CN201255387Y - High power LED light source packaged by liquid dipping - Google Patents
High power LED light source packaged by liquid dipping Download PDFInfo
- Publication number
- CN201255387Y CN201255387Y CNU2008200872274U CN200820087227U CN201255387Y CN 201255387 Y CN201255387 Y CN 201255387Y CN U2008200872274 U CNU2008200872274 U CN U2008200872274U CN 200820087227 U CN200820087227 U CN 200820087227U CN 201255387 Y CN201255387 Y CN 201255387Y
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- radiator
- cooling fluid
- light source
- led chip
- optical window
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Abstract
The utility model discloses a dipping packaging high power LED light source, which comprises an LED chip, a packaging substrate, cooling fluid, an optical window component, a shell and a radiator. The radiator is provided with the shell and the packaging substrate which is provided with an LED core 1. The top of the shell is provided with the optical window component. The shell is internally filled with the cooling fluid. The LED chip is arranged on the packaging substrate which is arranged on the radiator. The LED chip and the packaging substrate are immerged in the cooling fluid. The cooling liquid is sealed in a negative pressure closeness space formed by the optical window component, the shell and the radiator to form the condensation and evaporation circulation. The light generated by the LED chip gives off from the optical window component; and the heat is conveyed to a seat assembly and the radiator for radiating, thus effectively solving the radiating and light intensity output problem of the high power light source.
Description
Technical field
The utility model relates to lighting source, relates in particular to a kind of high-power LED light source of liquid immersion type encapsulation.
Background technology
Led light source is the new generation of green lighting source, and its power consumption has only 1/10th of ordinary incandescent lamp, and the life-span is long more than ten times.In addition, led light source also has advantages such as volume is little, sturdy and durable, rich color.In order to satisfy the requirement of higher light intensity, led light source by improving single chip power output or adopt the mode of led array to realize.In ideal conditions, the optical material of coupling and suitable encapsulating structure can be given full play to LED luminescent properties efficiently, and most electric energy is converted into light.But the PN junction long-term work that temperature has very large influence, particularly led chip to the output intensity and the colour temperature performance of high-power LED light source is in the condition of high temperature, and its optical property can very fast decay, and this is to need the key issue that solves in the LED encapsulation.In addition, led chip is to be made by semi-conducting material GaN and sapphire etc. at present, the refractive index of these materials is very high, and the light of generation is not easy to shine in the low-refraction air, therefore needs to select suitable refraction materials to improve the outgoing efficient of light source as matching layer.
The encapsulation technology of high-power LED encapsulation adopts highly heat-conductive material as substrate mostly at present, utilizes heat conduction or convection type that heat is taken away from substrate then.And adopt refractive index in the light-emitting area of led chip is that about 1.5 epoxy resin or silica gel are exported matching layer as optics, and the thermal conductivity factor of this material very low thermal resistance is very big, and heat can not scatter and disappear substantially.The main method of improving the led light source heat dispersion at present is to improve the heat conduction and the heat dispersion of substrate, adopts methods such as high thermal conductivity coefficient material, forced convertion, as patent 200520047169.9, proposes to utilize micro-injection flowing water device to come the cooling LED light source.Patent 200610060840.2 has proposed a kind of chip to be immersed LED method for packing in the cooling fluid, this method need rely on liquid flow heat could be taken away, the non-constant of tough liquid fluidity has influenced cooling effect like this in little hermetically-sealed construction.In order to address this problem, this patent proposes to solve with forced convertion, but has increased the complexity of system like this, and this method also is not suitable for undersized LED encapsulation simultaneously.
From the analysis of led light source heat generation characteristic as can be known, the bottleneck of led chip heat radiation is between chip and substrate, because the led chip volume is very little, the contact area between chip and the substrate is very limited, particularly upside-down mounting (flip-chip) structure, have a plurality of dielectric layers between the active area of heating and the substrate, thermal resistance increases sharply, and labor is referring to document " upside-down mounting large power white light LED thermal field analysis and test " (photoelectron laser, vol.16, num.5, pp.511-514,2005).The heat of led chip can not will leave as soon as possible like this, cause the PN junction temperature higher, and other optical materials such as epoxy resin, silica gel and fluorescer etc. are in work under the high temperature for a long time, the performance degradation of whole light source device aging very fast, poor reliability, this encapsulating structure is difficult to be suitable for the high-power LED light source of high power density.How under prerequisite cheaply, adopt the better type of cooling, led light source is operated on the lower temperature works, obtain higher luminous efficiency, in the longer life-span, higher reliability is this key issue to be solved in the utility model.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of high-power LED light source of liquid immersion type encapsulation is provided.
The high-power LED light source of liquid immersion type encapsulation comprises led chip, base plate for packaging, cooling fluid, optical window assembly, housing, radiator; Radiator is provided with housing, base plate for packaging, and base plate for packaging is provided with LED core 1, and case top is provided with the optical window assembly, is filled with cooling fluid in the housing.
Described optical window assembly comprises lens and is mixed with the blooming piece of fluorescent material that the blooming piece that is mixed with fluorescent material is provided with lens.Cooling fluid is acetone, ethanol, freon or water.Inner walls is provided with optical mirror.Radiator is finned radiator or heat-pipe type radiator.The inwall of housing and radiator is provided with the capillary groove that liquid refluxes.
The utility model is made of led chip, base plate for packaging, cooling fluid, optical window assembly, housing, radiator.Led chip is installed on the base plate for packaging, base plate for packaging is installed on the radiator, led chip and base plate for packaging are immersed in the cooling fluid, and cooling fluid is closed in the negative pressure confined space that optical window assembly, black box and radiator constitute and forms condensation, vaporization cycle.The light that led chip produces sends from the optical window assembly, and heat is cooled, and liquid is sent to black box and radiator sheds, and can effectively solve the problem of the heat radiation and the light intensity output of high-power LED light source.
Description of drawings
Fig. 1 is the structural representation of the high-power LED light source of liquid immersion type encapsulation;
Fig. 2 is the structural representation of optical window assembly of the present utility model;
Fig. 3 is the structural representation of radiator of the present utility model;
Among the figure: led chip 1, base plate for packaging 2, cooling fluid 3, optical window assembly 4, black box 5, radiator 6, lens 7, the blooming piece 8 that is mixed with fluorescent material, capillary groove 9.
The specific embodiment
Describe the specific embodiment of the present utility model in detail below in conjunction with accompanying drawing.
As shown in Figure 1, the high-power LED light source of liquid immersion type encapsulation comprises led chip 1, base plate for packaging 2, cooling fluid 3, optical window assembly 4, housing 5, radiator 6; Radiator 6 is provided with housing 5, base plate for packaging 2, and base plate for packaging 2 is provided with led chip 1, and housing 5 tops are provided with optical window assembly 4, are filled with cooling fluid 3 in the housing 5.
Led chip is fixed on the base plate for packaging by methods such as welding bindings, and base plate for packaging is made by the material of high thermal conductivity coefficient, is laid with chip on it to connect required circuit, and base plate for packaging is fixedly installed on the radiator.The confined space of a negative pressure that constitutes by optical window assembly, housing and radiator, charge into an amount of cooling fluid then therein, led chip and base plate for packaging are immersed in the cooling fluid fully, and cooling fluid forms evaporation, condensation cycle in the negative pressure confined space that optical window assembly, housing and radiator constitute.Housing is a container of being made by metal or other materials, and its inwall can be made into optical mirror, to strengthen the output of light in the optical window assembly.In order to strengthen radiating effect, radiator can increase fin and enlarge radiators such as area of dissipation or employing heat pipe-type.
The cooling fluid evaporation needs to absorb a large amount of heats, and in the process of condensation, need to discharge the heat of as much, utilize cooling fluid evaporation and condensation cycle can realize the most effective heat transfer type, heat pipe is exactly the heat transfer device that utilizes this mode to realize, its thermal conductivity is thousands of times of copper.Basic thought of the present utility model is to utilize the evaporation of cooling fluid and condensation cycle that the heat of led chip is taken away fast.Utilize the optical window assembly, housing and radiator constitute a confined space, then the air of this confined space is extracted out and formed negative pressure, an amount of cooling fluid is joined in the confined space, because cooling fluid its evaporating temperature in the confined space of negative pressure reduces greatly, therefore when the led chip adstante febre, cooling fluid is evaporated formation gas rapidly, inner surface condensation of gas at housing and radiator is a liquid, the capillary groove of liquid by housing and radiator setting is formed by evaporation to circulation near being back to led chip again, this circulation without any need for external impetus, only need led chip and housing, there is temperature difference between the radiator.This encapsulating structure is simple, the reliability height, and also heat transfer efficiency is higher than heat conduction and thermal convection current far away.
Cooling fluid is acetone, ethanol, freon or water, the selection of cooling fluid is extremely important, cooling fluid be a kind of transparent have electrical insulating property, heat endurance, optical stability, refractive index be in 1.3～1.8 between, boiling point is lower than 180 °, circuit and chip do not had corrosive liquid.This liquid can not cause short circuit owing to have electrical insulating property.The transparency of cooling fluid has guaranteed that light that led chip 1 the produces liquid that can not be cooled absorbs.Cooling fluid has optical stability, is in high strength blue light or UV-irradiation for a long time, composition and performance change can not take place.Further, select the cooling fluid of high index of refraction to help improving the outgoing efficient of light from led chip, but consider that light shines airborne efficient, the refractive index of cooling fluid can not be too high, should with the material refractive index basically identical (this optical material is generally selected glass or epoxy resin, and refractive index is about 1.5) of optical window assembly.Consider that cooling fluid has certain excursion with the composition different refractivity, therefore refractive index is chosen between 1.3～1.8.In addition, cooling fluid can not have corrosiveness to circuit and chip material.In addition, cooling fluid will have heat endurance, and long-term work is not at high temperature decomposed and never degenerated.In order to make cooling fluid be easy to evaporation, reach better heat-transfer effect, the boiling point of cooling fluid can not be too high, by regulating the addition of cooling fluid, can control the boiling point of cooling fluid in negative pressure space simultaneously.
Because the led chip that is installed on the base plate for packaging is immersed in the cooling fluid, most of heat that produces liquid that is cooled is directly taken away by evaporation and condensation cycle, cooling fluid is sent to housing with heat and radiator sheds then, also has the sub-fraction heat to be transmitted to radiator by base plate for packaging heat and sheds.Contrast traditional method for packing, method disclosed in the utility model is the cooling LED chip better, its reason is: (1) evaporation and condensation cycle are a kind of very effective heat transfer types, only need the minimum temperature difference just can form circulation automatically, effective like this led chip local temperature of avoiding is too high; (2) led chip immerses in the cooling fluid, and heat transfer area is greater than the contact area between led chip and the base plate for packaging; (3) cooling fluid has very large thermal capacity, and the temperature rise that same heat causes is more much smaller than airborne.
As shown in Figure 2, optical window assembly 4 comprises lens 7 and is mixed with the blooming piece 8 of fluorescent material that the blooming piece 8 that is mixed with fluorescent material is provided with lens 7.The effect of optical window assembly is an output intensity, and according to actual needs the characteristic of output light is adjusted.The optical window assembly is installed on the direction of led chip light-emitting area.Lens can change the dispersion angle of output beam, and the blooming piece that is mixed with fluorescent material can change the output light frequency and distribute, and realizes light sources of different colors, as white light LEDs etc.The effect that is mixed with the blooming piece of fluorescent material also can realize by directly mix fluorescent material in cooling fluid.
As shown in Figure 3, the inwall of radiator 6 is provided with the capillary groove 9 that liquid refluxes.This capillary groove entad is around led chip to be arranged.In order to make the cooling fluid of condensation be back near the led chip, porous capillary network or capillary groove need be set at the inwall of housing and radiator.This structure has very tiny hole or groove, and cooling fluid is because capillarity can be full of these holes and groove, and the influence that utilizes this capillary structure can make cooling fluid overcome gravity is back near the led chip.Consider that the porous capillary network can produce scattering to light, the inwall that the utility model is chosen in housing and radiator is provided with capillary groove.
Claims (6)
1. the high-power LED light source of a liquid immersion type encapsulation is characterized in that comprising led chip (1), base plate for packaging (2), cooling fluid (3), optical window assembly (4), housing (5), radiator (6); Radiator (6) is provided with housing (5), base plate for packaging (2), and base plate for packaging (2) is provided with led chip (1), and housing (5) top is provided with optical window assembly (4), is filled with cooling fluid (3) in the housing (5).
2. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1, it is characterized in that described optical window assembly (4) comprises lens (7) and is mixed with the blooming piece (8) of fluorescent material, the blooming piece (8) that is mixed with fluorescent material is provided with lens (7).
3. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described cooling fluid (3) is acetone, ethanol, freon or water.
4. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described housing (5) inwall is provided with optical mirror.
5. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described radiator (6) is finned radiator or heat-pipe type radiator.
6. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that the inwall of described housing (5) and radiator (6) is provided with the capillary groove (9) that liquid refluxes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200872274U CN201255387Y (en) | 2008-05-14 | 2008-05-14 | High power LED light source packaged by liquid dipping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200872274U CN201255387Y (en) | 2008-05-14 | 2008-05-14 | High power LED light source packaged by liquid dipping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201255387Y true CN201255387Y (en) | 2009-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200872274U Expired - Fee Related CN201255387Y (en) | 2008-05-14 | 2008-05-14 | High power LED light source packaged by liquid dipping |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544302A (en) * | 2010-12-17 | 2012-07-04 | 郑榕彬 | Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method |
| CN102859275A (en) * | 2010-05-03 | 2013-01-02 | 奥斯兰姆施尔凡尼亚公司 | Thermosyphon light engine and luminaire including same |
| TWI411746B (en) * | 2010-03-19 | 2013-10-11 | Univ Nat Formosa | Illumination device having high efficiency of cooling function |
-
2008
- 2008-05-14 CN CNU2008200872274U patent/CN201255387Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI411746B (en) * | 2010-03-19 | 2013-10-11 | Univ Nat Formosa | Illumination device having high efficiency of cooling function |
| CN102859275A (en) * | 2010-05-03 | 2013-01-02 | 奥斯兰姆施尔凡尼亚公司 | Thermosyphon light engine and luminaire including same |
| US9273861B2 (en) | 2010-05-03 | 2016-03-01 | Osram Sylvania Inc. | Thermosyphon light engine and luminaire including same |
| CN102544302A (en) * | 2010-12-17 | 2012-07-04 | 郑榕彬 | Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090610 Termination date: 20130514 |