CN101307867A - Liquid immersion type packaged large power LED light source - Google Patents
Liquid immersion type packaged large power LED light source Download PDFInfo
- Publication number
- CN101307867A CN101307867A CNA2008100617133A CN200810061713A CN101307867A CN 101307867 A CN101307867 A CN 101307867A CN A2008100617133 A CNA2008100617133 A CN A2008100617133A CN 200810061713 A CN200810061713 A CN 200810061713A CN 101307867 A CN101307867 A CN 101307867A
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- China
- Prior art keywords
- radiator
- cooling fluid
- light source
- led chip
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims description 25
- 238000007654 immersion Methods 0.000 title claims description 13
- 239000012809 cooling fluid Substances 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010992 reflux Methods 0.000 claims description 3
- 238000009833 condensation Methods 0.000 abstract description 10
- 230000005494 condensation Effects 0.000 abstract description 10
- 238000001704 evaporation Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 10
- 230000008020 evaporation Effects 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000027455 binding Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000520 microinjection Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention discloses an immersed-type packaged LED light source with high power, comprising an LED chip, a packaging substrate, cooling fluid, an optical window component, a shell and a radiator. The radiator is provided with the shell and the packaging substrate which is provided with the LED chip, the top of the shell is provided with the optical window component, and the cooling fluid is filled in the shell. The LED chip is arranged on the packaging substrate which is arranged on the radiator, and the LED chip and the packaging substrate are immersed in the cooling fluid, and the cooling fluid is enclosed in a negative pressure airtight space which is formed by the optical window component, the shell and the radiator to form condensation and evaporation circulation. Light generated by the LED chip is emitted from the optical window component, and heat energy is transmitted to a sealing component and the radiator to be dispersed, thereby effectively solving the problems of heat radiation and light intensity output of the LED light source with high power.
Description
Technical field
The present invention relates to lighting source, relate in particular to a kind of high-power LED light source of liquid immersion type encapsulation.
Background technology
Led light source is the new generation of green lighting source, and its power consumption has only 1/10th of ordinary incandescent lamp, and the life-span is long more than ten times.In addition, led light source also has advantages such as volume is little, sturdy and durable, rich color.In order to satisfy the requirement of higher light intensity, led light source by improving single chip power output or adopt the mode of led array to realize.In ideal conditions, the optical material of coupling and suitable encapsulating structure can be given full play to LED luminescent properties efficiently, and most electric energy is converted into light.But the PN junction long-term work that temperature has very large influence, particularly led chip to the output intensity and the colour temperature performance of high-power LED light source is in the condition of high temperature, and its optical property can very fast decay, and this is to need the key issue that solves in the LED encapsulation.In addition, led chip is to be made by semi-conducting material GaN and sapphire etc. at present, the refractive index of these materials is very high, and the light of generation is not easy to shine in the low-refraction air, therefore needs to select suitable refraction materials to improve the outgoing efficient of light source as matching layer.
The encapsulation technology of high-power LED encapsulation adopts highly heat-conductive material as substrate mostly at present, utilizes heat conduction or convection type that heat is taken away from substrate then.And adopt refractive index in the light-emitting area of led chip is that about 1.5 epoxy resin or silica gel are exported matching layer as optics, and the thermal conductivity factor of this material very low thermal resistance is very big, and heat can not scatter and disappear substantially.The main method of improving the led light source heat dispersion at present is to improve the heat conduction and the heat dispersion of substrate, adopts methods such as high thermal conductivity coefficient material, forced convertion, as patent 200520047169.9, proposes to utilize micro-injection flowing water device to come the cooling LED light source.Patent 200610060840.2 has proposed a kind of chip to be immersed LED method for packing in the cooling fluid, this method need rely on liquid flow heat could be taken away, the non-constant of tough liquid fluidity has influenced cooling effect like this in little hermetically-sealed construction.In order to address this problem, this patent proposes to solve with forced convertion, but has increased the complexity of system like this, and this method also is not suitable for undersized LED encapsulation simultaneously.
From the analysis of led light source heat generation characteristic as can be known, the bottleneck of led chip heat radiation is between chip and substrate, because the led chip volume is very little, the contact area between chip and the substrate is very limited, particularly upside-down mounting (flip-chip) structure, have a plurality of dielectric layers between the active area of heating and the substrate, thermal resistance increases sharply, and labor is referring to document " upside-down mounting large power white light LED thermal field analysis and test " (photoelectron laser, vol.16, num.5, pp.511-514,2005).The heat of led chip can not will leave as soon as possible like this, cause the PN junction temperature higher, and other optical materials such as epoxy resin, silica gel and fluorescer etc. are in work under the high temperature for a long time, the performance degradation of whole light source device aging very fast, poor reliability, this encapsulating structure is difficult to be suitable for the high-power LED light source of high power density.How under prerequisite cheaply, adopt the better type of cooling, led light source is operated on the lower temperature works, obtain higher luminous efficiency, in the longer life-span, higher reliability is the key issue that this present invention will solve.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of high-power LED light source of liquid immersion type encapsulation is provided.
The high-power LED light source of liquid immersion type encapsulation comprises led chip, base plate for packaging, cooling fluid, optical window assembly, housing, radiator; Radiator is provided with housing, base plate for packaging, and base plate for packaging is provided with LED core 1, and case top is provided with the optical window assembly, is filled with cooling fluid in the housing.
Described optical window assembly comprises lens and is mixed with the blooming piece of fluorescent material that the blooming piece that is mixed with fluorescent material is provided with lens.Cooling fluid is acetone, ethanol, freon or water.Inner walls is provided with optical mirror.Radiator is finned radiator or heat-pipe type radiator.The inwall of housing and radiator is provided with the capillary groove that liquid refluxes.
The present invention is made of led chip, base plate for packaging, cooling fluid, optical window assembly, housing, radiator.Led chip is installed on the base plate for packaging, base plate for packaging is installed on the radiator, led chip and base plate for packaging are immersed in the cooling fluid, and cooling fluid is closed in the negative pressure confined space that optical window assembly, black box and radiator constitute and forms condensation, vaporization cycle.The light that led chip produces sends from the optical window assembly, and heat is cooled, and liquid is sent to black box and radiator sheds, and can effectively solve the problem of the heat radiation and the light intensity output of high-power LED light source.
Description of drawings
Fig. 1 is the structural representation of the high-power LED light source of liquid immersion type encapsulation;
Fig. 2 is the structural representation of optical window assembly of the present invention;
Fig. 3 is the structural representation of radiator of the present invention;
Among the figure: led chip 1, base plate for packaging 2, cooling fluid 3, optical window assembly 4, black box 5, radiator 6, lens 7, the blooming piece 8 that is mixed with fluorescent material, capillary groove 9.
The specific embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
As shown in Figure 1, the high-power LED light source of liquid immersion type encapsulation comprises led chip 1, base plate for packaging 2, cooling fluid 3, optical window assembly 4, housing 5, radiator 6; Radiator 6 is provided with housing 5, base plate for packaging 2, and base plate for packaging 2 is provided with led chip 1, and housing 5 tops are provided with optical window assembly 4, are filled with cooling fluid 3 in the housing 5.
Led chip is fixed on the base plate for packaging by methods such as welding bindings, and base plate for packaging is made by the material of high thermal conductivity coefficient, is laid with chip on it to connect required circuit, and base plate for packaging is fixedly installed on the radiator.The confined space of a negative pressure that constitutes by optical window assembly, housing and radiator, charge into an amount of cooling fluid then therein, led chip and base plate for packaging are immersed in the cooling fluid fully, and cooling fluid forms evaporation, condensation cycle in the negative pressure confined space that optical window assembly, housing and radiator constitute.Housing is a container of being made by metal or other materials, and its inwall can be made into optical mirror, to strengthen the output of light in the optical window assembly.In order to strengthen radiating effect, radiator can increase fin and enlarge radiators such as area of dissipation or employing heat pipe-type.
The cooling fluid evaporation needs to absorb a large amount of heats, and in the process of condensation, need to discharge the heat of as much, utilize cooling fluid evaporation and condensation cycle can realize the most effective heat transfer type, heat pipe is exactly the heat transfer device that utilizes this mode to realize, its thermal conductivity is thousands of times of copper.Basic thought of the present invention is to utilize the evaporation of cooling fluid and condensation cycle that the heat of led chip is taken away fast.Utilize the optical window assembly, housing and radiator constitute a confined space, then the air of this confined space is extracted out and formed negative pressure, an amount of cooling fluid is joined in the confined space, because cooling fluid its evaporating temperature in the confined space of negative pressure reduces greatly, therefore when the led chip adstante febre, cooling fluid is evaporated formation gas rapidly, inner surface condensation of gas at housing and radiator is a liquid, the capillary groove of liquid by housing and radiator setting is formed by evaporation to circulation near being back to led chip again, this circulation without any need for external impetus, only need led chip and housing, there is temperature difference between the radiator.This encapsulating structure is simple, the reliability height, and also heat transfer efficiency is higher than heat conduction and thermal convection current far away.
Cooling fluid is acetone, ethanol, freon or water, the selection of cooling fluid is extremely important, cooling fluid be a kind of transparent have electrical insulating property, heat endurance, optical stability, refractive index be in 1.3～1.8 between, boiling point is lower than 180 °, circuit and chip do not had corrosive liquid.This liquid can not cause short circuit owing to have electrical insulating property.The transparency of cooling fluid has guaranteed that light that led chip 1 the produces liquid that can not be cooled absorbs.Cooling fluid has optical stability, is in high strength blue light or UV-irradiation for a long time, composition and performance change can not take place.Further, select the cooling fluid of high index of refraction to help improving the outgoing efficient of light from led chip, but consider that light shines airborne efficient, the refractive index of cooling fluid can not be too high, should with the material refractive index basically identical (this optical material is generally selected glass or epoxy resin, and refractive index is about 1.5) of optical window assembly.Consider that cooling fluid has certain excursion with the composition different refractivity, therefore refractive index is chosen between 1.3～1.8.In addition, cooling fluid can not have corrosiveness to circuit and chip material.In addition, cooling fluid will have heat endurance, and long-term work is not at high temperature decomposed and never degenerated.In order to make cooling fluid be easy to evaporation, reach better heat-transfer effect, the boiling point of cooling fluid can not be too high, by regulating the addition of cooling fluid, can control the boiling point of cooling fluid in negative pressure space simultaneously.
Because the led chip that is installed on the base plate for packaging is immersed in the cooling fluid, most of heat that produces liquid that is cooled is directly taken away by evaporation and condensation cycle, cooling fluid is sent to housing with heat and radiator sheds then, also has the sub-fraction heat to be transmitted to radiator by base plate for packaging heat and sheds.Contrast traditional method for packing, the method disclosed in the present is the cooling LED chip better, its reason is: (1) evaporation and condensation cycle are a kind of very effective heat transfer types, only need the minimum temperature difference just can form circulation automatically, effective like this led chip local temperature of avoiding is too high; (2) led chip immerses in the cooling fluid, and heat transfer area is greater than the contact area between led chip and the base plate for packaging; (3) cooling fluid has very large thermal capacity, and the temperature rise that same heat causes is more much smaller than airborne.
As shown in Figure 2, optical window assembly 4 comprises lens 7 and is mixed with the blooming piece 8 of fluorescent material that the blooming piece 8 that is mixed with fluorescent material is provided with lens 7.The effect of optical window assembly is an output intensity, and according to actual needs the characteristic of output light is adjusted.The optical window assembly is installed on the direction of led chip light-emitting area.Lens can change the dispersion angle of output beam, and the blooming piece that is mixed with fluorescent material can change the output light frequency and distribute, and realizes light sources of different colors, as white light LEDs etc.The effect that is mixed with the blooming piece of fluorescent material also can realize by directly mix fluorescent material in cooling fluid.
As shown in Figure 3, the inwall of radiator 6 is provided with the capillary groove 9 that liquid refluxes.This capillary groove entad is around led chip to be arranged.In order to make the cooling fluid of condensation be back near the led chip, porous capillary network or capillary groove need be set at the inwall of housing and radiator.This structure has very tiny hole or groove, and cooling fluid is because capillarity can be full of these holes and groove, and the influence that utilizes this capillary structure can make cooling fluid overcome gravity is back near the led chip.Consider that the porous capillary network can produce scattering to light, the inwall that the present invention is chosen in housing and radiator is provided with capillary groove.
Claims (6)
1. the high-power LED light source of a liquid immersion type encapsulation is characterized in that comprising led chip (1), base plate for packaging (2), cooling fluid (3), optical window assembly (4), housing (5), radiator (6); Radiator (6) is provided with housing (5), base plate for packaging (2), and base plate for packaging (2) is provided with led chip (1), and housing (5) top is provided with optical window assembly (4), is filled with cooling fluid (3) in the housing (5).
2. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1, it is characterized in that described optical window assembly (4) comprises lens (7) and is mixed with the blooming piece (8) of fluorescent material, the blooming piece (8) that is mixed with fluorescent material is provided with lens (7).
3. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described cooling fluid (3) is acetone, ethanol, freon or water
4. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described housing (5) inwall is provided with optical mirror.
5. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that described radiator (6) is finned radiator or heat-pipe type radiator.
6. the high-power LED light source of a kind of liquid immersion type encapsulation according to claim 1 is characterized in that the inwall of described housing (5) and radiator (6) is provided with the capillary groove (9) that liquid refluxes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100617133A CN101307867A (en) | 2008-05-14 | 2008-05-14 | Liquid immersion type packaged large power LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100617133A CN101307867A (en) | 2008-05-14 | 2008-05-14 | Liquid immersion type packaged large power LED light source |
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| Publication Number | Publication Date |
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| CN101307867A true CN101307867A (en) | 2008-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100617133A Pending CN101307867A (en) | 2008-05-14 | 2008-05-14 | Liquid immersion type packaged large power LED light source |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818866A (en) * | 2010-03-29 | 2010-09-01 | 蔡鸿 | Led lamp |
| CN102116424A (en) * | 2009-12-31 | 2011-07-06 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode illuminating device |
| WO2013044601A1 (en) * | 2011-09-30 | 2013-04-04 | Yang Dongzuo | Led dot matrix display and combined dot matrix display |
| CN103234131A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Optical coupling agent assistant cooling method for high-luminous-efficiency light-emitting diode (LED) lamp and lamp device |
| CN103775881A (en) * | 2014-01-28 | 2014-05-07 | 陈旭 | Quickly-installed glass heat pipe LED lamp |
| CN103775880A (en) * | 2014-01-28 | 2014-05-07 | 陈霞 | Glass heat pipe LED lamp with organic LED luminous bodies on surfaces of heat pipes |
| CN103775882A (en) * | 2014-01-28 | 2014-05-07 | 邱春燕 | LED (Light Emitting Diode) lamp with LED directly connected with glass heat tube in heat transfer manner |
| CN103775999A (en) * | 2014-01-28 | 2014-05-07 | 邱玉燕 | LED lamp with LED strip waterproof layer immersed below glass heat pipe working medium liquid level |
