CN201157868Y

CN201157868Y - Flexible circuit board stamping die

Info

Publication number: CN201157868Y
Application number: CNU2007201789388U
Authority: CN
Inventors: 龚奇杰
Original assignee: ZHUHAI FOREWIN ELECTRONIC CO Ltd
Current assignee: ZHUHAI FOREWIN ELECTRONIC CO Ltd
Priority date: 2007-12-27
Filing date: 2007-12-27
Publication date: 2008-12-03
Anticipated expiration: 2017-12-27

Abstract

The utility model discloses a flexible circuit board stamping die which has the advantages that the operation is simple, a flexible circuit board has little possibility of falling off, and the working efficiency is high. The stamping die comprises an upper die component (1) and a lower die component (2). A circuit board outline (21) is arranged on the upper surface of the lower die component (2); the flexible circuit board stamping die also comprises a discharging plate (3); the discharging plate (3) is positioned between the upper die component (1) and the lower die component (2); a circuit board die cutting location hole (31) is arranged on the discharging plate (3) and sleeved at the outer periphery of the circuit board outline (21); the front part of the discharging plate (3) is rotationally connected with the lower die component (2) through a connecting piece (4); and the back part thereof extends out of the lateral surface of the lower die component (2). The stamping die can be widely applied to the flexible circuit board field.

Description

Stamping mold for flexible circuit board

Technical field

The utility model relates to a kind of stamping mold for flexible circuit board.

Background technology

Flexible printed circuit board (Flexible Printed Circuit Board, be called for short FPC or FPC) be the printed circuit made from flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess, for example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and mobile arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design of soft or hard combination has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.The base material that is adopted is based on polyimide copper clad lamination, and this kind material thermal resistance height, dimensional stability are good, form final products with the coverlay that has mechanical protection and good electrical insulating properties concurrently by compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized being electrically connected of ectonexine circuit by metallization.

Die-cut being absolutely necessary a step in the production process of FPC, this production process are utilized diel and are undertaken by stamping machine.Structurally there is deficiency in existing diel, and troublesome poeration when causing FPC to take out in die-cut back drops easily and damages inefficiency.

The utility model content

Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, provides a kind of simple to operate, FPC to be difficult for dropping and the stamping mold for flexible circuit board of damage, high efficiency.

The technical scheme that the utility model adopted is: the utility model comprises upper die component, following membrane module, the described upper surface of membrane module down is provided with the circuit board profile, described stamping mold for flexible circuit board also comprises reclaiming plate, described reclaiming plate is at described upper die component and described down between the membrane module, described reclaiming plate is provided with the die-cut locating hole of circuit board, the die-cut locating hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotate with described down membrane module by connector is connected, side that the rear portion stretches out in described time membrane module.

Described upper die component comprises die shank, cope match-plate pattern, the upper mould fixed plate that has guide pillar, the patrix stripper that from up to down connects successively, described membrane module down comprises lower bolster, counterdie seat board, described circuit board profile is positioned at the upper surface of described lower bolster, and described lower bolster is that die is cut oralia.

Described connector is for connecting flexible glue or hinge.

Described stamping mold for flexible circuit board also comprises electromagnet, back-moving spring, and described electromagnet is positioned at described membrane module down and is connected with the lower surface of described reclaiming plate by described back-moving spring.

The beneficial effects of the utility model are: because the utility model comprises reclaiming plate, described reclaiming plate is at described upper die component and described down between the membrane module, described reclaiming plate is provided with the die-cut locating hole of circuit board, the die-cut locating hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotates with described membrane module down by connector and is connected, the rear portion stretches out in the described side of membrane module down, when die-cut, described reclaiming plate is placed on the described membrane module down, to treat that then die-cut wiring board is placed on the described reclaiming plate, after die-cut, the rear portion of described reclaiming plate is upwards lifted, wiring board after die-cut just breaks away from from described membrane module down, avoided directly taking out the inconvenience of FPC with hand, make FPC not fragile, make that simultaneously the process of taking out FPC has shortened the operating time, so the utility model is simple to operate, FPC is difficult for dropping and damaging, high efficiency;

Because the utility model also comprises electromagnet, back-moving spring, can realize flicking the automation control of the process of described reclaiming plate by described electromagnet and described back-moving spring, so the utility model easily is automated control.

Description of drawings

Fig. 1 is a main TV structure schematic diagram of the present utility model;

Fig. 2 is the A-A section structure schematic diagram of Fig. 1;

Fig. 3 is the right TV structure schematic diagram of the utility model embodiment one;

Fig. 4 is the right TV structure schematic diagram of the utility model embodiment two.

The specific embodiment

Embodiment one:

As Fig. 1～shown in Figure 3, the utility model comprises upper die component 1, following membrane module 2, reclaiming plate 3, the described upper surface of membrane module 2 down is provided with circuit board profile 21, described reclaiming plate 3 is at described upper die component 1 and described down between the membrane module 2, described reclaiming plate 3 is provided with the die-cut locating hole 31 of circuit board, the die-cut locating hole 31 of described circuit board is enclosed within the periphery of described circuit board profile 21, the front portion of described reclaiming plate 3 rotates with described membrane module 2 down by connector 4 and is connected, the rear portion stretches out in the described side of membrane module 2 down, described upper die component 1 comprises the die shank 11 that from up to down connects successively, cope match-plate pattern 12, the upper mould fixed plate 13 that has guide pillar 14, patrix stripper 15, described membrane module 2 down comprises lower bolster 22, counterdie seat board 23, described circuit board profile 21 is positioned at the upper surface of described lower bolster 22, described lower bolster 22 is cut oralia for die, described connector 4 is for connecting flexible glue, and certain described connector 4 also can be hinge.

When die-cut, described reclaiming plate 3 is placed on the described membrane module 2 down, to treat that then die-cut wiring board is placed on the described reclaiming plate 3, after die-cut, the rear portion of described reclaiming plate 3 is upwards lifted, wiring board after die-cut just breaks away from from described membrane module down 2, avoided directly taking out the inconvenience of FPC with hand, make FPC not fragile, the process of make taking out FPC has simultaneously shortened the operating time, so the utility model is simple to operate, FPC is difficult for dropping and damage, high efficiency.

Embodiment two:

As Fig. 1, Fig. 2, shown in Figure 4, the difference of present embodiment and embodiment one is: the described stamping mold for flexible circuit board of present embodiment also comprises electromagnet 5, back-moving spring 6, and described electromagnet 5 is positioned at described membrane module 2 down and is connected with the lower surface of described reclaiming plate 3 by described back-moving spring 6.Can realize flicking the automation control of the process of described reclaiming plate 3 by described electromagnet 5 and described back-moving spring 6, reduce artificial more.

The utility model can be widely used in the FPC field.

Claims

1, a kind of stamping mold for flexible circuit board, comprise upper die component (1), following membrane module (2), the described upper surface of membrane module (2) down is provided with circuit board profile (21), it is characterized in that: described stamping mold for flexible circuit board also comprises reclaiming plate (3), described reclaiming plate (3) is positioned at described upper die component (1) and described down between the membrane module (2), described reclaiming plate (3) is provided with the die-cut locating hole of circuit board (31), the die-cut locating hole of described circuit board (31) is enclosed within the periphery of described circuit board profile (21), and the front portion of described reclaiming plate (3) rotates with described membrane module (2) down by connector (4) and is connected, the rear portion stretches out in the described side of membrane module (2) down.

2, stamping mold for flexible circuit board according to claim 1, it is characterized in that: described upper die component (1) comprises die shank (11), cope match-plate pattern (12), the upper mould fixed plate (13) that has guide pillar (14), the patrix stripper (15) that from up to down connects successively, described membrane module (2) down comprises lower bolster (22), counterdie seat board (23), described circuit board profile (21) is positioned at the upper surface of described lower bolster (22), and described lower bolster (22) is cut oralia for die.

3, stamping mold for flexible circuit board according to claim 1 is characterized in that: described connector (4) is for connecting flexible glue or hinge.

4, according to claim 1 or 2 or 3 described stamping mold for flexible circuit board, it is characterized in that: described stamping mold for flexible circuit board also comprises electromagnet (5), back-moving spring (6), and described electromagnet (5) is positioned at described membrane module (2) down and is connected by the lower surface of described back-moving spring (6) with described reclaiming plate (3).