CN201119148Y - Electronic device shell - Google Patents
Electronic device shell Download PDFInfo
- Publication number
- CN201119148Y CN201119148Y CNU2007201940522U CN200720194052U CN201119148Y CN 201119148 Y CN201119148 Y CN 201119148Y CN U2007201940522 U CNU2007201940522 U CN U2007201940522U CN 200720194052 U CN200720194052 U CN 200720194052U CN 201119148 Y CN201119148 Y CN 201119148Y
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- shell
- electronic installation
- metal
- metal level
- microns
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Abstract
The utility model relates to an outer casing of an electronic device, which is suitable for installing on the main body of the electronic device. The outer casing of the electronic device comprises a nonmetallic casing body and a metal layer. The metal layer is covered on the surface of the nonmetallic casing body. The thickness of the metal layer is from 0.5 microns to 3000 microns, but the roughness of the surface of the metal layer is from 0.4 microns to 500 microns. Because of the metal layer, the electromagnetic interference can be shadowed through the outer casing of the electronic device.
Description
Technical field
The utility model relates to a kind of shell of electronic installation, and particularly relevant for a kind of shell with electronic installation of metal level.
Background technology
Mobile phone now, notebook computer and personal assistant device (Personal Digital Assistant, PDA) etc. hand-hold electronic device (portable electronic apparatus) all can produce electromagnetic interference (Electromagnetic Interference when work, and this electromagnetic interference has bad influence to health EMI).
In order to reduce the harmful effect of electromagnetic interference to health, the internal circuit of some hand-hold electronic devices and electronic component are designed to be coated by metal shell.Utilize the electromagnetic shielding effect of metal, the electromagnetic interference that hand-hold electronic device produced is covered.
Yet metal shell has heaviness and produces shortcomings such as difficult.To this, present way is to utilize sputtering method or vapour deposition method to form a metal level on the surface of plastic shell.So, the electromagnetic interference that hand-hold electronic device produced is subjected to this metal level and is covered.
Yet, in order to consider the problem of making needed time or cost, this sputtering method or the formed metal layer thickness of vapour deposition method utilized is not easy above 1 micron, and average surface roughness (Roughnessaverage, Ra) very low, so that the surface of this metal level visually can present the outward appearance kenel of minute surface.
Sputtering method and vapour deposition method need could be implemented under vacuum environment, and promptly must arrange in pairs or groups vacuum cavity (chamber) and vacuum pump of sputtering method and vapour deposition method could be implemented.Yet the cost of vacuum cavity and vacuum pump is very expensive, and vacuum pump need spend long time and the gas in the vacuum cavity could be extracted out, to form vacuum environment in vacuum cavity.Therefore, this way with sputtering method and vapour deposition method formation metal level has the shortcoming that cost of manufacture is too high and Production Time is oversize.
The utility model content
Problem to be solved in the utility model provides a kind of shell of electronic installation, to cover the electromagnetic interference that electronic installation is produced.
The scheme that the utility model adopted provides a kind of shell of electronic installation, is suitable for being arranged on the body of an electronic installation.The shell of electronic installation comprises a non-metal shell and a metal level.Metal level is covered in a surface of non-metal shell, and wherein metal layer thickness is between 0.5 micron to 3000 microns, and the surface roughness of metal level is between 0.4 micron to 500 microns.
According to the shell of electronic installation described in the utility model, the material of above-mentioned metal level is selected from by nickel, tin, zinc, lead, aluminium, copper, magnesium, titanium, silver and the golden group that forms.
