CN202082649U - Liquid metal radiating based high-power LED (Light-emitting Diode) light source with thread connection structure - Google Patents
Liquid metal radiating based high-power LED (Light-emitting Diode) light source with thread connection structure Download PDFInfo
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- CN202082649U CN202082649U CN2011200205554U CN201120020555U CN202082649U CN 202082649 U CN202082649 U CN 202082649U CN 2011200205554 U CN2011200205554 U CN 2011200205554U CN 201120020555 U CN201120020555 U CN 201120020555U CN 202082649 U CN202082649 U CN 202082649U
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- liquid metal
- micropore
- led chip
- room temperature
- temperature liquid
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 64
- 238000004806 packaging method and process Methods 0.000 claims abstract description 51
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052737 gold Inorganic materials 0.000 claims abstract description 6
- 239000010931 gold Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 19
- 241000218202 Coptis Species 0.000 claims description 11
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 3
- 238000002310 reflectometry Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model discloses a room temperature liquid metal microporous radiating based high-power LED (Light-emitting Diode) light source with a thread connection structure, which comprises LED chips, a microporous packaging substrate, a fluorescent rubber layer, room temperature liquid metal, a sealing layer, a radiator, gold wires, LED chip electrodes and micropores, wherein the radiator is sequentially provided with the sealing layer and the microporous packaging substrate, the micropores of the microporous packaging substrate are provided with the LED chips, the micropores of the microporous packaging substrate are filled with the room temperature liquid metal, the LED chips are provided with the LED chip electrodes, the LED chip electrodes are connected with the gold wires, and the fluorescent rubber layer is covered on the LED chips. In the utility model, the bottom parts of the LED chips are directly contacted with the liquid metal with very good conduction capability, the liquid metal is tightly contacted with the microporous packaging substrate, in addition, as the liquid metal is directly contacted with the radiator, and the heat caused when the LED chips work can be effectively radiated. By the utility model, the radiating effect of a high-power LED is better, the solid crystallizing process for packaging the LED can be reduced, the reflectivity of the bottom parts of the LED chips can be increased, and the light efficiency can be greatly improved.
Description
Technical field
The utility model relates to lighting source, relates in particular to a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore.
Background technology
Led light source is the new generation of green lighting source, and its power consumption has only 1/10th of ordinary incandescent lamp, and the life-span is long more than ten times.In addition, led light source also has advantages such as volume is little, sturdy and durable, rich color.In order to satisfy the requirement of higher light intensity, led light source by improving single chip power output or adopt the mode of led array to realize.In ideal conditions, the optical material of coupling and suitable encapsulating structure can be given full play to LED luminescent properties efficiently, and most electric energy is converted into light.But because the led chip area is very little, therefore a large amount of heats can't in time leave, and temperature is too high when therefore causing LED work.The too high PN junction long-term work that the output intensity and the colour temperature performance of high-power LED light source are had very large influence, particularly led chip of temperature is in the condition of high temperature, and its optical property can very fast decay, has a strong impact on the service life of LED.This is to need the key issue that solves in the LED encapsulation.
From the analysis of led light source heat generation characteristic as can be known, thermal contact resistance between LED base plate for packaging and the radiator has a strong impact on the heat dispersion of LED, special when the surface irregularity between base plate for packaging and the radiator, solution to this problem is to utilize heat conductive silica gel or other Heat Conduction Materials to be filled between two surfaces.But these material thermal conductivities are very little and easy wearing out, and influence the heat radiation and the long-time stability of device.How under prerequisite cheaply, adopt the better type of cooling, led light source is operated on the lower temperature works, obtain higher luminous efficiency, in the longer life-span, higher reliability is a key issue to be solved in the utility model.
Liquid metal is that a kind of (below 100) at normal temperatures is rendered as liquid metal, this material has thermal conductivity factor big (reaching as high as more than the 80W/K/m), has flowability under the normal temperature, porous can be used for reducing two kinds of thermal contact resistances between different materials in very trickle space.2009201925254 disclose a kind of method of utilizing liquid metal cooling LED chip, and this method is primarily aimed at the led chip heat radiation, reduce thermal resistance by add liquid metal between two hot interfaces.But also having the heat conduction problem at a hot interface not solve fully in that invention, is exactly between chip and the base plate for packaging.This interface is to utilize the solid crystalline substance of elargol to connect at present, and the thermal conductivity factor of elargol and little (being about 20W/K/m), more complicated is that elargol needs long-time hot setting, complexity and can produce fire damage to chip on the technology.In order to solve this difficult problem, the utility model makes full use of the characteristic of LED base plate for packaging, and base plate for packaging is had the base plate for packaging of micropore instead, and led chip is installed on the micropore of micropore base plate for packaging, be full of room temperature liquid metal in the micropore, the micropore base plate for packaging is installed on the radiator.The heat that sends of led chip directly conducts to base plate for packaging and radiator by liquid metal like this.Because the thermal conductivity factor of room temperature liquid metal is far above elargol, and liquid metal has permeability and mobile characteristics, strengthened the heat-conducting effect of liquid metal more, and liquid metal merges two hot interfaces fully like this.In this led chip encapsulation process, do not need long-time elevated temperature heat to solidify fully, not only reduce the fire damage of led chip but also reduced production cost, utilize the high-termal conductivity of liquid metal to improve heat dispersion between led chip, base plate for packaging and the radiator, this method can fundamentally solve the excessive problem of thermal contact resistance between led chip, base plate for packaging and the radiator.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and the high-power LED light source of a kind of room temperature liquid metal micropore heat conduction is provided.
High-power LED light source based on the heat conduction of room temperature liquid metal micropore comprises led chip, micropore base plate for packaging, fluorescence glue-line, room temperature liquid metal, sealant, radiator, gold thread, led chip electrode and micropore; Be provided with sealant, micropore base plate for packaging on the radiator in turn, be provided with led chip on the micropore of micropore base plate for packaging, be full of room temperature liquid metal in the micropore of micropore base plate for packaging, led chip is provided with the led chip electrode, be connected with gold thread on the led chip electrode, be coated with the fluorescence glue-line on the led chip.
Described led chip is a plurality of, links to each other by gold thread between the led chip electrode on adjacent two led chips.The micro-pore diameter of described micropore base plate for packaging is less than the square length of side of led chip.The material of described fluorescence glue-line is that silica gel mixes the colloidal materials that forms with fluorescent material.Described room temperature liquid metal is just to be rendered as liquid metal or alloy below 100.Described metal or alloy is one or more of gallium, indium, zinc, tin, magnesium, copper or gold.The material of described sealant is silica gel or epoxy resin.It is described that radiator is arranged is fin shape radiator or heat-pipe radiator.
The beneficial effect that the utility model compared with prior art has: in this LED encapsulation, the led chip bottom directly contacts with the extraordinary liquid metal of the capacity of heat transmission, and liquid metal closely contacts with the micropore substrate, and directly closely contact with radiator by liquid metal, the heat that led chip produces when work is effectively distributed.This method makes that the radiating effect of great power LED is better, and has reduced the solid brilliant process of LED encapsulation, has increased the reflectivity of led chip bottom, and light efficiency is greatly improved.
The room temperature liquid metal is a kind of liquid metal that just is rendered as below 100, for example gallium and alloy etc. thereof, these metals have very large thermal conductivity factor, tens times that are common silica gel thermal conductivity factor to hundreds of times, this material is filled between base plate for packaging and the radiator, the heat that led chip produces falls greatly to the thermal resistance of radiator conduction through base plate for packaging and reduces, and in addition liquid metal also can produce convection heat transfer' heat-transfer by convection in micro cellular voids, has further strengthened radiating effect.The effect that this method played is equivalent to led chip, base plate for packaging and radiator are merged fully.This fusion is different from welding between led chip, base plate for packaging and the radiator or elargol binding, can effectively avoid between the two because of the stress and the problem on deformation of welding and binding brings.This structure is together with each other, middle space is full of the room temperature liquid metal, can realize better heat-transfer effect, and a large amount of heats that led chip is produced transmit out, the junction temperature that ensures led chip remains on reduced levels, thereby has improved the operational reliability and the service life of great power LED.
Description of drawings
Fig. 1 is based on the overall structure schematic diagram of the high-power LED light source of room temperature liquid metal micropore heat conduction;
Fig. 2 is based on the micropore board structure schematic diagram of the high-power LED light source of room temperature liquid metal micropore heat conduction;
Among the figure: led chip 1, micropore base plate for packaging 2, fluorescence glue-line 3, room temperature liquid metal 4, sealant 5, radiator 6, gold thread 7, led chip electrode 8, micropore 9.
The specific embodiment
Describe the specific embodiment of the present utility model in detail below in conjunction with accompanying drawing.
As shown in Figure 1, 2, the high-power LED light source based on the heat conduction of room temperature liquid metal micropore comprises led chip 1, micropore base plate for packaging 2, fluorescence glue-line 3, room temperature liquid metal 4, sealant 5, radiator 6, gold thread 7, led chip electrode 8 and micropore 9; Be provided with sealant 5, micropore base plate for packaging 2 on the radiator 6 in turn, on the micropore 9 of micropore base plate for packaging 2, be provided with led chip 1, be full of room temperature liquid metal 4 in the micropore 9 of micropore base plate for packaging 2, led chip 1 is provided with led chip electrode 8, be connected with gold thread 7 on the led chip electrode 8, be coated with fluorescence glue-line 3 on the led chip 1.
Described led chip 1 is a plurality of, links to each other by gold thread 7 between the led chip electrode 8 on adjacent two led chips 1.Micropore 9 diameters of described micropore base plate for packaging 2 are less than the square length of side of led chip 1.The material of described fluorescence glue-line 3 is that silica gel mixes the colloidal materials that forms with fluorescent material.Described room temperature liquid metal 4 is just to be rendered as liquid metal or alloy below 100.Described metal or alloy is one or more of gallium, indium, zinc, tin, magnesium, copper or gold.The material of described sealant 5 is silica gel or epoxy resin.It is described that radiator 6 is arranged is fin shape radiator or heat-pipe radiator.
The light that led chip 1 produces sends by fluorescence glue-line 3, and most heats that led chip 1 produces conduct to radiator 6 through micropore base plate for packaging 2.Micropore base plate for packaging 2 and the radiator 6 general metal materials that adopt, thermal conductivity factor is higher.Led chip 1 is installed on the micropore 9 of micropore base plate for packaging 2, and the electrode 8 on the led chip 1 is interconnected to form current channel by gold thread 7, is full of room temperature liquid metal 4 in the micropore 9, and micropore base plate for packaging 2 is installed on the radiator 6.The heat that sends of led chip 1 is directly given base plate for packaging 2 and radiator 6 by liquid metal 4 conduction like this.In order to reduce thermal contact resistance, filling liquid metal 4 between micropore base plate for packaging 2 and radiator 6.This liquid metal is a kind of liquid metal or alloy that just is rendered as below 100, comprises at least a of following element: gallium, indium, zinc, tin, magnesium, copper or gold.For example gallium is a kind ofly can become the metal of liquid at 30 degree Celsius, and this liquid metal has very big thermal conductivity factor and well flowability and wellability, can penetrate into fully in the micropore 9 and hole between micropore base plate for packaging 2 and the radiator 6.This liquid metal has very large thermal conductivity factor, tens times that are common silica gel thermal conductivity factor to hundreds of times, this material is filled between micropore base plate for packaging 2 and the radiator 6, the heat that led chip 1 produces falls greatly to the thermal resistance of radiator 6 conduction through micropore base plate for packaging 2 and reduces, in addition liquid metal also can produce convection heat transfer' heat-transfer by convection in micropore 9, has further strengthened radiating effect.The effect that this method played is equivalent to led chip 1, micropore base plate for packaging 2 and radiator 6 are merged fully.This fusion is different from welding between base plate for packaging 2 and the radiator 6 or elargol binding, can effectively avoid between the two because of the stress and the problem on deformation of welding and binding brings.
Micropore base plate for packaging 2 structures based on the high-power LED light source of room temperature liquid metal micropore heat conduction, different with general LED base plate for packaging is many micropores that distributing on metal substrate, each micropore correspondence the installation site of a led chip 1, the diameter of micropore 9 is generally less than the size of led chip 1, led chip 1 covers on the micropore 9 and can not fall in micropore 9 like this, led chip 1 and micropore 9 form the cylindrical micropore of a sealing, wherein fill room temperature liquid metal 4.Like this, the heat that led chip 1 produces is transmitted on micropore base plate for packaging 2 and the radiator 6 by liquid metal 4, can realize better heat-transfer effect, a large amount of heats that led chip is produced transmit out, the junction temperature that ensures led chip remains on reduced levels, thereby has improved the operational reliability and the service life of great power LED.
Claims (8)
1. the high-power LED light source based on the heat conduction of room temperature liquid metal micropore is characterized in that comprising led chip (1), micropore base plate for packaging (2), fluorescence glue-line (3), room temperature liquid metal (4), sealant (5), radiator (6), gold thread (7), led chip electrode (8) and micropore (9); Be provided with sealant (5), micropore base plate for packaging (2) on the radiator (6) in turn, on the micropore (9) of micropore base plate for packaging (2), be provided with led chip (1), be full of room temperature liquid metal (4) in the micropore (9) of micropore base plate for packaging (2), led chip (1) is provided with led chip electrode (8), be connected with gold thread (7) on the led chip electrode (8), be coated with fluorescence glue-line (3) on the led chip (1).
2. a kind of high-power LED light source according to claim 1 based on the heat conduction of room temperature liquid metal micropore, it is characterized in that described led chip (1) for a plurality of, links to each other by gold thread (7) between the led chip electrode (8) on adjacent two led chips (1).
3. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 1 is characterized in that the square length of side of micropore (9) diameter of described micropore base plate for packaging (2) less than led chip (1).
4. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 1, the material that it is characterized in that described fluorescence glue-line (3) are that silica gel mixes the colloidal materials that forms with fluorescent material.
5. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 1 is characterized in that described room temperature liquid metal (4) is just to be rendered as liquid metal or alloy below 100.
6. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 5 is characterized in that described metal or alloy is one or more of gallium, indium, zinc, tin, magnesium, copper or gold.
7. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 1, the material that it is characterized in that described sealant (5) is silica gel or epoxy resin.
8. a kind of high-power LED light source based on the heat conduction of room temperature liquid metal micropore according to claim 1 is characterized in that described radiator (6) is arranged is fin shape radiator or heat-pipe radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200205554U CN202082649U (en) | 2011-01-23 | 2011-01-23 | Liquid metal radiating based high-power LED (Light-emitting Diode) light source with thread connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200205554U CN202082649U (en) | 2011-01-23 | 2011-01-23 | Liquid metal radiating based high-power LED (Light-emitting Diode) light source with thread connection structure |
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| CN202082649U true CN202082649U (en) | 2011-12-21 |
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| CN2011200205554U Expired - Lifetime CN202082649U (en) | 2011-01-23 | 2011-01-23 | Liquid metal radiating based high-power LED (Light-emitting Diode) light source with thread connection structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102135248A (en) * | 2011-01-23 | 2011-07-27 | 符建 | Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure |
| CN102980163A (en) * | 2012-12-20 | 2013-03-20 | 杭州纳晶科技有限公司 | Heat conduction connector for lamp and lamp including same |
| CN103367346A (en) * | 2013-07-12 | 2013-10-23 | 惠州伟志电子有限公司 | Novel high-power LED light source and implementation method thereof |
| CN108167776A (en) * | 2017-11-27 | 2018-06-15 | 安徽西马新能源技术有限公司 | A kind of cooling type LED component |
-
2011
- 2011-01-23 CN CN2011200205554U patent/CN202082649U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102135248A (en) * | 2011-01-23 | 2011-07-27 | 符建 | Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure |
| CN102980163A (en) * | 2012-12-20 | 2013-03-20 | 杭州纳晶科技有限公司 | Heat conduction connector for lamp and lamp including same |
| CN102980163B (en) * | 2012-12-20 | 2015-07-22 | 纳晶科技股份有限公司 | Heat conduction connector for lamp and lamp including same |
| CN103367346A (en) * | 2013-07-12 | 2013-10-23 | 惠州伟志电子有限公司 | Novel high-power LED light source and implementation method thereof |
| CN108167776A (en) * | 2017-11-27 | 2018-06-15 | 安徽西马新能源技术有限公司 | A kind of cooling type LED component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FU JIAN Effective date: 20120227 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120227 Address after: 310030, room 1508, A District, No. 328 Wen two road, Xihu District, Zhejiang, Hangzhou, China Patentee after: Hangzhou Guangzhui Technology Co., Ltd. Address before: Hangzhou City, Zhejiang province 310030 Xihu District Zijin Wenyuan 24 building 701 Patentee before: Fu Jian |
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| CP01 | Change in the name or title of a patent holder |
Address after: 310030, room 1508, A District, No. 328 Wen two road, Xihu District, Zhejiang, Hangzhou, China Patentee after: Zhejiang guangcone Technology Co., Ltd Address before: 310030, room 1508, A District, No. 328 Wen two road, Xihu District, Zhejiang, Hangzhou, China Patentee before: Hangzhou Guangzhui Technology Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111221 |
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| CX01 | Expiry of patent term |