CN201173640Y - Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship - Google Patents
Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship Download PDFInfo
- Publication number
- CN201173640Y CN201173640Y CNU2008200445908U CN200820044590U CN201173640Y CN 201173640 Y CN201173640 Y CN 201173640Y CN U2008200445908 U CNU2008200445908 U CN U2008200445908U CN 200820044590 U CN200820044590 U CN 200820044590U CN 201173640 Y CN201173640 Y CN 201173640Y
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- CN
- China
- Prior art keywords
- semiconductor
- air channel
- semiconductor cooler
- heat
- water tank
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- Air-Conditioning For Vehicles (AREA)
Abstract
The utility model relates to a semiconductor cooling element and a vehicle and watercraft semiconductor air-conditioning thereof. The existing semiconductor cooking element has small size and poor cooling capacity. The semiconductor cooling element comprises two insulating boards, a plurality of N-shaped semiconductor components and a plurality of P-shaped semiconductor components are arranged between the two insulated boards, the N-shaped semiconductor components and the P-shaped semiconductor components are mutually connected in series alternately and are led out through two connection feet, and the insulated boards comprises metal baseplates and oxidation insulting layer on the surface of the metal baseplate. The semiconductor cooling element of the utility model has the advantages of large size, strong cooling and heating capacity and long service life, and the vehicle and watercraft semiconductor air-conditioning composed of the semiconductor cooling element can be widely applied to various vehicles, watercrafts, and the like.
Description
Technical field
The utility model relates to the car and boat semiconductor air conditioner of a kind of semiconductor cooler and application thereof.
Background technology
As shown in Figure 1, semiconductor cooler comprises two insulation boards, be provided with a plurality of N-type semiconductor elements, a plurality of P-type semiconductor element between two insulation boards, above-mentioned N-type semiconductor element and P-type semiconductor element are cascaded spaced reciprocally, and are drawn by two pins 2.Existing semiconductor cooler all adopts the ceramic insulation plate.Because the heat conductivility of pottery is poor, generally makes eggshell china sheet 1, oversizely be easy to fragmentation.(mostly be below 60mm * 60mm, maximum is no more than 100mm * 100mm), poor refrigerating capability, a big bottleneck of become the development of restriction cooling technique of semiconductor, using so existing semiconductor cooler size is little.
The utility model content
The technical problems to be solved in the utility model is how to overcome that existing semiconductor cooler size is little, the defective of poor refrigerating capability, and a kind of size is big, ability to work the is strong semiconductor cooler and the car and boat semiconductor air conditioner of application thereof are provided.
For solving the problems of the technologies described above, this semiconductor cooler, comprise two insulation boards, be provided with a plurality of N-type semiconductor elements, a plurality of P-type semiconductor element between two insulation boards, above-mentioned N-type semiconductor unit's element and P-type semiconductor element are cascaded spaced reciprocally, and draw by two pins, described insulation board comprises the oxidation insulating layer on metal substrate and surface thereof.Said metal substrates can adopt aluminium or magnesium or its alloy material.Form oxidation insulating layer by electrochemical oxidation on its surface.Strength of Metallic Materials is big, difficult broken on the one hand, can make large-sized semiconductor cooler; The metal material heat conductivility is strong on the other hand.So design can overcome that existing semiconductor cooler size is little, the defective of poor refrigerating capability, has greatly enlarged its range of application and refrigerating capacity.
These car and boat semiconductor air conditioner, comprise semiconductor cooler, blower fan, air channel, heat-exchanging water tank, pump, radiator and fan, wherein radiator body is made up of the metal coil pipe that has fin, supply air system is formed in blower fan and air channel, heat-exchanging water tank becomes water circulation system with pump, radiator tandem, fan is arranged on a side of radiator, semiconductor cooler is arranged between air channel and the heat-exchanging water tank, its operative end surface closely contacts with the surface of air channel and heat-exchanging water tank respectively, and described semiconductor cooler is the aforesaid semiconductor cooler.So design is applicable to the vehicles such as car and boat.
As optimization, be provided with radiating fin in the described air channel, this radiating fin vertically distributes along the air channel, and perpendicular to the operative end surface of semiconductor cooler.So design, good effect of heat exchange.
As optimization, the metal substrate of described semiconductor cooler constitutes the sidewall of air channel or heat-exchanging water tank, perhaps constitutes the sidewall of the two respectively.That is to say: the lateral wall of air channel or heat-exchanging water tank forms oxidation insulating layer through oxidation, directly serves as the insulation board of semiconductor cooler operative end surface.So design, the heat exchange better effects if.
The utility model semiconductor cooler has that size is big, refrigeration, heating capacity is strong, the life-span is long advantage, and have following advantage with the car and boat of its formation with semiconductor air conditioner: 1, adopt the electronic component refrigeration, refrigerating capacity is easy to adjust by Current Control; 2, do not need cold-producing mediums such as the fluorine lithium is high, environmental protection, safety, no leakage hazard; 3, do not need compressor, noise is little; 4, reduce the power loss of engine, also just reduced oil consumption, saved fuel oil; 5, simple in structure, maintenance capacity is little, long service life (can work 100,000 hours); 6, do not consume cold-producing medium, saved expense, upkeep cost is low; 7, it is convenient and swift to freeze, heat conversion.Be widely used in the vehicles such as various car and boat.
Description of drawings
Below in conjunction with accompanying drawing the utility model car and boat are described further with semiconductor air conditioner:
Fig. 1 is existing semiconductor cooler structure and operation principle schematic diagram;
Fig. 2 is the structural representation () of the utility model semiconductor cooler;
Fig. 3 is the structural representation (two) of the utility model semiconductor cooler;
Fig. 4 is these car and boat with the air channel of semiconductor air conditioner, the schematic perspective view of heat-exchanging water tank (containing semiconductor cooler and blower fan);
Fig. 5 is the schematic cross-section () of Fig. 4;
Fig. 6 is the schematic cross-section () of Fig. 4.
Among the figure: 1 is that eggshell china sheet, 2 is that pin, 3 is that Copper Foil, 4 is that metal substrate, 5 is that oxidation insulating layer, 6 is that semiconductor cooler, 7 is that air blast, 8 is that air channel, 9 is that heat-exchanging water tank, 10 is that radiating fin, 11 is that clamping device, 12 is an air outlet.
The specific embodiment
Embodiment one: as shown in Figure 2, the utility model semiconductor cooler comprises two insulation boards, be provided with a plurality of N-type semiconductor elements, a plurality of P-type semiconductor element between two insulation boards, above-mentioned N-type semiconductor element and P-type semiconductor element are cascaded spaced reciprocally, and draw by two pins 2, described insulation board comprises the oxidation insulating layer 5 on metal substrate 4 and surface thereof.
During oxidation, all form oxidation insulating layer 5 on metal substrate 4 two sides, as shown in Figure 3, but its very thin thickness, the adverse effect of its heat exchanging can be ignored.
Embodiment two: as Fig. 4, shown in 5: these car and boat comprise semiconductor cooler 6 and related circuit with semiconductor air conditioner, air blast 7, air channel 8, heat-exchanging water tank 9, pump, radiator and fan, wherein radiator body is made up of the metal coil pipe that has fin, air blast 7 is formed supply air system with air channel 8, heat-exchanging water tank 9 and pump, radiator tandem becomes water circulation system, fan is arranged on a side of radiator, semiconductor cooler 6 is arranged between air channel 8 and the heat-exchanging water tank 9, its operative end surface closely contacts with the surface of air channel 8 and heat-exchanging water tank 9 respectively, and described semiconductor cooler is embodiment one a described semiconductor cooler.Air channel 8 and heat-exchanging water tank 9 and the semiconductor cooler between the two 6 closely contact under the effect of clamping device 11.
As shown in Figure 5: be provided with radiating fin 10 in the described air channel 8, this radiating fin 10 8 vertically distributes along the air channel, and perpendicular to the operative end surface of semiconductor cooler 6.
Embodiment three: as shown in Figure 6: the metal substrate 4 on described semiconductor cooler 6 two sides constitutes the sidewall of the two respectively.Remaining part and structure are as described in the enforcement mode two.
Good effect of heat exchange so not only, and can save two metal substrates 4, save material (can certainly only save a metal substrate).
Claims (4)
1, a kind of semiconductor cooler, comprise two insulation boards, be provided with a plurality of N-type semiconductor elements, a plurality of P-type semiconductor element between two insulation boards, above-mentioned N-type semiconductor element and P-type semiconductor element are cascaded spaced reciprocally, and draw by two pins, it is characterized in that:
Described insulation board comprises the oxidation insulating layer on metal substrate and surface thereof.
2, a kind of application rights requires the car and boat semiconductor air conditioner of 1 described semiconductor cooler, comprise semiconductor cooler, blower fan, the air channel, heat-exchanging water tank, pump, radiator and fan, wherein radiator body is made up of the metal coil pipe that has fin, supply air system is formed in blower fan and air channel, heat-exchanging water tank and pump, radiator tandem becomes water circulation system, fan is arranged on a side of radiator, semiconductor cooler is arranged between air channel and the heat-exchanging water tank, its operative end surface closely contacts with the surface of air channel and heat-exchanging water tank respectively, and it is characterized in that: described semiconductor cooler is the described semiconductor cooler of claim 1.
3, car and boat semiconductor air conditioner according to claim 2 is characterized in that: be provided with radiating fin in the described air channel, this radiating fin vertically distributes along the air channel, and perpendicular to the operative end surface of semiconductor cooler.
4, according to claim 2 or 3 described car and boat semiconductor air conditioners, it is characterized in that: the metal substrate of described semiconductor cooler constitutes the sidewall of air channel or heat-exchanging water tank, perhaps constitutes the sidewall of the two respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200445908U CN201173640Y (en) | 2008-03-07 | 2008-03-07 | Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200445908U CN201173640Y (en) | 2008-03-07 | 2008-03-07 | Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201173640Y true CN201173640Y (en) | 2008-12-31 |
Family
ID=40200764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200445908U Expired - Lifetime CN201173640Y (en) | 2008-03-07 | 2008-03-07 | Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201173640Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103697619A (en) * | 2013-12-27 | 2014-04-02 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor cooler module |
-
2008
- 2008-03-07 CN CNU2008200445908U patent/CN201173640Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103697619A (en) * | 2013-12-27 | 2014-04-02 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor cooler module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081231 |
|
| CX01 | Expiry of patent term |