CN102736708A - Heat-dissipating device - Google Patents
Heat-dissipating device Download PDFInfo
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- CN102736708A CN102736708A CN2011100824741A CN201110082474A CN102736708A CN 102736708 A CN102736708 A CN 102736708A CN 2011100824741 A CN2011100824741 A CN 2011100824741A CN 201110082474 A CN201110082474 A CN 201110082474A CN 102736708 A CN102736708 A CN 102736708A
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Abstract
The invention discloses a heat-dissipating device, which comprises a heat-dissipating panel and at least one heat-conducting component. The heat-dissipating panel is provided with at least two penetrating slots; the heat-conducting component is formed by bending an elastic heat-conducting plate, and comprises a base plate and two heat-conducting plates; the base plate touches the top surface of the heat-dissipating panel; and the two heat-conducting plates are extended from the base plate and pass through the two slots, and each of the two heat-conducting plates comprises an upper part and a lower part, wherein the lower part is extended from the upper part and bends with an angle inwards. By adopting the above structure when the heat-dissipating device is mounted on a memory device, the surface of each chip on the memory device is completely abutted to the corresponding heat-conducting plate as much as possible to achieve the optimal heat-dissipating effect.
Description
Technical field
The present invention relates to a kind of heat abstractor, especially refer to a kind ofly assemble easily and can be close to thermal source as far as possible comprehensively to reach the heat abstractor of best radiating effect.
Background technology
The EMS memory heat radiating device that uses in the past; Like the TaiWan, China patent is for I273688 number a memory module integrated structure; Comprise a memory modules and a heat abstractor at least, with a conducting strip, this heat abstractor is located at the top of this memory modules on this memory modules chip; And utilizing clamping connection portion this conducting strip of clamping connection, the heat that this memory modules is produced causes this heat abstractor by this conducting strip and the conduction of this clamping connection portion.
Another kind is used for the heat abstractor of internal memory, and shown in TaiWan, China patent M265763 number, it mainly respectively is covered with a slice heat sink in the both sides of internal memory, and mat one fastener is located in this two heat sink outside, utilizes this two heat sink that the heat of this internal memory is derived.
In addition; This case inventor propose such as TaiWan, China patent I330517 number a kind of memory modules of exposure and possess the heat abstractor of integrated structure; One heat sink and several heat conducting elements are provided, and each heat conducting element all comprises a substrate and two braces, and said two braces can be inside or outward-dipping; Supply to be located in same respectively or adjacent memory on, reach the effect of conduction and heat radiation.
Summary of the invention
The technical matters that the present invention solves provides a kind of heat abstractor, can be close to thermal source to reach best radiating effect as far as possible comprehensively.
Technical solution of the present invention is:
A kind of heat abstractor comprises: heat sink has two slots that run through on it; And heat conducting element, by an elastic heat conducting sheet bending forming, and comprise a substrate and two conducting strips; The recline end face of this heat sink of this substrate; Said two conducting strips are faced each other, and extend from two relative edges of this substrate respectively and pass said two slots, and each conducting strip comprises a top and a bottom; Extend respectively from this two top said two bottoms, and the angle that respectively bends inwards.
Another kind of heat abstractor of the present invention comprises: heat sink has a plurality of slots that run through on it; And a plurality of heat conducting elements; Each said heat conducting element is by an elastic heat conducting sheet bending forming; And each said heat conducting element comprises a substrate and two conducting strips, the recline end face of this heat sink of the substrate of each said heat conducting element, and two conducting strips of each said heat conducting element are faced each other; And extend from two relative edges of this substrate respectively and pass two adjacent slots on this heat sink; Each said conducting strip comprises a top and a bottom, and two bottoms of each said heat conducting element are corresponding respectively extends from its two top, and the angle that respectively bends inwards.
Learn that by above explanation the present invention has following advantage really:
The present invention provides a kind of new heat abstractor, and it comprises a heat sink and at least one heat conducting element, has at least two slots to run through on this heat sink; This heat conducting element is formed by elastic heat conducting sheet bending, more comprises a substrate and two conducting strips that extend from this substrate, and this substrate pastes with the end face of this heat sink mutually; This two conducting strip faces one another and passes respectively this two slot, and wherein, each conducting strip comprises a top and a bottom; Extend respectively from this two top this two bottom; And this bottom angle that bends inwards is established this thermal source for folder, and is close to this thermal source to reach heat conduction preferably and radiating effect as far as possible comprehensively.
With respect to prior art; Because the bottom of two conducting strips in the heat conducting element of the present invention possesses the characteristic of the angle that bends inwards especially; Make this two conducting strip not only can this thermal source be gripped in wherein; And can utilize the elasticity of this two conducting strip itself, make the face of this two conducting strip all be close to the two sides that is against this thermal source as much as possible, so that radiating effect of the present invention obviously is superior to the heat abstractor of prior art.
Preferably, the bottom tail end of each conducting strip more outwards bends, and makes contiguous its tail end part in each bottom all form a lead angle, and convenient this thermal source of guiding is inserted between this two conducting strip.
Preferably, this heat conducting element more includes at least two shell fragments, and this two shell fragment stretches out from the upper angled of this two conducting strip ground respectively, and the end of each shell fragment peaks at the bottom surface of this heat sink respectively, so that this heat conducting element is fixed on this heat sink.
Preferably, contiguous this lead angle part of the lower inside surface of each conducting strip is formed with a protuberance at least, and this protuberance is positioned at above the lead angle, so that this heat abstractor is fixed on this thermal source.
Preferably, this heat abstractor more comprises a fan, and has more a through hole on this heat sink, and this fan is located on this heat sink and over against this through hole, is used the radiating effect that reaches better.
Description of drawings
Fig. 1 is the three-dimensional exploded view of first preferred embodiment of the present invention;
Fig. 2 is the decomposition diagrammatic cross-section of this first preferred embodiment;
Fig. 3 is the combination appearance figure of this first preferred embodiment;
Fig. 4 is the combination diagrammatic cross-section of this first preferred embodiment;
Fig. 5 is the three-dimensional exploded view of second preferred embodiment of the present invention;
Fig. 6 is the combination appearance figure of this second preferred embodiment;
Fig. 7 is the combination diagrammatic cross-section of this second preferred embodiment.
The main element label declaration:
100: heat abstractor 1,1a: heat sink 11: slot
10: through hole 12: end face 13: bottom surface
2,2a: heat conducting element 21: substrate 22: conducting strip
220: lead angle 221: top 222: bottom
223: tail end 3: memory device 30: RAM card
31: chip 4: shell fragment 41: shell fragment is terminal
42: protuberance 50: fan
Embodiment
To understand in order technical characterictic of the present invention, purpose and effect being had more clearly, to contrast description of drawings embodiment of the present invention at present.
Fig. 1 shows first preferred embodiment of the present invention, and it discloses heat abstractor 100 of the present invention and is used for contacting a thermal source, and this thermal source is the chip 31 on the memory device 3 on the motherboard in the present embodiment, but not as limit.This memory device 3 possesses a RAM card at least, and is normally a plurality of, in this first embodiment, includes two RAM cards 30 on this memory device 3, and a plurality of chips 31 are respectively arranged on the two sides of each RAM card 30.This two RAM card 30 is when running, and the said chip 31 on it can produce heat energy, and these heat energy will be shed by heat abstractor 100 of the present invention, and this holds the back and details.
Like Fig. 1 and shown in Figure 2, this heat abstractor 100 of the present invention comprises a heat sink 1 and two heat conducting elements 2, and a plurality of slots that run through 11 are arranged on this heat sink 1; Each heat conducting element 2 is by an elastic heat conducting sheet bending forming, and comprises the reclining end face 12 of this heat sink 1 of a substrate 21 and two conducting strips 22, this substrate 21 of this heat conducting element 2; This two conducting strip 22 is faced each other; And extend from two relative edges of this substrate 21 respectively and pass wherein two adjacent slots 11, wherein each conducting strip 22 comprises a top 221 and a bottom 222, and said top 221 parallels; Said bottom 222 is extended the top 221 from said correspondence respectively, and each inwardly slightly bends an angle.
As shown in Figure 2; The user only needs each RAM card 30 on this memory device 3 is aimed in the gap between two conducting strips 22 of each heat conducting element 2 of this heat abstractor 100 respectively; Press down this heat abstractor 100 then; So that it moves down towards this memory device 3, just can entire heat dissipation device 100 be assembled on this memory device 3, like Fig. 3 and shown in Figure 4.Fig. 3 shows the diagrammatic cross-section when heat abstractor 100 of the present invention is assembled in this memory device 30; Wherein, The distance that two tops of two conducting strips 22 of each heat conducting element 2 are 221 roughly equates with the thickness of this RAM card 30; The bottom 222 of two conducting strips 22 of each heat conducting element 2 becomes the state that does not almost have bending from the state (as shown in Figure 2) of the angle that originally bends inwards, and this is because when assembling; Each RAM card 30 can insert between corresponding two bottoms 222; And they are strutted state as shown in Figure 3, because this two guide card 22 is resilient, therefore; The elastic force that two bottoms 222 of each heat conducting element 2 can be put aside when being strutted by this RAM card 30 and grip its corresponding RAM card 30 makes the position can be close on chip 31 surfaces on each RAM card 30 two sides as far as possible comprehensively and is against corresponding conducting strip 22.So, the heat energy that produced of each chip 31 of each RAM card 30 just can be transmitted to this heat sink 1 soon by corresponding each conducting strip 22 and dispel the heat.
In the present invention, because the surface of each chip 31, or say each thermal source surface, and be to be close to be against corresponding conducting strip 22 as far as possible comprehensively, therefore, the present invention possesses preferable heat conduction and radiating effect really compared to prior art.
Preferably, as shown in Figure 2, bottom 222 tail ends 223 of each conducting strip 22 more outwards bend, and make each bottom 222 contiguous its tail end 223 part all form a lead angle 220.In assembling with this heat abstractor 100 in 3 last times of this memory device; Can guide between two conducting strips 22 that corresponding RAM card 30 inserts each heat conducting element 2 swimmingly by two lead angles 220 on each heat conducting element 2; Such design, the convenience when significantly having improved heat abstractor of the present invention 100 and installing.
Preferably, as shown in Figure 4, more include at least two shell fragments 4, two shell fragments 4 on each heat conducting element 2 and stretch out obliquely from two tops 221 of two conducting strips 22 respectively, and the shell fragment of each shell fragment 4 terminal 41 peaks at the bottom surface 13 of this heat sink 1.When this heat conducting element 2 is assembled with this heat sink 1; Two shell fragments 4 can be by flexible compression to pass through these corresponding two slots 11; And flexibly reset the substrate 21 of this heat conducting element 2 is close on the end face 12 that is against this heat sink 1; So, the heat energy that transmits from this conducting strip 22 just can pass to this heat sink 1 as early as possible and dispel the heat.On the other hand, each heat conducting element 2 also can its shell fragment 4 of mat withstanding effect and can not come off from this heat sink 1.In the present invention; Except utilizing said shell fragment 4 to reach the aforementioned effect, another feasible practice is to use scolding tin that the substrate 21 of each heat conducting element 2 is welded in the end face of this heat sink 1, under this situation; Just need not make said shell fragment 4; Yet,, still can consider the scheme that the aforementioned scolding tin practice is followed said shell fragment 4 and deposited if specific demand is arranged.
Preferably, as shown in Figure 4, wherein more there is a protuberance 42 at 222 inboard contiguous these lead angle 220 places, bottom of each conducting strip 22, and this protuberance 42 is positioned at this lead angle 220 tops.As shown in Figure 4; At this heat abstractor 100 with after this memory device 3 combines; This protuberance 42 catches on these chip 31 bottoms on this RAM card 30 just, and this heat abstractor 100 is fixing with this memory device 3, makes that this heat abstractor 100 is unlikely to come off from this memory device 3 easily.
Fig. 5 to Fig. 7 shows second preferred embodiment of the present invention, and it comprises a heat sink 1a, a plurality of heat conducting element 2a and a fan 50.The structure of each heat conducting element 2a is approximately identical to above-mentioned heat conducting element 2, holds and does not give unnecessary details.Then similar as for this heat sink 1a with above-mentioned heat sink 1; Difference is slot 11 more on this heat sink 1a; And many through holes 10, fan 50 are located on this heat abstractor 100 and over against this through hole 10, the air-flow that this fan 50 produces; Can blow to said RAM card 30 via this through hole 10, reach better radiating effect.
In any case anyone can obtain enough enlightenments from the explanation of above-mentioned example, and according to and understanding content of the present invention is different from prior art really, and have usability and progressive on the industry.
The above is merely the schematic embodiment of the present invention, is not in order to limit scope of the present invention.Any those skilled in the art, equivalent variations of under the prerequisite that does not break away from design of the present invention and principle, having done and modification all should belong to the scope that the present invention protects.
Claims (10)
1. a heat abstractor is characterized in that, this heat abstractor comprises:
Heat sink has two slots that run through on it; And
Heat conducting element by an elastic heat conducting sheet bending forming, and comprises a substrate and two conducting strips; The recline end face of this heat sink of this substrate; Said two conducting strips are faced each other, and extend from two relative edges of this substrate respectively and pass said two slots, and each conducting strip comprises a top and a bottom; Extend respectively from this two top said two bottoms, and the angle that respectively bends inwards.
2. heat abstractor as claimed in claim 1 is characterized in that, the bottom tail end of each said conducting strip outwards bends, and contiguous its tail end part in each said bottom all forms a lead angle.
3. heat abstractor as claimed in claim 1 is characterized in that this heat conducting element includes at least two shell fragments, and said two shell fragments stretch out from the upper angled ground of said two conducting strips respectively, and the end of each said shell fragment peaks at the bottom surface of this heat sink respectively.
4. heat abstractor as claimed in claim 2 is characterized in that, contiguous this lead angle part of the lower inside surface of each said conducting strip is formed with a protuberance at least, and this protuberance is positioned at said lead angle top.
5. heat abstractor as claimed in claim 1 is characterized in that this heat abstractor comprises a fan, and wherein, this heat sink has a through hole, and this fan is located on this heat sink and over against this through hole.
6. a heat abstractor is characterized in that, this heat abstractor comprises:
Heat sink has a plurality of slots that run through on it; And
A plurality of heat conducting elements; Each said heat conducting element is by an elastic heat conducting sheet bending forming; And each said heat conducting element comprises a substrate and two conducting strips, the recline end face of this heat sink of the substrate of each said heat conducting element, and two conducting strips of each said heat conducting element are faced each other; And extend from two relative edges of this substrate respectively and pass two adjacent slots on this heat sink; Each said conducting strip comprises a top and a bottom, and two bottoms of each said heat conducting element are corresponding respectively extends from its two top, and the angle that respectively bends inwards.
7. heat abstractor as claimed in claim 6 is characterized in that the tail end of the bottom of each said conducting strip outwards bends, and contiguous its tail end part in each said bottom all forms a lead angle.
8. heat abstractor as claimed in claim 6; It is characterized in that; Each said heat conducting element includes at least two shell fragments; Each said shell fragment stretches out from the upper angled ground of each said conducting strip of each said heat conducting element respectively, and the end of each said shell fragment peaks at the bottom surface of this heat sink respectively.
9. heat abstractor as claimed in claim 7 is characterized in that, contiguous its lead angle part of the lower inside surface of each said conducting strip is formed with a protuberance at least, and the protuberance of each said conducting strip is positioned at its lead angle top.
10. heat abstractor as claimed in claim 6 is characterized in that this heat abstractor includes fan, and wherein, this heat sink has through hole, and said fan is located on this heat sink and over against said through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100824741A CN102736708A (en) | 2011-04-01 | 2011-04-01 | Heat-dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100824741A CN102736708A (en) | 2011-04-01 | 2011-04-01 | Heat-dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102736708A true CN102736708A (en) | 2012-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100824741A Pending CN102736708A (en) | 2011-04-01 | 2011-04-01 | Heat-dissipating device |
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| Country | Link |
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| CN (1) | CN102736708A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170722A (en) * | 2017-05-25 | 2017-09-15 | 东莞合安机电有限公司 | A kind of bimodulus piezoelectricity radiator structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201166824Y (en) * | 2008-02-13 | 2008-12-17 | 索士亚科技股份有限公司 | Radiating device for EMS memory module |
-
2011
- 2011-04-01 CN CN2011100824741A patent/CN102736708A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201166824Y (en) * | 2008-02-13 | 2008-12-17 | 索士亚科技股份有限公司 | Radiating device for EMS memory module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170722A (en) * | 2017-05-25 | 2017-09-15 | 东莞合安机电有限公司 | A kind of bimodulus piezoelectricity radiator structure |
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Application publication date: 20121017 |