, light weight and simple in structure.People such as Zhang Tao are at " the heat conduction reinforced analysis of filled and process metal in the phase change device " (refrigeration journal, 2007,10 (2): report 13), adopt foam metal as packing material, heat transfer property and energy storage efficiency on the energy storage device all directions have been strengthened greatly as phase-change accumulation energy device packing material, improved the temperature homogeneity in the device, made heat to be absorbed by phase-change material rapidly, its whole structure is better than fin.
Taking all factors into consideration effective now heat dissipation technology, it reasonably is applied in the heat radiation of CPU, is a kind of development trend of CPU heat dissipation technology.
Summary of the invention
The purpose of this utility model provides a kind of in light weight, volume is little, radiating efficiency is high cpu heat, to satisfy the urgent needs of the soaring day by day CPU heat radiation of power consumption.
The utility model is made up of base, open celled foam metal, collection chamber, hollow needle wing.Base hollow, open celled foam metal are arranged in the cavity of base, and a bit of collection chamber is arranged at open celled foam metal top, and collection chamber is connected with the cavity of the some radiating area hollow needle wings that are arranged on the top.Injecting liquid in base cavity pocket, vacuumize, is that hot junction, hollow needle wing are the combination heat pipe structure of cold junction thereby form with base and open celled foam metal.
Open celled foam metal for heat absorption district base adopts as the hot junction, can alleviate construction weight with it, has guaranteed working media excellent permeability therein again.The open celled foam metal can be selected open celled foam aluminium for use.Open celled foam aluminium has high porosity, high through-hole rate, low-density, high-specific surface area, pore diameter range is wide and the aperture is bigger characteristics, and through-hole rate can reach 60%, and density 0.9g/cm3 is the novel porous matter functional material of a class.
Adopt the square sectional hollow structure for radiating area hollow needle wing, reflux along pin wing inwall corner angle after the liquid-working-medium that helps injecting in the cavity condenses.According to application conditions, conventional media such as the optional water of the working media that injects in the cavity, alcohol, R123.Hollow needle wing top can be provided with the multilayer fin, can further strengthen its radiating effect.In addition, on hollow needle wing top or the side fan can be set, can guarantee that heat in time taken away by the convection current air, play the effect of further enhance heat equally.
Can be according to the structural parameters of thermal source heating power, working temperature and open celled foam aluminium, evaluation work medium consumption, liquid filled ratio and air quantity of fan, and definite pin wing arrangement mode and structural parameters.This combining form heat pipe can adopt hot-mold continuous cast and welding procedure manufacturing.
The utility model combines two kinds of heat pipe and foam metals heat dissipation technology efficiently, and heat conduction, phase-change heat transfer, convective heat transfer and radiant heat transfer are realized in same device.By adopting the big open celled foam metal of conductive coefficient height, heating surface (area) (HS as packing material, reduce heat conduction and phase-change heat transfer thermal resistance, and can strengthen heat transfer property and energy storage efficiency on the energy storage device all directions greatly, improve the temperature homogeneity in the device, make heat to be absorbed by phase-change material rapidly; By square sectional hollow needle wing, guarantee the condensation and the backflow of work medium for heat pipe; Also can add fan, the heat that the pin wing distributes is in time taken away by the convection current air, further improve its radiating efficiency.
After adopting this structure, make the utility model can utilize open celled foam metal fast Absorption heat, utilize the liquid that injects in the cavity that the heat that absorbs is dispersed fast, improve the radiating efficiency of radiator greatly.Owing to adopt the open celled foam metal, therefore device is in light weight simultaneously; And the volume of single unit system is little.
Description of drawings
Fig. 1 is the utility model open celled foam metal fever bobbin wing composite type cpu heat profile.
Among the figure: 1. thermal source, 2. base, 3. open celled foam metal, 4. collection chamber, 5. hollow needle wing, 6. fin.
