CN113539936A - Belt cleaning device is used in production of chip wafer - Google Patents
Belt cleaning device is used in production of chip wafer Download PDFInfo
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- CN113539936A CN113539936A CN202110758097.2A CN202110758097A CN113539936A CN 113539936 A CN113539936 A CN 113539936A CN 202110758097 A CN202110758097 A CN 202110758097A CN 113539936 A CN113539936 A CN 113539936A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a cleaning device for chip wafer production, which belongs to the technical field of chip processing and comprises an operation table, wherein a first sliding groove is symmetrically formed in the surface of the top of the operation table, a second sliding groove is symmetrically formed in the inner wall of the first sliding groove, a plurality of rotating shafts are movably arranged in the first sliding grooves at two sides, a shaft sleeve is sleeved in the middle of each rotating shaft, a fixing rod is fixedly connected to one side of each shaft sleeve, which is different from the first sliding groove, a bearing plate is fixedly arranged on one end face, which is different from the shaft sleeve, of each fixing rod, a plurality of first electric telescopic rods are fixedly connected to the surface of the top of the bearing plate, the end faces of the telescopic ends of the four first electric telescopic rods are fixedly connected with sliding rings, and first jacking springs are symmetrically fixed on the inner side walls of the sliding rings; the third electric telescopic rod is connected with the third electric telescopic rod, and the third electric telescopic rod is connected with the third electric telescopic rod.
Description
Technical Field
The invention belongs to the technical field of chip processing, and relates to a cleaning device for chip wafer production.
Background
As the feature size of an integrated circuit enters a deep submicron stage, the cleanliness of the surface of the chip required in the integrated circuit chip manufacturing process is higher and higher, and hundreds of cleaning processes exist in the integrated circuit manufacturing process in order to ensure the cleanliness of the surface of a chip material.
The traditional cleaning mode is to wash the chip by using deionized water, and in the traditional cleaning mode, the deionized water impacts the chip at a high flow rate to wash away impurities and pollutants on the chip, so that the cleaning effect is achieved. However, the impact force of the cleaning method on the chip is too large, which easily causes the damage of the element pattern, and the utilization rate of the deionized water of the cleaning method is low, which results in the waste of resources.
In the market, manual proportioning liquid medicine is also used for cleaning the chip wafer, and then the chip wafer is cleaned by using the modes of liquid medicine soaking, common blow-drying and external baking, although the process is simple, a plurality of problems exist, firstly, the liquid medicine proportioning is difficult to realize the datamation, and great quality risk is caused to the product quality; secondly, the chip wafer cleaning requirement is difficult to meet in the soaking process, and the liquid medicine residue and the damage to the product are serious; thirdly, the liquid medicine cleaning tank has the risk of secondary pollution to the chip wafer; the re-cleaned wafer chip cannot ensure the drying of moisture and liquid medicine, so that the residue is serious; finally, after the traditional blow-drying, water stains are left on the surface of the wafer, so that the cleaning efficiency and the cleaning effect of the traditional process are poor.
The bumps on the surface of the chip are more in number, small in size and made of soft metal, so that the chip is easily scratched by tweezers and damaged in the cleaning process; the optoelectronic device chip is usually made of some brittle materials, and is easily damaged due to excessive clamping force, so that the chip is scrapped.
Disclosure of Invention
The invention aims to provide a cleaning device for chip wafer production, which ensures the stable effect of wafers in the cleaning process by arranging a supporting device when the cleaning process is carried out under the condition of different weights of different types of wafers; by arranging the sliding ring, when the cleaning process is carried out on the wafers with different diameters, the sliding ring can fix the wafers, so that the condition that the wafers shake in the cleaning process is avoided, and the cleaning effect is poor; through setting up the ejector pad, the water intensity of control abluent wafer has accelerated the efficiency to wafer cleaning process.
The purpose of the invention can be realized by the following technical scheme:
a cleaning device for chip wafer production comprises an operation table, wherein the top surface of the operation table is symmetrically provided with first sliding grooves, the inner wall of the first chute is symmetrically provided with a second chute, the inside of the first chute at two sides is movably provided with a plurality of rotating shafts, the middle part of the rotating shaft is sleeved with a shaft sleeve, one side of the shaft sleeve, which is different from the first chute, is fixedly connected with a fixed rod, one end surface of the two fixed rods, which is different from the shaft sleeve, is fixed with a bearing plate, the top surface of the bearing plate is fixedly connected with a plurality of first electric telescopic rods, the end surfaces of the telescopic ends of the four first electric telescopic rods are all fixedly connected with sliding rings, the inner side wall of the sliding ring is symmetrically fixed with first puller springs, the other end of each first puller spring is fixedly connected with a clamping plate, each clamping plate is of an arc-shaped structure, and the lower end of the clamping plate extends to the lower part of the sliding ring, and the middle part of the top surface of the bearing plate is provided with a supporting device.
As the preferable technical scheme of the cleaning device for chip wafer production, the supporting device comprises a fixed column, the inside of the fixed column is of a cavity structure, a sliding rod is movably arranged in the fixed column, one end of the sliding rod is fixedly connected with a first sliding block, the first sliding block is in sliding connection with the inner wall of the fixed column, the other end of the sliding rod penetrates through the top surface of the fixed column and is fixedly connected with a top block, one end face of the top block, different from the sliding rod, is provided with a plurality of friction points, and a second jacking spring is fixedly arranged in the fixed column.
As the preferable technical scheme of the cleaning device for chip wafer production, electric pulleys are sleeved at two ends of the rotating shaft and are in sliding connection with the second sliding groove.
According to the preferable technical scheme of the cleaning device for chip wafer production, the top frame is arranged above the operating platform, the two ends of the top frame are fixedly connected with the two side walls of the operating platform in the axial direction, and the end face, facing the top surface of the operating platform, of one side of the top frame is internally provided with the third sliding groove.
According to the preferable technical scheme of the cleaning device for chip wafer production, the second sliding block is movably arranged in the third sliding groove, a second electric telescopic rod is arranged on the end face, different from the top frame, of one side of the second sliding block, the fixed end of the second electric telescopic rod is fixedly connected with the second sliding block, the telescopic end of the second electric telescopic rod is rotatably connected with an electric rotating shaft through a bearing, clamping frames are symmetrically and fixedly connected to the side wall of the electric rotating shaft, and the clamping frames are of an L-shaped structure.
According to the preferable technical scheme of the cleaning device for chip wafer production, the opposite end faces of the clamping frames are symmetrically provided with the third electric telescopic rods, the fixed ends of the third electric telescopic rods are fixedly connected with the clamping frames, the telescopic ends of the third electric telescopic rods penetrate through and are sleeved with the water inlet plates, the top end faces of the water inlet plates are fixedly connected with the end faces of the telescopic ends of the second electric telescopic rods, the opposite end faces of the two water inlet plates are respectively provided with the arc-shaped storage block grooves, the pushing blocks are arranged in the arc-shaped storage block grooves, the end faces of the pushing blocks, which are on the same side as the third electric telescopic rods, are fixedly connected with the telescopic ends of the third electric telescopic rods, and one side of each water inlet plate is provided with the opening.
As the preferable technical scheme of the cleaning device for producing the chip wafer, a plurality of universal wheels are arranged on the end surface of the bottom of the operating platform.
As the preferable technical scheme of the cleaning device for producing the chip wafer, the specific working method comprises the following steps:
s1: the wafer is placed in the sliding ring, the clamping plate in the sliding ring fixes the wafer, the wafer with different radiuses can be pressed by the clamping plate under the action of the first jacking spring, such as the wafer with a larger radius, the side wall of the wafer extrudes the clamping plate, the clamping plate is offset by the first jacking spring and can fix the wafer, if the wafer with a smaller radius, the elastic force of the first jacking spring extrudes the wafer through the clamping plate, so that the wafer is fixed, then the first electric telescopic rod is started, the telescopic end of the first electric telescopic rod drives the sliding ring to descend, so that the bottom of the wafer is contacted with the jacking block, and after the wafer is placed in the jacking block, under the condition that the weights of different types of wafers are different, the wafer generates gravity and extrudes the second jacking spring through the sliding rod and the first sliding block, so that the wafer is kept stable in the axial direction by rubbing the clamping plate;
s2: a second sliding block in the top frame slides to a position right above the wafer, then a second electric telescopic rod is started to enable the electric rotating shaft and the clamping frame to descend, the water inlet plate is close to the wafer, a water pipe special for cleaning the wafer is inserted into an opening of the water inlet plate, then a third electric telescopic rod is started, and a telescopic end of the third electric telescopic rod pushes a push block to control the flow velocity of cleaning liquid, so that the water body strength of the cleaned wafer is controlled;
s3: after the cleaning is finished, the first electric telescopic rod is started, the telescopic end of the first electric telescopic rod drives the sliding ring to ascend, the lower end of the sliding ring is far away from the wafer, the cleaning liquid remained in the sliding ring after the cleaning slides to the bearing plate, and then the surface of the wafer is dried.
The invention has the beneficial effects that:
(1) through setting up strutting arrangement, when the wafer was placed at the kicking block, under the condition that the weight of different kind wafers is different, the wafer produced gravity and extrudeed the tight spring in second top through slide bar and first slider to thereby friction point and grip block make wafer remain stable in the axial direction, have guaranteed the effect that the wafer is firm at the cleaning process in-process.
(2) Through setting up the slip ring, the grip block in the slip ring is fixed the wafer, the wafer that the radius is different can be under the effect of first top tension spring, like the great wafer of radius, the wafer lateral wall extrudees the grip block, and offset and can fix the wafer through first top tension spring, like the less wafer of radius, then the elasticity of first top tension spring passes through grip block extrusion wafer, thereby fix the wafer, the condition of wafer emergence shake in the cleaning process, thereby the cleaning performance is poor.
(3) Through setting up the ejector pad, the flexible end of third electric telescopic handle promotes the ejector pad and carries out the control of velocity of flow to the washing liquid to the water intensity of control abluent wafer has accelerated the efficiency to wafer cleaning process.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 3 is a schematic top view of the sliding ring of the present invention;
FIG. 4 is a schematic view of the support structure of the present invention;
FIG. 5 is a front view of the bearing plate of the present invention;
FIG. 6 is a schematic view of the construction of the top frame of the present invention;
fig. 7 is an enlarged schematic view of the structure at B of fig. 6.
In the figure: 1. an operation table; 2. a first chute; 3. a second chute; 4. fixing the rod; 5. a bearing plate; 6. a first electric telescopic rod; 7. a sliding ring; 8. a first urging spring; 9. a clamping plate; 10. a support device; 11. fixing a column; 12. a slide bar; 13. a first slider; 14. a top block; 15. a friction point; 16. a second urging spring; 17. a top frame; 18. a third chute; 19. a second slider; 20. a second electric telescopic rod; 21. an electric rotating shaft; 22. a clamping frame; 23. a third electric telescopic rod; 24. a water intake plate; 25. an arc-shaped block storage groove; 26. and (7) pushing the block.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, a cleaning device for chip wafer production comprises an operation table 1, wherein a first chute 2 is symmetrically formed on the top surface of the operation table 1, a second chute 3 is symmetrically formed on the inner wall of the first chute 2, a plurality of rotating shafts are movably arranged inside the first chute 2 on both sides, a shaft sleeve is sleeved in the middle of each rotating shaft, a fixing rod 4 is fixedly connected to one side of each shaft sleeve, which is different from the first chute 2, a bearing plate 5 is fixedly arranged on one end surface of each fixing rod 4, which is different from the shaft sleeve, a plurality of first electric telescopic rods 6 are fixedly connected to the top surface of each bearing plate 5, the end surfaces of the telescopic ends of the four first electric telescopic rods 6 are fixedly connected with a sliding ring 7, first jacking springs 8 are symmetrically fixed on the inner side wall of the sliding ring 7, and a clamping plate 9 is fixedly connected to the other ends of the first jacking springs 8, the clamping plate 9 is of a circular arc-shaped structure, the lower end of the clamping plate 9 extends to the position below the sliding ring 7, and a supporting device 10 is arranged in the middle of the surface of the top of the bearing plate 5.
In this embodiment, put into the slip ring 7 with the wafer, the grip block 9 in the slip ring 7 is fixed the wafer, the wafer that the radius is different can be under the effect of first top tension spring 8, if the great wafer of radius, the wafer lateral wall extrudees grip block 9, and offset and can fix the wafer through first top tension spring 8, if the less wafer of radius, then the elasticity of first top tension spring 8 extrudes the wafer through grip block 9, thereby fix the wafer, the condition of wafer shake in the cleaning process has been avoided, thereby the cleaning performance is poor.
Specifically, strutting arrangement 10 includes fixed column 11, fixed column 11 is inside to be the cavity structure, just fixed column 11 inside activity is provided with slide bar 12, the first slider 13 of one end fixedly connected with of slide bar 12, first slider 13 and fixed column 11 inner wall sliding connection, the other end of slide bar 12 runs through fixed column 11 top surface and fixedly connected with kicking block 14, kicking block 14 is different and sets up a plurality of friction point 15 in the terminal surface of slide bar 12, fixed column 11 is inside still to be fixed and to be equipped with second top tight spring 16.
In this embodiment, the first electric telescopic rod 6 is started subsequently, the telescopic end of the first electric telescopic rod 6 drives the sliding ring 7 to descend, so that the bottom of the wafer is in contact with the ejector block 14, and after the wafer is placed in the ejector block 14, under the condition that the weights of different wafers are different, the wafer generates gravity to extrude the second jacking spring 16 through the sliding rod 12 and the first sliding block 13, so that the friction point 15 and the clamping plate 9 enable the wafer to be kept stable in the axial direction, and the effect that the wafer is stable in the cleaning process is ensured.
Specifically, electric pulleys are sleeved at two ends of the rotating shaft and are connected with the second sliding groove 3 in a sliding mode.
In this embodiment, the electric pulley drives the receiving plate 5 to slide in the second chute 3, so as to move the receiving plate 5 to the lower part of the push plate, thereby accelerating the cleaning process.
Specifically, a top frame 17 is arranged above the operating platform 1, the top frame 17 is fixedly connected with two side walls of the operating platform 1 in the axial direction of two ends of the top frame 17, and a third sliding groove 18 is formed in the end face of one side of the top frame 17 facing the top surface of the operating platform 1.
Specifically, the inside activity of third spout 18 is provided with second slider 19, second slider 19 is provided with second electric telescopic handle 20 on different in a side end face of roof-rack 17, second electric telescopic handle 20's stiff end and 19 fixed connection of second slider, second electric telescopic handle 20's flexible end is connected with electronic pivot 21 through the bearing rotation, symmetry fixedly connected with holding frame 22 on electronic pivot 21's the lateral wall, and holding frame 22 is L type structure.
In the present embodiment, the first and second electrodes are,
specifically, the symmetry is provided with third electric telescopic handle 23 on the relative terminal surface of holding frame 22, and the stiff end and the holding frame 22 fixed connection of third electric telescopic handle 23, the flexible end of third electric telescopic handle 23 runs through and has cup jointed into water board 24, and the flexible end terminal surface fixed connection of the top terminal surface of water board 24 and second electric telescopic handle 20, two all seted up the arc on the relative terminal surface of water board 24 and deposited a groove 25, the arc is deposited and is provided with ejector pad 26 in the groove 25, and the terminal surface of ejector pad 26 and the homonymy of third electric telescopic handle 23 and the flexible end fixed connection of third electric telescopic handle 23, the opening has been seted up to one side of water board 24.
In this embodiment, the second slider 19 in the top frame 17 slides to a position right above the wafer, then the second electric telescopic rod 20 is started to lower the electric rotating shaft 21 together with the clamping frame 22, so that the water inlet plate 24 is close to the wafer, a water pipe specially used for cleaning the wafer is inserted into an opening of the water inlet plate 24, then the third electric telescopic rod 23 is started, and the telescopic end of the third electric telescopic rod 23 pushes the push block 26 to control the flow rate of the cleaning liquid, so as to control the water body strength of the cleaned wafer; the efficiency of the wafer cleaning process is accelerated.
Specifically, a plurality of universal wheels are installed on the end face of the bottom of the operating platform 1.
In this embodiment, can conveniently remove operation panel 1 through setting up the universal wheel.
Specifically, the specific working method of the device comprises the following steps:
s1: the wafer is put into the sliding ring 7, the clamping plate 9 in the sliding ring 7 fixes the wafer, the wafer with different radius can extrude the clamping plate 9 by the side wall of the wafer under the action of the first jacking spring 8, such as the wafer with larger radius, the first urging spring 8 is used for offsetting and fixing the wafer, if the radius of the wafer is smaller, the elastic force of the first urging spring 8 presses the wafer through the clamping plate 9, therefore, the wafer is fixed, then the first electric telescopic rod 6 is started, the telescopic end of the first electric telescopic rod 6 drives the sliding ring 7 to descend, so that the bottom of the wafer is contacted with the top block 14, after the wafer is placed on the top block 14, under the condition that the weight of different types of wafers is different, the wafer generates gravity to press a second jacking spring 16 through the slide rod 12 and the first slide block 13, so that the friction point 15 and the clamping plate 9 enable the wafer to be kept stable in the axial direction;
s2: a second sliding block 19 in the top frame 17 slides to a position right above the wafer, then a second electric telescopic rod 20 is started, so that an electric rotating shaft 21 with a clamping frame 22 descends, a water inlet plate 24 is close to the wafer, a water pipe specially used for cleaning the wafer is inserted into an opening of the water inlet plate 24, then a third electric telescopic rod 23 is started, and a telescopic end of the third electric telescopic rod 23 pushes a push block 26 to control the flow velocity of cleaning liquid, so that the water body strength of the cleaned wafer is controlled;
s3: after the cleaning is finished, the first electric telescopic rod 6 is started, the telescopic end of the first electric telescopic rod 6 drives the sliding ring 7 to ascend, the lower end of the sliding ring 7 is far away from the wafer, the cleaning liquid remained in the sliding ring 7 after the cleaning slides onto the bearing plate 5, and then the surface of the wafer is dried.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The utility model provides a belt cleaning device is used in production of chip wafer, includes operation panel (1), its characterized in that: the top surface of the operating platform (1) is symmetrically provided with first sliding chutes (2), the inner wall of each first sliding chute (2) is symmetrically provided with second sliding chutes (3), two sides of each first sliding chute (2) are movably provided with a plurality of rotating shafts, the middle parts of the rotating shafts are sleeved with shaft sleeves, one sides of the shaft sleeves, which are different from the first sliding chutes (2), are fixedly connected with fixing rods (4), one end surfaces of the two fixing rods (4), which are different from the shaft sleeves, are fixedly provided with bearing plates (5), the top surface of each bearing plate (5) is fixedly connected with a plurality of first electric telescopic rods (6), the telescopic end surfaces of the four first electric telescopic rods (6) are fixedly connected with sliding rings (7), the inner side walls of the sliding rings (7) are symmetrically fixed with first jacking springs (8), and the other ends of the first jacking springs (8) are fixedly connected with clamping plates (9), the clamping plate (9) is of a circular arc-shaped structure, the lower end of the clamping plate (9) extends to the position below the sliding ring (7), and a supporting device (10) is arranged in the middle of the surface of the top of the bearing plate (5).
2. The cleaning device for chip wafer production according to claim 1, wherein: support arrangement (10) are including fixed column (11), fixed column (11) are inside to be the cavity structure, just fixed column (11) inside activity is provided with slide bar (12), the first slider of one end fixedly connected with (13) of slide bar (12), first slider (13) and fixed column (11) inner wall sliding connection, the other end of slide bar (12) runs through fixed column (11) top surface and fixedly connected with kicking block (14), kicking block (14) are different in a terminal surface of slide bar (12) and set up a plurality of friction point (15), fixed column (11) are inside still to be fixed and are equipped with second top tight spring (16).
3. The cleaning device for chip wafer production according to claim 1, wherein: electric pulleys are sleeved at two ends of the rotating shaft and are in sliding connection with the second sliding grooves (3).
4. The cleaning device for chip wafer production according to claim 1, wherein: operating panel (1) top is provided with roof-rack (17), and on the axial direction at roof-rack (17) both ends with operating panel (1) both sides wall fixed connection, third spout (18) have been seted up towards in the terminal surface of one side of operating panel (1) top surface in roof-rack (17).
5. The cleaning device for chip wafer production according to claim 4, wherein: third spout (18) inside activity is provided with second slider (19), second slider (19) are provided with second electric telescopic handle (20) on different side end face of roof-rack (17), the stiff end and second slider (19) fixed connection of second electric telescopic handle (20), the flexible end of second electric telescopic handle (20) rotates through the bearing and is connected with electric rotating shaft (21), symmetry fixedly connected with holding frame (22) on the lateral wall of electric rotating shaft (21), and holding frame (22) are L type structure.
6. The cleaning device for chip wafer production according to claim 5, wherein: the symmetry is provided with third electric telescopic handle (23) on the relative terminal surface of holding frame (22), and the stiff end and holding frame (22) fixed connection of third electric telescopic handle (23), the flexible end of third electric telescopic handle (23) is run through and has been cup jointed into water board (24), and the top end face of intaking board (24) and the flexible end face fixed connection of second electric telescopic handle (20), two arc deposit a groove (25) have all been seted up on the relative terminal surface of board (24) of intaking, be provided with ejector pad (26) in arc deposit a groove (25), and the terminal surface of the homonymy of ejector pad (26) and third electric telescopic handle (23) and the flexible fixed connection of third electric telescopic handle (23), the opening has been seted up to one side of board (24) of intaking.
7. The cleaning device for chip wafer production according to claim 1, wherein: and a plurality of universal wheels are arranged on the end surface of the bottom of the operating platform (1).
8. The cleaning device for chip wafer production according to any one of claims 1 to 7, wherein: the specific working method of the device comprises the following steps:
s1: the wafer is placed in a sliding ring (7), a clamping plate (9) in the sliding ring (7) fixes the wafer, the side wall of the wafer can extrude the clamping plate (9) under the action of a first jacking spring (8) when the wafer with different radiuses is the wafer with a larger radius, the clamping plate can offset by the first jacking spring (8) and fix the wafer, if the wafer with a smaller radius is the wafer with a smaller radius, the elastic force of the first jacking spring (8) extrudes the wafer through the clamping plate (9) so as to fix the wafer, then a first electric telescopic rod (6) is started, the telescopic end of the first electric telescopic rod (6) drives the sliding ring (7) to descend to enable the bottom of the wafer to be contacted with a jacking block (14), and the wafer is placed in the jacking block (14) and extrudes a second jacking spring (16) through a sliding rod (12) and a first sliding block (13) under the condition that the weights of different kinds of wafers are different, whereby the friction point (15) and the clamping plate (9) cause the wafer to be held stable in the axial direction;
s2: a second sliding block (19) in the top frame (17) slides right above the wafer, then a second electric telescopic rod (20) is started to enable an electric rotating shaft (21) and a clamping frame (22) to descend, a water inlet plate (24) is close to the wafer, a water pipe special for cleaning the wafer is inserted into an opening of the water inlet plate (24), then a third electric telescopic rod (23) is started, and a telescopic end of the third electric telescopic rod (23) pushes a push block (26) to control the flow rate of cleaning liquid, so that the water body strength of the cleaned wafer is controlled;
s3: after cleaning, starting the first electric telescopic rod (6), driving the sliding ring (7) to ascend by the telescopic end of the first electric telescopic rod (6), keeping the lower end of the sliding ring (7) away from the wafer, sliding the cleaning liquid remained in the sliding ring (7) after cleaning onto the bearing plate (5), and drying the surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110758097.2A CN113539936A (en) | 2021-07-05 | 2021-07-05 | Belt cleaning device is used in production of chip wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
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