CN200962689Y - Printed board connection structure - Google Patents
Printed board connection structure Download PDFInfo
- Publication number
- CN200962689Y CN200962689Y CN 200620139304 CN200620139304U CN200962689Y CN 200962689 Y CN200962689 Y CN 200962689Y CN 200620139304 CN200620139304 CN 200620139304 CN 200620139304 U CN200620139304 U CN 200620139304U CN 200962689 Y CN200962689 Y CN 200962689Y
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- pad
- board
- daughter board
- pin
- printed board
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Abstract
The utility model relates to a connection structure for printed circuit boards, in particular to a reliable connection structure which directly and precisely positions and connects multiple printed circuit boards during the assembling of the printed circuit boards, without the need of connecting means between the circuit boards. The utility model has solder-pad-like pins on the edge of the sub-board, and patch-like solder pads corresponding to the solder-pad-like pins are arranged the mother-board, so that the sub-board is soldered directly to the mother-board through reflow soldering with the sub-board being perpendicular to or has an angle to the mother-board, realizing a reliable connection between two circuit boards without the need for inserting elements such as inserting needles and sockets, so that the material cost during the production is greatly lowered. With the positioning structure provided by the printed circuit board itself, the acuity and precision of the installation and positioning between the printed circuit boards are ensured, supreme stability and reliability are provided after soldering, and meanwhile the layout and space utilization are improved compared to the printed circuit boards with inserting elements.
Description
Technical field
The utility model relates to a kind of printed board syndeton, relates in particular in a kind of process with a plurality of printed board assemblings, does not need to adopt interface unit between each printed board, and the reliable syndeton that directly accurately is located by connecting.
Background technology
Now; in electronics industry; the PCB printed board relies on its good performance and ripe fabrication and processing technology; obtained using very widely; and in the design of electronic products process because the needs of structural design and circuit design; printed board usually can be carried out being fastened and connected between each printed board by the welding connector, reaches the requirement of making doubling plate or multi-layer sheet infrastructure product.
The connector that is adopted in existing printed board mainly contains through hole connector and SMD connector, wherein, use the through hole connector need consider the circuit trace space, then not only need consider the accurate positioning of welding when using the paster connector, more need to consider the connection reliability of connector.And, the connector that has at present reliable switching performance in the industry market all without exception employing the manufacturing process of " gold-plated " process connector, guarantee the stable and reliable of electric property with this, but because international metal price is high for a long time, if a large amount of connectors that use will cause increasing considerably of material cost in the printed board of large-scale production product, thereby reduce the competitiveness of product in market.
Especially in industrial automation control industry, being the PLC control unit module of carrier with the PCB printed board, is to be widely used in electronics industry.All adopt the demonstration situation of light emitting diode lamp to indicate the running status of product itself and the quality of signal in for example present various PLC control unit module.Because its modular design feature, the indicator light display circuit need turn over usually and turn 90 degrees, and makes it carry out luminous indication by the indication window of module.How to reach this display requirement, and present display circuit mainly contains following dual mode:
First kind: light emitting diode lamp is carried out angle adjustment by the form that installs a right angle lamp socket additional, together be welded in the printed board together with lamp socket then, thereby form an assembled unit;
Second kind: light emitting diode lamp directly is welded in the printed board, it is patched again/be welded in another piece printed board by welding rigging-angle connector spare (metal connector) on printed board then, thereby form an assembled unit.
But above-mentioned dual mode: there is the process operation complex steps in the former, the shortcoming that holder structure is difficult for meeting design requirement.And the metal connector that the latter adopts costs an arm and a leg, and will cause increasing substantially of material cost again if use in batches.
The utility model content
The technical problems to be solved in the utility model be to provide a kind of simple in structure, with low cost, connect printed board syndeton reliable, accurate positioning.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of printed board syndeton, comprise motherboard and daughter board, the edge of daughter board is provided with pad formula pin, the corresponding SMD pad that adapts with described pad formula pin that is provided with on the described motherboard.
Fixedly connected with described motherboard by at least one location structure simultaneously in described daughter board edge.
Described location structure comprises pilot pin and the corresponding location hole that is arranged on the described motherboard that is arranged on the described daughter board, and described pilot pin prolongs the edge that is provided with pad formula pin in daughter board.
Be provided with the semi arch interior angle between described pilot pin and the adjacent pad formula pin.
Described location structure comprises at least two, is arranged between the edge and described motherboard that has pad formula pin on the daughter board.
Described pad formula pin is arranged on two sides at described daughter board edge symmetrically.
Described symmetrically arranged pad formula pin is provided with the via hole through described daughter board, and adopts the auxiliary welding procedure of heavy copper that the pad formula pin welding of both sides is fixing by described via hole.
Described SMD pad is and corresponding row of described pad formula pin or two rows.
The end of described pad formula pin is provided with half hole of running through with described daughter board, adopts the auxiliary welding of heavy copper that the pad welding of both sides is fixing in described half hole.
The pilot pin of described daughter board is provided with pad formula pin, the outer correspondence of the location hole of described motherboard be provided with pad.
Compared with prior art, the utlity model has following advantage: be provided with pad formula pin by edge at daughter board, the corresponding SMD pad that adapts with described pad formula pin that is provided with on described motherboard, when daughter board is vertical with motherboard or at an angle to each other, can adopt the Reflow Soldering method directly described daughter board to be welded on the motherboard, thereby needn't use connector can realize reliable connection between two circuit boards, reduced the material cost in producing, only directly connect between the pad formula pin of two printed boards and the SMD pad by a pad, less pad quantity, increase the reliability that is electrically connected, on PCB routing and space availability ratio, all adopted the printing plate hight of connector simultaneously.In addition, constitute location structure by pilot pin and location hole between described daughter board and the motherboard, can strengthen the mechanical strength after the accuracy that connects between daughter board and the motherboard and the welding, reduce the influence of daughter board deflection butt welding contact reliability, the welding processing process is also more convenient, between described pilot pin and the pad formula pin semi arch interior angle is set, has avoided daughter board not enough, thereby guaranteed welding quality and stability because of the pilot pin insertion depth that the interior angle mismachining tolerance causes.
Description of drawings
Fig. 1 is the daughter board structural representation of embodiment one in the utility model;
Fig. 2 is the motherboard structure schematic diagram of embodiment one in the utility model;
Fig. 3 patches structural representation for daughter board and the motherboard of embodiment one in the utility model;
Fig. 4 is the daughter board structural representation of embodiment two in the utility model;
Fig. 5 is the motherboard structure schematic diagram of embodiment two in the utility model;
Fig. 6 patches structural representation for daughter board and the motherboard of embodiment two in the utility model.
Embodiment
Embodiment one is a kind of preferred embodiment of the present utility model, the daughter board structure as shown in fig. 1, be arranged side by side the pad formula pin one 1 that the circuit on a plurality of and the daughter board 1 links to each other with electric component at the edge of daughter board 1, prolong at the two ends at above-mentioned edge and two pilot pins 12, described pad formula pin one 1 is arranged on the both sides of described daughter board 1 symmetrically, owing to consider and strengthen described pad formula pin one 1 welding reliability, therefore design is milled the limit stage in printed board described pad formula pin one 1 is separated from the centre, formation runs through half hole 14 with described daughter board 1, adopt the auxiliary welding of the heavy copper of half sheet in described half hole 14, pad formula pin one 1 welding of both sides is fixing, simultaneously in order to prevent to operate thus the pad that may the cause problem that comes off, on described pad formula pin one 1, also designed via hole through described daughter board, described via hole also utilizes heavy copper to assist welding, the pad formula pin welding of both sides is fixing, strengthen the stationarity of pad self, avoid the pad formula pin of a side in the welding process back that is heated to produce with printed board and separate, influence welding quality.
Motherboard structure as shown in Figure 2, motherboard 2 be provided with motherboard 2 on the SMD pad 21 that links to each other with electric component of circuit, described SMD pad has two rows, and with respectively with described daughter board 1 both sides on pad formula pin one 1 corresponding, be that all the number with pad formula pin one 1 is suitable for number, width, the spacing of described SMD pad 21, the two ends of the SMD pad 21 of described two rows are provided with the location hole 22 that adapts with described pilot pin 12, the shape of promptly described location hole 22, big or small suitable with described pilot pin.
Daughter board and motherboard patch structure as shown in Figure 3, by described pilot pin 12 described daughter board 1 is patched in the location hole 22 of motherboard 2, pad formula pin one 1 on the described daughter board and the SMD pad 21 on the motherboard are corresponding one by one, according to the welding manner of similar paster components and parts, corresponding bonding pad formula pin one 1 between daughter board and the motherboard and the 21 welding formation of SMD pad are electrically connected reliably then by reflow soldering process.Itself has location structure printed board, the i.e. location structure that constitutes by pilot pin and location hole, make that accuracy, the precision of installing and locating effectively guaranteed before the welding between printed board and the printed board, after welding, have good stability and reliability, more guaranteed certain mechanical strength.
Simultaneously, between described pilot pin 12 and adjacent pad formula pin one 1, be provided with semi arch interior angle 13, because in the printed board course of processing, it is inapplicable in the angular region in printed board to consider that limit technology is milled in printed board, may have influence on the precision of printed board pilot pin processing dimension thus, be difficult to promptly guarantee that the interior angle cutting processing with described pilot pin 12 roots gets straight, can leave fillet at pilot pin 12 inboard places, the width of pilot pin 12 roots is increased, cause described pilot pin to insert in the described location hole 22 by the degree of depth of design, therefore in the course of processing, adopt " boring " technology ripe in the printed board processing technology to process semi arch in pilot pin 12 inboards, arc radius can be decided according to design needs and machining accuracy.By increasing the working depth of interior angle, promptly the root at described pilot pin 12 forms the semi arch interior angle, fabrication error in the connection procedure that prevents to cause thus, guarantee daughter board 1 insertion depth owing to error effect pilot pin 12 in the process of inserting motherboard 2, and then cause patching between back described pad formula pin one 1 and the SMD pad 21 and produce the space, the quality of influence welding, and, the semicircular arc that described interior angle adopted, its processing intensity is higher, and the root of the pilot pin 12 after the processing is easy fracture not also.
Directly be welded to connect by pad formula pin one 1 and SMD pad 21 in the present embodiment, saved the structure that patches of connector, reduced material cost; On PCB routing and space availability ratio, all adopt the printing plate hight of connector.Described pad formula pin one 1 can increase and decrease according to the side circuit needs with the quantity and the spacing of SMD pad 21, and the pad height of pad formula pin should be too not little, at least need to guarantee to be higher than the vertical height of general paster components and parts solder joint, thereby guarantee bonding area and welding reliability.
Embodiment two is an another kind of preferred embodiment of the present utility model: the daughter board structure as shown in Figure 4, be with the difference of embodiment one, described pilot pin 12 has three, all be to prolong out at the edge of described daughter board 1, two two ends that are positioned at above-mentioned edge wherein, another is positioned at the centre at above-mentioned edge, all be provided with semi arch interior angle 13 between described pilot pin 12 and the adjacent pad formula pin one 1, the described pilot pin 12 that increases can further increase the mechanical strength between described two printed boards, more is applicable to the situation that daughter board length or area are bigger.
The structure of corresponding described motherboard 2 as shown in Figure 5, described location hole 22 also also is three with described pilot pin, and position, shape and size also adapt with described pilot pin 12, also be with the difference of embodiment one, described SMD pad 21 ' adopts strip, and corresponding to the pad formula pin of positive and negative both sides on the described daughter board 1, promptly be equivalent to relative two SMD pads 21 among the described embodiment one are connected as a single entity, therefore more convenient in the processing also of printed board.
The syndeton of daughter board and motherboard as shown in Figure 6, by described three pilot pins 12 described daughter board 1 is patched in three corresponding location holes 22 on motherboard 2, pad formula pin one 1 on the described daughter board and the SMD pad 21 ' on the motherboard are corresponding one by one, also can by reflow soldering process corresponding bonding pad formula pin one 1 between daughter board and the motherboard and the 21 welding formation of SMD pad be electrically connected reliably then according to the welding manner of similar paster components and parts.And the solder joint of both sides also can be by SMD pad 21 ' the direct conducting of described strip, has guaranteed the reliability that connects between corresponding pad between described daughter board 1 and the motherboard 2.Described pilot pin 12 is provided with pad 16, outer corresponding to location hole 22 is provided with corresponding via pad or SMD pad 26, can be directly that pad 16 and 26 welding is fixing in above-mentioned welding process, also can reach the purpose of the bonding strength between described pilot pin of further reinforcement and the location hole.
In addition, the number of the described location structure that is made of pilot pin 12 and location hole 22 is not limited thereto, as long as can guarantee that the accurate positioning instant of printed board can, the size design of pilot pin and location keyhole also needs to consider the machining accuracy of printed board, avoids because trueness error causes the difficulty in the process of being fastened and connected.Pad 16 on the described daughter board 1 also can be designed to pad formula pin as required, and the circuit on daughter board or electric component link to each other, pad 26 on the corresponding described motherboard 2 also can link to each other with circuit or the electric component on the motherboard, when daughter board and motherboard realize that location and welding are fixing, realize being electrically connected of motherboard and daughter board.Via hole number on the described pad formula pin, can increase to a plurality of according to the needs of pad intensity and reliability, described pad formula pin one 1 also can only be arranged on a side of described daughter board 1, SMD pad 21 on the corresponding motherboard 2 also only is provided with one group, simplify the structure and processing technology, can be used in the not extra high situation of reliability requirement.The utility model can also further be simplified, remove described pilot pin 12 and location hole 22 and constituted location structure, in the course of processing, only need pad formula pin one 1 and SMD pad 21 corresponding placements and directly welding, when realization is electrically connected, described daughter board 1 is fixedlyed connected with motherboard 2, therefore be applicable to bonding strength to require very not high situation.
Above-described the utility model execution mode does not constitute the qualification to the utility model protection range.Any modification of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the claim protection range of the present utility model.
Claims (10)
1, a kind of printed board syndeton comprises motherboard and daughter board, it is characterized in that: the edge of daughter board is provided with pad formula pin, the corresponding SMD pad that adapts with described pad formula pin that is provided with on the described motherboard.
2, printed board syndeton as claimed in claim 1 is characterized in that: fixedly connected with described motherboard by at least one location structure simultaneously in described daughter board edge.
3, printed board syndeton as claimed in claim 2, it is characterized in that: described location structure comprises pilot pin and the corresponding location hole that is arranged on the described motherboard that is arranged on the described daughter board, and described pilot pin prolongs the edge that is provided with pad formula pin in daughter board.
4, printed board syndeton as claimed in claim 3 is characterized in that: be provided with the semi arch interior angle between described pilot pin and the adjacent pad formula pin.
5, printed board syndeton as claimed in claim 3 is characterized in that: the pilot pin of described daughter board is provided with pad formula pin, the outer correspondence of the location hole of described motherboard be provided with pad.
6, as each described printed board syndeton in the claim 1～5, it is characterized in that: described location structure comprises at least two, is arranged between the edge and described motherboard that has pad formula pin on the daughter board.
7, as each described printed board syndeton in the claim 1～5, it is characterized in that: on two sides that are arranged on described daughter board edge of described pad formula pin symmetry.
8, as each described printed board syndeton in the claim 1～5, it is characterized in that: described symmetrically arranged pad formula pin is provided with the via hole through described daughter board, and adopts the auxiliary welding procedure of heavy copper that the pad formula pin welding of both sides is fixing by described via hole.
9, as each described printed board syndeton in the claim 1～5, it is characterized in that: described SMD pad is for arranging with the corresponding row of described pad formula pin or two.
10, as each described printed board syndeton in the claim 1～5, it is characterized in that: the end of described pad formula pin is provided with half hole through described daughter board, adopts the auxiliary welding of heavy copper that the pad welding of both sides is fixing in described half hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620139304 CN200962689Y (en) | 2006-10-18 | 2006-10-18 | Printed board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620139304 CN200962689Y (en) | 2006-10-18 | 2006-10-18 | Printed board connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200962689Y true CN200962689Y (en) | 2007-10-17 |
Family
ID=38799197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620139304 Expired - Fee Related CN200962689Y (en) | 2006-10-18 | 2006-10-18 | Printed board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200962689Y (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867286A (en) * | 2010-06-29 | 2010-10-20 | 中兴通讯股份有限公司 | DC/ DC module power supply |
| CN102006726A (en) * | 2010-11-10 | 2011-04-06 | 友达光电股份有限公司 | Composite circuit board device and manufacturing method thereof |
| CN102143655A (en) * | 2010-12-24 | 2011-08-03 | 华为技术有限公司 | Power supply module and network equipment |
| CN102427661A (en) * | 2011-09-14 | 2012-04-25 | 聚信科技有限公司 | Printed circuit board (PCB) assembly and PCB assembly assembling method |
| WO2012061990A1 (en) * | 2010-11-11 | 2012-05-18 | 深圳盛凌电子股份有限公司 | Pcb board connector and pcb board connecting structure |
| CN102929334A (en) * | 2011-08-10 | 2013-02-13 | 深圳市顶星数码网络技术有限公司 | Board card connecting method |
| GB2494919A (en) * | 2011-09-23 | 2013-03-27 | Control Tech Ltd | Joining PCB together using prongs and holes, preferably staggered and with solder |
| TWI413463B (en) * | 2010-10-25 | 2013-10-21 | Au Optronics Corp | Complex circuit board device and fabrication method |
| CN103716990A (en) * | 2014-01-14 | 2014-04-09 | 深圳市倍通控制技术有限公司 | PCB and electronic product comprising same |
| CN103872588A (en) * | 2014-04-01 | 2014-06-18 | 沈阳华乐世通传动技术有限公司 | Mother board of modular mounting plate of intelligent power distribution cabinet |
| CN106163137A (en) * | 2016-07-05 | 2016-11-23 | 四川九洲电器集团有限责任公司 | A kind of welding procedure and structural member |
| CN108227594A (en) * | 2018-02-28 | 2018-06-29 | 广东美的制冷设备有限公司 | A kind of controller and the household electrical appliance with the controller |
| CN110099521A (en) * | 2019-06-05 | 2019-08-06 | 深圳市南极光电子科技股份有限公司 | A kind of welding method and PCB lamp bar of FPC and PCB lamp bar |
| CN114535740A (en) * | 2022-03-03 | 2022-05-27 | 京信通信技术(广州)有限公司 | Antenna, radiation unit and welding method of radiation unit |
| CN115024024A (en) * | 2020-02-05 | 2022-09-06 | 浩亭股份有限公司 | Component carrier for arranging electrical components on a printed circuit board |
-
2006
- 2006-10-18 CN CN 200620139304 patent/CN200962689Y/en not_active Expired - Fee Related
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012000371A1 (en) * | 2010-06-29 | 2012-01-05 | 中兴通讯股份有限公司 | Dc/dc module power supply |
| CN101867286A (en) * | 2010-06-29 | 2010-10-20 | 中兴通讯股份有限公司 | DC/ DC module power supply |
| US9173335B2 (en) | 2010-10-25 | 2015-10-27 | Au Optronics Corporation | Complex circuit board fabrication method |
| TWI413463B (en) * | 2010-10-25 | 2013-10-21 | Au Optronics Corp | Complex circuit board device and fabrication method |
| US8641260B2 (en) | 2010-10-25 | 2014-02-04 | Au Optronics Corporation | Complex circuit board and fabrication method thereof |
| CN102006726B (en) * | 2010-11-10 | 2012-06-27 | 友达光电股份有限公司 | Composite circuit board device and manufacturing method thereof |
| CN102006726A (en) * | 2010-11-10 | 2011-04-06 | 友达光电股份有限公司 | Composite circuit board device and manufacturing method thereof |
| WO2012061990A1 (en) * | 2010-11-11 | 2012-05-18 | 深圳盛凌电子股份有限公司 | Pcb board connector and pcb board connecting structure |
| CN102625965A (en) * | 2010-11-11 | 2012-08-01 | 深圳盛凌电子股份有限公司 | PCB board connector and PCB board connecting structure |
| CN102625965B (en) * | 2010-11-11 | 2014-07-09 | 深圳盛凌电子股份有限公司 | PCB board connector and PCB board connecting structure |
| CN102143655A (en) * | 2010-12-24 | 2011-08-03 | 华为技术有限公司 | Power supply module and network equipment |
| CN102143655B (en) * | 2010-12-24 | 2014-09-17 | 华为技术有限公司 | Power supply module and network equipment |
| CN102929334A (en) * | 2011-08-10 | 2013-02-13 | 深圳市顶星数码网络技术有限公司 | Board card connecting method |
| CN102427661A (en) * | 2011-09-14 | 2012-04-25 | 聚信科技有限公司 | Printed circuit board (PCB) assembly and PCB assembly assembling method |
| CN102427661B (en) * | 2011-09-14 | 2013-09-11 | 华为机器有限公司 | Printed circuit board (PCB) assembly and PCB assembly assembling method |
| GB2494919B (en) * | 2011-09-23 | 2015-06-17 | Control Tech Ltd | Method for connecting printed circuit boards. |
| GB2494919A (en) * | 2011-09-23 | 2013-03-27 | Control Tech Ltd | Joining PCB together using prongs and holes, preferably staggered and with solder |
| CN103716990A (en) * | 2014-01-14 | 2014-04-09 | 深圳市倍通控制技术有限公司 | PCB and electronic product comprising same |
| CN103872588A (en) * | 2014-04-01 | 2014-06-18 | 沈阳华乐世通传动技术有限公司 | Mother board of modular mounting plate of intelligent power distribution cabinet |
| CN106163137A (en) * | 2016-07-05 | 2016-11-23 | 四川九洲电器集团有限责任公司 | A kind of welding procedure and structural member |
| CN106163137B (en) * | 2016-07-05 | 2018-09-28 | 四川九洲电器集团有限责任公司 | A kind of welding procedure and structural member |
| CN108227594A (en) * | 2018-02-28 | 2018-06-29 | 广东美的制冷设备有限公司 | A kind of controller and the household electrical appliance with the controller |
| CN110099521A (en) * | 2019-06-05 | 2019-08-06 | 深圳市南极光电子科技股份有限公司 | A kind of welding method and PCB lamp bar of FPC and PCB lamp bar |
| CN115024024A (en) * | 2020-02-05 | 2022-09-06 | 浩亭股份有限公司 | Component carrier for arranging electrical components on a printed circuit board |
| CN114535740A (en) * | 2022-03-03 | 2022-05-27 | 京信通信技术(广州)有限公司 | Antenna, radiation unit and welding method of radiation unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071017 Termination date: 20121018 |