CN1849726B - Microwave-absorbing form-in-place paste - Google Patents
Microwave-absorbing form-in-place paste Download PDFInfo
- Publication number
- CN1849726B CN1849726B CN2004800258450A CN200480025845A CN1849726B CN 1849726 B CN1849726 B CN 1849726B CN 2004800258450 A CN2004800258450 A CN 2004800258450A CN 200480025845 A CN200480025845 A CN 200480025845A CN 1849726 B CN1849726 B CN 1849726B
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- China
- Prior art keywords
- microwave absorbing
- absorbing property
- resin system
- liquid resin
- filler
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
Abstract
A microwave-absorbing material which can be dispensed from standard form-in-place dispensing equipment combines a liquid resin system with a magnetic or lossy dielectric filler. In a preferred embodiment, the liquid resin system is a silicone resin system and the magnetic filler is iron carbonyl powder. The microwave-absorbing material is dispensed into a housing for electronic equipment. It may be dispensed into a cavity in the housing where it self-levels and cures. Alternatively, it may be dispensed onto a surface in the housing where, because of its thixotropic properties, it holds its shape and forms a pad of cured microwave-absorbing material thereon.
Description
Background of invention
1. invention field
The present invention relates to electronics industry, more specifically say, relate to electronic equipment, like bad radio frequency (RF) emission of computer, telecommunication apparatus etc., like the absorption of microwave radiation.
2. description of the Prior Art
By electronic equipment, it is well known in the art launching the problem that causes with radio frequency (RF) like the electric leakage magnetic (EM) of computer and telecommunication apparatus.Take the shell of these equipment of the whole bag of tricks shielding,, prevent that the ray that enclosure produces is penetrated into enclosure and disturbs the wherein work of parts to reduce the ray that is produced by the enclosure part.
These methods reduce radio frequency (RF) emission through comprising radiation absorbability bedding and padding in the enclosure, like microwave radiation.Traditionally, big volume or these bedding and padding of sheet material cutting-out from this type bedding and padding are cut into suitable size to adapt to hole, space or the area in the shell.These bedding and padding can have high permeability and high resistivity.
The present invention makes that for the existing bedding and padding in this area provide another kind of mode mode provides microwave absorbing property material to the shell of electronic equipment more simply and easily.
Summary of the invention
Therefore, the microwave absorbing property material that the dispensing equipment that the present invention relates to be formed by the original position of standard distributes.This equipment can comprise the various syringe-like applicators that are used for liner that the production original position forms etc.
This microwave absorbing property material comprises liquid resin system and magnetic or lossy dielectricity filler.In a preferred embodiment, this liquid resin system is the silicones system, and this magnetic fillers is a carbonyl iron powder.
The invention still further relates to and in electronic equipment, absorb radio frequency (RF) method for transmitting.This method may further comprise the steps: liquid resin system is provided; With magnetic or lossy dielectricity fillers dispersed in this liquid resin system; The liquid resin system that will contain said filler is assigned in the shell of electronic equipment; Contain the liquid resin system of said filler with slaking, form radio frequency (RF) absorbability bedding and padding in position, shell Central Plains.
This microwave absorbing property material, the liquid resin system that promptly contains said filler is self-leveling, can be assigned in the hole of shell.Perhaps, because its thixotropic behavior can be assigned to microwave absorbing property material on the case surface, form liner at this after the slaking.
Accompanying drawing referring now to following explanation is more completely described the present invention in detail.
Brief Description Of Drawings
Fig. 1 has shown the feed proportioning system that is used for microwave absorbing property material; With
Fig. 2 A and 2B are respectively stereogram and the end views that microwave absorbing property material is deposited on lip-deep feed proportioning system.
Preferred implementation details
Therefore, the microwave absorbing property material that the dispensing equipment that the present invention relates to be formed by the original position of standard distributes.In other words, can distribute this material by the various syringe-like applicators that are used for liner that the production original position forms etc.
Microwave absorbing property material comprises at least two kinds of compositions, and first kind is liquid resin system, can be the organic siliconresin system.Perhaps this liquid resin system possibly be polyurethane, epoxy resin or other organic resin system.
Another kind of composition is a filler, like magnetic or lossy dielectricity filler.Magnetic fillers is the filler with high permeability and high resistivity.Magnetic fillers can be a carbonyl iron powder.Perhaps, magnetic fillers can be an iron powder; Iron suicide; Ferrite (compound of iron oxide and another kind of oxide); PERMALLOY
(contain the alloy of 78.5% nickel and 21.5% iron, have high permeability and high resistivity); SENDUST
(alloy that contains 85% iron, 9.5% silicon and 5.5% aluminium); Carbon, i.e. conductivity carbon dust; Fiber is like graphite or metallic fiber; And have electromagnetism (EM) characteristic, i.e. other filler of high permeability and high resistivity.
Microwave absorbing property material is added to feed proportioning system, as the syringe-like distributor is attached in the ducted feed proportioning system.Shown this system among Fig. 1, wherein feed proportioning system 10 is allocated in microwave absorbing property material 12 in the hole 14 of shell of electronic equipment.In hole 14, microwave absorbing property material 12 self-levels to required thickness, thereby in hole 14, is forming RF (radio frequency) absorbability bedding and padding after the slaking.Desired thickness is confirmed as in advance and is weakened surface current and the required thickness of EMI (electromagnetic interference) in the shell.
The viscosity of microwave absorbing property material 12 of the present invention is enough to make filler in liquid resin system, to keep suspended state.Be controlled at the amount of the used filler of deposition in the hole 14 and the thickness of microwave absorbing property material 12, with optimization absorption to microwave energy on given frequency.
Microwave absorbing property material 12 of the present invention also has thixotropic behavior.Thixotropy is the liquefaction when stirring of certain colloidal gel, is returned to the ability of gel form when leaving standstill.In other words, such gel does not have under the pressure its shape of maintenance when leaving standstill, but can flow freely when applying light pressure.
The bedding and padding of this characteristic capable of using production microwave absorbing property material in the shell in no hole.Referring to Fig. 2 A and 2B, they are respectively that microwave absorbing property material 12 is deposited on stereogram and the end view that forms the feed proportioning system 10 of bedding and padding 18 on the surface 16 of electronic equipment casing.Because its thixotropic behavior, microwave oven absorbent material 12 is kept its shape as bedding and padding 18 on surface 16, and slaking when keeping this shape.
Change as far as foregoing is conspicuous for those of ordinary skills, but can the present invention be modified to beyond the scope of appended claims.
Claims (25)
1. microwave absorbing property material, said material comprises:
Liquid resin system; With
Have high permeability and high resistivity magnetic or lossy dielectricity filler and
Wherein, the viscosity of said microwave absorbing property material is enough to make said filler in liquid resin system, to keep suspended state, and wherein said microwave absorbing property material has thixotropy, makes it when applying light pressure, can flow freely;
Wherein, Said microwave absorbing property material is suitable for being assigned to from the syringe-like applicator of the liner that is used for the formation of production original position the surface of electronic equipment casing; Thereby original position forms the bedding and padding that absorb radio frequency; And because its thixotropy, said microwave absorbing property material is kept its shape as bedding and padding and slaking when keeping this shape on being allocated in said surface the time on this surface.
2. microwave absorbing property material as claimed in claim 1 is characterized in that said liquid resin system is selected from organic siliconresin system, polyurethane resin system and epoxy-resin systems.
3. microwave absorbing property material as claimed in claim 1 is characterized in that, said liquid resin system is the organic resin system.
4. microwave absorbing property material as claimed in claim 1 is characterized in that, said filler is selected from carbonyl iron, iron powder, iron suicide, ferrite, dilval, sendust, carbon, fiber and has other filler of electromagnetic property.
5. microwave absorbing property material as claimed in claim 1 is characterized in that, said liquid resin system is the organic siliconresin system, and said filler is a carbonyl iron powder.
6. method that in electronic equipment, absorbs radio-frequency transmissions said method comprising the steps of:
Liquid resin system is provided;
The magnetic or the lossy dielectricity filler that will have high permeability and high resistivity are allocated in the said liquid resin system; Make the viscosity of the said liquid resin system that contains said filler be enough to make said filler in liquid resin system, to keep suspended state; And the said liquid resin system that contains said filler has thixotropy, and this characteristic makes this liquid resin system that contains said filler when applying light pressure, can flow freely;
The said liquid resin system that will contain said filler is assigned to the shell of said electronic equipment from the syringe-like applicator of the liner that is used for the production original position and forms; Wherein, the said liquid resin system that contains said filler is kept its shape as bedding and padding owing to its thixotropy after in being assigned to shell; With
Slaking contains the said liquid resin system of said filler, in said shell, forms radio frequency absorption property bedding and padding, wherein, and the said liquid resin system slaking when keeping it that contains said filler owing to its thixotropy as the shape of bedding and padding.
7. method as claimed in claim 6 is characterized in that, the said liquid resin system that contains said filler is self-leveling, and is assigned in the hole of said shell.
8. method as claimed in claim 6 is characterized in that, the said liquid resin system that contains said filler is assigned on the surface of said shell.
9. microwave absorbing property material, said material comprises:
Magnetic fillers with high permeability and high resistivity;
Liquid resin system;
The viscosity of wherein said microwave absorbing property material is enough to make this magnetic fillers in said liquid resin system, to keep suspended state;
Wherein said microwave absorbing property material has thixotropy, makes it when applying light pressure, can flow freely;
Wherein, Said microwave absorbing property material is suitable for being assigned to from the syringe-like applicator of the liner that is used for the formation of production original position the surface of electronic equipment casing; Thereby original position forms the bedding and padding that absorb radio frequency; And because its thixotropy, said microwave absorbing property material is kept its shape as bedding and padding on said surface when slaking.
10. microwave absorbing property material as claimed in claim 9 is characterized in that said liquid resin system is selected from organic siliconresin system, polyurethane resin system and epoxy-resin systems.
11. microwave absorbing property material as claimed in claim 9 is characterized in that, said liquid resin system is the organic resin system.
12. microwave absorbing property material as claimed in claim 9 is characterized in that, said magnetic fillers is selected from carbonyl iron, iron powder, iron suicide, ferrite, dilval, sendust, carbon, fiber and has other filler of electromagnetic property.
13. microwave absorbing property material as claimed in claim 9 is characterized in that, said liquid resin system is the organic siliconresin system, and said magnetic fillers is a carbonyl iron powder.
14. microwave absorbing property material as claimed in claim 9 is characterized in that, said microwave absorbing property material has and weakens surface current and the required predetermined thickness of electromagnetic interference.
15. microwave absorbing property material as claimed in claim 14 is characterized in that, the thickness of said microwave absorbing property material is enough to optimize on given frequency the absorption to microwave energy.
16. microwave absorbing property material as claimed in claim 9 is characterized in that, said syringe-like applicator can apply enough pressure and freely flow out from this syringe-like applicator to cause microwave absorbing property material.
17. microwave absorbing property material as claimed in claim 16 is characterized in that, the bedding and padding that the microwave absorbing property material of said deposition forms have at least and weaken surface current and the required predetermined thickness of electromagnetic interference.
18. microwave absorbing property material as claimed in claim 9; It is characterized in that; When said microwave absorbing property material is assigned in the hole of electronic equipment casing; It self-levels to predetermined thickness, thereby in the hole, is forming radio frequency absorption property bedding and padding after the slaking, and the thickness of these bedding and padding is to weaken surface current and the required thickness of electromagnetic interference in the shell.
19. a shell is assigned the described microwave absorbing property material of claim 9 on its at least one surface, have the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference thereby form in position, shell Central Plains.
20. a microwave absorbing property original position forms pastes; It has thixotropy; Set the surface that is assigned to electronic equipment casing from the syringe-like applicator that is used for the liner that the production original position forms for; After slaking, to form radio frequency absorption property bedding and padding in position, shell Central Plains; This microwave absorbing property original position forms magnetic or the lossy dielectricity filler that pastes contains liquid resin system and in this liquid resin system, remains suspended state, and this microwave absorbing property original position that said thixotropy makes original position form forms pastes and when applying light pressure, can flow freely, and on being assigned to the surface, remains the shape of bedding and padding when back and slaking then.
21. microwave absorbing property original position as claimed in claim 20 forms pastes, it is characterized in that said magnetic fillers is the filler of high permeability and high resistivity.
22. microwave absorbing property original position as claimed in claim 20 forms pastes, it is characterized in that said liquid resin system is the organic siliconresin system, said magnetic fillers is a carbonyl iron powder.
23. shell; On its at least one surface, be assigned the described microwave absorbing property original position of claim 20 and form pastes, have the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference thereby form in position, shell Central Plains.
24. a microwave absorbing property original position forms pastes; It has thixotropy; Set for from the syringe-like applicator that is used for the liner that the production original position forms and be assigned in the hole of electronic equipment casing; After slaking, to form radio frequency absorption property bedding and padding in position, shell Central Plains; This microwave absorbing property original position forms magnetic or the lossy dielectricity filler that pastes contains liquid resin system and in this liquid resin system, remains suspended state; This microwave absorbing property original position that said thixotropy makes original position form forms pastes and when applying light pressure, can flow freely, and self-levels to predetermined thickness in being assigned to the hole of shell the time, thus after the slaking in the hole original position form and have the radio frequency absorption property bedding and padding that in shell, weaken the required thickness of surface current and electromagnetic interference.
25. shell; Have at least one and wherein be assigned the hole that the described microwave absorbing property original position of claim 24 forms pastes, thereby original position forms and has the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference in this hole.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50148803P | 2003-09-09 | 2003-09-09 | |
US60/501,488 | 2003-09-09 | ||
PCT/US2004/029726 WO2005023916A2 (en) | 2003-09-09 | 2004-09-09 | Microwave-absorbing form-in-place paste |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1849726A CN1849726A (en) | 2006-10-18 |
CN1849726B true CN1849726B (en) | 2012-04-04 |
Family
ID=34273048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800258450A Active CN1849726B (en) | 2003-09-09 | 2004-09-09 | Microwave-absorbing form-in-place paste |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050139282A1 (en) |
CN (1) | CN1849726B (en) |
TW (1) | TWI357425B (en) |
WO (1) | WO2005023916A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100363130C (en) * | 2005-11-10 | 2008-01-23 | 北京科技大学 | Method for preparing core-shell structure Fe-PAn by in-situ synthesis process |
CN101810886A (en) * | 2010-03-17 | 2010-08-25 | 清华大学 | New application of carbonyl iron powder |
CN102304347B (en) * | 2011-06-08 | 2013-08-14 | 浙江大学 | SiC/carbonyl iron nanometer composite material prepared from agricultural wastes through microwave composite and method thereof |
CN103183924A (en) * | 2011-12-29 | 2013-07-03 | 北京有色金属研究总院 | Microwave absorption composite material of hollow glass microspheres plated with Al and carbonyl iron powder, and preparation method thereof |
CN103658640B (en) * | 2013-12-27 | 2016-08-17 | 安徽华东光电技术研究所 | Preparation, coating and sintering method of iron-silicon-aluminum absorption paste for klystron |
CN105331331B (en) * | 2014-06-30 | 2017-03-15 | 比亚迪股份有限公司 | A kind of microwave absorbing material and preparation method thereof |
DE102015105353A1 (en) | 2015-04-09 | 2016-10-13 | Hauni Maschinenbau Gmbh | Suction belt conveyor and rod machine of the tobacco processing industry, use and method for measuring material properties of a material strand of the tobacco processing industry |
CN104861753B (en) * | 2015-05-08 | 2017-05-31 | 湖北大学 | A kind of bituminous epoxy coating with electromagnetic wave absorption function and preparation method thereof |
CN105017948A (en) * | 2015-08-05 | 2015-11-04 | 普罗旺斯科技(深圳)有限公司 | Wave absorbing sheet and manufacturing method thereof |
CN111286225A (en) * | 2020-02-22 | 2020-06-16 | 东莞市鹏威能源科技有限公司 | Graphene wave-absorbing film coating and preparation method and application thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1359989A (en) * | 2000-12-18 | 2002-07-24 | 黄佳玉 | Wave-absorbing material for preventing electromagnetic radiation |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2661596A (en) * | 1950-01-28 | 1953-12-08 | Wefco Inc | Field controlled hydraulic device |
US3867299A (en) * | 1971-08-11 | 1975-02-18 | Bethlehem Steel Corp | Method of making synthetic resin composites with magnetic fillers |
US3865784A (en) * | 1973-12-05 | 1975-02-11 | Union Carbide Corp | Stabilized organosilicon polymers |
JPS50155999A (en) * | 1974-06-05 | 1975-12-16 | ||
US4538151A (en) * | 1982-03-31 | 1985-08-27 | Nippon Electric Co., Ltd. | Electro-magnetic wave absorbing material |
US4992190A (en) * | 1989-09-22 | 1991-02-12 | Trw Inc. | Fluid responsive to a magnetic field |
WO1994010693A1 (en) * | 1992-10-30 | 1994-05-11 | Lord Corporation | Thixotropic magnetorheological materials |
DE4319965C3 (en) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Method of manufacturing an electromagnetic shielding case |
US5587102A (en) * | 1994-08-25 | 1996-12-24 | Djs&T Limited Partnership | Magnetic paint composition and method |
US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
US5552455A (en) * | 1995-08-31 | 1996-09-03 | Lockheed Corporation | Radar absorbing material and process for making same |
US5714536A (en) * | 1996-01-11 | 1998-02-03 | Xerox Corporation | Magnetic nanocompass compositions and processes for making and using |
JP3041295B1 (en) * | 1998-10-15 | 2000-05-15 | 株式会社リケン | Composite radio wave absorber and its construction method |
US6517744B1 (en) * | 1999-11-16 | 2003-02-11 | Jsr Corporation | Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure |
JP2001279102A (en) * | 2000-03-29 | 2001-10-10 | Yazaki Corp | Electroconductive paste |
JP4623244B2 (en) * | 2000-04-11 | 2011-02-02 | 信越化学工業株式会社 | Electromagnetic wave absorbing heat conductive silicone rubber composition |
JP3719382B2 (en) * | 2000-10-25 | 2005-11-24 | 信越化学工業株式会社 | Electromagnetic wave absorbing silicone rubber composition |
JP2002329995A (en) * | 2001-05-07 | 2002-11-15 | Shin Etsu Chem Co Ltd | Electromagnetic wave absorbing body |
-
2004
- 2004-09-08 TW TW093127150A patent/TWI357425B/en not_active IP Right Cessation
- 2004-09-09 US US10/937,454 patent/US20050139282A1/en not_active Abandoned
- 2004-09-09 WO PCT/US2004/029726 patent/WO2005023916A2/en active Application Filing
- 2004-09-09 CN CN2004800258450A patent/CN1849726B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1359989A (en) * | 2000-12-18 | 2002-07-24 | 黄佳玉 | Wave-absorbing material for preventing electromagnetic radiation |
Non-Patent Citations (2)
Title |
---|
王结良等.雷达吸波涂层用材料的研究进展.现代涂料与涂装 2.2003,(2),28-31. |
王结良等.雷达吸波涂层用材料的研究进展.现代涂料与涂装 2.2003,(2),28-31. * |
Also Published As
Publication number | Publication date |
---|---|
WO2005023916A3 (en) | 2005-06-02 |
TW200526716A (en) | 2005-08-16 |
TWI357425B (en) | 2012-02-01 |
US20050139282A1 (en) | 2005-06-30 |
CN1849726A (en) | 2006-10-18 |
WO2005023916A2 (en) | 2005-03-17 |
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