1325352 六、發明說明： 【發明所屬之技術領域】 本發明揭示了 -種雷射切割裂置及其切割方法尤 其私一種用於切割脆性材料如液晶顯示裝置 (TFT-LCD ) ( Thin Film Transistor > %% ^TFT ； Liquid Crystal Display’簡稱LCD)玻璃面板的雷射切割裝置 及其切割方法。 【先前技術】 隨著技術的不斷發展，液晶顯示裝置（TFT-LCD) 由於其自身的特性已廣泛的應用於消費領域内。其被視 為將用以取代傳統的陰極射線管（Cathode Ray Tube， 簡稱CRT )顯示裝置的強勁對手。 液即顯示裝置通常由兩塊玻璃基板、收容於兩塊玻 璃基板内的液晶及若干電路組成。液晶可以在電場的影 響下改麦排列方式來進行完成顯示動作。為了形成不同 尺寸的液晶顯示面板，通常需要對較大的液晶顯示面板 進行切割以滿足不同的需求。 傳統的切割液晶顯示面板的方式都是以刀輪等物 理手段作為切割工具，刀輪對玻璃面板施以玻璃定量之 應力，在玻璃表面造成穩定的垂直裂痕（Median Crack)，然後將玻璃面板的切割面翻轉，利用以樹脂制 成的加壓片對玻璃面板的切割面相對的背面施加壓縮 4 1325352 荷重以在玻璃面板上形成應力進而將玻璃面板完全分 離。 然而’刀輪切割玻璃面板需要經過多道製程如切割 (Scribe )、裂片（Break)、磨邊（Grinding )等，比較費 %，而且刀輪切割玻璃表面會對玻璃造成物理性破壞， 切割線附件常常存在一些不規則的微裂痕（Micr〇1325352 VI. Description of the Invention: [Technical Field] The present invention discloses a laser cutting and cracking method and a cutting method thereof, particularly for cutting a brittle material such as a liquid crystal display device (TFT-LCD) (Thin Film Transistor > ; %% ^TFT ; Liquid Crystal Display 'abbreviated LCD) laser cutting device for glass panels and cutting method thereof. [Prior Art] With the continuous development of technology, a liquid crystal display device (TFT-LCD) has been widely used in the consumer field due to its own characteristics. It is considered to be a strong competitor to replace the traditional cathode ray tube (CRT) display device. The liquid display device usually consists of two glass substrates, liquid crystals housed in two glass substrates, and several circuits. The liquid crystal can be changed to the arrangement of the wheat under the influence of the electric field to complete the display operation. In order to form liquid crystal display panels of different sizes, it is usually necessary to cut a large liquid crystal display panel to meet different needs. The traditional method of cutting the liquid crystal display panel is to use a physical means such as a cutter wheel as a cutting tool. The cutter wheel applies a glass quantitative stress to the glass panel, and causes a stable vertical crack (Median Crack) on the glass surface, and then the glass panel is The cut surface is reversed, and a pressure of 4 1325352 is applied to the opposite side of the cut surface of the glass panel by a pressure sheet made of a resin to form a stress on the glass panel to completely separate the glass panel. However, 'cutter-cut glass panels need to go through multiple processes such as cutting (Scribe), slashing (Break), edging (Grinding), etc., which is relatively expensive, and the cutter wheel cuts the glass surface to cause physical damage to the glass. Attachments often have some irregular micro-cracks (Micr〇
Crack )或是毛邊，這些缺陷對產品強度和生產良率產 生影響。 隨著消費性電子產品輕薄的發展趨勢，玻璃基板也 在向厚度更薄、材料密度更低、材料強度增強及熱膨脹 係數更低的趨勢發展，在這種情況下，傳統的利用刀輪 等物理手段進行切割的品質與生產效率上滿足不了需 求。因而一種利用雷射進行切割玻璃面板的方式產生 相比較傳統的刀輪切割’雷射切割不易產生微粒污 染、切割面平整、可大幅縮短生產時程，而且，雷射切 割玻璃面板後因無傳統刀輪切割所產生的微裂痕，所以 玻璃面板的強度為傳統的2-3倍。 如第一圖所示，一種先前的切割玻璃面板i的雷射 切割單元包括雷射系統2、刻線工具3及冷卻系統4。雷 射切副單元相對於玻璃基板的切割方向為箭頭A所 示。沿著切割方向A，刻線工具3先於玻璃面板i上形成 5 1325352 以微小的刻痕’隨後雷射系統2發射雷射光束沿著刻痕 進行加熱’冷卻系統隨之對加熱區進行冷卻，利用加熱 矛冷部所產生的溫度差對破璃面板產生的應力來進行 切割。 如第一圖所不’第一切割線5表示雷射切割單元在 玻璃面板1上的有效行程。當雷射切割單元完成第一切 割線5後，由於在整個切割過程中，刻線工具3、雷射系 統2及冷卻系統4的位置關係是固^的，㈣是說，雷射 :割早元只能沿-個㈣方向進行㈣，所以雷射切割 早兀t需要返回到初始位置的一側以進行第二次切割 樣’就產生了第-返回行程6。該第—返回行程 :不每射切割單元完成第一切割線5後返回到初始位 置的-側以進行第二次切割線7的無效行程。同理，第 =回行程8表示表示雷射切割單元完成第二切割線7 =回到㈣位置的—側以進行第三次切割線9的無效 此時’就可看出’當需要切割多次時由於刻線工 射系統2及冷卻系統4的位置關係是固定的，盆 :二-個切割方向進行切割，所以當完成前一個切割 線後單元就f要多次返回初 側以便於進行下一吹切剌，卜y 指置的- 行益效1 ° “個過程中就需要多次進 仃程’所以就需要需要大量的返回時間，增加了 工時’延緩了生產效率。這樣對於高效的面板切割時不 合適的。 所以需要設計—種新的雷射切割裝置及方法以克 服上述不利的情況發生。 【發明内容】 本發明的目的在於提供一種雷射切割裝置及方 法’其可以快速的完成切割。 本發明的目的是通過以下技術方案實現的:一種雷 射切割裝置，用於切割脆性材料，其具有第—切割方向 2括沿著第—㈣方向依次排列的第-冷卻系統，雷 二、統及第一切割工具’該雷射切割裝置還包括第二切 具及第二冷卻系統，當上述第—切割工具，雷射系 統及第-冷卻系統沿著上述第一切割方向完成一次切、 割後，該第二切割工具，上述雷射系統及該第二冷卻系 統沿著與上述第—切割方向相反的第二切割方向進行、 Z㈣。此外，還涉及—種雷射切割方法，其包括： ::::-切割方向進行一次切割;在上次切割完成後， 一與上述第—切割方向相反的方向進行下次切判。 ，與先前技術相比，本發明雷射切料置及方法採用 工具和一冷卻系統’在不需要增加太多設備 省專’名去了大量的返回時間，這樣就可以節 谲工時，加快切割流程，提高生產效率。 1325352 【實施方式】 >看第一圖到第五圖所示，本發明用於切割玻璃基 板13的雷射切割單元包括雷射系統第-刻線工具 11 ’第一冷卻系統111，帛二刻線工具12及帛二冷卻系 統 122。 在本發明雷射切割單元中，第一刻線工具^及第二 刻線工具12可以是雷射光束、鑽石刀、刀輪等可在玻璃 基板表面產生敎裂紋之任意工具。第_冷卻系統m 及第二冷卻系統122可以是單一液體、單一氣體加單一 液體的混合物或一種以上的氣體與液體的混合物等，如 純水、冷卻油、液態氮或液態氦等。 與先前的雷射切割技術相比，本發明的雷射切割單 元的雷射系統10，刻線工具u，12及冷卻系統ln，122 是在相互位置關係及數量上進行改變來實現本發明，並 達到一明顯的技術效果，並不涉及雷射系統、刻線工具 及冷卻系統的自身結構、發生或形成原理。故，本發明 雷射切割單元對於雷射系統10,刻線工具^，12及冷卻 糸統111，122的自身結構、發生或形成原理不進行詳細 介紹，僅利用其示意圖來說明本發明。 參看第三圖及第四圖所示’雷射切割玻璃面板先以 刻線工具在玻璃基板13上形成預刻線，雷射系統1 〇喷射 雷射光束如二氧化碳雷射光對玻璃面板表面進行加 8 1325352 …、玻璃面板本身因雷射能量而被加熱，玻璃的溫度控 制在其熔點溫度之下，玻璃面板内部因材料受熱膨脹而 產生張應力，隨後立即以冷卻系統冷卻玻璃面板。玻璃 面板因叉冷卻系統冷卻的影響，内部收縮而產生壓應 力。玻璃面板因雷射急速加熱與冷卻系統急速冷卻的影 響’内部應力分佈產生快速變化，進而在破璃面板產生 裂紋’裂紋在切割面成長使得玻璃面板完全分離。 造成玻璃面板劈裂的因素有：例如由於雷射與冷卻 的作用’對玻璃内部所產生之應力，可由下列公式表示： σ〜0.5αΕΔΤ ⑴ △Τ=Τ1-Τ2 (2) 其中’σ為玻璃面板内部所產生的應力大小，α為玻 璃面 板内部的熱膨脹係數，Ε為玻璃面板楊氏係數，Τ1 為雷射加熱玻璃面板後玻璃面板的溫度，Τ2為冷卻後玻 璃面板的溫度。 由公式（1 )和（2 )所示，面板内部的應力大小與 材料的熱膨脹係數、楊氏係數與雷射與冷卻系統在玻璃 面板上產生的溫度差成正比。而且Τ1的最大值不能大於 玻璃面板的氣化溫度。 當雷射與冷卻系統對玻璃面板所造成的應力大於 材料的破裂強度時，玻璃表面將產生裂紋，裂紋會隨著 9 1325352 製程條件的不同’在玻璃表面呈現不同的成長，如形成 一溝槽（Scribe)或是玻璃面板的完全分離（FuU Β〇^Crack or burrs, these defects have an impact on product strength and production yield. With the light and thin trend of consumer electronics, glass substrates are also developing toward thinner thickness, lower material density, higher material strength and lower thermal expansion coefficient. In this case, traditional use of knives and other physics The quality and productivity of the means for cutting can not meet the demand. Therefore, a method of cutting a glass panel by using a laser produces a comparison with a conventional cutter wheel. 'Laser cutting is less likely to cause particle contamination, the cutting surface is flat, and the production time can be greatly shortened. Moreover, since the laser cutting glass panel is not conventional, The micro-cracks produced by the cutter wheel cut, so the strength of the glass panel is 2-3 times that of the conventional one. As shown in the first figure, a prior laser cutting unit for cutting a glass panel i includes a laser system 2, a scribe tool 3, and a cooling system 4. The cutting direction of the laser cutting sub unit with respect to the glass substrate is indicated by an arrow A. Along the cutting direction A, the scribe tool 3 forms 5 1325352 on the glass panel i with a slight score. Then the laser system 2 emits a laser beam to heat along the nick. The cooling system then cools the heating zone. The cutting is performed by the stress generated by the glass panel by the temperature difference generated by heating the cold portion of the spear. The first cutting line 5 as shown in the first figure represents the effective stroke of the laser cutting unit on the glass panel 1. When the laser cutting unit completes the first cutting line 5, since the positional relationship of the scribe line tool 3, the laser system 2, and the cooling system 4 is solid during the entire cutting process, (4) is said that the laser: cutting early The element can only be carried out in the direction of - (four) (4), so the laser cutting is required to return to the side of the initial position for the second cutting of the sample to generate the first-return stroke 6. The first-return stroke: does not return to the - side of the initial position after the first cutting line 5 is completed per shot cutting unit to perform the invalid stroke of the second cutting line 7. Similarly, the first = return stroke 8 indicates that the laser cutting unit completes the second cutting line 7 = back to the (four) position - the side is invalid for the third cutting line 9 at this time 'can be seen ' when more cutting is required At the second time, since the positional relationship between the stenciling system 2 and the cooling system 4 is fixed, the basin: two cutting directions are cut, so when the previous cutting line is completed, the unit f is returned to the initial side multiple times to facilitate the operation. The next blow is cut, the y is set to - the line efficiency is 1 ° "There is a need to enter the process multiple times in a process" so it takes a lot of return time and increases the working hours to delay the production efficiency. It is not suitable for efficient panel cutting. Therefore, it is necessary to design a new laser cutting device and method to overcome the above disadvantages. [The invention] It is an object of the invention to provide a laser cutting device and method The cutting is completed quickly. The object of the present invention is achieved by the following technical solution: a laser cutting device for cutting a brittle material having a first cutting direction 2 along the first (four) direction Arranged first-cooling system, Ray II, and first cutting tool 'The laser cutting device further includes a second cutting device and a second cooling system, when the first cutting tool, the laser system and the first cooling system are along After the cutting and cutting in the first cutting direction, the second cutting tool, the laser system and the second cooling system are performed in a second cutting direction opposite to the first cutting direction, Z (four). The invention relates to a laser cutting method, which comprises: ::::-cutting in a cutting direction; after the last cutting is completed, performing a next cutting in a direction opposite to the above-mentioned first cutting direction. In