CN1849726B - Microwave-absorbing form-in-place paste - Google Patents

Microwave-absorbing form-in-place paste Download PDF

Info

Publication number
CN1849726B
CN1849726B CN2004800258450A CN200480025845A CN1849726B CN 1849726 B CN1849726 B CN 1849726B CN 2004800258450 A CN2004800258450 A CN 2004800258450A CN 200480025845 A CN200480025845 A CN 200480025845A CN 1849726 B CN1849726 B CN 1849726B
Authority
CN
China
Prior art keywords
microwave absorbing
absorbing property
resin system
liquid resin
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2004800258450A
Other languages
Chinese (zh)
Other versions
CN1849726A (en
Inventor
R·N·约翰逊
C·洛雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies AB
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of CN1849726A publication Critical patent/CN1849726A/en
Application granted granted Critical
Publication of CN1849726B publication Critical patent/CN1849726B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

Abstract

A microwave-absorbing material which can be dispensed from standard form-in-place dispensing equipment combines a liquid resin system with a magnetic or lossy dielectric filler. In a preferred embodiment, the liquid resin system is a silicone resin system and the magnetic filler is iron carbonyl powder. The microwave-absorbing material is dispensed into a housing for electronic equipment. It may be dispensed into a cavity in the housing where it self-levels and cures. Alternatively, it may be dispensed onto a surface in the housing where, because of its thixotropic properties, it holds its shape and forms a pad of cured microwave-absorbing material thereon.

Description

The microwave absorbing property coating that original position forms
Background of invention
1. invention field
The present invention relates to electronics industry, more specifically say, relate to electronic equipment, like bad radio frequency (RF) emission of computer, telecommunication apparatus etc., like the absorption of microwave radiation.
2. description of the Prior Art
By electronic equipment, it is well known in the art launching the problem that causes with radio frequency (RF) like the electric leakage magnetic (EM) of computer and telecommunication apparatus.Take the shell of these equipment of the whole bag of tricks shielding,, prevent that the ray that enclosure produces is penetrated into enclosure and disturbs the wherein work of parts to reduce the ray that is produced by the enclosure part.
These methods reduce radio frequency (RF) emission through comprising radiation absorbability bedding and padding in the enclosure, like microwave radiation.Traditionally, big volume or these bedding and padding of sheet material cutting-out from this type bedding and padding are cut into suitable size to adapt to hole, space or the area in the shell.These bedding and padding can have high permeability and high resistivity.
The present invention makes that for the existing bedding and padding in this area provide another kind of mode mode provides microwave absorbing property material to the shell of electronic equipment more simply and easily.
Summary of the invention
Therefore, the microwave absorbing property material that the dispensing equipment that the present invention relates to be formed by the original position of standard distributes.This equipment can comprise the various syringe-like applicators that are used for liner that the production original position forms etc.
This microwave absorbing property material comprises liquid resin system and magnetic or lossy dielectricity filler.In a preferred embodiment, this liquid resin system is the silicones system, and this magnetic fillers is a carbonyl iron powder.
The invention still further relates to and in electronic equipment, absorb radio frequency (RF) method for transmitting.This method may further comprise the steps: liquid resin system is provided; With magnetic or lossy dielectricity fillers dispersed in this liquid resin system; The liquid resin system that will contain said filler is assigned in the shell of electronic equipment; Contain the liquid resin system of said filler with slaking, form radio frequency (RF) absorbability bedding and padding in position, shell Central Plains.
This microwave absorbing property material, the liquid resin system that promptly contains said filler is self-leveling, can be assigned in the hole of shell.Perhaps, because its thixotropic behavior can be assigned to microwave absorbing property material on the case surface, form liner at this after the slaking.
Accompanying drawing referring now to following explanation is more completely described the present invention in detail.
Brief Description Of Drawings
Fig. 1 has shown the feed proportioning system that is used for microwave absorbing property material; With
Fig. 2 A and 2B are respectively stereogram and the end views that microwave absorbing property material is deposited on lip-deep feed proportioning system.
Preferred implementation details
Therefore, the microwave absorbing property material that the dispensing equipment that the present invention relates to be formed by the original position of standard distributes.In other words, can distribute this material by the various syringe-like applicators that are used for liner that the production original position forms etc.
Microwave absorbing property material comprises at least two kinds of compositions, and first kind is liquid resin system, can be the organic siliconresin system.Perhaps this liquid resin system possibly be polyurethane, epoxy resin or other organic resin system.
Another kind of composition is a filler, like magnetic or lossy dielectricity filler.Magnetic fillers is the filler with high permeability and high resistivity.Magnetic fillers can be a carbonyl iron powder.Perhaps, magnetic fillers can be an iron powder; Iron suicide; Ferrite (compound of iron oxide and another kind of oxide); PERMALLOY
Figure 048258450_0
(contain the alloy of 78.5% nickel and 21.5% iron, have high permeability and high resistivity); SENDUST (alloy that contains 85% iron, 9.5% silicon and 5.5% aluminium); Carbon, i.e. conductivity carbon dust; Fiber is like graphite or metallic fiber; And have electromagnetism (EM) characteristic, i.e. other filler of high permeability and high resistivity.
Microwave absorbing property material is added to feed proportioning system, as the syringe-like distributor is attached in the ducted feed proportioning system.Shown this system among Fig. 1, wherein feed proportioning system 10 is allocated in microwave absorbing property material 12 in the hole 14 of shell of electronic equipment.In hole 14, microwave absorbing property material 12 self-levels to required thickness, thereby in hole 14, is forming RF (radio frequency) absorbability bedding and padding after the slaking.Desired thickness is confirmed as in advance and is weakened surface current and the required thickness of EMI (electromagnetic interference) in the shell.
The viscosity of microwave absorbing property material 12 of the present invention is enough to make filler in liquid resin system, to keep suspended state.Be controlled at the amount of the used filler of deposition in the hole 14 and the thickness of microwave absorbing property material 12, with optimization absorption to microwave energy on given frequency.
Microwave absorbing property material 12 of the present invention also has thixotropic behavior.Thixotropy is the liquefaction when stirring of certain colloidal gel, is returned to the ability of gel form when leaving standstill.In other words, such gel does not have under the pressure its shape of maintenance when leaving standstill, but can flow freely when applying light pressure.
The bedding and padding of this characteristic capable of using production microwave absorbing property material in the shell in no hole.Referring to Fig. 2 A and 2B, they are respectively that microwave absorbing property material 12 is deposited on stereogram and the end view that forms the feed proportioning system 10 of bedding and padding 18 on the surface 16 of electronic equipment casing.Because its thixotropic behavior, microwave oven absorbent material 12 is kept its shape as bedding and padding 18 on surface 16, and slaking when keeping this shape.
Change as far as foregoing is conspicuous for those of ordinary skills, but can the present invention be modified to beyond the scope of appended claims.

Claims (25)

1. microwave absorbing property material, said material comprises:
Liquid resin system; With
Have high permeability and high resistivity magnetic or lossy dielectricity filler and
Wherein, the viscosity of said microwave absorbing property material is enough to make said filler in liquid resin system, to keep suspended state, and wherein said microwave absorbing property material has thixotropy, makes it when applying light pressure, can flow freely;
Wherein, Said microwave absorbing property material is suitable for being assigned to from the syringe-like applicator of the liner that is used for the formation of production original position the surface of electronic equipment casing; Thereby original position forms the bedding and padding that absorb radio frequency; And because its thixotropy, said microwave absorbing property material is kept its shape as bedding and padding and slaking when keeping this shape on being allocated in said surface the time on this surface.
2. microwave absorbing property material as claimed in claim 1 is characterized in that said liquid resin system is selected from organic siliconresin system, polyurethane resin system and epoxy-resin systems.
3. microwave absorbing property material as claimed in claim 1 is characterized in that, said liquid resin system is the organic resin system.
4. microwave absorbing property material as claimed in claim 1 is characterized in that, said filler is selected from carbonyl iron, iron powder, iron suicide, ferrite, dilval, sendust, carbon, fiber and has other filler of electromagnetic property.
5. microwave absorbing property material as claimed in claim 1 is characterized in that, said liquid resin system is the organic siliconresin system, and said filler is a carbonyl iron powder.
6. method that in electronic equipment, absorbs radio-frequency transmissions said method comprising the steps of:
Liquid resin system is provided;
The magnetic or the lossy dielectricity filler that will have high permeability and high resistivity are allocated in the said liquid resin system; Make the viscosity of the said liquid resin system that contains said filler be enough to make said filler in liquid resin system, to keep suspended state; And the said liquid resin system that contains said filler has thixotropy, and this characteristic makes this liquid resin system that contains said filler when applying light pressure, can flow freely;
The said liquid resin system that will contain said filler is assigned to the shell of said electronic equipment from the syringe-like applicator of the liner that is used for the production original position and forms; Wherein, the said liquid resin system that contains said filler is kept its shape as bedding and padding owing to its thixotropy after in being assigned to shell; With
Slaking contains the said liquid resin system of said filler, in said shell, forms radio frequency absorption property bedding and padding, wherein, and the said liquid resin system slaking when keeping it that contains said filler owing to its thixotropy as the shape of bedding and padding.
7. method as claimed in claim 6 is characterized in that, the said liquid resin system that contains said filler is self-leveling, and is assigned in the hole of said shell.
8. method as claimed in claim 6 is characterized in that, the said liquid resin system that contains said filler is assigned on the surface of said shell.
9. microwave absorbing property material, said material comprises:
Magnetic fillers with high permeability and high resistivity;
Liquid resin system;
The viscosity of wherein said microwave absorbing property material is enough to make this magnetic fillers in said liquid resin system, to keep suspended state;
Wherein said microwave absorbing property material has thixotropy, makes it when applying light pressure, can flow freely;
Wherein, Said microwave absorbing property material is suitable for being assigned to from the syringe-like applicator of the liner that is used for the formation of production original position the surface of electronic equipment casing; Thereby original position forms the bedding and padding that absorb radio frequency; And because its thixotropy, said microwave absorbing property material is kept its shape as bedding and padding on said surface when slaking.
10. microwave absorbing property material as claimed in claim 9 is characterized in that said liquid resin system is selected from organic siliconresin system, polyurethane resin system and epoxy-resin systems.
11. microwave absorbing property material as claimed in claim 9 is characterized in that, said liquid resin system is the organic resin system.
12. microwave absorbing property material as claimed in claim 9 is characterized in that, said magnetic fillers is selected from carbonyl iron, iron powder, iron suicide, ferrite, dilval, sendust, carbon, fiber and has other filler of electromagnetic property.
13. microwave absorbing property material as claimed in claim 9 is characterized in that, said liquid resin system is the organic siliconresin system, and said magnetic fillers is a carbonyl iron powder.
14. microwave absorbing property material as claimed in claim 9 is characterized in that, said microwave absorbing property material has and weakens surface current and the required predetermined thickness of electromagnetic interference.
15. microwave absorbing property material as claimed in claim 14 is characterized in that, the thickness of said microwave absorbing property material is enough to optimize on given frequency the absorption to microwave energy.
16. microwave absorbing property material as claimed in claim 9 is characterized in that, said syringe-like applicator can apply enough pressure and freely flow out from this syringe-like applicator to cause microwave absorbing property material.
17. microwave absorbing property material as claimed in claim 16 is characterized in that, the bedding and padding that the microwave absorbing property material of said deposition forms have at least and weaken surface current and the required predetermined thickness of electromagnetic interference.
18. microwave absorbing property material as claimed in claim 9; It is characterized in that; When said microwave absorbing property material is assigned in the hole of electronic equipment casing; It self-levels to predetermined thickness, thereby in the hole, is forming radio frequency absorption property bedding and padding after the slaking, and the thickness of these bedding and padding is to weaken surface current and the required thickness of electromagnetic interference in the shell.
19. a shell is assigned the described microwave absorbing property material of claim 9 on its at least one surface, have the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference thereby form in position, shell Central Plains.
20. a microwave absorbing property original position forms pastes; It has thixotropy; Set the surface that is assigned to electronic equipment casing from the syringe-like applicator that is used for the liner that the production original position forms for; After slaking, to form radio frequency absorption property bedding and padding in position, shell Central Plains; This microwave absorbing property original position forms magnetic or the lossy dielectricity filler that pastes contains liquid resin system and in this liquid resin system, remains suspended state, and this microwave absorbing property original position that said thixotropy makes original position form forms pastes and when applying light pressure, can flow freely, and on being assigned to the surface, remains the shape of bedding and padding when back and slaking then.
21. microwave absorbing property original position as claimed in claim 20 forms pastes, it is characterized in that said magnetic fillers is the filler of high permeability and high resistivity.
22. microwave absorbing property original position as claimed in claim 20 forms pastes, it is characterized in that said liquid resin system is the organic siliconresin system, said magnetic fillers is a carbonyl iron powder.
23. shell; On its at least one surface, be assigned the described microwave absorbing property original position of claim 20 and form pastes, have the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference thereby form in position, shell Central Plains.
24. a microwave absorbing property original position forms pastes; It has thixotropy; Set for from the syringe-like applicator that is used for the liner that the production original position forms and be assigned in the hole of electronic equipment casing; After slaking, to form radio frequency absorption property bedding and padding in position, shell Central Plains; This microwave absorbing property original position forms magnetic or the lossy dielectricity filler that pastes contains liquid resin system and in this liquid resin system, remains suspended state; This microwave absorbing property original position that said thixotropy makes original position form forms pastes and when applying light pressure, can flow freely, and self-levels to predetermined thickness in being assigned to the hole of shell the time, thus after the slaking in the hole original position form and have the radio frequency absorption property bedding and padding that in shell, weaken the required thickness of surface current and electromagnetic interference.
25. shell; Have at least one and wherein be assigned the hole that the described microwave absorbing property original position of claim 24 forms pastes, thereby original position forms and has the bedding and padding that in shell, weaken the required predetermined thickness of surface current and electromagnetic interference in this hole.
CN2004800258450A 2003-09-09 2004-09-09 Microwave-absorbing form-in-place paste Active CN1849726B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50148803P 2003-09-09 2003-09-09
US60/501,488 2003-09-09
PCT/US2004/029726 WO2005023916A2 (en) 2003-09-09 2004-09-09 Microwave-absorbing form-in-place paste