Shell according to electronic installation described in the utility model, the material of above-mentioned non-metal shell is to be selected from by polyethylene (polyethylene, PE), polyimides (polyimide, PI), propylene-butadiene-styrene copolymer compound (acrylonitrile-butadiene-styrene copolymers, ABS), Merlon (polycarbonate), poly-sulfonyl (polysulfone, PSF), acrylic resin (acrylic resin), polyvinyl chloride (polyvinyl chloride, PVC), polyphenylene oxide (polyphenylene ether, PPE), polystyrene (polystyrene, PS), polyamide (polyamide, PA), nylon, polyene (polyolefin), Polyetherimide (polyetherimide), polybutylene terephthalate (polybutylene terephthalate, PBT), polyethylene terephthalate (polyethylene terephthalate), polymethyl acrylate (polymethylacrylate) and polyamine formic acid esters (polyurethane, PU) group that is formed.
According to the shell of electronic installation described in the utility model, the material of above-mentioned non-metal shell comprises carbon fibre material.
According to the shell of electronic installation described in the utility model, also comprise a protective layer, and protective layer covers metal level.
According to the shell of electronic installation described in the utility model, the material of above-mentioned protective layer is to be selected from the group that is made up of butyral resin (butyral resin) and epoxy resin (epoxy resin).
According to the shell of electronic installation described in the utility model, above-mentioned metal level covers the outer surface of non-metal shell.
According to the shell of electronic installation described in the utility model, above-mentioned metal level covers the inner surface of non-metal shell.
According to the shell of electronic installation described in the utility model, above-mentioned metal layer thickness is between 0.5 micron to 24.9 microns.
According to the shell of electronic installation described in the utility model, above-mentioned metal level covers the outer surface and the inner surface of non-metal shell.
According to the shell of electronic installation described in the utility model, above-mentioned metal level is made with spray-gun process (Metal Spraying).
By above-mentioned metal level, the shell of electronic installation of the present utility model can shield the electromagnetic interference that worn-out electronic installation produced, and leaks to avoid electromagnetic interference, and then reduces the harmful effect of electromagnetic interference to health.
Description of drawings
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, below in conjunction with accompanying drawing embodiment of the present utility model is elaborated, wherein:
Figure 1A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model first embodiment.
Figure 1B is the generalized section of Figure 1A center line I-I.
Fig. 2 A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model second embodiment.
Fig. 2 B is the generalized section of Fig. 2 A center line J-J.
Fig. 3 A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model the 3rd embodiment.
Fig. 3 B is the generalized section of Fig. 3 A center line K-K.
The main element symbol description:
100,200,300: electronic installation
110: body
120,130,210,220,310,320: shell
122,212,222,312,322: metal level
124,214,224: non-metal shell
124a: surface
214a: outer surface
214b: inner surface
216: protective layer
T: thickness
Embodiment
First embodiment
Figure 1A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model first embodiment.See also Figure 1A, electronic installation 100 comprises a body 110 and two shells 120,130, and wherein shell 120 can be arranged on the body 110 with shell 130, and body 110 can be held between shell 120 and the shell 130.
Mandatory declaration be that electronic installation 100 can be hand-hold electronic devices such as mobile phone, personal digital aid (PDA), notebook computer.Though the electronic installation 100 shown in Figure 1A is a mobile phone, the electronic installation 100 of Figure 1A is only for illustrating, and non-limiting the utility model.
Figure 1B is the generalized section of Figure 1A center line I-I.See also Figure 1A and Figure 1B, the shell 120 of electronic installation 100 comprises a metal level 122 and a non-metal shell 124 (the oblique line part shown in Figure 1A and Figure 1B), and wherein metal level 122 is covered in a surperficial 124a of non-metal shell 124.In the present embodiment, surperficial 124a can be the inner surface of non-metal shell 124.That is to say that metal level 122 can cover the inner surface of non-metal shell 124.
The thickness T of metal level 122 is between 0.5 micron to 24.9 microns, and the surface roughness of metal level 122 is between 0.4 micron to 500 microns, and wherein above-mentioned surface roughness is meant average surface roughness (Ra).Compared to utilizing the formed metal level of sputtering method and vapour deposition method at present, metal level 122 of the present utility model has thicker thickness and more coarse surface, and satisfy the metal level 122 of the condition of above-mentioned surface roughness, its surface presents the outward appearance of single-size, and visually can present the outward appearance kenel of cloudy surface.
For thickness and the roughness that makes metal level 122 can satisfy above-mentioned condition, metal level 122 can utilize the method beyond sputtering method and the vapour deposition method to make, and for example metal level 122 can be made with spray-gun process.Specifically, the step of spray-gun process comprises, at first, METAL HEATING PROCESS is become motlten metal, and wherein motlten metal can be liquid metal or the metal that presents the semi-molten state.Then, by Compressed Gas with molten metal sprays on the surperficial 124a of non-metal shell 124.So, metal level 122 is formed.
Spray-gun process can be implemented in general external environment, need not implement under vacuum environment.Therefore, needn't arrange in pairs or groups vacuum cavity and vacuum pump of spray-gun process.Compared to sputtering method and vapour deposition method, spray-gun process has very low cost of manufacture.In addition, in spray-gun process, motlten metal can form metal level 122 soon after being sprayed at surperficial 124a, so the time of utilizing spray-gun process formation metal level 122, not only Billy was shorter with the time that sputtering method or vapour deposition method form metal level, and the thickness of metal level 122 is thicker than sputtering method or the formed metal level of vapour deposition method.
When electronic installation 100 in when work, though body 110 can produce electromagnetic interference, metal level 122 can cover electromagnetic interference, leaks to avoid electromagnetic interference.In addition, metal level 122 more can be formed at the inner surface of shell 130.That is to say that the inner surface of shell 120,130 can be covered by metal level 122.So, electromagnetic interference can reduce significantly to the harmful effect of health.In addition, metal generally has good capacity of heat transmission, so metal level 122 heat energy that electronic installation 110 is produced more can spread apace and come, to help electronic installation 110 heat radiations.
In the present embodiment, the material of metal level 122 can be a nickel, tin, zinc, plumbous, aluminium, copper, magnesium, titanium, silver, the combination in any of gold or these metals, it also can be the combination in any of these metals and other metals, and the material of non-metal shell 124 can be a plastic material, for example is polyethylene, polyimides, propylene-butadiene-styrene copolymer compound, Merlon, poly-sulfonyl, acrylic resin, polyvinyl chloride, polyphenylene oxide, polystyrene, polyamide, nylon, polyene, Polyetherimide, polybutylene terephthalate, polyethylene terephthalate, polymethyl acrylate, the combination in any of polyamine formic acid esters or these materials.In addition, the material of non-metal shell 124 also can comprise carbon fibre material or other suitable nonmetallic materials.
Second embodiment
Fig. 2 A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model second embodiment, and Fig. 2 B is the generalized section of Fig. 2 A center line J-J.See also Fig. 2 A and Fig. 2 B, electronic installation 200 comprises body 110 and two shells 210 and 220.
Shell 210 comprises a metal level 212 and a non-metal shell 214, and shell 220 comprises a metal level 222 and a non-metal shell 224, wherein metal level 212 covers the outer surface 214a of non-metal shell 214, and metal level 222 equally also covers the outer surface of non-metal shell 224, and wherein the thickness of metal level 222 is between 0.5 micron to 3000 microns.
Hence one can see that, metal level 212 and metal level 222 all are covered in the outer surface of electronic installation 200, so metal level 212 not only can cover the electromagnetic interference that body 110 is produced with metal level 222, and can also make electronic installation 200 present the texture of metal in appearance.
In addition, metal has good capacity of heat transmission mostly, add that metal level 212 and metal level 222 all are positioned on the outer surface of electronic installation 200, so metal level 212 is discharged outside in the environment with the heat energy that metal level 222 can help electronic installation 200 to be produced.
In the present embodiment, the material of metal level 212 and metal level 222 is identical with the metal level 122 of previous embodiment, and metal level 212 all can be made with spray-gun process with metal level 222.Also the non-metal shell 124 with previous embodiment is identical for the material of non-metal shell 214 and non-metal shell 224.
In the present embodiment, shell 210 can also comprise a protective layer 216, and protective layer 216 covers metal level 212.Utilize the made metal level of spray-gun process 212 to have a lot of small pores usually, and for these pores are sealed, protective layer 216 form and also is covered on the metal level 212, to seal these pores.In the present embodiment, protective layer 216 can be selected the resin material of mobile good and good penetrability for use.For example, the material of protective layer 216 can be the combination in any of butyral resin, epoxy resin or these resin materials.In addition, shell 220 can also comprise protective layer 216, and this protective layer 216 also covers metal level 222, and then a plurality of small pore of sealing metal layer 222.
What deserves to be mentioned is that protective layer 216 also can be applied among first embodiment.Specifically, the metal level 122 (please join Figure 1B shown in) of protective layer 216 on also can covering surfaces 124a, or can be covered in the metal level of shell 130.That is to say; protective layer 216 can cover the metal level 122 (shown in Figure 1B) that is positioned on non-metal shell 124 inner surfaces (being surperficial 124a); also can cover the metal level 212 (shown in Fig. 2 B) that is positioned on the non-metal shell 214 outer surface 214a, so emphasize that at this utility model does not limit on the outer surface that protective layer 216 is disposed at non-metal shell or on the inner surface.
Secondly, it must be emphasized that protective layer 216 is not to be the necessary member of shell 210 or shell 220.That is to say that shell 210 also can not comprise protective layer 216 with shell 220.Hence one can see that, and the protective layer 216 shown in Fig. 2 B only for illustrating, is emphasized and non-limiting the utility model at this.
The 3rd embodiment
Fig. 3 A is the decomposing schematic representation of the electronic installation that illustrated according to the utility model the 3rd embodiment, and Fig. 3 B is the generalized section of Fig. 3 A center line K-K.See also Fig. 3 A, electronic installation 300 comprises body 110 and two shells 310,320, and wherein shell 310 comprises a non-metal shell 214 and a metal level 312, and shell 320 comprises a non-metal shell 224 and a metal level 322.
Present embodiment is similar to previous embodiment, and the shell 310,320 of present embodiment and the difference of previous embodiment are, metal level 312 covers the inner surface 214b and the outer surface 214a of non-metal shell 214, and metal level 322 equally also covers the inner surface and the outer surface of non-metal shell 224.
In the present embodiment, the thickness of the metal level 322 of covering outer surface 214a or non-metal shell 224 outer surfaces is between 0.5 micron to 3000 microns, and the thickness of the metal level 322 of covering inner surface 214b or non-metal shell 224 inner surfaces is between 0.5 micron to 24.9 microns.
In sum, by the metal level on the surface that covers non-metal shell, the shell of electronic installation of the present utility model can cover electromagnetic interference, and then reduces the harmful effect of electromagnetic interference to health.
In addition, metal level can cover the outer surface of non-metal shell, or covers the inner surface and the outer surface of non-metal shell simultaneously.Therefore, the utility model can make electronic installation present the texture of metal in appearance, and the heat energy that can also help electronic installation to produce is discharged outside in the environment.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when doing a little modification and perfect, therefore protection range of the present utility model is worked as with being as the criterion that claims were defined.
Claims (11)
1. the shell of an electronic installation is suitable for being arranged on the body of an electronic installation, it is characterized in that the shell of this electronic installation comprises:
One non-metal shell; And
One metal level is covered in a surface of this non-metal shell, and wherein this metal layer thickness is between 0.5 micron to 3000 microns, and the surface roughness of metal level is between 0.4 micron to 500 microns.
2. the shell of electronic installation as claimed in claim 1 is characterized in that, the material of this metal level is to be selected from by nickel, tin, zinc, lead, aluminium, copper, magnesium, titanium, silver and the golden group that forms.
3. the shell of electronic installation as claimed in claim 1, it is characterized in that the material of this non-metal shell is to be selected from the group that is made up of polyethylene, polyimides, propylene-butadiene-styrene copolymer compound, Merlon, poly-sulfonyl, acrylic resin, polyvinyl chloride, polyphenylene oxide, polystyrene, polyamide, nylon, polyene, Polyetherimide, polybutylene terephthalate, polyethylene terephthalate, polymethyl acrylate and polyamine formic acid esters.
4. the shell of electronic installation as claimed in claim 1 is characterized in that, the material of this non-metal shell comprises carbon fibre material.
5. the shell of electronic installation as claimed in claim 1 is characterized in that, also comprises a protective layer, and this protective layer covers this metal level.
6. the shell of electronic installation as claimed in claim 5 is characterized in that, the material of this protective layer is to be selected from the group that is made up of butyral resin and epoxy resin.
7. the shell of electronic installation as claimed in claim 1 is characterized in that, this metal level covers the outer surface of this non-metal shell.
8. the shell of electronic installation as claimed in claim 1 is characterized in that, this metal level covers the inner surface of this non-metal shell.
9. the shell of electronic installation as claimed in claim 8 is characterized in that, this metal layer thickness is between 0.5 micron to 24.9 microns.
10. the shell of electronic installation as claimed in claim 1 is characterized in that, this metal level covers the outer surface and the inner surface of this non-metal shell.
11. the shell of electronic installation as claimed in claim 1 is characterized in that, this metal level is made with spray-gun process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201940522U CN201119148Y (en) | 2007-11-05 | 2007-11-05 | Electronic device shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201940522U CN201119148Y (en) | 2007-11-05 | 2007-11-05 | Electronic device shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201119148Y true CN201119148Y (en) | 2008-09-17 |
Family
ID=39993754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201940522U Expired - Fee Related CN201119148Y (en) | 2007-11-05 | 2007-11-05 | Electronic device shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201119148Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014166238A1 (en) * | 2013-08-21 | 2014-10-16 | 中兴通讯股份有限公司 | Mobile terminal and heat dissipation method of liquid metal of same |
| CN104497543A (en) * | 2014-12-08 | 2015-04-08 | 国家电网公司 | Shell of small and special electrical machine and application of shell |
| CN105826343A (en) * | 2016-05-03 | 2016-08-03 | 奕瑞影像科技（太仓）有限公司 | Electromagnetic shielding structure used for X-ray flat plane detector and preparation method |
| CN106832862A (en) * | 2017-02-28 | 2017-06-13 | 深圳市景创科技电子有限公司 | A kind of radiation proof material for handle casing and preparation method thereof |
| CN107312293A (en) * | 2017-06-14 | 2017-11-03 | 安徽华昊机械制造有限公司 | A kind of preparation method of electric machine casing |
-
2007
- 2007-11-05 CN CNU2007201940522U patent/CN201119148Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014166238A1 (en) * | 2013-08-21 | 2014-10-16 | 中兴通讯股份有限公司 | Mobile terminal and heat dissipation method of liquid metal of same |
| CN104497543A (en) * | 2014-12-08 | 2015-04-08 | 国家电网公司 | Shell of small and special electrical machine and application of shell |
| CN105826343A (en) * | 2016-05-03 | 2016-08-03 | 奕瑞影像科技（太仓）有限公司 | Electromagnetic shielding structure used for X-ray flat plane detector and preparation method |
| CN105826343B (en) * | 2016-05-03 | 2020-05-19 | 奕瑞影像科技（太仓）有限公司 | Electromagnetic shielding structure for X-ray flat panel detector and preparation method |
| CN106832862A (en) * | 2017-02-28 | 2017-06-13 | 深圳市景创科技电子有限公司 | A kind of radiation proof material for handle casing and preparation method thereof |
| CN107312293A (en) * | 2017-06-14 | 2017-11-03 | 安徽华昊机械制造有限公司 | A kind of preparation method of electric machine casing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20101105 |