CN103697619A - High-thermal-conductivity metal circuit semiconductor cooler module - Google Patents
High-thermal-conductivity metal circuit semiconductor cooler module Download PDFInfo
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- CN103697619A CN103697619A CN201310733904.0A CN201310733904A CN103697619A CN 103697619 A CN103697619 A CN 103697619A CN 201310733904 A CN201310733904 A CN 201310733904A CN 103697619 A CN103697619 A CN 103697619A
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- chilling plate
- semiconductor chilling
- circuit semiconductor
- termal conductivity
- conductivity metallic
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Abstract
The invention discloses a high-thermal-conductivity metal circuit semiconductor cooler module and relates to the technical field of air conditioner cooling and heating. The high-thermal-conductivity metal circuit semiconductor cooler module comprises a cold collecting part, a wire drive circuit board and a radiator and is characterized in that a high-thermal-conductivity metal circuit semiconductor cooler is disposed between the cold collecting part and the radiator. By using the high-thermal-conductivity metal circuit semiconductor cooler as the solution of the cooling module, the cooling module is high in cooling efficiency and good in heat conducting effect. The high-thermal-conductivity diamond-like carbon metal substrate semiconductor cooling module is low in heat resistance, applicable to both cooling and heating, high in cooling efficiency, energy saving, environmental friendly, and the like.
Description
Technical field
The present invention relates to air conditioner refrigerating and heat technical field.
Background technology
At air conditioner refrigerating with heat technical field, existing semiconductor refrigerating module technology is to adopt ceramic substrate semiconductor refrigerating chip architecture mostly, also has indivedual employing plastic films or mica structure.
Above-mentioned existing module solution because of substrate thermal resistance larger, the general coefficient of heat conduction is all below 10W/m.k.Because its heat conductivility is not ideal enough, easily affect its durable service behaviour, refrigerating efficiency is on the low side.In addition ceramic substrate semiconductor chilling plate is easily broken, easily causes when mounted yields lower, is particularly screwed in the mount scheme on radiator, easily causes whole semiconductor chilling plate fragmentation and even loses efficacy.
Summary of the invention
The present invention aims to provide that a kind of coefficient of heat conduction is high, refrigerating efficiency is high and the high-termal conductivity metallic circuit semiconductor chilling plate module of environmental protection, overcomes the deficiency of existing technologies.
The present invention includes cold of collection, wire drive circuit board and radiator, it is characterized in that, between cold of collection and radiator, high-termal conductivity metallic circuit semiconductor chilling plate is set.
The present invention adopts high-termal conductivity metallic circuit semiconductor chilling plate as refrigeration module solution, and refrigeration module is realized the object of refrigerating efficiency height and good heat conduction effect.It is low that high heat conduction class is bored carbon metal substrate semiconductor refrigerating module thermal resistance, not only can also can be used for heating for refrigeration, has that refrigerating efficiency is high, thermal resistance is little, a feature such as energy-conservation and environmental protection.
Collect cold temperature of not only effectively conducting on high heat conduction class brill carbon metal substrate semiconductor chilling plate, the effect of huyashi-chuuka (cold chinese-style noodles) and hot side physical isolation is provided in conjunction with other parts simultaneously.The present invention all meets or exceeds domestic and international market like product.
Of the present invention applied widely, as:
1, military aspect: infra-red detection, the navigation system of the aspects such as guided missile, radar, submarine.
2, medical aspect; Cold power, coldly close, cataract extraction sheet, blood analyser etc.
3, laboratory installation aspect: cold-trap, ice chest, cold trap, cryogenic electronic testing arrangement, various constant temperature, high low-temperature testing instrument sheet.
4, special purpose device aspect: oil product low-temperature test instrument, biogenetic products low-temperature test instrument, bacteriological incubator, constant temperature developing trough, computer etc.
5, daily life aspect: air-conditioning, cold, hot two-purpose case, water dispenser, e-mail etc.
In order to improve high-termal conductivity metallic circuit semiconductor chilling plate and the heat-conductive characteristic of collection between cold, also can high-termal conductivity metallic circuit semiconductor chilling plate with collect cold between Heat Conduction Material is set.
In like manner, in order to improve the heat-conductive characteristic between high-termal conductivity metallic circuit semiconductor chilling plate and radiator, also can between high-termal conductivity metallic circuit semiconductor chilling plate and radiator, Heat Conduction Material be set.
In addition, drive circuit board of the present invention at least can adopt following three kinds of forms to combine with module body:
Described drive circuit board is arranged between cold of described collection and radiator, and drive circuit board is arranged on radiator, and the output of drive circuit board is connected with high-termal conductivity metallic circuit semiconductor chilling plate by wire.
Described drive circuit board is arranged on outside described module, and high-termal conductivity metallic circuit semiconductor chilling plate is connected by wire with drive circuit.
Within described drive circuit board is arranged on high-termal conductivity metallic circuit semiconductor chilling plate, high-termal conductivity metallic circuit semiconductor chilling plate is connected by wire with drive circuit.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present invention.
Fig. 2 is another kind of structural representation of the present invention.
The specific embodiment
One, by Chinese Patent Application No., be that 200510108046 disclosed methods are made the metal substrate with class brill carbon plated film:
The thickness of getting metal substrate (aluminium sheet or copper coin or steel plate or iron plate can adopt other alloy substrates, particularly military project and space flight industry titaniferous etc. to meet the substrate of material) is 0.5～5mm approximately.
On substrate, make after insulating barrier, on line layer, make the heat conductive insulating layer that diamond or quasi cobalt carbon diaphragm form, then on insulating barrier, adopt vacuum splashing and plating to add plating mode or adopt print copper (or silver) mode to make line layer.Wherein, it is to generate one deck anodic oxide coating that the insulating barrier of substrate is made, or epoxide-resin glue or PP glue or anodic oxide coating mix with epoxide-resin glue PP glue.The formation method of the heat conductive insulating layer that in addition, diamond or quasi cobalt carbon diaphragm form is: with cathode loop arc physics vapour deposition (Cathodic Arc PVD) method, sputter physical vapour deposition (PVD) (Sputtering PVD) method or plasma enhanced chemical vapor deposition (Plasma Assisted CVD) method, form.
The metal substrate with class brill carbon plated film using for one side only carries out above technique at an one side for metal substrate substrate, forms single-side type and bores carbon metal substrate.
For the metal substrate that class is bored carbon plated film that has of two-sided use, need be at two-sided above technique, the formation pinacoidal class brill carbon metal substrate of carrying out respectively of metal substrate substrate.
Two, the production technology of high-termal conductivity metallic circuit semiconductor chilling plate:
Example one: a kind of typical specific embodiment, is comprised of a single-side type brill carbon metal substrate, semiconductor refrigerating crystal grain, flow deflector, another piece single-side type brill carbon metal substrate successively composite package.
Concrete processing technology: there is class by etching and bore the conductive layer on the metal substrate of carbon plated film, make it expose the circuit of etched figure as the use of pad, flow deflector is welded on pad respectively.
Another piece class is bored carbon metal substrate and is processed too a lot of pads, and then flow deflector is welded on respectively on each pad.
Two classes are bored to carbon metal substrate and stack, and make to be welded with respectively the face positioned opposite of pad.
Semiconductor refrigerating particle is divided into N-type and P type, two one group, N-type and P type form a galvanic couple pair, every group of right one side of galvanic couple is welded on a class and bores on the flow deflector on carbon metal substrate, and the right another side of galvanic couple is welded on another piece class and bores on the flow deflector on carbon metal substrate.Semiconductor refrigerating crystal grain is connected in series by flow deflector.
Two classes bore carbon metal substrate by upper and lower pad and flow deflector by all galvanic couples to being concatenated, finally form a positive pole and negative pole, anodal and negative pole exchanges and can change cold and hot attribute.
The coefficient of conductivity of the product forming is much larger than 10W/m.k.There is high, the high heat conduction of refrigerating efficiency, thermal resistance is little, energy-conservation and the feature such as environmental protection.
Example two: the another kind of typical specific embodiment, by three or above class, bore carbon metal substrate, semiconductor refrigerating crystal grain and flow deflector composite package and form.In the class at two ends, boring carbon metal substrate is one side, and middle is two-sided.Between two adjacent classes brill carbon metal substrates, there are respectively conductor refrigeration crystal grain and flow deflector.
Three, high-termal conductivity metallic circuit semiconductor chilling plate module production technology and structure:
Example 1: accompanying drawing 1 has shown a kind of typical embodiment:
This high-termal conductivity metallic circuit semiconductor chilling plate module is by collecting cold 1-1, high-termal conductivity metallic circuit semiconductor chilling plate 1-2(1 or a plurality of), wire 1-5 and drive circuit board 1-3, radiator 1-4 form.
First in the bottom of high-termal conductivity metallic circuit semiconductor chilling plate 1-2, be coated with heat-conducting silicone grease or heat conductive silica gel or other Heat Conduction Material, then by screw or clasp, lock, the high-termal conductivity metallic circuit semiconductor chilling plate 1-2 one side with Heat Conduction Material is fastening with radiator 1-4.
On the top of high-termal conductivity metallic circuit semiconductor chilling plate 1-2, be coated with heat-conducting silicone grease or heat conductive silica gel or other Heat Conduction Material again, then by screw or clasp, cold the 1-1 of another side and collection of high-termal conductivity metallic circuit semiconductor chilling plate 1-2 with Heat Conduction Material is fastening, to collect cold or heat.
The thickness of drive circuit board 1-3 is less than the thickness of high-termal conductivity metallic circuit semiconductor chilling plate 1-2, and drive circuit board 1-3 is arranged on radiator 1-4.The output of drive circuit board 1-3 is connected drive current is provided with high-termal conductivity metallic circuit semiconductor chilling plate 1-2 by wire 1-5, after the input parallel connection of all drive circuit board 1-3, then wire both positive and negative polarity is drawn.
Example 2: accompanying drawing 2 has shown another kind of typical embodiment:
This high-termal conductivity metallic circuit semiconductor chilling plate module forms by collecting cold 2-1, high-termal conductivity metallic circuit semiconductor chilling plate 2-2 and drive circuit board 2-3, radiator 2-4 and wire 2-5.
High-termal conductivity metallic circuit semiconductor chilling plate 2-2 makes an integrated member that has identical large area with cold 2-1 of collection or be optionally slightly less than its area.
Drive circuit board 2-3 is placed in outside whole module, and high-termal conductivity metallic circuit semiconductor chilling plate 2-2 is connected by wire 2-5 with drive circuit.
First in high-termal conductivity metallic circuit semiconductor chilling plate 2-2 bottom, be coated with heat-conducting silicone grease or heat conductive silica gel or other Heat Conduction Material, by screw or clasp, lock again, the high-termal conductivity metallic circuit semiconductor chilling plate 2-2 one side with Heat Conduction Material is fastening with radiator 2-4.
Again high-termal conductivity metallic circuit semiconductor chilling plate 2-2 top is coated with to heat-conducting silicone grease or heat conductive silica gel or other Heat Conduction Material, by screw or clasp, lock, cold the 2-1 of another side and collection of high-termal conductivity metallic circuit semiconductor chilling plate 2-2 with Heat Conduction Material is fastening, to collect cold or heat.
Also drive circuit board 2-3 directly can be designed within high-termal conductivity metallic circuit semiconductor chilling plate 2-2.
As, high-termal conductivity metallic circuit semiconductor chilling plate 2-2 and drive circuit board 2-3 are made to an integral body, high-termal conductivity metallic circuit semiconductor chilling plate 2-2 is connected by wire 2-5 with drive circuit 2-3.Drive circuit board output is drawn by wire both positive and negative polarity.
Claims (6)
1. high-termal conductivity metallic circuit semiconductor chilling plate module, comprises cold of collection, wire, drive circuit board and radiator, it is characterized in that, between cold of collection and radiator, high-termal conductivity metallic circuit semiconductor chilling plate is set.
2. high-termal conductivity metallic circuit semiconductor chilling plate module according to claim 1, is characterized in that, between cold of high-termal conductivity metallic circuit semiconductor chilling plate and collection, Heat Conduction Material is set.
3. according to high-termal conductivity metallic circuit semiconductor chilling plate module described in claim 1 or 2, it is characterized in that, between high-termal conductivity metallic circuit semiconductor chilling plate and radiator, Heat Conduction Material is set.
4. high-termal conductivity metallic circuit semiconductor chilling plate module according to claim 3, it is characterized in that described drive circuit board is arranged between cold of described collection and radiator, and drive circuit board is arranged on radiator, the output of drive circuit board is connected with high-termal conductivity metallic circuit semiconductor chilling plate by wire.
5. high-termal conductivity metallic circuit semiconductor chilling plate module according to claim 3, is characterized in that described drive circuit board is arranged on outside described module, and high-termal conductivity metallic circuit semiconductor chilling plate is connected by wire with drive circuit.
6. high-termal conductivity metallic circuit semiconductor chilling plate module according to claim 3, within it is characterized in that described drive circuit board is arranged on high-termal conductivity metallic circuit semiconductor chilling plate, high-termal conductivity metallic circuit semiconductor chilling plate is connected by wire with drive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310733904.0A CN103697619A (en) | 2013-12-27 | 2013-12-27 | High-thermal-conductivity metal circuit semiconductor cooler module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310733904.0A CN103697619A (en) | 2013-12-27 | 2013-12-27 | High-thermal-conductivity metal circuit semiconductor cooler module |
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| Publication Number | Publication Date |
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| CN103697619A true CN103697619A (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310733904.0A Pending CN103697619A (en) | 2013-12-27 | 2013-12-27 | High-thermal-conductivity metal circuit semiconductor cooler module |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050279104A1 (en) * | 2004-06-22 | 2005-12-22 | Javier Leija | Thermoelectric module |
| CN1937273A (en) * | 2005-08-02 | 2007-03-28 | 株式会社东芝 | Thermoelectric device and method of manufacturing the same |
| CN200943974Y (en) * | 2006-08-07 | 2007-09-05 | 高飞 | Novel structured semi-conductor refrigerating subassembly |
| CN201173640Y (en) * | 2008-03-07 | 2008-12-31 | 珠海熙玛电子科技有限公司 | Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship |
| CN101527346A (en) * | 2008-03-04 | 2009-09-09 | 富士迈半导体精密工业（上海）有限公司 | Thermoelectric cooler and illuminating apparatus adopting same |
| CN203629120U (en) * | 2013-12-27 | 2014-06-04 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor chilling plate module |
-
2013
- 2013-12-27 CN CN201310733904.0A patent/CN103697619A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050279104A1 (en) * | 2004-06-22 | 2005-12-22 | Javier Leija | Thermoelectric module |
| CN1937273A (en) * | 2005-08-02 | 2007-03-28 | 株式会社东芝 | Thermoelectric device and method of manufacturing the same |
| CN200943974Y (en) * | 2006-08-07 | 2007-09-05 | 高飞 | Novel structured semi-conductor refrigerating subassembly |
| CN101527346A (en) * | 2008-03-04 | 2009-09-09 | 富士迈半导体精密工业（上海）有限公司 | Thermoelectric cooler and illuminating apparatus adopting same |
| CN201173640Y (en) * | 2008-03-07 | 2008-12-31 | 珠海熙玛电子科技有限公司 | Semiconductor refrigerator device and semiconductor air conditioner using same for car and ship |
| CN203629120U (en) * | 2013-12-27 | 2014-06-04 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor chilling plate module |
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Application publication date: 20140402 |