CN100568627C - A kind of module power supply base pin structure - Google Patents
A kind of module power supply base pin structure Download PDFInfo
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- CN100568627C CN100568627C CNB2007100710250A CN200710071025A CN100568627C CN 100568627 C CN100568627 C CN 100568627C CN B2007100710250 A CNB2007100710250 A CN B2007100710250A CN 200710071025 A CN200710071025 A CN 200710071025A CN 100568627 C CN100568627 C CN 100568627C
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Abstract
The invention discloses a kind of module power supply base pin structure, comprise perforation formula pin, surface-adhered type pin and high-temperature insulation spare, it is characterized in that will bore a hole formula pin, surface-adhered type pin of described insulating part located by modular power source industrial standard pin definition of pin position and obtained module power supply base pin structure.Module power supply base pin structure of the present invention has the two advantage of full separation perforation formula pin and full surface mount tubular type pin concurrently, has overcome the shortcoming of the two again.Power supply input and output pin adopts perforation formula pin, has good overcurrent capability, firm mechanical connection intensity; It is few that the miscellaneous function pin adopts the surface-adhered type pin to take the printed circuit board (PCB) resource; Surface-adhered type pin behind the plastic packaging combines as a whole with perforation formula pin, and mechanical strength is strengthened.The production technology of binding modules power supply, module power supply base pin structure 100 can adopt the SMT explained hereafter, enhances productivity.
Description
Technical field
The present invention relates to modular power source, particularly have the pin of the brick pattern block power supply of industry-standard package.
Background technology
Current modular power source power density is more and more higher.The Da Cheng that is lifted at very of power density depends on development of technology on, and the components and parts property development also has benefited from dispelling the heat and the improvement of encapsulating structure simultaneously.Industrial standard fragment of brick power pin is normally separated the perforation formula entirely, sees Fig. 1; It is full surface mount (SMT) formula that pin is also arranged in recent years, sees Fig. 2.The full perforation formula pin that separates has good overcurrent capability, firm mechanical connection intensity, but this pin need provide through hole to take more printed circuit (PCB) plate resource for installation, and other electron component all can not be installed by its top layer bottom via hole place; And this pin can not adopt the SMT explained hereafter, and packaging efficiency is low.The conventional module power supply all is to adopt this pin package basically.Full surface-adhered type pin can overcome the latter's shortcoming effectively, but lose its advantage with to separate perforation formula pin opposite, it is little that it takies the pcb board resource, can adopt the SMT explained hereafter, the packaging efficiency height, but overcurrent capability is relatively poor relatively, the mechanical connection intensity difference.So on the 1/16 stock mould block power supply that full surface mount tubular type pin is generally used for just occurring in recent years.
Summary of the invention
The present invention is based on the defective of above-mentioned two type block power pin, proposed the module power supply base pin structure that a kind of process has been improved.
The present invention is achieved in that a kind of module power supply base pin structure, comprise perforation formula pin, surface-adhered type pin and high-temperature insulation spare, it is characterized in that power supply input and output pin adopts perforation formula pin, the miscellaneous function pin adopts the surface-adhered type pin, and will bore a hole formula pin, surface-adhered type pin of described insulating part located by modular power source industrial standard pin definition of pin position and obtained module power supply base pin structure.
Modular power source has many pins usually, comprises the most basic power supply input and output pin, and some other is used for the auxiliary pin of function control and management.There is big electric current to flow through on the power supply input and output pin, so the ability of its overcurrent is had certain requirement; And the miscellaneous function pin only transmits signal usually, and overcurrent capability is not had special requirement.For this reason, among the present invention, power supply input and output pin adopts perforation formula pin, and the miscellaneous function pin adopts the surface-adhered type pin, by high-temperature insulation spare this two classes pin is located by modular power source industrial standard pin definition of pin position to obtain module power supply base pin structure again.
Module power supply base pin structure of the present invention has the two advantage of full separation perforation formula pin and full surface mount tubular type pin concurrently, has overcome the shortcoming of the two again.Power supply input and output pin adopts perforation formula pin, has good overcurrent capability, firm mechanical connection intensity; It is few that the miscellaneous function pin adopts the surface-adhered type pin to take the printed circuit board (PCB) resource; Surface-adhered type pin behind the plastic packaging combines as a whole with perforation formula pin, and mechanical strength is strengthened.The production technology of binding modules power supply, module power supply base pin structure 100 can adopt the SMT explained hereafter, enhances productivity.
According to the present invention, there are first installation head, first step, V-type to end tin sulculus, the anti-skidding sulculus of V-type, second step and second installation head on the described perforation formula pin.Described module power supply base pin structure is characterized in that the thickness of the first installation head length of described perforation formula pin less than connected modular power source pcb board.
There are first solder side, V-type to end tin sulculus, the anti-skidding sulculus of V-type, step and installation head on the described surface-adhered type pin.Described step and installation head also can be replaced by second solder side.Lead the tin sulculus on first solder side of described surface-adhered type pin and/or second solder side.
According to the present invention, the first step of described perforation formula pin and first solder side of surface-adhered type pin are on same plane or a little more than first solder side of surface-adhered type pin.
According to the present invention, described insulating part comprises the pin connector that connects perforation formula pin and surface-adhered type pin, also comprises the intermediate connector that is used to connect the pin connector.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is that modular power source adopts the schematic diagram that separates perforation formula pin.
Fig. 2 is the schematic diagram that modular power source adopts full surface-adhered type pin.
Fig. 3 is a mount structure schematic diagram of the present invention, wherein Fig. 3 (A) is the structural representation of perforation formula pin, Fig. 3 (B) is the structural representation of a kind of execution mode of surface-adhered type pin, Fig. 3 (C) is the upward view of Fig. 3 (B), Fig. 3 (D) is the structural representation of the another kind of execution mode of surface-adhered type pin, and Fig. 3 (E) is the upward view of Fig. 3 (D).
Fig. 4 is the structural representation of a kind of execution mode of module power supply base pin structure of the present invention.
Fig. 5 is the schematic diagram that module power supply base pin structure of the present invention assembles on the pcb board of modular power source.
Fig. 6 is the schematic diagram that the module power supply base pin structure of another embodiment of the present invention assembles on the pcb board of modular power source.
Fig. 7 is equipped with the schematic diagram that the pcb board of two modular power sources of module power supply base pin structure of the present invention is assembled together.
Fig. 8 is the present invention's structural representation of an execution mode again.
Fig. 9 is the schematic diagram that the module power supply base pin structure of Fig. 8 execution mode of the present invention assembles on the pcb board of modular power source.
Figure 10 is the schematic diagram that the module power supply base pin structure of the another execution mode of the present invention assembles on the pcb board of modular power source.
Figure 11 is the schematic diagram that the pcb board of two modular power sources installing by Figure 10 execution mode is installed together.
Embodiment
With reference to Fig. 3 (A), there are first installation head 201, first step 202, V-type to end tin sulculus 203, the anti-skidding sulculus 204 of V-type, second step 205 and second installation head 206 on the perforation formula pin one 01.Installation head 201, installation head 205 ends respectively have down pin, and contraposition is convenient produces assembling to help, and the length of installation head 201 can be less than the thickness of modular power source pcb board to be applicable to the SMT explained hereafter.With reference to Fig. 3 (B, C), an execution mode of surface-adhered type pin one 02 has first solder side 211, V-type to end tin sulculus 212, the anti-skidding sulculus 213 of V-type, step 214, installation head 215 on it.With reference to Fig. 3 (D, E), another execution mode of surface-adhered type pin one 02 is that with Fig. 3 (B) execution mode difference described step 214, installation head 215 form another kind of surface-adhered type pin one 02-1 by 217 replacements of second solder side.All offer on first solder side 211 and second solder side 217 and lead tin sulculus 216.
With reference to Fig. 4, will bore a hole formula pin one 01, surface-adhered type pin one 02 of high-temperature resistance plastice spare 103 located by modular power source industrial standard pin definition of pin position at anti-skidding sulculus 204 places and obtained module power supply base pin structure 100.The perforation formula pin one 01 installing and locating step 202 of structural member 100 and the solder side 211 of surface-adhered type pin one 02 can be welded on the pcb board of modular power source to guarantee surface-adhered type pin one 02 reliably on same plane or a little more than the solder side 211 of surface-adhered type pin one 02.Perforation formula pin one 01 is defined as power supply input and output pin, and surface-adhered type pin one 02 is defined as the miscellaneous function pin.
With reference to Fig. 5, working of plastics 103 comprises a pair of pin connector 121 that connects perforation formula pin one 01, surface-adhered type pin one 02, and the intermediate connector 122 of the described a pair of pin connector 121 of bridge joint.Pin connector 121 makes surface-adhered type pin and perforation formula pin combine as a whole, and mechanical strength is strengthened.Intermediate connector 122 parts temporarily provide a plane for the SMT paster.Chip mounter with mount structure spare 100 pasters on the pcb board of modular power source.Production after assembling the stove welding was excised intermediate connector 122 parts.
With reference to Fig. 6, another execution mode of the present invention, be to comprise in the working of plastics 103 pin connector 121 with Fig. 5 execution mode difference, thereby intermediate connector 122 parts are saved, during the SMT paster directly to 121 part operations of pin connector, on the pcb board of modular power source, this depends on produces the assembly technology level with its paster, and this mode is had relatively high expectations.
With reference to Fig. 7, with working of plastics shown in Figure 6 103 and perforation formula pin one 01, surface-adhered type pin one 02 is located by modular power source industrial standard pin definition of pin position obtains two module power supply base pin structure 100-1 and 100-2, then two module power supply base pin structure 100-1 and 100-2 are installed on the pcb board of modular power source.The pcb board of two modular power sources assembles relatively.
Fig. 8, Fig. 9, Figure 10, Figure 11 are the structure and the scheme of installations of another execution mode of the present invention.Be that with Fig. 4 execution mode difference surface-adhered type pin one 02-1 two ends all are the paster welding.All the other structures are identical with Fig. 4 execution mode.
What should be understood that is: the foregoing description is just to explanation of the present invention, rather than limitation of the present invention, and any innovation and creation that do not exceed in the connotation scope of the present invention all fall within protection scope of the present invention.
Claims (10)
1, a kind of module power supply base pin structure, comprise perforation formula pin (101), surface-adhered type pin (102) and high-temperature insulation spare (103), it is characterized in that power supply input and output pin adopts perforation formula pin (101), the miscellaneous function pin adopts will bore a hole formula pin (101), surface-adhered type pin (102) of surface-adhered type pin (102), described insulating part (103) to be located by modular power source industrial standard pin definition of pin position and obtain module power supply base pin structure (100).
2, module power supply base pin structure as claimed in claim 1 is characterized in that having on the described perforation formula pin (101) first installation head (201), first step (202), V-type to end tin sulculus (203), the anti-skidding sulculus of V-type (204), second step (205) and second installation head (206).
3, module power supply base pin structure as claimed in claim 2 is characterized in that the thickness of first installation head (201) length of described perforation formula pin (101) less than connected modular power source pcb board.
4, module power supply base pin structure as claimed in claim 2 is characterized in that having on the described surface-adhered type pin (102) first solder side (211), V-type to end tin sulculus (212), the anti-skidding sulculus of V-type (213), step (214) and installation head 215.
5, module power supply base pin structure as claimed in claim 4 is characterized in that described step (214) and installation head (215) are replaced by second solder side (217).
6,, it is characterized in that leading tin sulculus (216) on first solder side (211) of described surface-adhered type pin (102) and/or second solder side (217) as claim 4 or 5 described module power supply base pin structures.
7, module power supply base pin structure as claimed in claim 4, the first step (202) that it is characterized in that described perforation formula pin (101) and first solder side (211) of surface-adhered type pin (102) are on same plane or a little more than first solder side (211) of surface-adhered type pin (102).
8, the described module power supply base pin structure of claim 1 is characterized in that described perforation formula pin (101) is defined as power supply input and output pin, and described surface-adhered type pin (102) is defined as the miscellaneous function pin.
9, the described module power supply base pin structure of claim 1 is characterized in that described insulating part (103) comprises the pin connector (121) that connects perforation formula pin (101) and surface-adhered type pin (102).
10, the described module power supply base pin structure of claim 9 is characterized in that described insulating part (103) also comprises the intermediate connector (122) that is used to connect pin connector (121).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100710250A CN100568627C (en) | 2007-08-29 | 2007-08-29 | A kind of module power supply base pin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100710250A CN100568627C (en) | 2007-08-29 | 2007-08-29 | A kind of module power supply base pin structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101136517A CN101136517A (en) | 2008-03-05 |
| CN100568627C true CN100568627C (en) | 2009-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100710250A Expired - Fee Related CN100568627C (en) | 2007-08-29 | 2007-08-29 | A kind of module power supply base pin structure |
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| CN (1) | CN100568627C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106276769A (en) * | 2016-08-11 | 2017-01-04 | 太仓市凯福士机械有限公司 | A kind of high-strength micro conductive composition mechanism |
| CN106373927A (en) * | 2016-08-25 | 2017-02-01 | 西安芯派电子科技有限公司 | Plug-in package piece |
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- 2007-08-29 CN CNB2007100710250A patent/CN100568627C/en not_active Expired - Fee Related
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| CN101136517A (en) | 2008-03-05 |
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Granted publication date: 20091209 Termination date: 20200829 |