contrast, the laser cutting material setting method of the present invention uses a tool and a cooling system to save a large amount of return time without having to add too much equipment. This can save time, speed up the cutting process, and improve production. [Embodiment] <See the first to fifth figures, the laser cutting unit for cutting the glass substrate 13 of the present invention includes the laser system first-line tool 11' first cold The system 111, the second scribe tool 12 and the second cooling system 122. In the laser cutting unit of the present invention, the first scribe tool and the second scribe tool 12 may be laser beams, diamond knives, cutter wheels, etc. Any tool capable of generating a crack in the surface of the glass substrate. The first cooling system m and the second cooling system 122 may be a single liquid, a single gas plus a single liquid mixture or a mixture of more than one gas and liquid, such as pure water, Cooling oil, liquid nitrogen or liquid helium, etc. The laser system 10 of the laser cutting unit of the present invention, the scribe line tools u, 12 and the cooling system ln, 122 are in a positional relationship with each other compared to the previous laser cutting technique. And varying the number to achieve the present invention, and to achieve a significant technical effect, does not involve the laser system, the scribe line tool and the cooling system's own structure, occurrence or formation principle. Therefore, the laser cutting unit of the present invention does not describe in detail the structure, occurrence or formation principle of the laser system 10, the scribe line tool 12, and the cooling system 111, 122, and only uses the schematic diagram to illustrate the present invention. Referring to the third and fourth figures, the laser cutting glass panel is first formed with a scribe line tool on the glass substrate 13, and the laser system 1 〇 jets a laser beam such as carbon dioxide laser light to add the surface of the glass panel. 8 1325352 ..., the glass panel itself is heated by the laser energy, the temperature of the glass is controlled below its melting point temperature, the inside of the glass panel is subjected to tensile stress due to thermal expansion of the material, and then the glass panel is cooled by the cooling system immediately. Due to the cooling of the fork cooling system, the glass panel is internally contracted to create a compressive stress. The glass panel is rapidly heated by the laser and the rapid cooling of the cooling system. The internal stress distribution changes rapidly, and cracks occur in the glass panel. The crack grows on the cutting surface and completely separates the glass panel. The factors causing the cracking of the glass panel are: for example, due to the action of laser and cooling, the stress generated inside the glass can be expressed by the following formula: σ~0.5αΕΔΤ (1) △Τ=Τ1-Τ2 (2) where 'σ is glass The magnitude of the stress generated inside the panel, α is the coefficient of thermal expansion inside the glass panel, Ε is the Young's modulus of the glass panel, Τ1 is the temperature of the glass panel after the laser heating the glass panel, and Τ2 is the temperature of the glass panel after cooling. As shown by equations (1) and (2), the stress inside the panel is proportional to the thermal expansion coefficient of the material, the Young's modulus, and the temperature difference between the laser and the cooling system on the glass panel. Moreover, the maximum value of Τ1 cannot be greater than the vaporization temperature of the glass panel. When the stress caused by the laser and cooling system on the glass panel is greater than the burst strength of the material, cracks will occur on the surface of the glass, and the crack will grow differently on the surface of the glass according to the different process conditions of 9 1325352, such as forming a trench. (Scribe) or complete separation of glass panels (FuU Β〇^
Cut，簡稱 FBC)。 繼續參看第三圖及第四圖所示，雷射切割單元相對 於玻璃基板的切割方向具有第一切割方向3及與第一 切割方向B相反的第二切割方向c。沿著第一切割方向 B，第一刻線工具Π，第二冷卻系統122，雷射系統， 第一冷部系統111及第二刻線工具12依次排列。如第三 圖所不’當雷射單％沿著第—切割方向B對玻璃基板^ 進行切割時，第一刻線工具只先於玻璃基板^上形成預 刻痕’雷射系統10沿著預刻痕進行加熱，隨後第一冷卻 系統111對加熱的部位進行冷卻，這樣來完成第一次切 割過程。在第一次切割過程中，第二刻線工具12及第二 冷卻糸統122處於非工作狀態。 ，看第四圖所示，當完成第一次切割過程後，雷射 刀d單元便返回玻璃基板初始一側的第二切割方向 進行切此4，第二刻線卫具12，雷射系統及第 、卻系統122處於工作狀態。而第—刻線工具η及第 -冷卻統111處與非工作狀態。當完成第二次切割過 矛王後第一-人切割就類似第一次切割進行工作。第三次 完成後，第四次就類似第二次切割進行工作。根據實際 需要，可繼續進行多次切割。 1325352 在本發明中，有效切割線用實線表示，無效行程用 虛線表示。參看第五圖所示，雷射切割單元沿第一切㈣ 方向B進行切割以形成第一有效切割線14，隨後在完成 第一有效切割線14後的玻璃面板的一側進行了較短的 第一無效行程15，然後雷射切割單元沿第二切割方向c 進行第二有效切割線16 ’在完成第二有效切割線Μ後返 回到玻璃面板的初始切割的一側。然後在玻璃面板的初 始的一側進行第二無效行程17，以開始更下次的切割作 業。以此類推。 從中可以看出，本發明雷射切割裝置與方法，在增 加了一刻線工具和一冷卻系統的條件下進行切割，在切 割完上一次的作業後，不需要再返回到玻璃基板的初始 切割的一侧進行下次切割，而是直接在上次切割完成後 所處的玻璃基板的—侧進行下—次㈣。與先前技術相 比’明顯的省去了無效的返回行程，節省了大量的工時。 θ综上所述，本發明確已符合發明專利之要件，爰依 域出專利申m，以上所述僅為本發明之較佳實 a方式，自不能以此限定本發明之權利範圍。舉凡所屬 技術項域巾具有通常知識者差依本發明精神所作之等 文仏錦或變化，皆仍涵蓋於後附之巾請專利範圍内。 【圖式簡單說明】 第—圖係一種先前的雷射切割單元示意圖。 11 1325352 第二圖係第一圖中所示的先前的雷射切割單元的 切割行程示意圖。 第三圖係本發明雷射切割單元沿第一切割方向進 行切割的示意圖。 第四圖係本發明雷射切割單元沿第二切割方向進 行切割的示意圖。 第五圖係本發明雷射切割單元的切割行程示意圖。 【主要元件符號說明】 雷射系統 10, 2 第一刻線工具 11 第一冷卻系統 111 第二刻線工具 12 第二冷卻系統 122 玻璃面板 13 第一有效切割線 14, 5 第一無效行程 15, 6 第二有效切割線 16, 7 第二無效行程 17, 8 刻線工具 3 冷卻系統 4 第三有效切割線 9 12Cut, referred to as FBC). Continuing with reference to the third and fourth figures, the laser cutting unit has a first cutting direction 3 and a second cutting direction c opposite the first cutting direction B with respect to the cutting direction of the glass substrate. Along the first cutting direction B, the first scribe tool Π, the second cooling system 122, the laser system, the first cold portion system 111 and the second scribe tool 12 are sequentially arranged. As shown in the third figure, when the laser sheet is cut along the first-cutting direction B, the first scribe tool only forms a pre-scratch on the glass substrate ^ along the laser system 10 along the laser system 10 The pre-scoring is heated, and then the first cooling system 111 cools the heated portion, thus completing the first cutting process. During the first cutting process, the second reticle tool 12 and the second cooling cymbal 122 are in an inoperative state. As shown