CN207885103U - A kind of electromagnetic shielding film - Google Patents
A kind of electromagnetic shielding film Download PDFInfo
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- CN207885103U CN207885103U CN201820124024.1U CN201820124024U CN207885103U CN 207885103 U CN207885103 U CN 207885103U CN 201820124024 U CN201820124024 U CN 201820124024U CN 207885103 U CN207885103 U CN 207885103U
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Abstract
The utility model provides a kind of electromagnetic shielding film, including at least one layer of electro-magnetic screen layer, the side of electro-magnetic screen layer is adhesive linkage, the other side is insulating layer, the at least one side of insulating layer is coarse, roughness is 2~10 μm, electro-magnetic screen layer is copper plate or silver coating, adhesive linkage is modified epoxy layer, modified polyurethane layer or Modified acrylate adhesive layer, insulating layer also has inorganic particulate adhesive layer with electromagnetic shielding interlayer, the thickness of insulating layer is 1~10 μm, the thickness of electro-magnetic screen layer is 10~5000nm, the outer surface of adhesive layer also coated with protective film, electromagnetic shielding film further includes release carrier layer.The utility model to insulating layer outer surface by being coated with resin or adhesive containing inorganic particulate, or inorganic particulate is directly added in insulating layer material, form the coarse insulating layer in outer surface, achieve the purpose that carry out roughening treatment to insulating layer and electro-magnetic screen layer faying face, significantly reduces ground resistance when electromagnetic shielding film application.
Description
Technical field
The utility model belongs to insulation technology field, and in particular to a kind of electromagnetic shielding film.
Background technology
In recent years, with the substantial increase of electromagnetic wave application demand, people gradually go deep into the progress of electromagnetic wave,
Its application band is developed more and more.In order to meet the needs of remote transmission and detection, the equipment such as radar, satellite communication
Electromagnetic radiation power also gradually increasing, electromagnetic intensity greatly improves, especially the wide wave from radio wave to microwave
Section.Currently, electromagnetic wave is commonly utilized in the every field such as health care, television broadcasting, mobile communication and optics, carried for life
Many facilities are supplied, but excessive application electromagnetic wave causes a degree of Contamination of Electromagnetic Wave so that the electromagnetism of space background
Environment increasingly complex, every field start to propose the requirement of electromagnetism interference one after another.The research of optical technology continued in recent years
Deeply, the electricity that it also needs that system will be generated interference under the premise of meeting normal use using diversity requirements of optical system
Magnetic wave effectively masks, and especially in fields such as military and aerospaces, applies in various weaponrys and carry-on light
It learns observation and detecting devices must simultaneously meet two aspects and require：On the one hand electronic device in influence system can be worked normally
It is effectively masked with the electromagnetic wave for generating interference to signal receiver, on the other hand also to have both excellent light transmission features, make
It does not influence optical system imaging quality, to meet the requirement of equipment detection and observation.In order to solve the problems, such as electromagnetic shielding, start
Continuous research and development electromagnetism product shield technology.
The core of wiring board screened film is electro-magnetic screen layer, surrounds electro-magnetic screen layer, many various level shapes occurs
The electromagnetic shielding film of formula.CN103763893A discloses a kind of electromagnetic shielding film and the printed wiring board comprising screened film, system
Include that will be bonded electromagnetic shielding film and wiring board using the rough surface of electro-magnetic screen layer in thickness direction hot-press solidifying as method
Layer is pierced through and is grounded, or electromagnetic shielding film and wiring board are pierced through using conductive materials and shielded in thickness direction hot-press solidifying
Cover film to be grounded, or by electromagnetic shielding film and wiring board in thickness direction hot-press solidifying, formed in the circuit board through-hole or
Hole metallization is grounded by blind hole, and conducting particles is free of in the screened film adhesive linkage of the invention, cost is reduced, reduces
Insertion loss can meet the growth requirement of electronic product high-speed high frequency, however the invention carries out roughening institute to shielding layer surface
The method used needs first to be roughened and cures afterwards for the roughening of copper foil method of wiring board, then is passivated, or using the side of wiring board microetch
Method is first roughened and is passivated again, and reagent used in these method of roughening is possible to pollute the environment, and some is practical even containing toxic
Substance.CN106061107A discloses a kind of rigid-flex circuit board and preparation method thereof of tool electromagnetic shielding film, the tool electromagnetism
The rigid-flex circuit board of screened film, including rigid region and flexure region, rigid region include the first rigidity stacked gradually
Daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board, flexure region include the electromagnetic shielding film stacked gradually,
Cover film, flexible daughter board, cover film and electromagnetic shielding film, electromagnetic shielding film include the first release film being cascading,
The rigid-flex circuit board of insulating layer and conductive viscose layer, the tool electromagnetic shielding film of the invention is by rigid-flex combined board system
It is completed during making after taking off lid exposing flexible region, makes electromagnetic shielding film energy in bonding processes using the auxiliary spacer specially designed
Well be under pressure with heat and be reliably attached to flexible region surface, however the material of the invention conductive viscose layer be copper starch or
Silver paste, cost are higher.CN104883866A discloses a kind of electromagnetic shielding film and its manufacturing process with thermal conductive resin, should
Electromagnetic shielding film includes：Carrier layer, flexible oil layer of ink, heat conduction ink layer and the conductive gluing being coated on heat conduction ink layer
Oxidant layer, heat conduction ink layer impart the good heat conductivility of electromagnetic shielding film, and thermal coefficient is up to 2.0W/m*k or more, flexible oil
Layer of ink makes the electromagnetic shielding film have good flexibility, meets the use demand of flexible circuit board, the manufacturing process of the invention
It is easy to implement in existing industrial production, facilitate commercial introduction application, however, the invention screened film level is more, increases system
Cause this.
Currently, all containing conductive adhesive layer in the basic structure of screened film, conductive adhesive layer will increase the insertion loss of wiring board,
The metallic contained in conductive adhesive layer simultaneously can reduce the bending of wiring board.Therefore, to meet according to demand, it is desirable to can be with
It is changed by generation type, material type and the hierarchical structure to electro-magnetic screen layer and insulating layer, obtains being free of conducting resinl
The electromagnetic shielding film of layer, to avoid the reduction of insertion loss and bending performance.
Utility model content
To solve the deficiencies in the prior art, the purpose of this utility model is to provide a kind of electromagnetic shielding film.
To realize that above-mentioned target, the utility model use following technical scheme：
A kind of electromagnetic shielding film includes at least one layer of electro-magnetic screen layer, and the side of the electro-magnetic screen layer is adhesive linkage,
The other side is insulating layer, and at least one side of the insulating layer is coarse, and roughness is 2~10 μm, preferably 1~8 μm.
Preferably, the electro-magnetic screen layer is copper plate or silver coating.
Preferably, the electro-magnetic screen layer is metal material copper plate or metal material silver coating.
It is further preferred that the metal material is one kind in aluminium, titanium, zinc, iron, nickel, chromium, cobalt or copper simple substance.
It is further preferred that the metal material is at least two shapes in aluminium, titanium, zinc, iron, nickel, chromium, cobalt or copper simple substance
At alloy.
Preferably, the adhesive linkage is modified epoxy layer, modified polyurethane layer or Modified acrylate adhesive layer.
Preferably, the insulating layer is the modified polyurethane layer containing inorganic particulate, modified acroleic acid ester layer or modified ring
Oxygen insulating oil layer of ink.
Preferably, the insulating layer also has inorganic particulate adhesive layer with electromagnetic shielding interlayer.
Preferably, the grain size of the inorganic particulate is 2-15 μm.
Preferably, the thickness of the adhesive linkage is 1~15 μm.
Preferably, the thickness of the insulating layer is 1~10 μm.
Preferably, the thickness of the electro-magnetic screen layer is 10~5000nm, and the electro-magnetic screen layer is copper plate or silver-plated
Layer.
Preferably, the outer surface of the adhesive layer also coated with protective film.
Preferably, the electromagnetic shielding film further includes basilar memebrane and/or protective film.
The beneficial effects of the utility model
1, on the basis of existing technology, the utility model to insulating layer outer surface by being coated with the tree containing inorganic particulate
Fat or adhesive, or inorganic particulate is directly added in insulating layer material, the coarse insulating layer in outer surface is formed, is reached to exhausted
Edge layer and electro-magnetic screen layer faying face carry out the purpose of roughening treatment, significantly reduce ground connection electricity when electromagnetic shielding film application
Resistance；
2, the utility model has equally reached the conductive effect brought with conducting resinl, ground resistance using the adhesive linkage of insulation
It significantly reduces, advantageously reduces the electromagnetic interference of wiring board, improve the transmission performance of signal, while shielding film heat resistance, stripping
Not by harmful effect, bending resistance is obviously improved intensity, and product service life increases.
Description of the drawings
Fig. 1 is the structural schematic diagram for the electromagnetic shielding film that insulating layer contains inorganic particulate adhesive layer with electromagnetic shielding interlayer.
Fig. 2 is the structural schematic diagram for the electromagnetic shielding film that insulating layer contains inorganic particulate.
Specific implementation mode
Following embodiment is intended to further illustrate the utility model content, rather than limits the utility model claims
Protection domain.
Embodiment 1
As shown in Figure 1, a kind of electromagnetic shielding film, carrier film 4 is equipped with insulating layer 2, and insulating layer 2 is equipped with electromagnetic shielding
Layer 1, electro-magnetic screen layer 1 are equipped with adhesive linkage 3, and 3 surface of adhesive linkage posts protective film 6, wherein carrier film 4 be containing non-silicon from
The PET film of proximate matter material.There is inorganic particulate adhesive layer 5 between electro-magnetic screen layer 1 and insulating layer 2.
Embodiment 2
As shown in Fig. 2, a kind of electromagnetic shielding film, carrier film 4 is equipped with insulating layer 2, and insulating layer 2 is equipped with electromagnetic shielding
Layer 1, electro-magnetic screen layer 1 are equipped with adhesive linkage 3, and coated with protective film 6 is covered in 3 outer surface of adhesive linkage, and it is grain that grain size is contained in insulating layer 2
The inorganic particulate that diameter is 2~15 μm.Wherein, contact surface 7 not exclusively smooth, insulating layer 2 and the electromagnetism of insulating layer 2 and carrier film 4
The roughness of the contact surface 5 of shielded layer 1 is 2~10 μm.Carrier film 4 is PET weight release films.
The preparation method of electromagnetic shielding film, includes the following steps in embodiment 1 and embodiment 2：
(1) it is coated with to form insulating layer 2 in 4 side of carrier film, roughening treatment is carried out to insulating layer 2, or in 2 material of insulating layer
Middle addition inorganic particulate forms the insulating layer 2 with coarse surface；
(2) pass through vacuum evaporation in step (1) treated coarse surface or sputter forms electro-magnetic screen layer 1；
(3) it is coated with to form adhesive linkage 3 in 1 surface of electro-magnetic screen layer that step (2) is formed；
(4) protective film 6 is posted in 3 surface of adhesive linkage that step (3) is formed.
In step (1), roughening treatment is in modified epoxy of 2 outer surface of the insulating layer coating containing inorganic particulate, changes
Property polyurethane or Modified acrylate adhesive, such as the inorganic particulate adhesive layer in embodiment 1.
The present embodiment is then that inorganic particulate is added in insulating layer material, forms the insulating layer with coarse surface.
Comparative example 1
A kind of electromagnetic shielding film, carrier film are equipped with insulating layer, and insulating layer is equipped with electro-magnetic screen layer, electro-magnetic screen layer
It is equipped with adhesive linkage, wherein carrier film is PET weight release films.
The preparation method of the electromagnetic shielding film, includes the following steps：
(1) 50 μm of thickness is chosen, the PET weight release films of 250~1500mm of width apply layer of cloth in its layer upper surface side
Material forms the insulating layer that thickness is 2 μm after being fully cured；
(2) surface of insulating layer after step (1) solidification is directly sunk electromagnetic shielding layer material by vacuum evaporation mode
For product on coarse surface, deposition forms the electro-magnetic screen layer that thickness is 100nm；
(3) the electromagnetic shielding layer surface formed in step (2) is directly coated with bonding layer material and forms the bonding that thickness is 2 μm
Layer；
(4) the bonding layer surface formed in step (3) posts protective film.
Comparative example 2
A kind of electromagnetic shielding film, carrier film are equipped with insulating layer, and insulating layer is equipped with electro-magnetic screen layer, electro-magnetic screen layer
It is equipped with adhesive linkage, wherein carrier film is PET weight release films.
The preparation method of the electromagnetic shielding film, includes the following steps：
(1) 40 μm of thickness is chosen, the PET weight release films of 250~1500mm of width apply layer of cloth in its layer upper surface side
Material forms the insulating layer that thickness is 10 μm after being fully cured；
(2) electromagnetic shielding layer material is directly deposited on by sputtering way by the surface of insulating layer after step (1) solidification
On coarse surface, deposition forms the electro-magnetic screen layer that thickness is 500nm；
(3) the electromagnetic shielding layer surface formed in step (2) is directly coated with bonding layer material and forms the bonding that thickness is 8 μm
Layer；
(4) the bonding layer surface formed in step (3) posts protective film.
By the electromagnetic shielding film of embodiment 1 and embodiment 2, the electromagnetic wave shielding film properties with comparative example 1 and comparative example 2
It is compared, the results are shown in Table 1.
1 electromagnetic wave shielding film properties of table
| Performance test | Embodiment 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 |
| Ground resistance (ohm) | 0.4 | 0.2 | 1.2 | 0.8 |
| Peel strength (Kgf/cm) | 1.1 | 1.3 | 1.4 | 1.0 |
| Heat resistance (300 DEG C, wicking) | OK | OK | OK | OK |
| Bending resistance (secondary) | 15600 | 10800 | 8320 | 9350 |
Ground connection performance when the roughness in Coating combination face applies electromagnetic shielding film generates significant impact.Table 1 is real
Apply example 1~2 and comparative example 1~2 be compared, Coating combination face ground resistance after roughening treatment is remarkably decreased, this be by
After surface roughening treatment, in bonding processes, adhesive linkage glue surface becomes the ground connection that soft flow makes electro-magnetic screen layer and wiring board
Contact pads significantly reduce ground resistance.The optimal roughness of surface of insulating layer roughening treatment is 1~8 μm, coarse to spend
It is small, it is more demanding to pressing segment difference, it is easy poor contact, causes ground resistance to increase, excessive roughness can lead to adhesive linkage
Crawling.
The utility model remains to reach the conductive effect brought with conducting resinl using the adhesive linkage of insulation, and ground resistance reduces
The electromagnetic interference of wiring board is advantageously reduced, signal transmission performance is improved.Other performance illustrates electromagnetic wave shielding without significant change
For film under the premise of ensureing electromagnetic shielding and good electric conductivity (low ground resistance) effect, other performance is not by harmful effect.
Bending resistance significantly rises, and is conducive to the extension of product service life.
Above-described embodiment is the preferable implementation of the utility model, and in addition to this, the utility model can be with other sides
Formula realizes that any obvious replacement is in the protection model of the utility model without departing from the concept of the premise utility
Within enclosing.
Claims (10)
1. a kind of electromagnetic shielding film, which is characterized in that include at least one layer of electro-magnetic screen layer, the side of the electro-magnetic screen layer
It is adhesive linkage, the other side is insulating layer, and at least one side of the insulating layer is coarse, and roughness is 2~10 μm.
2. electromagnetic shielding film according to claim 1, which is characterized in that the electro-magnetic screen layer is copper plate or silver-plated
Layer.
3. electromagnetic shielding film according to claim 1, which is characterized in that the adhesive linkage be modified epoxy layer,
Modified polyurethane layer or Modified acrylate adhesive layer.
4. electromagnetic shielding film according to claim 1, which is characterized in that the insulating layer is changing containing inorganic particulate
Property layer of polyurethane, modified acroleic acid ester layer or modified epoxy insulating oil layer of ink.
5. electromagnetic shielding film according to claim 1, which is characterized in that the insulating layer also has with electromagnetic shielding interlayer
Inorganic particulate adhesive layer.
6. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the adhesive linkage is 1~15 μm.
7. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the insulating layer is 1~10 μm.
8. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the electro-magnetic screen layer be 10~
5000nm。
9. electromagnetic shielding film according to claim 1, which is characterized in that also post protection in the outer surface of the adhesive linkage
Film.
10. electromagnetic shielding film according to claim 1, which is characterized in that the electromagnetic shielding film further includes substrate
Film and/or protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820124024.1U CN207885103U (en) | 2018-01-24 | 2018-01-24 | A kind of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820124024.1U CN207885103U (en) | 2018-01-24 | 2018-01-24 | A kind of electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207885103U true CN207885103U (en) | 2018-09-18 |
Family
ID=63508300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820124024.1U Active CN207885103U (en) | 2018-01-24 | 2018-01-24 | A kind of electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207885103U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109831904A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film and preparation method thereof |
| CN111954369A (en) * | 2020-08-23 | 2020-11-17 | 东莞市惟实电子材料科技有限公司 | Electromagnetic shielding film insulating layer with thickness of 3-12 microns |
| WO2022016687A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
-
2018
- 2018-01-24 CN CN201820124024.1U patent/CN207885103U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109831904A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film and preparation method thereof |
| WO2022016687A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
| CN111954369A (en) * | 2020-08-23 | 2020-11-17 | 东莞市惟实电子材料科技有限公司 | Electromagnetic shielding film insulating layer with thickness of 3-12 microns |
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