Publications (2)

Publication Number Publication Date
CN1849726A CN1849726A (en) 2006-10-18
CN1849726B true CN1849726B (en) 2012-04-04

Family

ID=34273048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800258450A Active CN1849726B (en) 2003-09-09 2004-09-09 Microwave-absorbing form-in-place paste

Country Status (4)

Country Link
US (1) US20050139282A1 (en)
CN (1) CN1849726B (en)
TW (1) TWI357425B (en)
WO (1) WO2005023916A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100363130C (en) * 2005-11-10 2008-01-23 北京科技大学 Method for preparing core-shell structure Fe-PAn by in-situ synthesis process
CN101810886A (en) * 2010-03-17 2010-08-25 清华大学 New application of carbonyl iron powder
CN102304347B (en) * 2011-06-08 2013-08-14 浙江大学 SiC/carbonyl iron nanometer composite material prepared from agricultural wastes through microwave composite and method thereof
CN103183924A (en) * 2011-12-29 2013-07-03 北京有色金属研究总院 Microwave absorption composite material of hollow glass microspheres plated with Al and carbonyl iron powder, and preparation method thereof
CN103658640B (en) * 2013-12-27 2016-08-17 安徽华东光电技术研究所 Preparation, coating and sintering method of iron-silicon-aluminum absorption paste for klystron
CN105331331B (en) * 2014-06-30 2017-03-15 比亚迪股份有限公司 A kind of microwave absorbing material and preparation method thereof
DE102015105353A1 (en) 2015-04-09 2016-10-13 Hauni Maschinenbau Gmbh Suction belt conveyor and rod machine of the tobacco processing industry, use and method for measuring material properties of a material strand of the tobacco processing industry
CN104861753B (en) * 2015-05-08 2017-05-31 湖北大学 A kind of bituminous epoxy coating with electromagnetic wave absorption function and preparation method thereof
CN105017948A (en) * 2015-08-05 2015-11-04 普罗旺斯科技(深圳)有限公司 Wave absorbing sheet and manufacturing method thereof
CN111286225A (en) * 2020-02-22 2020-06-16 东莞市鹏威能源科技有限公司 Graphene wave-absorbing film coating and preparation method and application thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359989A (en) * 2000-12-18 2002-07-24 黄佳玉 Wave-absorbing material for preventing electromagnetic radiation

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2661596A (en) * 1950-01-28 1953-12-08 Wefco Inc Field controlled hydraulic device
US3867299A (en) * 1971-08-11 1975-02-18 Bethlehem Steel Corp Method of making synthetic resin composites with magnetic fillers
US3865784A (en) * 1973-12-05 1975-02-11 Union Carbide Corp Stabilized organosilicon polymers
JPS50155999A (en) * 1974-06-05 1975-12-16
US4538151A (en) * 1982-03-31 1985-08-27 Nippon Electric Co., Ltd. Electro-magnetic wave absorbing material
US4992190A (en) * 1989-09-22 1991-02-12 Trw Inc. Fluid responsive to a magnetic field
WO1994010693A1 (en) * 1992-10-30 1994-05-11 Lord Corporation Thixotropic magnetorheological materials
DE4319965C3 (en) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Method of manufacturing an electromagnetic shielding case
US5587102A (en) * 1994-08-25 1996-12-24 Djs&T Limited Partnership Magnetic paint composition and method
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
US5552455A (en) * 1995-08-31 1996-09-03 Lockheed Corporation Radar absorbing material and process for making same
US5714536A (en) * 1996-01-11 1998-02-03 Xerox Corporation Magnetic nanocompass compositions and processes for making and using
JP3041295B1 (en) * 1998-10-15 2000-05-15 株式会社リケン Composite radio wave absorber and its construction method
US6517744B1 (en) * 1999-11-16 2003-02-11 Jsr Corporation Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
JP2001279102A (en) * 2000-03-29 2001-10-10 Yazaki Corp Electroconductive paste
JP4623244B2 (en) * 2000-04-11 2011-02-02 信越化学工業株式会社 Electromagnetic wave absorbing heat conductive silicone rubber composition
JP3719382B2 (en) * 2000-10-25 2005-11-24 信越化学工業株式会社 Electromagnetic wave absorbing silicone rubber composition
JP2002329995A (en) * 2001-05-07 2002-11-15 Shin Etsu Chem Co Ltd Electromagnetic wave absorbing body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359989A (en) * 2000-12-18 2002-07-24 黄佳玉 Wave-absorbing material for preventing electromagnetic radiation

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
王结良等.雷达吸波涂层用材料的研究进展.现代涂料与涂装 2.2003,(2),28-31.
王结良等.雷达吸波涂层用材料的研究进展.现代涂料与涂装 2.2003,(2),28-31. *

Also Published As

Publication number Publication date
WO2005023916A3 (en) 2005-06-02
TW200526716A (en) 2005-08-16
TWI357425B (en) 2012-02-01
US20050139282A1 (en) 2005-06-30
CN1849726A (en) 2006-10-18
WO2005023916A2 (en) 2005-03-17

Similar Documents

Publication Publication Date Title
CN1849726B (en) Microwave-absorbing form-in-place paste
US8847184B2 (en) Composite film for board level EMI shielding
US20040020674A1 (en) Composite EMI shield
CN110600888B (en) Radio frequency absorber skin and manufacturing method thereof
CN1639866B (en) EMI shield including a lossy medium
US20160141085A1 (en) Magnetically Controlled Polymer Nanocomposite Material and Methods for Applying and Curing Same, and Nanomagnetic Composite for RF Applications
US20090084600A1 (en) Nano coating for emi gaskets
US20120023743A1 (en) Methods and apparatus for shielding circuitry from interference
KR20090033586A (en) A roll-type composite sheet with enhanced heat-releasing, electromagnetic wave- and impact-absorbing properties, and a method for preparation of the same
JP2006032929A5 (en)
CN106559974A (en) Including the thermal interfacial material of conductive material
KR101385823B1 (en) Sheet for prevention of electromagnetic wave interference, flat cable for high-frequency signal, flexible print substrate, and method for production of sheet for prevention of electromagnetic wave interference
CN104854974A (en) Electromagnetic interference suppression body
CN213401173U (en) Thermal interface material piece and electronic device comprising same
KR20150064902A (en) Composition for complex sheet with EMI shielding and absorbing, thermal dissipation and electric insulation, and complex sheet comprising the same
CN100546451C (en) Electromagnetic wave absorb
KR100874690B1 (en) A roll-type composite sheet with enhanced electromagnetic wave-shielding and -absorbing, and heat-releasing properties, and a method for preparation of the same
JP2002184916A (en) Multifunctional sheet and manufacturing method therefor
KR102082810B1 (en) Sheet of complex shielding electromagnetic wave with high performance and manufacturing methods thereof
JP4311654B2 (en) Laminated electromagnetic wave absorber
KR20070007311A (en) Squeezable, cross-linked, grease-like electromagnetic wave absorber
JP2001077585A (en) Electromagnetic wave absorbing paste
JPH1027986A (en) Radio wave absorber
WO2005002315A2 (en) Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials
WO2023037770A1 (en) Electromagnetic wave shield film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant