M3 3 0724 八、新型說明： 【新型所屬之技術領域】 本創作是有關於-種電子裝置的外殼，且特別是有關 於一種具有金屬層之電子裝置的外殼。 【先前技術】 ..現今的手機、筆記型電腦與個人助理器（Pers〇nal Digital Assistant，PDA )等手持電子裝置（p〇rtaWe咖伽此 apparatus)在運作時都會產生電磁干擾㈤⑽馳㈣价 Interference，EMI)，而這種電磁干擾對人體健康會有不良 “為了降低電磁干擾對人體健康的不良影響，一些手持 電子裂置的㈣電路與電子元件設計餘金屬外殼所包 覆。利用金屬的電磁屏蔽效應，手持電子裝置所產生的電 磁干擾得以受到遮蔽。 然:，金屬外殼具有笨重以及生產不易等缺點。對 此:目别的做法是_频法或蒸舰在娜外殼的表面 上形成-金屬層。如此，手持電子裝置所產生的電磁干擾 得以受到此金屬層所遮蔽。 …'、而’為了考量製造所需要的時間錢本的問題，這 ΓΓΓ鱗法絲鍍法所軸的金屬層的厚料容易超過 、八只，平均表面粗糙度（Roughness average，Ra；)很低， j致於k種金屬層的表面在視覺上會呈現鏡面的外觀型 悲0 M330724 ，鍍法與療鍍法需要在真空環境下才能實施 ，即濺鍍 二二，鍍法必需搭配真空腔體（chamber)以及真空幫浦才 然而’真空轉與真空幫浦的造價十分昂貴，而 且，、空幫浦需要花費报長的時間才能將真空腔體内的氣體 抽出在真空腔_形成真空環境。因此，這種用藏鑛 法與条射形成金屬層的做法具有製作成本太高以及製作 時間太長的缺點。 【新型内容】 本創作是提供一種電子裝置的外殼，以遮蔽電子裝置 所產生的電磁干擾。 本創作是提供一種電子裝置的外殼，適於設置於一電 子裝置的一本體上。電子裝置的外殼包括一塑膠殼體以及 一金屬層。金屬層覆蓋於塑膠殼體的一表面，其中金屬層 的厚度介於〇·5微米至3000微米，而金屬層的表面粗糙度 介於0.4微米至500微米。 依ft?、本創作一貫施例所述之電子裝置的外殼，上述金 屬層的材質選自於由鎳、錫、鋅、錯、I呂、銅、鎂、鈦、 銀以及金所組成之族群。 依照本創作一實施例所述之電子裝置的外殼，上述塑 膠殼體的材質是選自於由聚乙稀（polyethylene, PE)、聚 醯亞胺（polyimide，PI)、丙烯-丁二烯-苯乙烯共聚合物 (acrylonitrile-butadiene-styrene copolymers, ABS)、聚碳 酸醋（polycarbonate)、聚硫醯（polysulfone，PSF)、丙M3 3 0724 VIII. New description: [New technical field] This creation is about the outer casing of an electronic device, and in particular relates to an outer casing of an electronic device having a metal layer. [Prior Art] .. Today's mobile phones, notebook computers and personal assistants (PDAs) and other handheld electronic devices (p〇rtaWe aga gamma this appratus) will generate electromagnetic interference when operating (5) (10) Chi (four) price Interference, EMI), and this kind of electromagnetic interference will have bad health to human body. "In order to reduce the adverse effects of electromagnetic interference on human health, some hand-held electronically cracked (four) circuits and electronic components are designed to cover the outer metal casing. Electromagnetic shielding effect, electromagnetic interference generated by handheld electronic devices can be shielded. However, the metal casing is cumbersome and difficult to produce, etc. This is done by the method of _frequency method or steamboat formation on the surface of the Na shell. - a metal layer. Thus, the electromagnetic interference generated by the handheld electronic device is obscured by the metal layer. ', and 'in order to consider the time and cost required for manufacturing, the metal of the shaft of the scale plating method The thick material of the layer is easy to exceed, eight, the average surface roughness (Roughness average, Ra;) is very low, j is the table of k kinds of metal layers The surface will be visually mirrored. M330724, the plating method and the plating method need to be implemented in a vacuum environment, that is, the sputtering is required. The plating method must be combined with a vacuum chamber and a vacuum pump. 'The vacuum transfer and vacuum pump are very expensive. Moreover, the empty pump needs to take the time to report the gas in the vacuum chamber out of the vacuum chamber to form a vacuum environment. Therefore, this mining method and The method of forming a metal layer by striping has the disadvantages of high production cost and long production time. [New content] The present invention provides an outer casing of an electronic device to shield electromagnetic interference generated by an electronic device. The present invention provides an electronic device. The outer casing of the device is adapted to be disposed on a body of an electronic device. The outer casing of the electronic device comprises a plastic casing and a metal layer. The metal layer covers a surface of the plastic casing, wherein the thickness of the metal layer is between 5 micrometers to 3000 micrometers, and the surface roughness of the metal layer is between 0.4 micrometers and 500 micrometers. According to the ft? The outer casing, the material of the metal layer is selected from the group consisting of nickel, tin, zinc, aluminum, copper, magnesium, titanium, silver, and gold. The outer casing of the electronic device according to an embodiment of the present invention, The material of the plastic case is selected from the group consisting of polyethylene (PE), polyimide (PI), acrylonitrile-butadiene-styrene copolymers (ABS). ), polycarbonate, polysulfone (PSF), C
M3 3 0724 烯酸樹脂（acrylic resin)、聚氯乙烯（polyvinyl chloride， PVC)、聚苯(polyphenylene ether，PPE)、聚苯乙烯 (polystyrene，PS)、聚醯胺（polyamide，PA)、尼龍、聚 烯（polyolefin)、聚醚醯亞胺（polyetherimide)、聚對苯 二甲酸 丁二酯（polybutylene terephthalate，PBT )、聚對苯 二甲酸乙酯（polyethylene terephthalate )、聚丙烯酸曱酯 (polymethylacrylate)以及聚胺甲酸醋（polyurethane，PU ) 所組成之族群。 依照本創作一實施例所述之電子裝置的外殼，更包括 一保護層，且保護層覆蓋金屬層。 依照本創作一實施例所述之電子裝置的外殼，上述保 漢層的材質疋選自於由丁酸:樹脂以及環氧 樹脂（epoxy resin)所組成之族群。 依照本創作一實施例所述之電子裝置的外殼，上述金 屬層覆蓋塑膠殼體的外表面。 依照本創作一實施例所述之電子裝置的外殼，上述金 屬層覆蓋塑膠殼體的内表面。 依照本創作一實施例所述之電子裝置的外殼，上述金 屬層的厚度介於〇·5微米至24·9微米。 依知本創作一實施例所述之電子裝$的外殼，上述金 屬層覆蓋塑膠殼體的外表面與内表面。 屬屏作—實施觸述之電子裝置的外殼，上述金 屬層1金屬噴塗法（MetalSpraying)所製成。 猎上逑金屬層，本創作之電子裝置的外殼能屏敝電 M3 3 0724 子裝置所產生的電磁干擾，以避免電磁干擾外洩，進而降 低電磁干擾對人體健康的不良影響。 為讓本創作之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉一些實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 【第一實施例】 圖1A是根據本創作第一實施例所繪示的電子裝置之 分解示意圖。請參閱圖1A，電子裝置10〇包括一本體11〇 以及二外殼120、130，其中外殼12〇與外殼13〇可設置於 一本體110上，而本體110可被夾持於外殼12〇與外殼13〇 之間。 必須說明的是，電子裝置100可以是手機、個人數位 助理器、筆記型電腦等手持電子裝置。雖然圖1A所示的 電子裝置100為手機，但是圖1A的電子裝置⑽僅為舉 例說明，並非限定本創作。 圖1B是圖1A中線14的剖面示意圖。請參閱圖1A 與圖1B’電子裝置100的外殼120包括—金屬層122以及 一塑膠殼體124(^A與圖1B中所示的斜線部分），並 中金屬層122¾蓋於塑膠殼體124的—表面㈣。在本^ 施例中，表面124a可以是塑膠殼體124的内表面。也= 說，金屬層122可覆蓋塑膠殼體124的内表面。，疋 金屬層m的厚度τ介於0 5微米至⑽微米，而金 M3 3 0724 屬層122的表面粗糙度介於〇·4微米至5〇〇微米，其中上 述表面粗糙度是指平均表面粗糙度（Ra)。相較於習知利 用濺鍍法與蒸鍍法所形成的金屬層而言，本創作的金屬層 122具有較厚的厚度以及較粗糙的表面，而滿足上述表面 粗糙度之條件的金屬層122,其表面呈現均勻顆粒的外 觀，且在視覺上會呈現霧面的外觀型態。 為了使金屬層122的厚度與粗糙度能滿足上述的條 件，金屬層122可以利用濺鍍法與蒸鍍法以外的方法來製 成，例如金屬層122可以用金屬喷塗法來製成。詳細而言: 金屬喷塗法的步驟包括，首先，將金屬加熱祕融金屬， 其中熔融金屬可以是液態金屬或是呈現半熔化狀態的金 屬。接著，藉由壓縮氣體將溶融金屬噴塗在塑膠殼體124 的表面124a上。如此，金屬層122得以形成。 扣金屬喷塗法可以在一般外界環境中實施，不需要在真 空環境下實施。因此，金屬噴塗法不必搭配真空腔體與真 空幫浦。相較於濺鍍法與蒸鍍法而言，金屬喷塗法具有很 低的製作成本。另外，在金屬喷塗法中，熔融金屬在喷塗 、/表面124a之後會很快地形成金屬層122，故利用金屬喷 塗法形成金屬層122的時間不但比利用濺鍍法或蒸鍍法形 成金屬層的時間更短，且金屬層122的厚度比濺鍍法或蒸 鍍法所形成的金屬層更厚。 當電子裝置100在運作時，本體110雖然會產生電磁 干擾，但是金屬層122會遮蔽電磁干擾，以避免電磁干擾 外茂。此外，金屬層122更可以形成於外殼13〇的内表面。 M3 3 0724 也就是說’外殼120、no的内表面皆可以被金屬層122 所覆蓋。如此，電磁干擾對人體健康的不良影響能大幅地 降低。此外，金屬一般具有很好的熱傳導能力，因此金屬 層122能使電子裝置11〇所產生的熱能更能快速地擴散開 來’以幫助電子裝置110散熱。 在本實施例中，金屬層122的材質可以是鎳、錫、鋅、 鉛、鋁、銅、鎂、鈦、銀、金或這些金屬的任意組合，也 可以是這些金屬與其他金屬的任意組合，而塑膠殼體124 的材質可以是聚乙烯、聚醯亞胺、丙烯_丁二烯_苯乙烯共 聚合物、聚碳酸酯、聚硫醯、丙烯酸樹脂、聚氯乙烯、聚 笨醚、聚苯乙烯、聚酿胺、尼龍、聚烯、聚_目藍亞胺、聚 對笨一曱酸丁二酯、聚對苯二曱酸乙酯、聚丙烯酸曱酯、 聚胺曱酸酯或這些材料的任意組合。 【第二實施例】 圖2A是根據本創作第二實施例所緣示的電子裝置之 分解示意圖，而圖2B是圖2A中線J-J的剖面示意圖。請 參閱圖2A與圖2B，電子裝置2〇〇包括本體no以及二外 殼 210 與 220。 外殼210包括一金屬層212與一塑膠殼體214，而外 殼220包括一金屬層222與一塑膠殼體224，其中金屬層 212覆蓋塑膠殼體214的外表面214a，而金屬層222同樣 也覆蓋塑膠殼體224的外表面，其中金屬層222的厚度介 於0.5微米至3000微米。 由此可知，金屬層212與金屬層222皆覆蓋於電子襞 M330724 置200的外表面，所以金屬層212與金屬層222不但可以 遮蔽本體110戶斤產生的電磁干擾，而且還能使電子裝置2⑻ 在外觀上呈現金屬的質感。 此外，金屬大多具有很好的熱傳導能力，加上金屬層 212與金屬層222皆位於電子裝置2〇〇的外表面上，因此 金屬層212與金屬層222可以幫助電子裝置2〇0所產生的 熱能排出至外界環境中。 在本只轭例中，金屬層212與金屬層222的材質盘前 述實施例的金屬層122相同，且金屬層212與金屬層⑽ 白可以用金屬喷塗法來製成。塑勝殼體214與塑膠殼體 的材質也與前述實施例的塑膠殼體124相同。 在本實施例中，外殼210更可以包括一保護層216， 且保遵層216覆1金屬層212。利用金屬喷塗法所製成的 金屬層加通常具有很多微小的細孔，而為了將這些細孔 密封，保護層216形成並覆蓋於金屬層212上，以密封這 些細孔。在本實施例中，保護層216可選用流動性佳與滲 透性好的樹脂材料。舉例而言，保護層2丨6的材質可以是 丁，樹脂、環氧樹脂或這些樹脂材料的任意組合。另外， 外忒220亦可更包括保護層216，而且此保護層216亦覆 蓋金屬^ 222，進而密封金屬層222❾多個微小的細孔。 a值知一提的是，保護層216亦可以應用於第一實施例 中。詳e之，保護層216也亦可以覆蓋表面12扣上的金屬 層122(請參圖1B所示），或是可以覆蓋於外殼13〇的金 屬層。也就疋說，保護層216可以覆蓋位於塑膠殼體124 M330724 内表面（即表面124a)上的金屬層122 (如圖1B所示）， 也可以覆蓋位於塑膠殼體214外表面214a上的金屬層212 (如圖2B所示）’故在此強調本發明並不侷限保護層216 ' 配置於塑膠殼體的外表面上或内表面上。 ’ 其次’必須強調的是’保護層216並非是外殼210或 . 外殼220的必要構件。也就是說，外殼21〇與外殼220亦 … 可以不包括保護層216。由此可知，圖2Β所示的保護層 216僅為舉例說明，在此強調並非限定本創作。 【第三實施例】 圖3Α是根據本創作第三實施例所緣示的電子裝置之 分解示意圖，而圖3Β是圖3Α中線Κ-Κ的剖面示意圖。 請參閱圖3Α，電子裝置300包括本體11〇與二外殼^1〇、 320 ’其中外设310包括塑膠殼體214與一金屬層312，而 外殼320包括塑膠殼體224與一金屬層322。曰 本實施例與前述實施例相似，而本實施例的外殼 310、320與前述實施例的不同之處在於，金屬層312覆蓋 • 塑膠殼體214的内表面214b與外表面214a，而^屬層 同樣也覆蓋塑膠殼體224的内表面與外表面。 在本實施例中，覆蓋外表面214a <塑膠殼體224外 表面的金屬層322的厚度介於〇·5微米至3〇〇〇微米，而覆 蓋内表面214b或塑膠殼體224内表面的金 2 介於0.5微米至24.9微米。 - 综上所述’藉由覆蓋塑膠殼體之表面的金屬層，本創 作之電子裝置的外殼能遮蔽電磁干擾，進而降低電磁干擾 M330724 對人體健康的不良影響。 此外，金屬層可覆蓋塑膠殼體的外表面，或者η 覆盍塑膠殼體的内表面與外表面。因此，本創作能使 裝置在外觀上壬現金屬的質感，而且還能幫助電子罟 產生的熱能排出至外界環境中。 又所 雖然本創作已以實施例揭露如上，然其並非用 本創作，任何熟習本創作所屬領域之具有通常知 不脫離本創作之精神和_内，當可作些許之更 ，’因此本創作之賴範圍當視後附之中請專利範園;斤界 定者為準 * 【圖式簡單說明】 圖1Α是根據本創作第一實施例所繪示的電子裝置之 分解示意圖。 圖1Β是圖1Α中線ι_ι的剖面示意圖。 圖2A是根據本創作第二實施例所繪示的電子裝置 分解不意圖。 圖2B是圖2A中線j_j的剖面示意圖。 圖3A是根據本創作第三實施例所繪示的電子裝置之 分解示意圖。 圖3B是圖3A中線K-K的剖面示意圖。 【主要元件符號說明】 100、200、300 :電子裝置 12 M330724 110 :本體 120、130、210、220、310、320 :外殼 122、212、222、312、322 :金屬層 124、214、224 :塑膠殼體 124a :表面 214a :外表面 214b :内表面 216 :保護層 T :厚度 < S > 13M3 3 0724 Acrylic resin, polyvinyl chloride (PVC), polyphenylene ether (PPE), polystyrene (PS), polyamide (PA), nylon, Polyolefin, polyetherimide, polybutylene terephthalate (PBT), polyethylene terephthalate, polymethylacrylate, and a group of polyurethanes (PU). The housing of the electronic device according to an embodiment of the present invention further includes a protective layer, and the protective layer covers the metal layer. According to the outer casing of the electronic device of the embodiment, the material of the protective layer is selected from the group consisting of butyric acid: resin and epoxy resin. According to the outer casing of the electronic device of the embodiment, the metal layer covers the outer surface of the plastic casing. According to the outer casing of the electronic device of the embodiment, the metal layer covers the inner surface of the plastic casing. According to the outer casing of the electronic device of the embodiment of the present invention, the metal layer has a thickness of from 〇5 μm to 24·9 μm. According to an embodiment of the electronic device of the embodiment, the metal layer covers the outer surface and the inner surface of the plastic casing. It is a screen--the outer casing of the electronic device that implements the touch, and the above-mentioned metal layer 1 is made by metal spraying method (MetalSpraying). Hunting on the metal layer, the outer casing of the electronic device of this creation can shield the electromagnetic interference generated by the M3 3 0724 sub-device to avoid leakage of electromagnetic interference, thereby reducing the adverse effects of electromagnetic interference on human health. The above and other objects, features and advantages of the present invention will become more apparent and understood. [Embodiment] FIG. 1A is an exploded perspective view of an electronic device according to a first embodiment of the present invention. Referring to FIG. 1A, the electronic device 10 includes a body 11 and two outer casings 120 and 130. The outer casing 12 and the outer casing 13 can be disposed on a body 110, and the body 110 can be clamped to the outer casing 12 and the outer casing. Between 13 。. It should be noted that the electronic device 100 may be a handheld electronic device such as a mobile phone, a personal digital assistant, or a notebook computer. Although the electronic device 100 shown in Fig. 1A is a mobile phone, the electronic device (10) of Fig. 1A is merely illustrative and does not limit the creation. Figure 1B is a schematic cross-sectional view of line 14 of Figure 1A. Referring to FIG. 1A and FIG. 1B, the outer casing 120 of the electronic device 100 includes a metal layer 122 and a plastic casing 124 (the oblique portion shown in FIG. 1B), and the metal layer 1223⁄4 is covered by the plastic casing 124. - surface (four). In this embodiment, the surface 124a may be the inner surface of the plastic housing 124. Also, the metal layer 122 may cover the inner surface of the plastic housing 124. The thickness τ of the base metal layer m is between 0 5 micrometers and (10) micrometers, and the surface roughness of the gold layer M3 3 0724 is 122 μm to 5 μm, wherein the surface roughness refers to the average surface. Roughness (Ra). Compared with the conventional metal layer formed by the sputtering method and the vapor deposition method, the metal layer 122 of the present invention has a thick thickness and a rough surface, and the metal layer 122 satisfies the condition of the surface roughness described above. The surface exhibits a uniform particle appearance and visually presents a matte appearance. In order to make the thickness and roughness of the metal layer 122 satisfy the above conditions, the metal layer 122 can be formed by a sputtering method other than the vapor deposition method, for example, the metal layer 122 can be formed by metal spraying. In detail: the steps of the metal spraying method include, first, heating the metal to a molten metal, wherein the molten metal may be a liquid metal or a metal exhibiting a semi-molten state. Next, the molten metal is sprayed onto the surface 124a of the plastic casing 124 by a compressed gas. As such, the metal layer 122 is formed. The buckle metal spraying method can be implemented in a general external environment and does not need to be implemented in a vacuum environment. Therefore, the metal spraying method does not have to be combined with a vacuum chamber and a vacuum pump. Metal spraying has a very low manufacturing cost compared to sputtering and evaporation. In addition, in the metal spraying method, the molten metal forms the metal layer 122 quickly after the spraying/surface 124a, so the time for forming the metal layer 122 by the metal spraying method is not only the sputtering method or the vapor deposition method. The time for forming the metal layer is shorter, and the thickness of the metal layer 122 is thicker than the metal layer formed by the sputtering method or the vapor deposition method. While the electronic device 100 is in operation, the body 110 may generate electromagnetic interference, but the metal layer 122 may shield electromagnetic interference to avoid electromagnetic interference. Further, the metal layer 122 may be formed on the inner surface of the outer casing 13A. M3 3 0724 means that the inner surfaces of the outer casing 120, no can be covered by the metal layer 122. Thus, the adverse effects of electromagnetic interference on human health can be greatly reduced. In addition, the metal generally has a good thermal conductivity, so that the metal layer 122 enables the thermal energy generated by the electronic device 11 to spread more rapidly to help dissipate heat from the electronic device 110. In this embodiment, the material of the metal layer 122 may be nickel, tin, zinc, lead, aluminum, copper, magnesium, titanium, silver, gold or any combination of these metals, or any combination of these metals and other metals. The plastic casing 124 may be made of polyethylene, polyimine, propylene-butadiene-styrene copolymer, polycarbonate, polysulfide, acrylic resin, polyvinyl chloride, polyether, poly Styrene, polyamine, nylon, polyolefin, poly-methylene imine, poly(p-butylene terephthalate), polyethyl terephthalate, polyethyl acrylate, polyamine phthalate or these Any combination of materials. [Second Embodiment] Fig. 2A is an exploded perspective view of an electronic device according to a second embodiment of the present invention, and Fig. 2B is a schematic cross-sectional view taken along line J-J of Fig. 2A. Referring to Figures 2A and 2B, the electronic device 2A includes a body no and two outer casings 210 and 220. The outer casing 210 includes a metal layer 212 and a plastic casing 214. The outer casing 220 includes a metal layer 222 and a plastic casing 224. The metal layer 212 covers the outer surface 214a of the plastic casing 214, and the metal layer 222 is also covered. The outer surface of the plastic housing 224, wherein the metal layer 222 has a thickness of between 0.5 micrometers and 3000 micrometers. Therefore, the metal layer 212 and the metal layer 222 cover the outer surface of the electronic device M330724. Therefore, the metal layer 212 and the metal layer 222 can not only shield the electromagnetic interference generated by the body 110, but also enable the electronic device 2 (8). It has a metallic texture in appearance. In addition, the metal has a good thermal conductivity, and the metal layer 212 and the metal layer 222 are both located on the outer surface of the electronic device 2, so the metal layer 212 and the metal layer 222 can help the electronic device 2〇0. Thermal energy is discharged to the outside environment. In the present yoke example, the metal layer 212 is the same as the metal layer 122 of the foregoing embodiment of the material layer of the metal layer 222, and the metal layer 212 and the metal layer (10) white can be formed by metal spraying. The material of the plastic housing 214 and the plastic housing is also the same as that of the plastic housing 124 of the previous embodiment. In this embodiment, the outer casing 210 further includes a protective layer 216, and the protective layer 216 is covered with a metal layer 212. The metal layer formed by the metal spraying method usually has a plurality of minute pores, and in order to seal the pores, a protective layer 216 is formed and covered on the metal layer 212 to seal the pores. In the present embodiment, the protective layer 216 may be selected from a resin material having good fluidity and permeability. For example, the material of the protective layer 2丨6 may be butyl, resin, epoxy resin or any combination of these resin materials. In addition, the outer casing 220 may further include a protective layer 216, and the protective layer 216 also covers the metal 222, thereby sealing the metal layer 222 and a plurality of minute pores. It is to be noted that the protective layer 216 can also be applied to the first embodiment. In detail, the protective layer 216 can also cover the metal layer 122 on the surface 12 (see FIG. 1B) or the metal layer covering the outer casing 13〇. In other words, the protective layer 216 can cover the metal layer 122 (shown in FIG. 1B) on the inner surface (ie, surface 124a) of the plastic housing 124 M330724, and can also cover the metal on the outer surface 214a of the plastic housing 214. Layer 212 (shown in Figure 2B) is hereby emphasized that the invention is not limited to the protective layer 216' being disposed on or on the outer surface of the plastic housing. The second thing that must be emphasized is that the protective layer 216 is not an essential component of the outer casing 210 or the outer casing 220. That is, the outer casing 21 and the outer casing 220 may not include the protective layer 216. It can be seen that the protective layer 216 shown in FIG. 2A is merely an example, and it is emphasized here that the present invention is not limited. [THIRD EMBODIMENT] Fig. 3A is an exploded perspective view of the electronic device according to the third embodiment of the present invention, and Fig. 3A is a schematic cross-sectional view of the line Κ-Κ in Fig. 3 . Referring to FIG. 3A, the electronic device 300 includes a body 11 and two housings, wherein the peripheral device 310 includes a plastic housing 214 and a metal layer 312, and the housing 320 includes a plastic housing 224 and a metal layer 322. The present embodiment is similar to the previous embodiment, and the outer casing 310, 320 of the present embodiment is different from the foregoing embodiment in that the metal layer 312 covers the inner surface 214b and the outer surface 214a of the plastic casing 214, and The layers also cover the inner and outer surfaces of the plastic housing 224. In the present embodiment, the thickness of the metal layer 322 covering the outer surface 214a < the outer surface of the plastic casing 224 is between 5·5 μm and 3 μm, and covers the inner surface 214b or the inner surface of the plastic casing 224. Gold 2 is between 0.5 microns and 24.9 microns. - In summary, by covering the metal layer on the surface of the plastic case, the outer casing of the created electronic device can shield electromagnetic interference, thereby reducing the adverse effects of electromagnetic interference M330724 on human health. In addition, the metal layer may cover the outer surface of the plastic casing, or η may cover the inner and outer surfaces of the plastic casing. Therefore, this creation enables the device to exhibit a metallic appearance in appearance, and also helps the heat generated by the electronic raft to be discharged to the outside environment. In addition, although this creation has been disclosed above by way of example, it is not the use of this creation, and any familiarity with the field of the creation of this creation generally does not deviate from the spirit of the creation and _, when it can be made a little more, 'so this creation The scope of the application depends on the patent application garden; the definition of the standard is correct* [Simplified illustration of the drawing] FIG. 1A is an exploded schematic view of the electronic device according to the first embodiment of the present creation. Figure 1 is a schematic cross-sectional view of the line ι_ι in Figure 1 . Fig. 2A is an exploded view of the electronic device according to the second embodiment of the present invention. 2B is a schematic cross-sectional view of line j_j of FIG. 2A. FIG. 3A is an exploded perspective view of an electronic device according to a third embodiment of the present invention. Figure 3B is a schematic cross-sectional view of line K-K of Figure 3A. [Description of main component symbols] 100, 200, 300: electronic device 12 M330724 110: body 120, 130, 210, 220, 310, 320: outer casing 122, 212, 222, 312, 322: metal layers 124, 214, 224: Plastic housing 124a: surface 214a: outer surface 214b: inner surface 216: protective layer T: thickness < S > 13