| CN104806972A (en) * | 2014-01-28 | 2015-07-29 | 应德明 | LED lamp with LEDs directly connected with heat transfer heat tube |
| CN104896323A (en) * | 2014-01-28 | 2015-09-09 | 施国樑 | A glass heat tube LED lamp |
| CN105932146A (en) * | 2016-06-15 | 2016-09-07 | 青岛杰生电气有限公司 | Ultraviolet light-emitting device |
| WO2018098910A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Liquid-submersion chip radiator |
| CN111714784A (en) * | 2020-08-10 | 2020-09-29 | 佛山紫熙慧众科技有限公司 | Multiband LED phototherapy system |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN112057744A (en) * | 2019-06-11 | 2020-12-11 | 承奕科技股份有限公司 | Scald preventing casing that skin equipment was used is gone into in illumination and utensil this scald preventing casing's equipment |
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2008
- 2008-05-14 CN CNA2008100617133A patent/CN101307867A/en active Pending
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| CN102116424A (en) * | 2009-12-31 | 2011-07-06 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode illuminating device |
| CN101818866B (en) * | 2010-03-29 | 2012-11-14 | 蔡鸿 | Led lamp |
| CN101818866A (en) * | 2010-03-29 | 2010-09-01 | 蔡鸿 | Led lamp |
| WO2013044601A1 (en) * | 2011-09-30 | 2013-04-04 | Yang Dongzuo | Led dot matrix display and combined dot matrix display |
| CN103234131B (en) * | 2013-05-09 | 2016-04-06 | 杭州电子科技大学 | The optocoupler mixture supplement heat rejecter LED lamp device of high light-emitting efficiency |
| CN103234131A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Optical coupling agent assistant cooling method for high-luminous-efficiency light-emitting diode (LED) lamp and lamp device |
| CN103775881B (en) * | 2014-01-28 | 2016-08-24 | 陈旭 | Fast-assembling glass heat pipe LED lamp |
| CN103775882A (en) * | 2014-01-28 | 2014-05-07 | 邱春燕 | LED (Light Emitting Diode) lamp with LED directly connected with glass heat tube in heat transfer manner |
| CN103775999A (en) * | 2014-01-28 | 2014-05-07 | 邱玉燕 | LED lamp with LED strip waterproof layer immersed below glass heat pipe working medium liquid level |
| CN104806972A (en) * | 2014-01-28 | 2015-07-29 | 应德明 | LED lamp with LEDs directly connected with heat transfer heat tube |
| CN104896323A (en) * | 2014-01-28 | 2015-09-09 | 施国樑 | A glass heat tube LED lamp |
| CN103775880A (en) * | 2014-01-28 | 2014-05-07 | 陈霞 | Glass heat pipe LED lamp with organic LED luminous bodies on surfaces of heat pipes |
| CN103775881A (en) * | 2014-01-28 | 2014-05-07 | 陈旭 | Quickly-installed glass heat pipe LED lamp |
| CN105932146A (en) * | 2016-06-15 | 2016-09-07 | 青岛杰生电气有限公司 | Ultraviolet light-emitting device |
| WO2018098910A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Liquid-submersion chip radiator |
| CN112057744A (en) * | 2019-06-11 | 2020-12-11 | 承奕科技股份有限公司 | Scald preventing casing that skin equipment was used is gone into in illumination and utensil this scald preventing casing's equipment |
| WO2020248988A1 (en) * | 2019-06-11 | 2020-12-17 | 承奕科技股份有限公司 | Anti-scalding machine casing for device for shining light into skin and device having anti-scalding machine casing |
| CN112057744B (en) * | 2019-06-11 | 2022-04-26 | 承奕科技股份有限公司 | Scald preventing casing that skin equipment was used is gone into in illumination and utensil this scald preventing casing's equipment |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111714784A (en) * | 2020-08-10 | 2020-09-29 | 佛山紫熙慧众科技有限公司 | Multiband LED phototherapy system |
| CN113053864A (en) * | 2021-03-11 | 2021-06-29 | 广东良友科技有限公司 | Semiconductor double-layer array flip packaging structure and packaging method thereof |
| CN113053864B (en) * | 2021-03-11 | 2022-07-12 | 广东良友科技有限公司 | Semiconductor double-layer array flip packaging structure and packaging method thereof |
| WO2023071060A1 (en) * | 2021-10-26 | 2023-05-04 | 深圳市绎立锐光科技开发有限公司 | Laser light source apparatus and light source system |
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