Embodiment
The utility model open celled foam metal fever bobbin wing composite type cpu heat is made up of base 2, open celled foam metal 3, collection chamber 4, hollow needle wing 5 as shown in Figure 1.Base 2 hollows, open celled foam metal 3 are arranged in the cavity of base 2, and a bit of collection chamber 4 is arranged at open celled foam metal 3 tops, and collection chamber 4 is connected with the cavity of the some radiating area hollow needle wings 5 that are arranged on the top.Injecting liquid in base 2 cavitys, vacuumize, is that hot junction, hollow needle wing 5 are the combination heat pipe structure of cold junction thereby form with base 2 and open celled foam metal 3.
Open celled foam metal 3 for heat absorption district base 2 adopts as the hot junction, can alleviate construction weight with it, has guaranteed working media excellent permeability therein again.Open celled foam metal 3 is selected open celled foam aluminium for use in the present embodiment.Adopt the open celled foam aluminium of seepage flow casting preparation, its hole is continuous three-dimensional space network structure, is similar to spongy.Its pore structure is made up of close-connected bending, thin thin metallic framework and the hole that is interconnected.Open celled foam aluminium has high porosity, high through-hole rate, low-density, high-specific surface area, pore diameter range is wide and the aperture is bigger characteristics, and through-hole rate can reach 60%, density 0.9g/cm
3, be the novel porous matter functional material of a class.Therefore, open celled foam metal energy enhance heat transfer performance and energy storage efficiency can be absorbed heat by phase-change material and heat transfer medium; And connective good, can not hinder the circulation of heat transfer medium.
Adopt the square sectional hollow structure for radiating area hollow needle wing 5, reflux along pin wing inwall corner angle after the liquid-working-medium that helps injecting in the cavity condenses.According to application conditions, conventional media such as the optional water of the working media that injects in the cavity, alcohol, R123.Adopt water as liquid-working-medium in the present embodiment, water is full of in the open celled foam metal 3.Hollow needle wing 5 tops can be provided with multilayer fin 6, can further strengthen its radiating effect.In addition, fan can be set, can guarantee that heat in time taken away by the convection current air, play the effect of further enhance heat equally on hollow needle wing 5 tops or side.
Can be according to the structural parameters of heating power, working temperature and the open celled foam aluminium of thermal source 1, evaluation work medium consumption, liquid filled ratio and air quantity of fan, and definite pin wing arrangement mode and structural parameters.This combining form heat pipe can adopt hot-mold continuous cast and welding procedure manufacturing.
Because the boiling point of water is lower under the vacuum state, when heat transferred base 2 from thermal source 1, base 2 transmits whole heat absorption zone rapidly through open celled foam metal 3, and after making the water that is full of in the open celled foam metal 3 reach boiling, produce steam, gas is assembled in collection chamber 4, and rise in the cavity of each hollow needle wing 5, because hollow needle wing 5, and the thermolysis of the fin 6 on pin wing top, steam condenses into water droplet at the square cavities inwall of hollow needle wing 5, and in being back to open celled foam metal 3 in the base cavity pocket along the inwall corner angle, and constantly circulation, and the working medium water in the cavity remains on a lower temperature, thus play thermolysis.
Claims (7)
1, a kind of open celled foam metal fever bobbin wing composite type cpu heat, form by base, open celled foam metal, collection chamber, hollow needle wing, it is characterized in that: base hollow, the open celled foam metal is arranged in the cavity of base, a bit of collection chamber is arranged at open celled foam metal top, collection chamber is connected with the cavity of the some radiating area hollow needle wings that are arranged on the top, is marked with liquid in base cavity pocket.
2, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1, it is characterized in that: the open celled foam metal can be selected open celled foam aluminium for use.
3, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1 is characterized in that: the hollow needle wing adopts the square sectional hollow structure.
4, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1, it is characterized in that: hollow needle wing top is provided with the multilayer fin.
5, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1 is characterized in that: the optional water of the liquid that injects in the base cavity pocket, alcohol, R123.
6, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1, it is characterized in that: base cavity pocket is a vacuum.
7, open celled foam metal fever bobbin wing composite type cpu heat according to claim 1 is characterized in that: be provided with fan on hollow needle wing top or side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201802527U CN201294224Y (en) | 2008-12-01 | 2008-12-01 | Open pore foamed metal hot pipe needle-fin-combined CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201802527U CN201294224Y (en) | 2008-12-01 | 2008-12-01 | Open pore foamed metal hot pipe needle-fin-combined CPU radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201294224Y true CN201294224Y (en) | 2009-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201802527U Expired - Fee Related CN201294224Y (en) | 2008-12-01 | 2008-12-01 | Open pore foamed metal hot pipe needle-fin-combined CPU radiator |
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| CN (1) | CN201294224Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102359717A (en) * | 2011-10-27 | 2012-02-22 | 贵州光浦森光电有限公司 | Method for assembling LED lighting lamp |
| CN102829660A (en) * | 2012-09-03 | 2012-12-19 | 浙江大学 | Pulse heat pipe exchanger based on foamed materials |
| CN103002716A (en) * | 2012-10-30 | 2013-03-27 | 任立元 | Bionic convection heat radiation device |
| CN105188311A (en) * | 2015-08-23 | 2015-12-23 | 李增珍 | Liquid cooling plate |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
| RU207764U1 (en) * | 2021-04-16 | 2021-11-15 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | RADIATOR FOR COOLING SEMICONDUCTOR AND MICROELECTRONIC ELECTRIC VACUUM DEVICES |
| RU212836U1 (en) * | 2022-02-28 | 2022-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | RADIATOR FOR COOLING SEMICONDUCTOR AND MICROELECTRONIC VACUUM DEVICES |
| EP4230946A1 (en) * | 2022-02-21 | 2023-08-23 | Nokia Technologies Oy | Oscillating heat pipes |
-
2008
- 2008-12-01 CN CNU2008201802527U patent/CN201294224Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102359717A (en) * | 2011-10-27 | 2012-02-22 | 贵州光浦森光电有限公司 | Method for assembling LED lighting lamp |
| CN102359717B (en) * | 2011-10-27 | 2014-10-22 | 贵州光浦森光电有限公司 | Method for assembling LED lighting lamp |
| CN102829660A (en) * | 2012-09-03 | 2012-12-19 | 浙江大学 | Pulse heat pipe exchanger based on foamed materials |
| CN102829660B (en) * | 2012-09-03 | 2014-05-07 | 浙江大学 | Pulse heat pipe exchanger based on foamed materials |
| CN103002716A (en) * | 2012-10-30 | 2013-03-27 | 任立元 | Bionic convection heat radiation device |
| CN105188311B (en) * | 2015-08-23 | 2017-06-16 | 杭州玄冰科技有限公司 | A kind of liquid cooling plate |
| CN105188311A (en) * | 2015-08-23 | 2015-12-23 | 李增珍 | Liquid cooling plate |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
| RU207764U1 (en) * | 2021-04-16 | 2021-11-15 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | RADIATOR FOR COOLING SEMICONDUCTOR AND MICROELECTRONIC ELECTRIC VACUUM DEVICES |
| EP4230946A1 (en) * | 2022-02-21 | 2023-08-23 | Nokia Technologies Oy | Oscillating heat pipes |
| RU212836U1 (en) * | 2022-02-28 | 2022-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | RADIATOR FOR COOLING SEMICONDUCTOR AND MICROELECTRONIC VACUUM DEVICES |
| RU2803414C1 (en) * | 2022-07-26 | 2023-09-12 | Акционерное общество "Научно-производственное предприятие "Пульсар" | Radiator with efficient and distributed heat removal |
| RU222954U1 (en) * | 2023-10-09 | 2024-01-24 | Акционерное общество "Научно-производственное предприятие "Алмаз" (АО "НПП "Алмаз") | RADIATOR FOR COOLING SEMICONDUCTOR AND MICROELECTRONIC VACUUM DEVICES |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20101201 |