in the fourth figure, after completing the first cutting process, the laser cutter d unit returns to the second cutting direction of the initial side of the glass substrate to cut the 4, the second engraving fixture 12, the laser system And the system 122 is in operation. The first-line tool η and the first-cooling system 111 are in a non-operating state. When the second cut has been completed, the first-person cut is similar to the first cut. After the third completion, the fourth time worked like a second cut. Multiple cuts can be continued as needed. 1325352 In the present invention, the effective cutting line is indicated by a solid line, and the invalid stroke is indicated by a broken line. Referring to the fifth figure, the laser cutting unit cuts along the first cutting (four) direction B to form the first effective cutting line 14, and then performs a shorter side on the side of the glass panel after completing the first effective cutting line 14. The first invalid stroke 15, then the laser cutting unit performs a second effective cutting line 16' along the second cutting direction c to return to the side of the initial cut of the glass panel after completing the second effective cutting line. A second inactive stroke 17 is then made on the initial side of the glass panel to begin the next cutting operation. And so on. It can be seen that the laser cutting apparatus and method of the present invention cuts under the condition of adding a scribe tool and a cooling system, and does not need to return to the initial cutting of the glass substrate after the last job is cut. The next cut is performed on one side, and the next side (four) is performed directly on the side of the glass substrate where the last cut is completed. Compared with the prior art, it is obvious that the invalid return trip is saved, saving a lot of man-hours. As described above, the present invention has indeed met the requirements of the invention patents, and the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. Anyone who has a general knowledge of the technical field is not limited to the scope of the invention. [Simple description of the drawing] The first figure is a schematic diagram of a previous laser cutting unit. 11 1325352 The second figure is a schematic view of the cutting stroke of the previous laser cutting unit shown in the first figure. The third figure is a schematic view of the laser cutting unit of the present invention cutting along the first cutting direction. The fourth figure is a schematic view of the laser cutting unit of the present invention cutting along the second cutting direction. The fifth figure is a schematic view of the cutting stroke of the laser cutting unit of the present invention. [Main component symbol description] Laser system 10, 2 First scribe tool 11 First cooling system 111 Second scribe tool 12 Second cooling system 122 Glass panel 13 First effective cutting line 14, 5 First invalid stroke 15 , 6 second effective cutting line 16, 7 second invalid stroke 17, 8 scribe tool 3 cooling system 4 third effective cutting line 9 12