CN201044235Y - Device for treating substrate - Google Patents
Device for treating substrate Download PDFInfo
- Publication number
- CN201044235Y CN201044235Y CNU2007201396764U CN200720139676U CN201044235Y CN 201044235 Y CN201044235 Y CN 201044235Y CN U2007201396764 U CNU2007201396764 U CN U2007201396764U CN 200720139676 U CN200720139676 U CN 200720139676U CN 201044235 Y CN201044235 Y CN 201044235Y
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- Prior art keywords
- treatment fluid
- treatment
- feed mechanism
- substrate
- fluid feed
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- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 title claims description 79
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims description 95
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 2
- 238000011010 flushing procedure Methods 0.000 description 50
- 238000006073 displacement reaction Methods 0.000 description 13
- 238000005530 etching Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Abstract
A plaque treatment device can substantially reduce the probability of uneven feed of treatment liquid 'curtain' on plaque surface through supplying treatment liquid in the shape of a curtain at least twice and also can improve the replacement performance of treatment liquid through increasing the supplied quantity of treatment liquid. The plaque treatment device which completes treatment of a plaque (B) carried on a carrying path inside a treatment chamber (12) is provided with an intake nozzle part (20) arranged above the carrying path, wherein, the intake nozzle part (20) has an integral first nozzle part consisting of a first member (20A) and a second member (20B) and a second nozzle part consisting of a first member (20B) and a second member (20C); moreover, the ejecting port (2012a) and the ejecting port (2022a) of the first nozzle part and the second nozzle part respectively eject treatment liquid in the breadth direction of the plaque.
Description
Technical field
The utility model relates to a kind of substrate board treatment, this substrate board treatment is at liquid crystal display device (LCD), plasma display apparatus (PDP), semiconductor device, printed circuit board (PCB), organic EL (electro luminescence: electroluminescence) substrate, FED (Field emission display: field-emitter display) in the manufacturing process of substrate etc., LCD or PDP are carried out various processing, for example carry out clean with glass substrate, semiconductor substrate, printed circuit board (PCB), organic EL substrate, FED substrate etc.
Background technology
In the patent documentation 1 (TOHKEMY 2004-273984 number) of Japan, record and to wash the substrate board treatment of processing to the substrate surface after the etch processes.Promptly, dispose the inlet nozzle 20 of slit-shaped above near the entrance side opening 14 of treatment chamber 12, in the time of in substrate W is moved into the treatment chamber 12 of washing handling part 10, be the curtain shape from inlet nozzle 20 and supply with flushing liquor, as substrate W during, supply with flushing liquor till substrate W takes out of in the treatment chamber 12 to the upper surface of substrate W from top jet nozzle 22 further to the conveyance of conveyance direction downstream.Like this, by near treatment chamber 12 inlet from the inlet nozzle 20 of slit-shaped under substrate surface be the curtain shape and supply with needed flushing liquor, thereby replace with flushing liquor at short notice, from top jet nozzle 22 carry out the supply of flushing liquor, prevent the situation that the uniformity owing to remaining shape that the treatment fluid Wiring pattern that cause, that form that uses in handling in the last stage arranged or live width worsens thus on substrate surface thereafter.
By making inlet nozzle 20 be the ejection of curtain shape, and in order on the substrate width direction, to guarantee uniform spray volume, preferably make the gap of slit be too narrow to the degree of a few tenths of a mm for thereby slit-shaped can make flushing liquor.
But when the slit gap narrow dimension, the part of slit is just blocked by foreign matter easily, or adheres to foreign matter easily.If stop up foreign matter, then can not be from this part ejection flushing liquor, so the curtain of flushing liquor will isolate.This isolates and can make flushing liquor produce the supply inequality on the Width of substrate surface, therefore can produce the processing inequality on the Width of substrate, thereby can not realize uniform processing.
Summary of the invention
The utility model proposes in view of top situation, its purpose is to provide a kind of substrate board treatment, be that the curtain shape is supplied with treatment fluid and the probability of happening of treatment fluid inequality is supplied with on the surface that significantly is reduced in substrate by at least twice, and improve the displacement performance of treatment fluid by the quantity delivered that increases treatment fluid.
First scheme of the present utility model is a kind of substrate board treatment, its substrate to conveyance on the conveyance path in treatment trough is supplied with treatment fluid, thereby carry out given processing, it is characterized in that, this device comprises the treatment fluid feed mechanism, this treatment fluid feed mechanism is configured in the place, top position in described conveyance path, substrate in conveyance is supplied with treatment fluid, described treatment fluid feed mechanism has the first treatment fluid feed mechanism and the second treatment fluid feed mechanism, described first at least, the second treatment fluid feed mechanism has Width to described conveyance path respectively and is elongated first of curtain shape ejection treatment fluid, second ejiction opening.
According to this structure, be the curtain shape and supply with treatment fluid uniformly in the surface on the Width of substrate respectively from first, second elongated ejiction opening.Also have, a treatment fluid ejiction opening by the situation of foreign matter obstruction etc. under, even the corresponding position generation at the treatment fluid curtain is isolated, but because the possibility of isolating in the same area generation of another treatment fluid curtain is extremely low, therefore can significantly be reduced in the substrate surface treatment fluid and supply with uneven generation probability, and owing to the quantity delivered of treatment fluid increases displacement performance and the displacement quality that has improved treatment fluid.
Alternative plan of the present utility model is as the described substrate board treatment of first scheme, it is characterized in that, described first, second ejiction opening is towards the substrate transferring direction.According to this structure, after treatment fluid is fallen on the substrate, can flow along the conveyance direction, therefore can suppress the conveyance direction more the treatment fluid adverse current in downstream to the situation of upstream side, so be fit to carry out the displacement of treatment fluid.
Third party's case of the present utility model is as the described substrate board treatment of first scheme, it is characterized in that, described first, second treatment fluid feed mechanism has stepped construction on above-below direction, and one constitutes.According to this structure, only just can set first, second treatment fluid feed mechanism simultaneously, so operation such as adjustment becomes easy by adjusting a position or an angle of handling feed mechanism.
Cubic case of the present utility model is as the described substrate board treatment of third party's case, it is characterized in that, described first, the second treatment fluid feed mechanism is laminated into one by three members and constitutes on above-below direction, wherein these three member shapes are identical, and has rectangular shape elongated on described Width, and adjacent mutually member is at opposed position, and the treatment fluid that has respectively as the inner space in the position of staggering mutually stockpiles portion, and has the ejection path that extends to the ejiction opening in conveyance direction downstream from each treatment fluid portion of stockpiling respectively.According to this structure, in three members, on mutually adjacent member, at opposed position and the treatment fluid that is formed with respectively as the inner space of the position of staggering mutually stockpile portion, each treatment fluid stockpiles portion from separately treatment fluid and imports to ejiction opening through the ejection path, and sprays from ejiction opening.
The 5th scheme of the present utility model is as the described substrate board treatment of cubic case, it is characterized in that, described first, second treatment fluid feed mechanism has the treatment fluid injection path that wears described member upper surface from described each treatment fluid portion of stockpiling respectively.According to this structure, each treatment fluid is from the top of described first, second treatment fluid feed mechanism, injects delivery pathways through separately treatment fluid and stockpiles portion to pairing treatment fluid.
The 6th scheme of the present utility model is as the described substrate board treatment of first scheme, it is characterized in that, the relative horizontal direction of first, second ejiction opening of described first, second treatment fluid feed mechanism tilts about 20 °.According to this structure, fall the roughly the same position of substrate surface from the treatment fluid of first, second ejiction opening.Therefore can more uniform replacement Treatment liquid.
The 7th scheme of the present utility model is as the described substrate board treatment of first scheme, it is characterized in that having adjustment means, and this adjustment means is in the position of described first, second treatment fluid feed mechanism of above-below direction adjusted.According to this structure, can adjust and make the roughly the same position of falling substrate surface from the treatment fluid of first, second ejiction opening.Therefore can more uniform replacement Treatment liquid.
All directions of the present utility model case is as the described substrate board treatment of the 7th scheme, it is characterized in that, by described adjustment means the height of described first, second treatment fluid feed mechanism is adjusted, made and on the conveyance direction on the conveyance path, fall on the roughly the same position from the ejection liquid of described first, second ejiction opening.According to this structure,, improve the displacement efficiency of treatment fluid thus owing to the roughly the same position of falling from each treatment fluid of first, second ejiction opening ejection on the conveyance path.
The 9th scheme of the present utility model is as the described substrate board treatment of first scheme, it is characterized in that, described treatment trough has the inlet opening that receives described substrate, and described treatment fluid feed mechanism is positioned at described treatment trough, is disposed near the described inlet opening.According to this structure, will be the curtain shape from the treatment fluid of described treatment fluid feed mechanism and supply on the upper surface of base plate of in last operation, handling, thereby in last operation, can be replaced into treatment fluid at short notice attached to the liquid on the substrate surface.
According to first scheme, can significantly reduce the substrate surface treatment fluid and supply with uneven generation probability, and can improve the displacement performance and the displacement quality of treatment fluid by the quantity delivered that increases treatment fluid.
According to alternative plan because the treatment fluid of falling on the substrate flows along the conveyance direction, so can suppress the conveyance direction more the treatment fluid adverse current in downstream can compatibly carry out the displacement of treatment fluid to upstream side.
According to third party's case, only, just can set first, second treatment fluid feed mechanism simultaneously by adjusting the position or the angle of a treatment fluid feed mechanism, can make to adjust and wait the operation transfiguration easy.
According to cubic case, each treatment fluid can be stockpiled portion from separately treatment fluid and spray from ejiction opening via the ejection path.
According to the 5th scheme, each treatment fluid can be injected delivery pathways from the top of first, second treatment fluid feed mechanism via separately treatment fluid and stockpile portion to pairing treatment fluid.
According to the 6th scheme, fall roughly the same position on the substrate surface owing to make, so replacement Treatment liquid more equably from the treatment fluid of first, second ejiction opening.
According to the 7th scheme, make the roughly the same position of falling substrate surface from the treatment fluid of first, second ejiction opening owing to adjusting, so replacement Treatment liquid more equably.
According to the case from all directions, fall roughly the same position on the conveyance path by making from each treatment fluid of first, second ejiction opening ejection, can improve the displacement efficiency of treatment fluid.
According to the 9th scheme,, can be treatment fluid with liquid displacement in last operation at short notice attached to substrate surface by be the treatment fluid of curtain shape supply to the upper surface of base plate of in last operation, handling from described treatment fluid feed mechanism.
Description of drawings
Fig. 1 is a sectional view of representing an execution mode of substrate board treatment of the present invention with schematic configuration.
Fig. 2 A, Fig. 2 B are the figure of the internal structure of expression inlet nozzle portion, and wherein Fig. 2 A is the sectional view of the internal structure of expression inlet nozzle portion, and Fig. 2 B is the vertical view of the internal structure of expression inlet nozzle portion.
Fig. 3 is expression with inlet nozzle portion location and is fixed on the end view of an execution mode of the support portion on the given position in the treatment chamber.
Embodiment
Fig. 1 is a sectional view of representing an execution mode of substrate board treatment of the present invention with schematic configuration.The expression substrate board treatment is applied to wash the example in the handling part in Fig. 1.The etch processes groove disposed adjacent of washing handling part 10 and last operation (left of Fig. 1).This etch processes groove supplies to etching on the substrate surface with soup (being called etching solution later on), removes the exposed portions serve that forms the etchant resist lower floor of pattern by development treatment.
Washing handling part 10 is when washing away etching with soup etc., and (flushing liquor for example is made of pure water etc. to be replaced into the mechanism of new flushing liquor.So long as the liquid different with supply to treatment fluid on the substrate B in last operation gets final product).
Washing handling part 10 has treatment chamber 12, and this treatment chamber 12 has entrance side opening 14 and the outlet side opening 16 that is used to make substrate B discrepancy.Inside in treatment chamber 12, dispose a plurality of roller paths 18 from entrance side opening 14 towards outlet side opening 16, this roller path 18 is arranged in parallel, and support and conveyance substrate B with flat-hand position, perhaps support and conveyance substrate B with only the tilt posture of required angle of the vertical direction (Width) with substrate transferring direction (direction of arrow of Fig. 1).A plurality of roller paths 18 constitute the substrate transferring path.
Near the entrance side opening 14 of treatment chamber 12, dispose inlet nozzle portion (treatment fluid feed mechanism) 20.Inlet nozzle portion 20 is fixed on appropriate location on treatment chamber 12 sidewalls by support portion 22.Inlet nozzle portion 20 has the ejiction opening that forms long slit-shaped along the Width in substrate transferring path, and flushing liquor is supplied on the upper surface of the substrate B that handled in last operation with being the curtain shape.Inlet nozzle portion 20 will be attached to the lip-deep etching solution of substrate B and be replaced into flushing liquor at short notice to the flushing liquor that substrate B supplies with aequum in last operation.Top jet nozzle portion 24 is positioned at the position, downstream of inlet nozzle portion 20, and above roller path 18 and be provided with given number along the substrate transferring path.
Be connected with flushing liquor supplying tubing 26,28 respectively in inlet nozzle portion 20 and the top jet nozzle portion 24.Flushing liquor supplying tubing 26,28 is connected to the ejection oral-lateral of pump 34 respectively via pipe arrangement 32a.Appropriate location in flushing liquor supplying tubing 26,28 is respectively arranged with open and close control valve V1, V2.The suction oral-lateral of pump 34 is connected to the bottom of the aqua storage tank 36 that stockpiles pure water 2 via pipe arrangement 32b.Be provided with liquid effuser 42 in the bottom of treatment chamber 12.Liquid effuser 42 branches into and reclaims with pipe arrangement 44 and discharge opeing pipe arrangement 46.The front end flow export that reclaims with pipe arrangement 44 imports in the aqua storage tank 36.In addition, via discharge opeing with the pipe arrangement 46 used flushing liquor of draining.Be respectively arranged with open and close control valve V4, V5 on pipe arrangement 46 reclaiming with pipe arrangement 44 and discharge opeing.Pure water is installed on aqua storage tank 36 supplies with, pure water is suitably supplied in the aqua storage tank 36 from omitting illustrated pure water supply source with pipe arrangement 52.
Fig. 2 A, Fig. 2 B are the figure of the internal structure of expression inlet nozzle portion 20, and Fig. 2 A is the sectional view of the internal structure of expression inlet nozzle portion 20, and Fig. 2 B is the vertical view of the internal structure of expression inlet nozzle portion 20.Inlet nozzle portion 20 is made of first～the 3rd member 20A～20C, and this first～the 3rd member 20A～20C has elongated rectangular shape respectively, and measure-alike.First～the 3rd member 20A～20C constitutes one with stacked state.The flushing liquor that is formed with as the inner space on first, second member 20A, 20B stockpiles portion 201, this flushing liquor stockpiles portion 201 part at first, second member 20A, the mutual opposed position of 20B is suitably excised and formed along long axis direction, and on the first member 20A, run through and be provided with flushing liquor injection path 2011, it is to stockpile the given in the longitudinal direction a plurality of positions of portion 201 from flushing liquor to be connected to form upward that this flushing liquor injects path 2011, and for example this flushing liquor injection path 2011 is connected to form upward from four positions in Fig. 2 B.One distolateral (being right-hand in Fig. 2 A) that stockpiles portion 201 at the flushing liquor that is formed by the first member 20A and the second member 20B is formed with ejection path 2012, this ejection path 2012 has from this flushing liquor and stockpiles the size fine gap of portion 201 up to a side end face (hereinafter referred to as ejection face), and is shape of slit as the ejiction opening 2012a of ejection path 2012 front ends.
Second, the 3rd member 20B, the flushing liquor that is formed with on the 20C as the inner space stockpiles portion 202, this flushing liquor stockpiles portion 202 and is positioned at second, the 3rd member 20B, a part of appropriate position at the mutual opposed position of 20C, and be at least and stockpile the position that portion 201 staggers with flushing liquor, excise and form along long axis direction, and on the first member 20A and the second member 20B, run through and be provided with flushing liquor injection path 2021, it is to stockpile portion 202 given a plurality of positions on long axis direction from flushing liquor to be connected to form upward that this flushing liquor injects path 2021, for example is that this flushing liquor injection path 2021 is connected to form upward from four positions in Fig. 2 B.Stockpile at the flushing liquor that forms by the second member 20B and the 3rd member 20C on distolateral (in Fig. 2 A for right-hand) of portion 202 and be formed with ejection path 2022, this ejection path 2022 has from this flushing liquor and stockpiles the portion 202 fine gap of the size up to a side end face, and is shape of slit as the ejiction opening 2022a of these ejection path 2022 front ends.Flushing liquor injects path 2011,2021 and is connected with flushing liquor supplying tubing 26.
The gap size in ejection path 2012,2022 is a few tenths of a mm, then is preferably set to 0.2～0.4mm if consider curtain shape shape and the ejection liquid measure of guaranteeing flushing liquor.The line portion of Fig. 2 B is the composition surface, by run through the mode that first～the 3rd member 20A～20C carries out bolted etc. or utilizes adhesive etc. to link at this position, and then, by between first, second member 20A, the 20B and a plurality of appropriate locations between second, third member 20B, the 20C pad of fine shape being set, thereby the gap size that will spray path 2012,2022 keeps certain more accurately.
The second member 20B of inlet nozzle portion 20 is set at required thickness, is set at 1cm at this, therefore, the about 1cm in ejiction opening 2012a, the 2022a of two slit-shaped interval on ejection face also is parallel to each other.
Fig. 3 for expression with inlet nozzle portion 20 location and be fixed on the end view of an execution mode of the support portion 22 on the given position in the treatment chamber 12.Support portion 22 has: tabular fixture 221, and it is connected on the appropriate location of the sidewall in the treatment chamber 12, and is horizontal-extending, runs through the through hole 221a that is provided with given diameter on the appropriate location of fixture 221; Bolt component 222, it runs through through hole 221a, is provided with external screw thread in its Lower Half, and has bolt head 222a at its top; Nut 223 has internal thread on inwall, from the setting that is spirally connected of the lower end side of bolt component 222; Connector 224, it has through hole 224a, and has downwards and to extend the extension that is provided with the 224b of portion is set, wherein, through hole 224a is fixedly installed on the following side of nut 223, is equipped with bigger than the internal diameter of this nut 223 at least internal diameter, perhaps is provided with internal thread equally.Be vertically installed with guide 225 from the appropriate position of fixture 221, this guide 225 forms from cross section and sees the コ word shape with required gap.Be fitted in the mode that can slide along the vertical direction by appropriate location in the gap of コ word shape of guide 225 connector 224, thereby when bolt component 222 being rotated operation, nut 223 and connector 224 can not rotate (this is because the confined result of rotation), and only carry out lifting moving.The first half of bolt component 222 only forms circular bar-shaped, and the through hole 221a of fixture 221 forms the bearing of circular bar-shaped bolt component 222 as the first half and works.On the other hand, the Lower Half of bolt 222 and nut 223 and connector 224 are spirally connected, and thus, the lifting of nut 223 and connector 224 can be carried out in the externally threaded size range on being arranged on bolt component 222 Lower Halves.
Be provided with in the extension of connector 224 that the posture with regulation is installed with inlet nozzle portion 20 on the 224b of portion.Determine the position of inlet nozzle portion 20 in treatment chamber 12 thus.Towards the downstream, and the relative horizontal direction of the ejection face given angle that tilts tilts about 20 ° at this on the conveyance path for ejiction opening 2012a, the 2022a of inlet nozzle portion 20.By this angle of inclination, the flushing liquor that supplies on the substrate B effectively washes away the etching solution of bringing into from last operation, thereby carries out the displacement of etching solution and flushing liquor.
Also have, 222a is rotated operation to bolt head, adjusts the height of inlet nozzle portion 20, promptly adjust ejiction opening 2012a, 2022a height from the conveyance path, thus, as shown in Figure 3, the flushing liquor that sprays respectively from ejiction opening 2012a, 2022a is fallen the roughly the same position on the conveyance path.Thus, improve the displacement efficiency of treatment fluid.Also have,,, also can improve the displacement efficiency of treatment fluid thus so be that one situation is compared and the flushing liquor of about twice can be supplied to identical position with ejiction opening because supply with the flushing liquor of aequum respectively from two ejiction opening 2012a, 2022a.
Like this, by two ejiction openings are set in inlet nozzle portion 20, even produces on the part of the curtain that flushing liquor forms thereby foreign matter has stopped up an ejiction opening and to isolate, the probability that the curtain that forms from the flushing liquor of another ejiction opening ejection isolates in the same position generation just becomes exponential/one.Therefore, utilize formed two curtains can be, supply with flushing liquor under the state that does not isolate as far as possible with Width, therefore can significantly suppress to produce the possibility of treatment liquid replacing inequality at substrate to the roughly the same position of the conveyance direction on substrate B surface.
In addition, the present invention can adopt following mode of texturing.
(1) in the present embodiment, in an inlet nozzle portion 20, be formed with two ejiction openings, but the inlet nozzle portion that two or given number also can continuous and parallel be set, wherein this inlet nozzle portion has an ejiction opening, and this inlet nozzle portion independently separates given interval along the substrate transferring direction respectively.In this mode, except adjusting described given interval, can also adjust each inlet nozzle portion the relative horizontal plane of ejection face the angle of inclination and from the height in conveyance path, thereby make flushing liquor fall roughly the same position on the conveyance path.
(2) in the present embodiment, in an inlet nozzle portion 20, be formed with two ejiction openings, but in structure shown in Figure 2, also can be by further stacked the 4th, the 5th member, the ejiction opening increase is set to three, four or more.
(3) in the present embodiment, flushing liquor as shown in Figure 2 injects path 2011,2021 and is formed on the upper face side that flushing liquor stockpiles portion 201,202, but also can be formed on side or back side.
(4) in the present embodiment, as shown in Figure 3, be to make inlet nozzle portion 20 inclination given angles own, make ejiction opening with structure, the shape of given angle but also can adopt towards below ejection flushing liquor.
Claims (9)
1. substrate board treatment, its substrate to conveyance on the conveyance path in treatment trough is supplied with treatment fluid, thereby carry out given processing, it is characterized in that, this device comprises the treatment fluid feed mechanism, this treatment fluid feed mechanism is configured in the place, top position in described conveyance path, substrate in conveyance is supplied with treatment fluid, described treatment fluid feed mechanism has the first treatment fluid feed mechanism and the second treatment fluid feed mechanism, described first at least, the second treatment fluid feed mechanism has Width to described conveyance path respectively and is elongated first of curtain shape ejection treatment fluid, second ejiction opening.
2. substrate board treatment as claimed in claim 1 is characterized in that, described first, second ejiction opening is towards the substrate transferring direction.
3. substrate board treatment as claimed in claim 1 is characterized in that, described first, second treatment fluid feed mechanism has stepped construction on above-below direction, and one constitutes.
4. substrate board treatment as claimed in claim 3, it is characterized in that, described first, second treatment fluid feed mechanism is laminated into one by three members and constitutes on above-below direction, wherein these three member shapes are identical, and has rectangular shape elongated on described Width, and mutually adjacent member at opposed position and the treatment fluid that has respectively as the inner space in the position of staggering mutually stockpile portion, and have the ejection path that extends to the ejiction opening in conveyance direction downstream from each treatment fluid portion of stockpiling respectively.
5. substrate board treatment as claimed in claim 4 is characterized in that, described first, second treatment fluid feed mechanism has the treatment fluid injection path that wears described member upper surface from described each treatment fluid portion of stockpiling respectively.
6. substrate board treatment as claimed in claim 1 is characterized in that, the relative horizontal direction of first, second ejiction opening of described first, second treatment fluid feed mechanism tilts about 20 °.
7. substrate board treatment as claimed in claim 1 is characterized in that having adjustment means, and this adjustment means is in the position of described first, second treatment fluid feed mechanism of above-below direction adjusted.
8. substrate board treatment as claimed in claim 7, it is characterized in that, by described adjustment means the height of described first, second treatment fluid feed mechanism is adjusted, made and on the conveyance direction on the conveyance path, fall on the roughly the same position from the ejection liquid of described first, second ejiction opening.
9. substrate board treatment as claimed in claim 1 is characterized in that, described treatment trough has the inlet opening that receives described substrate, and described treatment fluid feed mechanism is positioned at described treatment trough, is disposed near the described inlet opening.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006093132A JP2007266545A (en) | 2006-03-30 | 2006-03-30 | Substrate treatment equipment |
| JP2006093132 | 2006-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201044235Y true CN201044235Y (en) | 2008-04-02 |
Family
ID=38639197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201396764U Expired - Lifetime CN201044235Y (en) | 2006-03-30 | 2007-03-30 | Device for treating substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007266545A (en) |
| CN (1) | CN201044235Y (en) |
| TW (1) | TWM331181U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103792713A (en) * | 2014-01-27 | 2014-05-14 | 北京京东方显示技术有限公司 | Solution cutter and developing solution washing device with same |
| CN104952765A (en) * | 2014-03-26 | 2015-09-30 | 斯克林集团公司 | Substrate processing apparatus, nozzle and substrate processing method |
| CN110681508A (en) * | 2018-07-04 | 2020-01-14 | 显示器生产服务株式会社 | Substrate processing apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6527674B2 (en) * | 2014-03-26 | 2019-06-05 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus, nozzle and substrate processing method |
| JP7237670B2 (en) * | 2019-03-15 | 2023-03-13 | 株式会社Ｓｃｒｅｅｎホールディングス | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129266A (en) * | 1991-10-31 | 1993-05-25 | Toshiba Corp | Method and equipment for cleaning |
| JPH09276773A (en) * | 1996-04-10 | 1997-10-28 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JPH1092784A (en) * | 1996-09-10 | 1998-04-10 | Toshiba Microelectron Corp | Wafer treatment equipment and wafer treatment method |
| JP3489992B2 (en) * | 1998-07-16 | 2004-01-26 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2004273984A (en) * | 2003-03-12 | 2004-09-30 | Dainippon Screen Mfg Co Ltd | Method and device for substrate processing |
| JP2005072058A (en) * | 2003-08-27 | 2005-03-17 | Sharp Corp | Cleaning apparatus and cleaning method |
-
2006
- 2006-03-30 JP JP2006093132A patent/JP2007266545A/en not_active Abandoned
-
2007
- 2007-03-21 TW TW96204566U patent/TWM331181U/en not_active IP Right Cessation
- 2007-03-30 CN CNU2007201396764U patent/CN201044235Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103792713A (en) * | 2014-01-27 | 2014-05-14 | 北京京东方显示技术有限公司 | Solution cutter and developing solution washing device with same |
| CN105842998A (en) * | 2014-01-27 | 2016-08-10 | 北京京东方显示技术有限公司 | Liquid-spraying knife and developing liquid cleaning apparatus equipped with same |
| CN103792713B (en) * | 2014-01-27 | 2016-08-17 | 北京京东方显示技术有限公司 | A kind of liquid cutter and have this liquid cutter developer solution clean device |
| CN105842998B (en) * | 2014-01-27 | 2019-10-18 | 北京京东方显示技术有限公司 | A kind of liquid cutter and the developer solution cleaning device with the liquid cutter |
| CN104952765A (en) * | 2014-03-26 | 2015-09-30 | 斯克林集团公司 | Substrate processing apparatus, nozzle and substrate processing method |
| CN110681508A (en) * | 2018-07-04 | 2020-01-14 | 显示器生产服务株式会社 | Substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM331181U (en) | 2008-04-21 |
| JP2007266545A (en) | 2007-10-11 |
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