CN1972562A - 一种线路板基体上焊盘的制造方法及焊盘 - Google Patents
一种线路板基体上焊盘的制造方法及焊盘 Download PDFInfo
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- CN1972562A CN1972562A CN 200510022158 CN200510022158A CN1972562A CN 1972562 A CN1972562 A CN 1972562A CN 200510022158 CN200510022158 CN 200510022158 CN 200510022158 A CN200510022158 A CN 200510022158A CN 1972562 A CN1972562 A CN 1972562A
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- Prior art keywords
- pad
- leg
- circuit board
- board substrate
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510022158XA CN100527917C (zh) | 2005-11-23 | 2005-11-23 | 一种线路板基体上焊盘的制造方法及焊盘 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510022158XA CN100527917C (zh) | 2005-11-23 | 2005-11-23 | 一种线路板基体上焊盘的制造方法及焊盘 |
Publications (2)
Publication Number | Publication Date |
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CN1972562A true CN1972562A (zh) | 2007-05-30 |
CN100527917C CN100527917C (zh) | 2009-08-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB200510022158XA Active CN100527917C (zh) | 2005-11-23 | 2005-11-23 | 一种线路板基体上焊盘的制造方法及焊盘 |
Country Status (1)
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CN (1) | CN100527917C (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5311405A (en) * | 1993-08-02 | 1994-05-10 | Motorola, Inc. | Method and apparatus for aligning and attaching a surface mount component |
JP3656543B2 (ja) * | 2000-10-25 | 2005-06-08 | 松下電器産業株式会社 | 電子部品実装方法 |
US6833615B2 (en) * | 2000-12-29 | 2004-12-21 | Intel Corporation | Via-in-pad with off-center geometry |
JP2004214533A (ja) * | 2003-01-08 | 2004-07-29 | Alps Electric Co Ltd | ランドパターン構造および電気部品搭載用基板 |
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2005
- 2005-11-23 CN CNB200510022158XA patent/CN100527917C/zh active Active
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Publication number | Publication date |
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CN100527917C (zh) | 2009-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: A manufacturing method of pad on circuit board substrate and pad License type: Exclusive license Record date: 20080504 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201211 Address after: 214500 9-629 Fuhai square, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jingjiang Huiheng New Material Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220303 Address after: 214500 No. 96, Xingye Road, Jingjiang City, Taizhou City, Jiangsu Province (in Chengnan Incubation Park) Patentee after: Jingjiang Defang Technology Service Co.,Ltd. Address before: 214500 9-629 Fuhai square, Jingjiang City, Taizhou City, Jiangsu Province Patentee before: Jingjiang Huiheng New Material Co.,Ltd. |