CN201166824Y - Radiating device for EMS memory module - Google Patents
Radiating device for EMS memory module Download PDFInfo
- Publication number
- CN201166824Y CN201166824Y CNU2008200061908U CN200820006190U CN201166824Y CN 201166824 Y CN201166824 Y CN 201166824Y CN U2008200061908 U CNU2008200061908 U CN U2008200061908U CN 200820006190 U CN200820006190 U CN 200820006190U CN 201166824 Y CN201166824 Y CN 201166824Y
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- Prior art keywords
- heat radiation
- memory modules
- radiation sheet
- sheet material
- heat
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Abstract
The utility model provides a device for cooling a memory module, which is used for clamping on the memory module. The cooling device comprises a first cooling component, a second cooling component and a fixing member, wherein the first cooling component comprises a cooling plate material and a uniform temperature plate; cooling fins are formed on one side of the cooling plate material, embedding parts are arranged on the upper side thereof, one side of the uniform temperature plate is attached to the inner lateral surface of the cooling plate material, and the other side of the uniform temperature plate is attached to the memory module; the second cooling component comprises a cooling plate material, cooling fins are formed on one side of the cooling plate material, an embedding part is arranged on the material plate material; when the two cooling plate materials are correspondingly clamped, each cooling fin thereof are arranged correspondingly, and each embedding part is embedded into each other; and the fixing member performs the function of clamping grips corresponding to the first cooling component and the second cooling component, thereby realizing the rapid heat conduction of the uniform temperature plate attached to the two sides of the memory module so as to improve the heat conduction efficiency of the entire cooling device.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of heat abstractor that is used for memory modules.
Background technology
At present, because the arriving of information age, computing machine has been everyone indispensable outfit, computing machine is equipped with and the upgrading of peripheral product and the insider also is devoted to invariably, for example random access memory is developed to 128 * 4MG by 64KB, following even can develop more jumbo random access memory, and because the power the during running of present random access memory is less, so do not need to add heat abstractor, but along with the memory capacity of random access memory can be increasing, relative working temperature also can be more and more higher, therefore, also needs heat abstractor effectively to reduce temperature.
Therefore, be and design a kind of heat abstractor for the random access memory use, as shown in Figure 1, this heat abstractor 100a includes members such as two heat radiation sheet material 2a and several fixtures 3a, wherein, two heat radiation sheet material 2a press from both sides the surface that is affixed on memory modules respectively, again by several fixtures 3a clamping on two heat radiation sheet material 2a, memory modules is clamped by two heat radiation sheet material 2a.The heat of high temperature that is produced after memory modules work can be dispelled the heat by two heat radiation sheet material 2a.
But though above-mentioned known heat abstractor 100a can dispel the heat to memory modules, the effect that only depends on two heat radiation sheet material 2a to dispel the heat is not good.Therefore, how improving the whole radiating effect that is used for the heat abstractor 100a of memory modules is present urgent problem.
The utility model content
The purpose of this utility model is to provide a kind of and is used for memory modules and can makes the heat abstractor of memory modules efficiently radiates heat.
The heat abstractor that is used for memory modules in the utility model is clamped to the corresponding surface of memory modules, this heat abstractor comprises: first radiating subassembly, comprise heat radiation sheet material and temperature-uniforming plate, one side of this heat radiation sheet material is formed with at least one group of radiating fin, upside at this heat radiation sheet material is provided with at least one fitting portion, the one side of described temperature-uniforming plate is attached on the medial surface of this heat radiation sheet material, and another side then amplexiforms mutually with described memory modules; Second radiating subassembly, comprise heat radiation sheet material, one side of this heat radiation sheet material forms at least one group of radiating fin, the radiating fin of corresponding described first radiating subassembly of this radiating fin is arranged, upside at this heat radiation sheet material is provided with at least one fitting portion, and it is chimeric that the fitting portion of corresponding described first radiating subassembly of this fitting portion is made clip; And at least one fixture, pull fixing corresponding to described first radiating subassembly and described second radiating subassembly work folder.
The heat abstractor that is used for memory modules in the utility model is clamped to the corresponding surface of memory modules, this heat abstractor comprises: two radiating subassemblies, this radiating subassembly comprises heat radiation sheet material and temperature-uniforming plate, one side of this heat radiation sheet material is formed with at least one group of radiating fin, upside at this heat radiation sheet material is provided with at least one fitting portion in addition, the one side of this temperature-uniforming plate is attached on the medial surface of this heat radiation sheet material, and another side then amplexiforms mutually with described memory modules; And at least one fixture, make folder corresponding to described two radiating subassemblies and pull fixing; This fixture is during to described two radiating subassembly clampings, and described two mutual butts of fitting portion are chimeric, and described two groups of radiating fins are then corresponding to be arranged.
By said structure as can be known, the utility model all has been sticked temperature-uniforming plate at place, the both sides of memory modules and heat conduction very fast improves the radiating efficiency of whole memory modules.
In addition, the utility model is provided with radiating fin respectively in the lateral margin place on two heat radiation sheet materials, when with the relative clamping of two heat radiation sheet materials, these two the heat radiation sheet materials radiating fin just be arranged in a row, by these radiating fins can more efficiently the work heat energy that memory modules produced be dispelled the heat in outside.
Description of drawings
Fig. 1 is the three-dimensional exploded view of known heat abstractor;
Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor;
Fig. 3 does not press from both sides the stereographic map of the memory modules of pulling for two radiating subassemblies of the utility model;
Fig. 4 is the stereographic map of the utility model heat abstractor;
Fig. 5 is along the sectional view of 5-5 line among Fig. 4.
Description of reference numerals
Heat abstractor 100a
Heat radiation sheet material 2a fixture 3a
Heat abstractor 100 memory modules 200
Radiating subassembly 10 temperature-uniforming plates 1
Heat radiation sheet material 2 radiating fins 21
Fitting portion 22 depressed parts 23
Brace 32 heat-conducting mediums 4
Golden finger contact 201
Embodiment
Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows.
On the corresponding surface that is clamped to memory modules in the utility model, this heat abstractor comprises:
First radiating subassembly comprises heat radiation sheet material and temperature-uniforming plate, and a side of this heat radiation sheet material is formed with at least one group of radiating fin; Upside at this heat radiation sheet material is provided with at least one fitting portion; The one side of described temperature-uniforming plate is attached on the medial surface of this heat radiation sheet material, and another side then amplexiforms mutually with described memory modules;
Second radiating subassembly comprises heat radiation sheet material, and a side of this heat radiation sheet material forms at least one group of radiating fin, and the radiating fin of corresponding described first radiating subassembly of this radiating fin is arranged; Upside at this heat radiation sheet material is provided with at least one fitting portion, and it is chimeric that the fitting portion of corresponding described first radiating subassembly of this fitting portion is made clip; And at least one fixture, pull fixing corresponding to described first radiating subassembly and described second radiating subassembly work folder.
The heat abstractor that is used for memory modules in the utility model please refer to Fig. 2 and shown in Figure 3, and this heat abstractor 100 and two radiating subassemblies 10 and two fixture 30 that be clamped in memory modules 200 corresponding dual-side surfaces identical by structure are formed; In addition, the quantity of fixture 30 also can be single kenel.
Wherein, two radiating subassemblies 10 all have temperature-uniforming plate 1 (also can only in a radiating subassembly temperature-uniforming plate 1 be set), be long strip-board shape, omit together with the length of memory modules 200, temperature-uniforming plate 1 inside of present embodiment is provided with working fluid and capillary structure, reaches thermal conduction mechanism so as to the liquid-gas phase transitionization of utilizing internal flow.Side on temperature-uniforming plate 1 is pasted with heat radiation sheet material 2, heat radiation sheet material 2 also is long strip-board shape, the length of this heat radiation sheet material 2 slightly is longer than temperature-uniforming plate 1, this heat radiation sheet material 2 is made for the material of excellent in heat dissipation effect such as aluminium, and the heat radiation sheet material 2 a lateral edges be formed with at least one group of radiating fin 21, present embodiment is provided with two groups and radiating fin 21 separated by a distance, and when with the relative clamping of two heat radiation sheet materials 2, the radiating fin 21 of these two sheet materials 2 that dispel the heat just is arranged in a row.
In addition, upper edge appropriate location at heat radiation sheet material 2 is provided with fitting portion 22, present embodiment is respectively to be provided with fitting portion 22 in the both sides of heat radiation sheet material 2, this fitting portion 22 is the L type, when two heat radiation sheet materials 2 when folder is pulled relatively, the clip that the L type fitting portion 22 on two heat radiation sheet material 2 just is square is fixed together.
Please continue with reference to Fig. 2, the utility model respectively is provided with vertical depressed part 23 one at the heat radiation sheet material 2 outer surface places that correspond to fitting portion 22, with by fixture 30 clampings on depressed part 23, this fixture 30 is the ㄇ font, and the brace 32 that it includes two corresponding and flexible clamping sheets 31 of tool and connects two clamping sheets 31, these two elasticity clamping sheet 31 clampings are on the depressed part 23 of two heat radiation sheet materials 2.
Please refer to Fig. 2, Fig. 3 and Fig. 4, wherein, when on memory modules 200, heat abstractor 100 being installed, two temperature-uniforming plates 1 are installed in respectively on two heat radiation sheet materials 2, to be equipped with on the relative both side surface that is clamped in memory modules 200 of two of temperature-uniforming plate 1 heat radiation sheet materials 2, when clamping, can on temperature-uniforming plate 1 and surface that memory modules 200 attaches mutually, be coated with one deck heat-conducting medium 4 (as shown in Figure 5) earlier, can be more rapidly by heat-conducting medium 4 the work heat energy of memory modules 200 be conducted on the temperature-uniforming plate 1.When two heat radiation sheet materials 2 clamp memory modules 200, two heat radiations, 22 mutual chimeric being connected together of L type fitting portion on the sheet material 2, make memory modules 200 be coated the only protruding golden finger contact 201 that exposes by two heat radiation sheet materials 2, at last, relend by fixture 30 clampings on the depressed part 23 of two heat radiation sheet materials 2, can make heat abstractor 100 assemblings on the memory modules 200 finish.
By said structure as can be known, because the utility model all be sticked at the both side surface place of memory modules 200 temperature-uniforming plate 1 and heat conduction very fast improve the radiating efficiency of the heat abstractor 100 of whole memory modules 200.In addition, by the radiating fin 21 of two heat radiations on the sheet materials 2 also can the more efficient work heat energy that memory modules 200 is produced dispel the heat in outside.
The above is preferred embodiment of the present utility model only, is not to be used to limit protection domain of the present utility model.
Claims (10)
1, a kind of heat abstractor that is used for memory modules is characterized in that, is clamped on the corresponding surface of memory modules, and this heat abstractor comprises:
First radiating subassembly comprises heat radiation sheet material and temperature-uniforming plate, and a side of this heat radiation sheet material is formed with at least one group of radiating fin; Upside at this heat radiation sheet material is provided with at least one fitting portion; The one side of described temperature-uniforming plate is attached on the medial surface of this heat radiation sheet material, and another side then amplexiforms mutually with described memory modules;
Second radiating subassembly comprises heat radiation sheet material, and a side of this heat radiation sheet material forms at least one group of radiating fin, and the radiating fin of corresponding described first radiating subassembly of this radiating fin is arranged; Upside at this heat radiation sheet material is provided with at least one fitting portion, and it is chimeric that the fitting portion of corresponding described first radiating subassembly of this fitting portion is made clip; And
At least one fixture is pulled fixing corresponding to described first radiating subassembly and described second radiating subassembly work folder.
2, the heat abstractor that is used for memory modules as claimed in claim 1 is characterized in that, described heat radiation sheet material is aluminium material.
3, the heat abstractor that is used for memory modules as claimed in claim 1 is characterized in that, described fitting portion is the L type.
4, the heat abstractor that is used for memory modules as claimed in claim 3 is characterized in that, is provided with depressed part at the described heat radiation sheet material outside surface that corresponds to described fitting portion; Described fixture is the ㄇ font, the brace that it comprises two mutual correspondences and rubber-like clamping sheet and connects these two clamping sheets, and these two clamping sheet clampings are on the depressed part of described two heat radiation sheet materials.
5, the heat abstractor that is used for memory modules as claimed in claim 1 is characterized in that, is coated with heat-conducting medium on the surface of amplexiforming mutually of described temperature-uniforming plate and described memory modules.
6, a kind of heat abstractor that is used for memory modules is characterized in that, is clamped on the corresponding surface of memory modules, and this heat abstractor comprises:
Two radiating subassemblies, this radiating subassembly comprise heat radiation sheet material and temperature-uniforming plate, and a side of this heat radiation sheet material is formed with at least one group of radiating fin, and the upside at this heat radiation sheet material is provided with at least one fitting portion in addition; The one side of this temperature-uniforming plate is attached on the medial surface of this heat radiation sheet material, and another side then amplexiforms mutually with described memory modules; And
At least one fixture is made folder corresponding to described two radiating subassemblies and is pulled fixing;
This fixture is during to described two radiating subassembly clampings, and described two mutual butts of fitting portion are chimeric, and described two groups of radiating fins are then corresponding to be arranged.
7, the heat abstractor that is used for memory modules as claimed in claim 6 is characterized in that, described heat radiation sheet material is aluminium material.
8, the heat abstractor that is used for memory modules as claimed in claim 6 is characterized in that, described fitting portion is the L type.
9, the heat abstractor that is used for memory modules as claimed in claim 8 is characterized in that, is provided with depressed part at the described heat radiation sheet material outside surface that corresponds to described fitting portion; Described fixture is the ㄇ font, the brace that it comprises two mutual correspondences and rubber-like clamping sheet and connects these two clamping sheets, and these two clamping sheet clampings are on the depressed part of described two heat radiation sheet materials.
10, the heat abstractor that is used for memory modules as claimed in claim 6 is characterized in that, is coated with heat-conducting medium on the surface of amplexiforming mutually of described temperature-uniforming plate and described memory modules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200061908U CN201166824Y (en) | 2008-02-13 | 2008-02-13 | Radiating device for EMS memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200061908U CN201166824Y (en) | 2008-02-13 | 2008-02-13 | Radiating device for EMS memory module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201166824Y true CN201166824Y (en) | 2008-12-17 |
Family
ID=40192215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200061908U Expired - Fee Related CN201166824Y (en) | 2008-02-13 | 2008-02-13 | Radiating device for EMS memory module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201166824Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736708A (en) * | 2011-04-01 | 2012-10-17 | 台通科技股份有限公司 | Heat-dissipating device |
| CN108538327A (en) * | 2018-07-05 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of heat sink arrangement and application method can be used for fixed M.3 hard disk |
| CN109782879A (en) * | 2017-11-14 | 2019-05-21 | 英业达科技有限公司 | EMS memory heat radiating device |
-
2008
- 2008-02-13 CN CNU2008200061908U patent/CN201166824Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736708A (en) * | 2011-04-01 | 2012-10-17 | 台通科技股份有限公司 | Heat-dissipating device |
| CN109782879A (en) * | 2017-11-14 | 2019-05-21 | 英业达科技有限公司 | EMS memory heat radiating device |
| CN108538327A (en) * | 2018-07-05 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of heat sink arrangement and application method can be used for fixed M.3 hard disk |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20170213 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |