CN101867286A - DC/ DC module power supply - Google Patents

DC/ DC module power supply Download PDF

Info

Publication number
CN101867286A
CN101867286A CN201010215030A CN201010215030A CN101867286A CN 101867286 A CN101867286 A CN 101867286A CN 201010215030 A CN201010215030 A CN 201010215030A CN 201010215030 A CN201010215030 A CN 201010215030A CN 101867286 A CN101867286 A CN 101867286A
Authority
CN
China
Prior art keywords
circuit board
paster
power source
modular power
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201010215030A
Other languages
Chinese (zh)
Other versions
CN101867286B (en
Inventor
张滨
陈丽霞
张洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN201010215030.6A priority Critical patent/CN101867286B/en
Publication of CN101867286A publication Critical patent/CN101867286A/en
Priority to PCT/CN2011/075364 priority patent/WO2012000371A1/en
Application granted granted Critical
Publication of CN101867286B publication Critical patent/CN101867286B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a DC/ DC module power supply, and relates to DC/ DC module power supply technology. The DC/ DC module power supply comprises a circuit board and a plurality of locating components, wherein one end of each locating component is provided with a plug-in piece, and the other end thereof is provided with a paster; the plug-in pieces of the locating components are correspondingly connected with through holes of the circuit board; and the pasters of the locating components are connected with a system board. By adopting the technical scheme, the DC/ DC module power supply can improve the power density and the heat dissipation capability of the DC/ DC module power supply, increases the arrangement density of the system board, and enhances the welding reliability of the DC/ DC module power supply on the system board.

Description

A kind of DC/DC modular power source
Technical field
The present invention relates to the DC/DC modular power source, relate in particular to a vertical DC/DC modular power source.
Background technology
As the DC/DC modular power source, be widely used for the communications fields such as switching equipment, access device, mobile communication, microwave communication, optical transmission, router, and field such as automotive electronics, Aero-Space.In the communications field communication system generally be with-48V or+the 24V power supply.Have one or more DC/DC modular power sources in the system, the voltage transitions of direct current supply is become the operating voltage that needs on the wiring board.Along with requiring more and more higher to the power density of DC/DC modular power source and conversion efficiency etc. in the communication field, a miniaturization is provided, high efficiency, the DC/DC modular power source becomes very urgent demand reliably, and the variation of the encapsulating structure of DC/DC modular power source is to realize miniaturization, high efficiency a solution.
The structure that common a kind of DC/DC modular power source is formed mainly comprises: one group of printed circuit board (PCB), circuit devcie layout, the compositions such as contact pin that are used to be electrically connected.The encapsulation of DC/DC modular power source mainly contains plug-in unit encapsulation and two kinds of structures of paster encapsulation, the DC/DC modular power source of plug-in unit encapsulation and system board between connection need adopt through hole, the pin of DC/DC modular power source is realized being connected of system board and modular power source by the welding connecting hole on the system board, the present main version of DC/DC modular power source of paster encapsulation is the structure of horizontal positioned, the pin of the structure of horizontal positioned mainly adopts BGA (Ball GridArray, ball grid array) encapsulation or single terminal welded structure form.The DC/DC modular power source of paster encapsulating structure on structure, some problems as the flatness of welding occur easily when using, and the problem of the intensity after the welding etc.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of DC/DC modular power source, to improve the integrated level of system.
In order to address the above problem, it is considered herein that the DC/DC modular power source can link to each other with system board with the paster connected mode, wherein, vertical paster ways of connecting is adopted in being connected between DC/DC modular power source and the system, can be further provide solder pad on the plane with being connected of system board at the circuit printing plate of DC/DC modular power source, be used to increase the bonding strength of DC/DC modular power source and system board, use as radiating element simultaneously.
Particularly, the invention discloses a kind of DC/DC modular power source, comprise circuit board and some align members, described align member one end is a plug-in unit, and the other end is a paster, wherein, and the corresponding through hole that connects described circuit board of the plug-in unit of described align member; The paster of described align member connects described system board.
Further, in the above-mentioned power supply, the plug-in unit of described align member is with the corresponding through hole that connects described circuit board of welding manner; The paster of described align member connects described system board with solder reflow.
Further, above-mentioned power supply also comprises positioning cards, and this positioning cards is used for according to the distance between the through hole of described circuit board, and some described align members are connected as one.
Wherein, described circuit board is vertically connected on the described system board.
Described circuit board comprises the connection plane, and described connection plane is provided with solder pad;
Described circuit board is vertically connected on the described system board by described solder pad.
This DC/DC modular power source also comprises the paster member, and this paster member is connected the top of described circuit board.
Described paster member is sheet or tabs shape.
Described paster member is bonded in the top of described circuit board by thermal conductive insulation glue.
Adopt technical solution of the present invention, can improve the power density and the heat-sinking capability of DC/DC modular power source, and improve the density of the layout of system board, strengthen the soldering reliability of DC/DC modular power source on system board.
Description of drawings
The schematic diagram of Fig. 1 for being connected between DC/DC modular power source and the system board;
Fig. 2 is the component diagram of DC/DC modular power source;
Fig. 3 is a DC/DC modular power source printed circuit board schematic diagram;
Fig. 4 is heat radiation paster structure spare schematic diagram;
Fig. 5 is the connector schematic diagram;
Fig. 6 is the application example schematic diagram.
Embodiment
Below in conjunction with drawings and the specific embodiments technical solution of the present invention is described in further details.
A kind of DC/DC modular power source comprises circuit board and some align members at least.Introduce the each several part function below.
Circuit board comprises printed circuit board and realizes the device of circuit function;
Wherein, circuit board is vertically connected on the system board, preferably, circuit board and system board link to each other is connected the plane one or more solder pad (as covering copper) also can be set, like this, can DC/DC modular power source proposed by the invention be welded on corresponding pad window on the system board, strengthen the weld strength of DC/DC modular power source and system board by solder pad, the solder pad (as covering copper) that connects simultaneously on the plane can also reach thermolysis, thereby improves the efficient of modular power source.
Align member, be used to realize reliable connection the between DC/DC modular power source and the system board, the one end is a plug-in unit, the other end is a paster, wherein, the plug-in unit of align member is by the through hole on the corresponding connecting circuit plate of plug-in unit welding manner, and the paster of align member is then by paster solder reflow connected system plate;
Preferably, can adopt a location card, this locator card can connect as one some align members according to the distance between the through hole on the circuit board, can be convenient to assembling, at this moment, and can be with some align member integral body of positioning cards and connection thereof as connector.Wherein, positioning cards connects as one finger according to the distance between the through hole on the circuit board with some align members, positioning cards is changed to the distance between each align member the distance between the through hole of circuit board, perhaps the distance between each align member is changed to the integral multiple of the distance between the through hole of circuit board.
Also have in some preferred schemes, the DC/DC modular power source can also comprise a paster member, this paster member is connected the top of circuit board, to guarantee the flatness at DC/DC modular power source top, the top of the suction nozzle of chip mounter absorption DC/DC modular power source can be assembled to this DC/DC modular power source on the system board like this.Wherein, this paster member can stick on the top of DC/DC modular power source by heat-conducting glue.Further, this paster member can adopt the good material of heat radiation, so just can the device that need in the DC/DC modular power source to dispel the heat be dispelled the heat, thus the efficient of raising modular power source.Particularly, the shape of paster member can be sheet, sticks on the end face of circuit board.Perhaps the shape of paster member can be one folding piece, and the end face that the main body in this tabs sticks on circuit board to be realizing the paster function, and the folded part of tabs sticks on the device of realization circuit function of circuit board side, to realize the heat radiation attachment function.
Introduce several below according to preferred DC/DC modular power source that technical solution of the present invention proposed.
Embodiment 1
DC/DC modular power source in the present embodiment, as shown in Figure 1, DC/DC modular power source 12 is applied on the system board, DC/DC modular power source 12 is made up of circuit board (being printed circuit board 121 and the device 122 of realizing circuit function), connector 13 two parts, wherein, connector 13 is welded on the printed circuit board 121 reliably by the through hole solder reflow, and the DC/DC modular power source is realized reliable connection between DC/DC modular power sources and the system board by connector 13.The connection plane that this DC/DC modular power source is connected with system is provided with covers copper pad, can strengthen being connected of DC/DC modular power source and system board, and reach the effect of heat radiation.This kind of DC//DC modular power source 12 is because the heat radiation of its device meets the demands, and the plane (for example end face of circuit board) that can directly use the device on the DC//DC modular power source 12 when carrying out paster is not so use the paster member.
Embodiment 2
Present embodiment proposes a kind of preferred DC/DC modular power source, and it is vertically mounted on and forms a system product on the system board, as shown in Figure 2.System product 10 comprises the motherboard (being system board) 11 of a system, the DC/DC modular power source 12 that is welded with one or more vertically arranged present embodiments above and is proposed.
Wherein, the paster reflow soldering is adopted in the connection between DC/DC modular power source and the system board.The composition structure of DC/DC modular power source 12 as shown in Figure 3, comprises circuit board 121 (device that comprises printed circuit board and realization circuit function), connector 13 and paster member 14.
Have through hole on the circuit board 121, the corresponding connection of plug-in unit end that this through hole is used for mode and connector 13 by plug-in unit welding is with being connected between realization connector 13 and the circuit board 121;
In the present embodiment, circuit board 121 is provided with a plurality of solder pad (promptly covering copper) 1211 with the plane 1212 that is connected that system board is welded to connect, as shown in Figure 4.Like this, when the DC/DC modular power source is welded on the system board 11, solder pad is welded to paster pad window corresponding on the system board gets final product, to improve the soldering reliability of DC/DC modular power source on system board.Simultaneously, the solder pad on the connection plane can also increase the area of dissipation of DC/DC modular power source.
Paster member 14 is bonded in circuit board 121 tops by thermal conductive insulation glue, thereby when assembling DC/DC modular power source, suction nozzle as chip mounter is drawn the plane, play the paster effect, and in the present embodiment, the paster member is an one folding piece, the similar N shape of its shape, being the paster member extends on the device of realizing circuit function the circuit board from the top of circuit board, thereby has played the effect of heat radiation for the device of realizing circuit function.
Particularly, the paster member 14 in the present embodiment as shown in Figure 5.The paster member mainly is divided into two sections, wherein, one section end face that is connected circuit board as the paster function face 141 of DC/DC modular power source 12, another section is as heat radiation attachment function face 142, be bonded in the power device (being the device of realizing circuit function in the circuit board) that needs on the circuit board to dispel the heat by the heat conductive insulating adhesive glue, simultaneously, in order to strengthen adhibit quality, the paster member also has the another side (being that side that does not have the circuit function device in the circuit board) of one section stickup circuit board, need the device of heat radiation effectively to dispel the heat thereby give, increase the area of dissipation of power device, improve reliability of products.
Interface unit 13 is the devices that connect the electric and mechanical connection effect between DC/DC modular power source and the system board, as shown in Figure 6, comprises some align members 131 and positioning cards 132.Wherein, an end (1311) of align member 131 is cylindrical plug-in unit, is used for the corresponding welding of through hole that connects with DC/DC modular power source printed circuit board, and the other end (1312) is the paster of tetragonal body, is used for the DC/DC modular power source and is connected with system board.Positioning cards then connects as one these some align members according to the distance between the through hole of printed circuit board, so that assembling.Wherein, the distance between each align member equals the distance between the through hole of printed circuit board, and perhaps the distance between each align member equals the integral multiple of the distance between the through hole of printed circuit board.Wherein, through hole welding ends 1311 is welded on through hole 1211 positions of printed circuit board, and paster welding ends 1312 is welded on the system board.
From the foregoing description as can be seen, the DC/DC modular power source of vertical paster proposed by the invention is characterized in miniaturization, vertical installation, because its paster encapsulating structure, covering at the printed circuit board side has increased reliability and area of dissipation when brazing connects.In addition, the paster structure of DC/DC modular power source proposed by the invention can compatible be used for the heat radiation of device.
The above is a preferred embodiments of the present invention only, is not to be used to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (8)

1. a DC/DC modular power source comprises circuit board, it is characterized in that, also comprises some align members, and described align member one end is a plug-in unit, and the other end is a paster, wherein, and the corresponding through hole that connects described circuit board of the plug-in unit of described align member; The paster of described align member connects described system board.
2. power supply as claimed in claim 1 is characterized in that,
The plug-in unit of described align member is with the corresponding through hole that connects described circuit board of welding manner; The paster of described align member connects described system board with solder reflow.
3. power supply as claimed in claim 1 is characterized in that this power supply also comprises positioning cards, and this positioning cards is used for according to the distance between the through hole of described circuit board, and some described align members are connected as one.
4. as claim 1,2 or 3 described power supplys, it is characterized in that,
Described circuit board is vertically connected on the described system board.
5. power supply as claimed in claim 4 is characterized in that,
Described circuit board comprises the connection plane, and described connection plane is provided with solder pad;
Described circuit board is vertically connected on the described system board by described solder pad.
6. as claim 1,2 or 3 described power supplys, it is characterized in that,
This DC/DC modular power source also comprises the paster member, and this paster member is connected the top of described circuit board.
7. power supply as claimed in claim 6 is characterized in that,
Described paster member is sheet or tabs shape.
8. power supply as claimed in claim 6 is characterized in that,
Described paster member is bonded in the top of described circuit board by thermal conductive insulation glue.
CN201010215030.6A 2010-06-29 2010-06-29 DC/ DC module power supply Active CN101867286B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010215030.6A CN101867286B (en) 2010-06-29 2010-06-29 DC/ DC module power supply
PCT/CN2011/075364 WO2012000371A1 (en) 2010-06-29 2011-06-07 Dc/dc module power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010215030.6A CN101867286B (en) 2010-06-29 2010-06-29 DC/ DC module power supply

Publications (2)

Publication Number Publication Date
CN101867286A true CN101867286A (en) 2010-10-20
CN101867286B CN101867286B (en) 2015-05-13

Family

ID=42958879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010215030.6A Active CN101867286B (en) 2010-06-29 2010-06-29 DC/ DC module power supply

Country Status (2)

Country Link
CN (1) CN101867286B (en)
WO (1) WO2012000371A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012000371A1 (en) * 2010-06-29 2012-01-05 中兴通讯股份有限公司 Dc/dc module power supply
WO2013104206A1 (en) * 2012-01-11 2013-07-18 华为技术有限公司 Power device insulating heat radiation structure, circuit board and power supply equipment
CN103596365A (en) * 2013-11-28 2014-02-19 上海空间电源研究所 Installation structure of power tubes and printed circuit board
CN103943581A (en) * 2013-01-23 2014-07-23 中兴通讯股份有限公司 Power device packaging structure and packaging method
CN107367803A (en) * 2017-08-28 2017-11-21 华进半导体封装先导技术研发中心有限公司 A kind of light module package structure and preparation method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245509A (en) * 1991-09-05 1993-09-14 Telefunken Electronic Gmbh Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement
US20020041506A1 (en) * 2000-08-29 2002-04-11 Kun-Feng Chen Power supply device for enhancing heat-dissipating effect
JP2007135336A (en) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd High-voltage power supply unit
CN101052273A (en) * 2007-05-16 2007-10-10 艾默生网络能源有限公司 PCB plate connection structure and connection method
CN200962689Y (en) * 2006-10-18 2007-10-17 中控科技集团有限公司 Printed board connection structure
CN101299426A (en) * 2007-04-30 2008-11-05 华为技术有限公司 Module and electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006050891A (en) * 2004-07-08 2006-02-16 Toshiba Tec Corp Multi-phase version dc/dc converter apparatus
CN101867286B (en) * 2010-06-29 2015-05-13 中兴通讯股份有限公司 DC/ DC module power supply

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245509A (en) * 1991-09-05 1993-09-14 Telefunken Electronic Gmbh Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement
US20020041506A1 (en) * 2000-08-29 2002-04-11 Kun-Feng Chen Power supply device for enhancing heat-dissipating effect
JP2007135336A (en) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd High-voltage power supply unit
CN200962689Y (en) * 2006-10-18 2007-10-17 中控科技集团有限公司 Printed board connection structure
CN101299426A (en) * 2007-04-30 2008-11-05 华为技术有限公司 Module and electronic device
CN101052273A (en) * 2007-05-16 2007-10-10 艾默生网络能源有限公司 PCB plate connection structure and connection method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012000371A1 (en) * 2010-06-29 2012-01-05 中兴通讯股份有限公司 Dc/dc module power supply
WO2013104206A1 (en) * 2012-01-11 2013-07-18 华为技术有限公司 Power device insulating heat radiation structure, circuit board and power supply equipment
CN103943581A (en) * 2013-01-23 2014-07-23 中兴通讯股份有限公司 Power device packaging structure and packaging method
CN103943581B (en) * 2013-01-23 2017-07-07 中兴通讯股份有限公司 Power device packaging structure and method for packing
CN103596365A (en) * 2013-11-28 2014-02-19 上海空间电源研究所 Installation structure of power tubes and printed circuit board
CN103596365B (en) * 2013-11-28 2017-04-19 上海空间电源研究所 Installation structure of power tubes and printed circuit board
CN107367803A (en) * 2017-08-28 2017-11-21 华进半导体封装先导技术研发中心有限公司 A kind of light module package structure and preparation method

Also Published As

Publication number Publication date
CN101867286B (en) 2015-05-13
WO2012000371A1 (en) 2012-01-05

Similar Documents

Publication Publication Date Title
US8004070B1 (en) Wire-free chip module and method
US20120273932A1 (en) Power supply module and packaging and integrating method thereof
CN101867286B (en) DC/ DC module power supply
CN101533834A (en) Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same
CN101779529B (en) Electric circuit configuration and method for producing electric circuit configuration
CN219017643U (en) Power module and electronic equipment with same
CN102164453A (en) Circuit module
CN109588023B (en) Heat dissipation structure and related equipment
US7688591B2 (en) Electronic-component-mounting board
CN103037619A (en) Printed circuit board assembly
KR101115403B1 (en) Light emitting apparatus
CN111064344B (en) Power module with bottom metal heat dissipation substrate
CN202906868U (en) Leadless large power light metal oxide semiconductor (MOS) solid state relay
CN220368591U (en) Power supply device
CN211788986U (en) Circuit packaging chip
CN214848628U (en) Semiconductor circuit having a plurality of transistors
CN115052420B (en) Circuit board for electronic circuit lamination design and design method thereof
CN220672562U (en) Gallium nitride half-bridge module
CN214592492U (en) Motor drive module
CN220173466U (en) Heat radiation structure for power device and power device unit
CN210928114U (en) Heat dissipation type light multilayer circuit board
CN201523352U (en) Integrated circuit voltage regulator
CN217334079U (en) Integrated driving module
CN214544925U (en) Ceramic substrate
JP7474143B2 (en) Optical Modules

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant