CN1805126A - Substrate treating apparatus - Google Patents
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- CN1805126A CN1805126A CN 200510137082 CN200510137082A CN1805126A CN 1805126 A CN1805126 A CN 1805126A CN 200510137082 CN200510137082 CN 200510137082 CN 200510137082 A CN200510137082 A CN 200510137082A CN 1805126 A CN1805126 A CN 1805126A
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- many substrates
- conveying mechanism
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- 239000000758 substrate Substances 0.000 title claims abstract description 860
- 238000003860 storage Methods 0.000 claims abstract description 221
- 238000011282 treatment Methods 0.000 claims description 778
- 230000007246 mechanism Effects 0.000 claims description 460
- 238000012545 processing Methods 0.000 claims description 376
- 238000001035 drying Methods 0.000 claims description 69
- 238000010923 batch production Methods 0.000 claims description 55
- 238000012958 reprocessing Methods 0.000 claims description 29
- 238000011068 loading method Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims 5
- 235000012431 wafers Nutrition 0.000 description 582
- 238000004140 cleaning Methods 0.000 description 71
- 238000005192 partition Methods 0.000 description 55
- 230000007723 transport mechanism Effects 0.000 description 55
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 54
- 239000010410 layer Substances 0.000 description 47
- 230000005540 biological transmission Effects 0.000 description 44
- 238000012546 transfer Methods 0.000 description 40
- 230000033001 locomotion Effects 0.000 description 34
- 238000012423 maintenance Methods 0.000 description 32
- 230000003028 elevating effect Effects 0.000 description 28
- 239000000243 solution Substances 0.000 description 27
- 230000005571 horizontal transmission Effects 0.000 description 25
- 239000000126 substance Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 230000008859 change Effects 0.000 description 13
- 239000007789 gas Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 229910021641 deionized water Inorganic materials 0.000 description 12
- 230000007613 environmental effect Effects 0.000 description 12
- 239000008367 deionised water Substances 0.000 description 11
- 238000000151 deposition Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- GQWNECFJGBQMBO-UHFFFAOYSA-N Molindone hydrochloride Chemical compound Cl.O=C1C=2C(CC)=C(C)NC=2CCC1CN1CCOCC1 GQWNECFJGBQMBO-UHFFFAOYSA-N 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 4
- 238000012993 chemical processing Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005570 vertical transmission Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002242 deionisation method Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A substrate treating apparatus includes a storage block for accommodating foups each storing a plurality of substrates, a first treating block for treating a plurality of substrates en bloc, a second treating block for treating one substrate at a time, and a transport device for transporting the substrates between the foups, first treating block and second treating block. The substrates may be treated in a mode of treating a plurality of substrates en bloc, and/or a mode of treating one substrate at a time.
Description
Technical field
The present invention relates to about handling semiconductor wafer for example, being used for the substrate processing equipment of substrate of (being designated hereinafter simply as substrate) such as glass substrates of LCD.
Background of invention
For polytype substrate processing equipment, processing mode can be categorized as widely the batch mode of many about integrally handling (for example 25) substrate and about the mode piecewise of single treatment one substrate.
In batch mode, the many substrates in handling all are immersed in the Treatment Solution that is stored in the treatment box.This mode has fabulous a large amount of industry characteristics that substrate is handled, and guarantees fabulous a large amount of industry characteristics that substrate is handled, and guarantee homogeneous quality that substrate handles (as Japanese unexamined patent publication No. 2001-196342 disclosed).
Piecewise or in individual substrate processing mode, Treatment Solution is put on individual substrate that is used to handle that in level, rotates.This mode can be with degree of precision treatment substrate (as what be disclosed in the patent publication No. 2000-070873 of Japanese unexamined).
This two mode all has merits and demerits on the characteristics of handling.Adopt each mode according to handling desired content.
The legacy equipment that can work in these modes has following shortcoming.
For batch processing mode, substrate demonstrates the not satisfied result who handles quality sometimes.Especially when the cleaning of substrate was incorrect, the substrate of handling in batch mode must further be handled in single chip mode, to improve the quality of handling.
In addition, in a series of processing procedures need with the combination two mode treatment substrates the time, must make and obtain being the designed all substrate processing equipments that separate of these two different modes.This causes the inconvenience of big installing space and increases cost.And when carrying substrate between these substrate processing equipments, in a single day substrate moves to outside the equipment, thereby just in the face of contaminated possibility.
Summary of the invention
Consider that above-mentioned state of the art has produced the present invention, its purpose provides about one first treatment region of the treatment substrate in the batch mode with about a substrate processing equipment of treatment substrate in one or two of one second treatment region of the treatment substrate in the single chip mode.
Finished above-mentioned purpose according to the present invention by a substrate processing equipment, this equipment comprises the container platform that is used to support store the container of many substrates; The substrate treatment region, this district comprises and is used for integrally handling one first processing section of many substrates and one second processing section of a substrate of single treatment; Between container platform, first processing section and second processing section, carry the conveying mechanism of substrate; And be used for controlling the control device that is used for the transportation work of the conveying mechanism of conveying substrate between container platform, first processing section and second processing section according to the substrate treatment state.
According to the present invention, the substrate treatment region comprises one second processing section that is used for integrally handling one first processing section of many substrates and is used for a substrate of single treatment.Conveying mechanism is transported to first processing section or second processing section from the container platform with substrate under the control of control device.Thereby a substrate processing equipment can clean in the mode of a mode of integrally handling many substrates and a substrate of single treatment, etching, peel off and dried.Like this, can use the high Precision Processing substrate.
The substrate treatment region can be divided into two zones, first processing section is configured to relative mutually with second processing section.First processing section is placed in one of them zone, and second processing section is placed in another zone.The substrate processing section is divided into two zones.First processing section is interior, relative mutually with the zone that second processing section is set at separately.This provides the greater efficiency aspect layout substrate treatment region, to realize less floor space.The transportation work of conveying mechanism comprises more a spot of motion, to realize fabulous transfer efficiency.
This equipment can also be included in the separator between above-mentioned two zones.This separator will at the environment in all respective regions separately prevent that the environmental gas in a zone from expanding to another zone.Thereby, treatment substrate suitably in each part of first and second processing sections that in these zones, are provided with.
First processing section can comprise the processing unit that is used for being in the processing solution-treated many substrates of perpendicular attitude; The dry drying unit that is in many substrates of perpendicular attitude after being used in processing unit, handling; With arrive/leave conveying mechanism transmit and accept many substrates and between horizontal attitude and perpendicular attitude, change many posture changing mechanisms; And be used to arrive/leave the transmission of posture changing mechanism and accept conveying mechanism many substrates and that between processing unit and drying unit, carry one first processing section of substrate.
Carry in the process of substrate between first processing section and conveying mechanism, posture changing mechanism integrally changes the attitude of many substrates.This provides processing has been in the processing unit of many substrates in the perpendicular attitude or the convenience that drying unit is carried substrate.The conveying mechanism of first processing section and arrive/leave that posture changing mechanism transmits and carry substrate when accepting substrate between processing unit and drying unit.This has further improved the transfer efficiency in first processing section.
The conveying mechanism that second processing section can comprise individual substrate processing unit that is used for a substrate of single treatment and be used for carrying one second processing section of substrate between conveying mechanism and individual substrate processing unit.The conveying mechanism of second processing section of conveying substrate has further improved the transfer efficiency in second processing section between conveying mechanism and individual substrate processing unit.
The posture changing mechanism that is included in first processing section can be one first posture changing mechanism, and this equipment may further include spanning substrate treatment region and conveying mechanism one second posture changing mechanism that be oppositely arranged, that be used for carrying substrate between first processing section and second processing section and change many substrates between horizontal attitude and perpendicular attitude.Carry in the process of substrate between first processing section and second processing section, the second posture changing mechanism integrally changes the attitude of many substrates.This provides the convenience of carrying substrate between first processing section and second processing section.For the second posture changing mechanism that spanning substrate treatment region and conveying mechanism are oppositely arranged, the second posture changing mechanism can not interfere with conveying mechanism.Thereby, can control the conveying operations of the conveying mechanism and the second posture changing mechanism mutually individually.
The substrate that conveying mechanism can be configured to handle in first processing section is transported to second processing section.Can handle in the mode of a substrate of single treatment continuously with the substrate that the mode of integrally handling many substrates was handled.
The substrate that conveying mechanism can be configured to manage in second processing section everywhere is transported to first processing section.The substrate of handling in the mode of a substrate of single treatment can be handled in the mode of integrally handling many substrates continuously.
In another aspect of this invention, substrate processing equipment comprises the storage area that is used to accept deposit the container of many substrates; Be used for integrally handling one first treatment region of many substrates; Be used for one second treatment region to a substrate of many substrate single treatments; And be used in the delivery area that is received within conveying substrate between the container of storage area, first treatment region and second treatment region.
According to the present invention, the equipment that has first treatment region and second treatment region can be by the mode treatment substrate of a mode of integrally handling many substrates and a substrate of single treatment.And, the surrounding air of the storage area of storage container is kept clean.
Second treatment region can be arranged between first treatment region and the storage area, and the delivery area can be arranged between first treatment region and the storage area and be relative with second treatment region.In this layout, surround the delivery area by first treatment region, second treatment region and storage area, this has realized the transport path that shortens.Therefore, can carry substrate effectively.
Can first treatment region, second treatment region and storage area be set along a long side of substrate processing equipment.This layout allows the short side of substrate processing equipment shorter than the occasion that the side at storage area is provided with first treatment region and second treatment region.Can also eliminate the dead angle, be used for the floor space of reduction equipment.
Press another aspect of the present invention, substrate processing equipment comprises the container platform that is used to support deposit the container of many substrates; One first treatment region that is used for many substrates of disposed of in its entirety; Be used for one second treatment region to a substrate of many substrate single treatments; And the delivery area of between the container of placing on the container platform, first treatment region and second treatment region, carrying substrate; Wherein second treatment region is arranged between first treatment region and the container platform, and the delivery area is arranged between first treatment region and the container platform and relative with second treatment region.
According to the present invention, the equipment that has first treatment region and second treatment region can be with the mode of integrally handling many substrates and the mode treatment substrate of a substrate of single treatment.And, surrounding the delivery area by first treatment region, second treatment region and storage area, this has realized the transport path that shortens.Therefore, can carry substrate effectively.
According to this bright another aspect, substrate processing equipment comprises the container platform that is used to support deposit the container of many substrates; Be used for integrally handling one first treatment region of many substrates; Be used for one second treatment region to a substrate of many substrate single treatments; And the delivery area that is used between the container of placing on the container platform, first treatment region and second treatment region, carrying substrate; Wherein the long side along substrate processing equipment sets gradually first treatment region, second treatment region and container platform.
According to the present invention, the equipment that has first treatment region and second treatment region can be by the mode treatment substrate of a mode of integrally handling many substrates and a substrate of single treatment.And above-mentioned layout allows the short side of substrate processing equipment shorter than the occasion that the side at storage area is provided with first treatment region and second treatment region.Can also eliminate the dead angle, with the floor space of reduction equipment.
First treatment region can be arranged to integrally clean and dry many substrates, and second treatment region is used for once cleaning and dry substrate.Thereby, can clean and dry substrate by the mode of many substrates of disposed of in its entirety and the mode of a substrate of single treatment.
Second treatment region can be configured to clean the fringe region at least on the rear surface of each substrate.
Second treatment region can also be configured to substrate of an etching of many substrates.
The delivery area can be configured to carry the substrate of handling in second treatment region to arrive first treatment region from second treatment region.According to carrying substrate, in first treatment region, handle the substrate of in second treatment region, having handled in this mode.
The delivery area can be configured to carry the substrate of handling in first treatment region to arrive second treatment region from first treatment region.According to carrying substrate, in second treatment region, handle the substrate of in first treatment region, having handled in this mode.
The delivery area can be configured to arrive second treatment region from the container transport substrate, and the substrate of handling in second treatment region from the conveying of second treatment region arrives first treatment region and carries the substrate of handling in first treatment region to arrive container from first treatment region.According to carrying substrate, substrate processed, that leave in the container in first treatment region, in second treatment region, to handle then, and enter the substrate that the container loading lives through these processing along with the substrate of handling returns in this mode.
The delivery area can comprise the conveying mechanism of the delivery area that is used for integrally carrying many substrates; And second treatment region can comprise and be used for once cleaning and individual substrate processing section of a dry substrate, the substrate frame of second treatment region that is used to keep many substrates and the conveying mechanism that is used between the substrate frame of individual substrate processing section and second treatment region, many substrates once being carried second treatment region of a substrate; The conveying mechanism of this delivery area integrally is placed on many substrates on the substrate frame of second treatment region and from this substrate frame and obtains many wafers.Delivery area with conveying mechanism of delivery area integrally is transported to second processing unit with many substrates.This provides the greater efficiency of carrying substrate.Second treatment region has the substrate frame of second treatment region that is used to keep conveying mechanism many substrates, that can transmit and accept substrate and arrive/leave the delivery area.Second delivery area also has the conveying mechanism that is used for many substrates are once carried second delivery area of a substrate.Thereby, can between the substrate frame of second treatment region and individual substrate processing section, carry substrate.
The substrate frame of second treatment region can comprise the predetermined process substrate frame that is used for keeping before the processing many substrates in individual substrate processing section, and the reprocessing substrate frame that keeps many substrates in individual substrate processing section after being used for handling; Second treatment region conveying mechanism once carry a substrate to arrive individual substrate processing section and many substrates once be transported to the reprocessing substrate frame with a substrate from individual substrate processing section from the preliminary treatment substrate frame for many substrates; The conveying mechanism of delivery area integrally is placed on many substrates on the preliminary treatment substrate frame and from the reprocessing substrate frame and integrally obtains many substrates.For the substrate frame of second treatment region that comprises preliminary treatment substrate frame and reprocessing substrate frame, the substrate that delivers into second treatment region is placed on the shelf, will be placed on another shelf from the substrate of second treatment region output simultaneously.Like this, the substrate of handling in second treatment region is not by the contamination of substrates that will handle in second treatment region.
In the occasion that the conveying mechanism of delivery area can carry N to open substrate, it is many times the substrate of N that the preliminary treatment substrate frame can keep quantity in each substrate frame of reprocessing substrate frame.Thereby each substrate frame of the reprocessing substrate frame of preliminary treatment substrate frame can be held the N substrate doubly corresponding to the quantity of being carried by the conveying mechanism of delivery area.
Individual substrate processing section can comprise and is arranged among many rows and a plurality of processing units in the multilayer, the conveying mechanism of second treatment region once carries a substrate to arrive each processing unit from the preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive the reprocessing substrate frame from each processing unit to many substrates.Individual substrate processing section that has a plurality of processing units has bigger processing capacity.Because all processing units are vertically banked up, and have avoided the increase of floor space.
The delivery area can comprise the conveying mechanism of the delivery area that is used for integrally carrying many substrates; And first treatment region can comprise integrally batch process part, be used to keep the substrate frame of one first treatment region of many substrates and the conveying mechanism that is used between the substrate frame of the batch process district and first treatment region, integrally carrying one first treatment region of many substrates with liquid handling and dry many substrates; The conveying mechanism of delivery area integrally is placed on many substrates on the substrate frame of first treatment region and from this substrate frame and obtains many substrates.For this structure, the delivery area can suitably be transported to substrate first treatment region by the substrate frame of first treatment region.The conveying mechanism of first treatment region can suitably be carried substrate between the substrate frame of the batch process district and first treatment region.
The conveying mechanism of delivery area can be configured to transmit and accept to be in the substrate frame that substrate in the horizontal attitude arrived/left first treatment region; The substrate that the conveying mechanism of first treatment region can be configured to transmit and accept to be in perpendicular attitude arrives/leaves the substrate frame of first treatment region; And the substrate frame of first treatment region can be provided in and integrally changes many substrates between horizontal attitude and the perpendicular attitude so that be sent to the conveying mechanism of delivery area and the conveying mechanism of first treatment region.Integrally carry the conveying mechanism of the delivery area be in many substrates in the horizontal attitude easily substrate to be transported to deposit many basic containers being in horizontal attitude and from this container transport substrate, and arrive many substrates that remain in horizontal attitude second treatment region substrate frame and carry substrate from this substrate frame.Integrally carry the conveying mechanism of first treatment region that is in many substrates in the perpendicular attitude can easily substrate be transported to the substrate frame of first treatment region and carry substrate from this substrate frame.And arrive the batch process district of many substrates that integrally are in perpendicular attitude and carry substrate from this treatment region.According to the present invention, the substrate frame of first treatment region transmits between the conveying mechanism of the conveying mechanism of delivery area and first treatment region in the process of substrate and integrally to change many substrates in horizontal attitude and perpendicular attitude.Therefore, can between the conveying mechanism of the conveying mechanism of delivery area and first treatment region, transmit substrate easily.
According to equipment of the present invention can also comprise with storage area and second treatment region and the delivery area is separated and formation and storage area in relative being used to of container allow the separator of the passway that substrate passes through, and the shutter member that is used to open and close the passway, the delivery area is configured to enter/leave container in the storage area by passway loading and unloading substrate.Separator and valve prevent that the surrounding air of storage area from flowing into second treatment region and delivery area.The environmental gas that is oppositely arranged first treatment region storage area as second treatment region and delivery area across second treatment region and storage area separates.Thereby, admitting the delivery area of substrate from container, or at first and second treatment regions, the environmental gas that substrate will never be stored the district pollutes.
Container can have an aperture of a side that is formed on it and the lid that is used to open and close, and shutter member has being connected/dismantling and maintaining body of lid of the container that is used for connecting, dismantle and remain on storage area.By the lid that opens and closes the detachable container of shutter member of passway in the separator.Thereby only open the delivery area inside of container.Because the surrounding air of the storage area of storage container does not flow into container, the substrate in container is not contaminated.
According to another aspect of the present invention, substrate processing equipment comprises the storage area that is used to accept deposit separately all containers of many substrates; Be used for integrally handling one first treatment region of many substrates; And for one second treatment region of a substrate of many substrate single treatments; Storage area comprises one first that is used to keep from the accessibility container of first treatment region; Be used to keep one second from the accessibility container of second treatment region; The container conveyance apparatus that is used for transport box between first and second; Wherein first treatment region comprises and is used for the loading and unloading substrate entered/left the container of placing on first platform one first conveying mechanism; And second treatment region comprise that being used for the loading and unloading substrate enters/leave container one second conveying mechanism of placing on second platform.
According to the present invention, the equipment that has first treatment region and second treatment region can be with the mode of integrally handling many substrates and the mode treatment substrate of a substrate of single treatment.And, admit the surrounding air of the storage area of container to keep clean.
And first treatment region and second treatment region are configured to carry substrate by means of storage area between them.Substrate never directly transmits between first treatment region and second treatment region.Therefore, can control first treatment region and second treatment region mutually individually, and not require between this two treatment region and coordinate.Even in the occasion of controlling first treatment region and second treatment region separately, can coordinate and control this two treatment region by the control storage area.
First treatment region and second treatment region comprise first conveying mechanism and second conveying mechanism respectively.Like this, can carry substrate between the storage area and first treatment region and between the storage area and second treatment region.
Container conveyance apparatus can be configured to from second container transport to the first that will deposit the substrate of having handled in second treatment region.By carrying substrate, can in first treatment region, handle the substrate of in second treatment region, having handled in this mode.
Container conveyance apparatus can be configured to deposit from first conveying the substrate of having handled in first treatment region container arrives second.By carrying substrate, can in second treatment region, handle the substrate of in first treatment region, having handled in this mode.
First treatment region and second treatment region can be set in a side of storage area.This layout is convenient to transmitting substrate between the storage area and first treatment region and between the storage area and second treatment region.
First treatment region can be relative mutually with second treatment region.For this layout, be easy to substrate is transported to first treatment region and second treatment region from the storage area that between this two treatment region, is provided with.
Storage area can also comprise the shelf that is used to keep a plurality of containers, and container conveyance apparatus has container transport to this shelf with from the another function of this shelf transport box.With the shelf that can arrive container conveyance apparatus, storage area can be admitted container in mode easily.
Shelf can be arranged on the container transport path between first and second.This layout allows container conveyance apparatus to be easy to arrive shelf.
Because the container transport path along container conveyance apparatus is provided with, so shelf can be configured to keep a plurality of containers.Thereby container conveyance apparatus can arrive the container of greater number, has therefore increased the quantity of carrying.Because these containers all are arranged on the transport path, also improve transfer efficiency.
Container conveyance apparatus can comprise one the 3rd conveying mechanism that is used for transport box between first and shelf, and between second and shelf one the 4th conveying mechanism of transport box.The the 3rd and the 3rd conveying mechanism separately can be individually at first and shelf and at transport box between second and the shelf, this has improved transfer efficiency.
The 3rd conveying mechanism can be along a lateral movement of shelf, be used for being loaded in container on the shelf at one side place and from this shelf unloading container, and the 4th conveying mechanism movable along the opposite side of shelf, be used for being loaded in container on the shelf at opposite side place and from this shelf unloading container.
Because the 3rd conveying mechanism has different transport paths with the 4th conveying mechanism, does not interfere between the operation of the 3rd conveying mechanism and the 4th conveying mechanism.Because shelf is to feed from both sides, therefore the transport path of the 3rd conveying mechanism and the 4th conveying mechanism can form along shelf.This layout has guaranteed higher transfer efficiency.
Second can be included in a plurality of stands that are provided with on the expanded range of shelf, and the 4th conveying mechanism can move along the opposite side away from first treatment region of shelf.For second that is provided with on the expanded range of shelf, the transport path of the 4th conveying mechanism can be formed straight line.A plurality of second permission increase the substrate quantity of carrying between the storage area and second treatment region.
According to equipment of the present invention can also comprise storage area is separated with first treatment region and form and first platform on the container placed one first separator relative, that be used to allow the first passage mouth that substrate passes through; Be used to open and close one first shutter member of first passage mouth; Storage area separated with second treatment region and form and second platform on the container placed one second separator relative, that be used to allow the second channel mouth that substrate passes through; And one second shutter member that is used to open and close the second channel mouth; First conveying mechanism is configured to integrally many substrate load and unloading be entered/leave container on first platform by the first passage mouth; Second conveying mechanism is configured to once a substrate load and unloading be entered/leave a plurality of containers on second platform by the second channel mouth for many substrates.First and second separators and first and second shutter members prevent that the environmental gas of storage area from flowing into first and second treatment regions.Like this, in first and second treatment regions of admittance from the substrate of container, the environmental gas that substrate will never be stored the district pollutes.
The lid that each container can have the aperture in its side and be used to cut out and open this aperture; First shutter member have be used to connect, dismantle with keep lid one first be connected/dismantle and maintaining body; Second shutter member have be used to connect, dismantle with keep lid one second be connected/dismantle and maintaining body.With the first and second connection/dismountings and maintaining body, the lid of first and second each container of shutter member by opening and closing first and second passwaies is dismountable.Like this, only first and second treatment regions are opened the inside of each container.Owing to admit the environmental gas of the storage area of container not flow into container, so the substrate in the container is not contaminated.
First treatment region can be arranged for integrally cleaning and dry many substrates, and second treatment region is used for many substrates are once cleaned and dry substrate.So, can clean and drying receptacle according to the mode of integrally handling many substrates with according to the mode of a substrate of single treatment.
Second treatment region can be configured to clean the fringe region at least on the back side of each substrate.
According to a different aspect of the present invention, substrate processing equipment comprises the storage area that is used to accept deposit separately all containers of many substrates; Be used for integrally handling one first treatment region of many substrates; Be used for one second treatment region to a substrate of many substrate single treatments; Storage area comprise be used to keep from one first of the accessibility container of first treatment region, be used to keep from one second of the accessibility container of second treatment region, be used to keep one the 3rd and the container conveyance apparatus that is used for transport box between first, second and the 3rd from the outside accessibility container of substrate processing equipment; Wherein first treatment region comprises and is used for the loading and unloading substrate entered/left the container of placing on first platform one first conveying mechanism; And second treatment region comprise be used for the loading and unloading substrate enter/leave the container of placing on second platform and be arranged on one second conveying mechanism between first treatment region and the 3rd.
According to another aspect of the present invention, substrate processing equipment comprises the storage area that is used to accept deposit separately the container of many substrates; Be used for integrally handling one first treatment region of many substrates; For one second treatment region to a substrate of many substrate single treatments; Storage area comprise be used to keep from one first of the accessibility container of first treatment region, be used to keep one second and the container conveyance apparatus that is used for transport box between first and second from the accessibility container of second treatment region; First treatment region comprises one first conveying mechanism that is used for the loading and unloading substrate and enters/leave the container of placing on first platform, be used for integrally the batch process part with solution-treated or dry many substrates; Wherein second treatment region comprise be used for the loading and unloading substrate enter/leave the container of placing on second platform and be placed on direction that batch process part wherein is set and one second conveying mechanism on the expanded range.
According to the present invention, what have first treatment region and second treatment region can be with the mode of integrally handling many substrates and the mode treatment substrate of a substrate of single treatment.And, admit the surrounding air of the storage area of container to keep clean.
And, first treatment region and second treatment region are arranged to carry substrate by storage area between them.Substrate never directly transmits between first treatment region and second treatment region.Therefore, even in the occasion of controlling first treatment region and second treatment region separately, can coordinate and regulate this two treatment region by the control storage area.
Between first treatment region and the 3rd or the occasion that second treatment region is set on the expanded range of direction of batch process part is set therein, the short side of substrate processing equipment can be shorter than the occasion that first treatment region and second treatment region are set in storage area one side.Can also eliminate the dead angle, with the floor space of reduction equipment.
First treatment region and second treatment region comprise first conveying mechanism and second conveying mechanism respectively.Like this, can carry substrate between the storage area and first treatment region and between the storage area and second treatment region.
Be placed on container on first and second platform and can have substrate load and unloading plane in the face of equidirectional.Thereby, do not require that container conveyance apparatus centers on the storage area rotary container.
Can also comprise a plurality of shelfs that are used to keep a plurality of containers (when being placed on it) along the transport path of container conveyance apparatus according to equipment of the present invention, the container conveyance apparatus transport box arrives and leaves this shelf.
With the shelf that is provided with in the storage area, storage area can be admitted container by mode easily.Container conveyance apparatus can arrive the container of greater number, thereby increases the quantity of carrying.Because these containers all are arranged on the transport path, have also improved transfer efficiency.
Shelf can be arranged between first treatment region and the 3rd and in the position relative with second treatment region.Storage area transmits and accepts substrate and arrives and leave first treatment region and second treatment region, therefore comprises a part relative with second treatment region.Storage area can be made compact by shelf is installed in that part of.
All shelfs can have its side that plays first effect.Relative with first treatment region with being positioned at, play first effect one of them shelf at side place, storage area can be formed than compacter be arranged first occasion of shelf branch.
On the expanded range that second can be arranged on shelf.With second on the expanded range that is arranged on shelf, the transport path of container conveyance apparatus can form straight line.
Second can comprise vertically disposed a plurality of stand.A plurality of second quantity that allow to be increased in the substrate of carrying between the storage area and second treatment region.Because all second vertical settings have been avoided the increase floor space.
According to equipment of the present invention can also comprise storage area is separated with first treatment region and form and be placed on the relative first passage mouth of container on first platform, be used to one first separator that allows substrate to pass through; Be used to open and close one first shutter member of first passage mouth; That storage area is separated with second treatment region and be used to form and be placed on the relative second channel mouth of container on second platform, be used to one second separator that allows substrate to pass through; And one second shutter member that is used to open and close the second channel mouth; First conveying mechanism be configured to by the first passage mouth integrally the loading and unloading substrate enter/leave container on first platform; Second conveying mechanism is configured to by the second channel mouth substrate of loading and unloading of many substrates be entered/leave container on second platform.First and second separators and first and second shutter members prevent that the environmental gas of storage area from flowing into first and second treatment regions.Thereby first and second treatment regions of accepting substrate from container, the environmental gas that substrate will never be stored the district pollutes.
Each container can have in an aperture of its side formation, and comprises the lid that is used to close this aperture; First shutter member have be used to connect, dismantle with keep lid one first be connected/dismantle and maintaining body; Second shutter member have be used to connect, dismantle with keep lid one second be connected/dismantle and maintaining body.With the first and second connection/dismountings and the maintaining body that are provided, the lid of the first and second shutter member containers by opening and closing first and second passwaies is dismountable.Thereby, the inside of only first and second treatment regions being opened container.Owing to admit the environmental gas of the storage area of container not flow into container, so the substrate in the container is not contaminated.
First treatment region can be configured to integrally clean and dry many substrates, and second treatment region is used for many substrates are once cleaned and handle a substrate.Thereby, can clean and dry substrate by the mode of integrally handling many substrates with by the mode of a substrate of single treatment.
Second treatment region can be configured to clean the fringe region at least at the back side of each substrate.
The accompanying drawing summary
For purpose of the present invention is shown, preferable some forms at present shown in the drawings, but should be appreciated that ad hoc structure and the measure of the present invention shown in being not limited to.
Fig. 1 is the schematic plan view of the substrate processing equipment among the embodiment 1;
Fig. 2 A is the plane graph and the end view of one first posture changing device when supporting that pedestal is in level;
Fig. 2 B is the plane graph and the end view of the first posture changing device when supporting that pedestal is in plumbness;
Fig. 3 A is used to transmit one first impeller of substrate and the front view of the first posture changing device;
Fig. 3 B is used to transmit first impeller of substrate and the front view of the first posture changing device;
Fig. 4 A is illustrated in the front view that transmits one group of substrate between first impeller and the batch feed mechanism;
Fig. 4 B is illustrated in the front view that transmits this group substrate between first impeller and the batch feed mechanism;
Fig. 5 is the schematic sectional view of drying unit;
Fig. 6 A is the schematic diagram of cleaning unit;
Fig. 6 B is illustrated in the schematic diagram that transmits one group of substrate between lifter and the batch feed mechanism;
Fig. 7 is the schematic diagram of cleaning and drying unit;
Fig. 8 is the flow chart that an example of substrate processing equipment work is shown;
Fig. 9 is the schematic plan view of substrate processing equipment among the embodiment 2;
Figure 10 is the schematic plan view of substrate processing equipment among the embodiment 3;
Figure 11 is the stereogram of whole container;
Figure 12 A is the plane graph of storage area;
Figure 12 B is the front view of storage area inside;
Figure 13 illustrates the end view of depositing all parts of sending part and conveying device;
Figure 14 is the stereogram of shutter member;
Figure 15 is the end view that shutter member work is shown;
Figure 16 A be illustrated in the substrate frame of one first treatment region when supporting pedestal to be in level plane graph (on) and end view (descending);
Figure 16 B be illustrated in substrate frame when supporting pedestal to be in plumbness plane graph (on) and end view (descending);
Figure 17 A is used to transmit the impeller of substrate and the front view of substrate frame;
Figure 17 B is used to transmit the impeller of substrate and the front view of substrate frame;
Figure 18 A is illustrated in the end view that transmits one group of substrate between the conveying mechanism of impeller and one first treatment region;
Figure 18 B is illustrated in the end view that transmits this group substrate between the conveying mechanism of the impeller and first treatment region;
Figure 18 C is illustrated in the end view that transmits all group of substrate between the conveying mechanism of the impeller and first treatment region;
Figure 18 D is illustrated in the end view that transmits all group of substrate between the conveying mechanism of the impeller and first treatment region;
Figure 19 is the schematic diagram of drying unit;
Figure 20 A is the schematic diagram of deionized water cleaning unit;
Figure 20 B is illustrated in the schematic diagram that transmits one group of substrate between the conveying mechanism of the filter and first treatment region;
Figure 21 A is the plane graph of preliminary treatment substrate frame;
Figure 21 B is the front view of preliminary treatment substrate frame;
Figure 22 is the schematic isometric of processing unit;
Figure 23 is the flow chart that an example of substrate processing equipment work is shown;
Figure 24 is the schematic plan view that substrate processing equipment among the embodiment 4 is shown;
Figure 25 is the schematic plan view that substrate processing equipment among the embodiment 5 is shown;
Figure 26 is the plane graph of storage area;
Figure 27 is one a front view;
Figure 28 is the end view that the work of storage area and one first treatment region is shown;
Figure 29 is the stereogram of shutter member;
Figure 30 is the end view that shutter member work is shown;
Figure 31 is the end view of one second conveying mechanism;
Figure 32 is the flow chart that an example of substrate processing equipment work is shown;
Figure 33 is the schematic plan view that substrate processing equipment among the embodiment 6 is shown;
Figure 34 is the schematic plan view that substrate processing equipment among the embodiment 7 is shown;
Figure 35 A is the plane graph of storage area;
Figure 35 B is the front view of a shelf;
Figure 36 is the end view that all parts of storage area and one first treatment region are shown;
Figure 37 is the end view of a whole container transport mechanism;
Figure 38 is the stereogram of one first shutter member;
Figure 39 is the end view that the first shutter member work is shown;
Figure 40 is the end view that one second shutter member work is shown;
Figure 41 is the flow chart that an example of substrate processing equipment work is shown; And
Figure 42 is the schematic plan view that substrate processing equipment among the embodiment 8 is shown.
Embodiment
Be described in detail a plurality of preferred embodiment of the present invention hereinafter with reference to accompanying drawing.
Fig. 1 is the schematic plan view of substrate processing equipment among the embodiment 1.
This substrate processing equipment is configured for the predetermined process (for example protective layer lift-off processing) of carrying out substrate or wafer W (for example semiconductor wafer).Comprise the box platform 1 that is used to support store the box C of wafer W on this outfit of equipment, be used to carry out wafer W predetermined process treatment region 3 and box platform 1 is set and treatment region 3 between be used for the delivery area 5 of transfer wafers W.Treatment region 3 has the one second processing section 3b that is used for integrally handling one first processing section 3a of many wafer W and is used for a wafer W of single treatment.
Being placed on each box C on the box platform 1 comprises and is in level and is in many (for example 25) wafer W in the multilayer (following many wafer W can be called one group of wafer W in suitable place).
The first processing section 3a has and is used to transmit wafer W and arrives the conveying mechanism 13 of delivery area 5 and accept wafer from this mechanism, and the one first posture changing device 21 that between level and plumbness, changes the attitude of whole one group of wafer W, be used for one group of wafer W integrally is sent to the first posture changing device 21 and accepts one first impeller 23 of one group of wafer from this converter, be used for that one group of wafer W is sent to first impeller 23 and receive the conveying mechanism 25 of one first treatment region of one group of wafer from first impeller, and be used for that one group of wafer W is sent to conveying mechanism 25 and accept the batch process station 27 of integrally handling this group wafer W of one group of wafer from this mechanism.
Narrate the first posture changing device 21 with reference to Fig. 2.Fig. 2 A show the first posture changing device 21 when supporting that pedestal 21a is in level plane graph (on) and end view (descending).Fig. 2 B show the first posture changing device 21 when supporting that pedestal 21a is in plumbness plane graph (on) and end view (descending).The first posture changing device 21 has to be supported pedestal 21a and is arranged on to support to be used on the pedestal 21a all wafer W are remained on a plurality of keeper 21b in the multilayer.Support that pedestal 21a is pivotable by the horizontal axis P that unshowned transmission mechanism is centered around the proximal end of supporting pedestal 21a.Like this, support pedestal 21a can take the perpendicular attitude shown in the horizontal attitude shown in Fig. 2 A and Fig. 2 B.Keeper 21b also can pivot with support pedestal 21a, thereby is rotated between horizontal attitude by this group wafer W that keeper 21b is kept.
This first posture changing device 21 is relative with transport path 11, is used for when supporting that pedestal 21a is in horizontal attitude wafer W being sent to the conveying mechanism 13 of delivery area and accepting wafer from this mechanism.
Consult Fig. 3.Fig. 3 A and 3B be between transmit first impeller 23 of wafer W and the front view of the first posture changing device 21.When transmitting one group of wafer W between first impeller 23 and the first posture changing device 21, the support substrate 21a of the first posture changing device 21 is in perpendicular attitude, shown in Fig. 3 A and 3B.When first impeller 23 when the first posture changing device 21 is accepted this group wafer W, as shown in Figure 3A, first impeller 23 is positioned under the first posture changing device 21.Then, shown in Fig. 3 B, first impeller 23 moves upward, and integrally accepts this group wafer W from the first posture changing device 21.
The conveying mechanism 25 of first processing section can move horizontally (the Y direction among Fig. 1) along batch process station 27 by unshowned transmission mechanism transmission.Conveying mechanism 25 have horizontally extending be used for integrally keeping one of one group of wafer W split/close the folder 25a.
Conveying mechanism 25 is sent to one group of wafer W first impeller 23 that is in the ready position not relative with batch process station 27 and accepts one group of wafer from this impeller.Shown in Fig. 4 A and 4B,, between first impeller 23 and conveying mechanism 25, transmit this group wafer W along with first impeller, 23 vertical moving and clip 25a take the opening/closing action.
Consult Fig. 5.Drying unit 29 is the rotary dryers with drying receptacle 29a, and this drying receptacle is formed with and is used for by the open top of one group of wafer W and opens and closes open-topped slide lid 29b slidably.The rotation keeper 29c that drying receptacle 29a has therein one group of wafer W that being used for of being provided with remain in perpendicular attitude rotatably be used for the vertical impeller 29d that movably keeps the drier of this group wafer W.In the sidewall of drying receptacle 29a, form nozzle 29e, be used to provide nitrogen and rinsing liquid.In addition, drying receptacle 29a is communicated with vacuum source, is used to make its inner pressure relief, and is communicated with discharging processing device, is used to handle the waste water of discharging from drying receptacle.
The impeller 29d of drier moves upward on the drying receptacle 29a, be used for one group of wafer W is sent to the conveying mechanism 25 of first processing section and receives one group of wafer (at Fig. 5, being shown in dotted line at the impeller 29d that one group of wafer W is sent to conveying mechanism 25 or the drier when this mechanism accepts one group of wafer) from this mechanism.And in drying receptacle 29a, the impeller 29d of drier should organize wafer W and be sent to rotation keeper 29c and accept this group wafer from this keeper.Before dried, projectile 29d drops to the bottom of drying receptacle 29a, avoid with rotate in rotation keeper 29c interference (in Fig. 5, solid line shows the impeller 29d of the drier that is under this state).
Consult Fig. 6 A and 6B.Being used to of the bottom that cleaning unit 31 comprises the cleaning box 31a that is used to deposit clean solution, be arranged on cleaning box 31a supplied the ascending pipe 31b of clean solution and the outer container 31c that is used to collect the overflow of clean solution around the open top of cleaning box 31a.And, lifter 35 is set, be used for one group of wafer W integrally is immersed in the cleaning box 31a.Lifter 35 has a plurality of horizontally extending maintenance bar 35a, is used for integrally remaining in this group wafer W of perpendicular attitude.Make lifter 35 vertical and level is removable by unshowned transmission mechanism.
Secondly, will narrate the second processing section 3b.The second processing section 3b comprises along the transport path 41 of one second processing section that separator 7 forms, the side that is arranged on transport path 41 and is used for handling the conveying mechanism 45 of handling station 43 and be used for once carrying one second processing section of a wafer W between individual substrate being handled the conveying mechanism 13 of station 43 and delivery area at individual substrate of the wafer W of horizontal attitude.
The conveying mechanism 45 of second processing section is used for moving horizontally (the Y direction of Fig. 1) along the transport path 41 of second processing section by the screw conveyer mechanism driving.Conveying mechanism 45 has two U-shaped keeping arm 45a1 and 45a2 (following be referred to as keeping arm 45a in the place of not distinguishing this two arm) in its top position, each arm once keeps a wafer W.Also by unshowned transmission mechanism transmission two keeping arm 45a, be used to rotate, vertical moving and horizontal-extending and withdrawal.Conveying mechanism 45 moves to the position relative with the transport path 11 of delivery area on the transport path 41 of second processing section, once a wafer W is sent to the conveying mechanism 13 of delivery area and accepts a wafer from this mechanism.
In this embodiment, individual substrate is handled station 43 and is had a plurality of (for example four) cleaning and drying unit 51a, 51b, 51c and 51d (following cleaning and the drying unit 51 of being referred to as in the place of not distinguishing these unit).Each cleaning and drying unit 51 are configured to have the loading hole of relative it of transport path 41 with second processing section.
Consult Fig. 7.Each cleaning and drying unit 51 comprise a wafer W that is used for remaining in horizontal attitude substrate keeper 53a, be used for the motor 53b of rotary substrate keeper 53a, movably be arranged on and be used to transmit the nozzle 53c of clean solution on the wafer W and center on the cup shell 53d that wafer W prevents the clean solution scattering.On wafer W, be provided with the unshowned blowing unit that is used for the downward clean gas of blowing-out in surface of wafer W.
The conveying mechanism 45 of second processing section can be moved horizontally to a position relative with each cleaning and clean unit 51.Then, two keeping arm 45a appropriate exercises are used to enter in each cleaning and the drying unit 51 and load a wafer W.
Substrate processing equipment with said structure also comprises the control unit 65 that is used for the conveying of a wafer W of control (or one group of wafer W) on the basis of predetermined substrate treatment state.Conveying mechanism 13, the first attitude transducer 21, first impeller 23 of control unit 65 control delivery areas; The conveying mechanism 25 of first processing section and the conveying mechanism 45 of second processing section (following above-mentioned conveying mechanism is referred to as " conveying system ").Control unit 65 comprises and being used for the CPU (CPU) of the multiple calculating of substrate processing execution and the storage medium that is used to deposit predetermined substrate treatment state and handles desired many information about substrate.
Narrate an example of the work of substrate processing equipment with above structure hereinafter with reference to Fig. 8.
(step S1) is transported to batch process station 27 from box C with wafer W.
The box C that deposits the wafer W that is in horizontal attitude and the multilayer is placed on the box platform 1, and the conveying mechanism 13 of delivery area is towards box C motion, and from the box C wafer W of once taking.
Conveying mechanism 13 is rotated and moves to relative with the first posture changing device 21 in the first processing section 3a with other.At this moment, the support pedestal 21a of the first posture changing device 21 is in horizontal attitude.Conveying mechanism 13 once with a wafer handling that is in horizontal attitude to the first posture changing device 21.
Should operate repeatedly, and be used for 25 wafer W are placed on the first posture changing device 21.Then, the support pedestal 21a of the first posture changing device 21 is pivoted into perpendicular attitude around axis P.25 wafer W (will be called one group of wafer W in following operation narration) that are held part 21b maintenance also forward perpendicular attitude to from horizontal attitude.
When first impeller 23 moves upward to delivering position, clip 25a is closed, be used for contact and support all should organizing wafer W.Then, first impeller 23 descends, thereby conveying mechanism 25 is integrally accepted this group wafer W.
Keep the conveying mechanism 25 of this group wafer W to be moved horizontally to the position of chemical treatment more than 33, lifter 35 be positioned at chemical treatment near.
Control unit 65 comprises the above-mentioned conveying of conveying system control wafer W of the conveying mechanism 13 of delivery area by operation.
(step S2) carries out the diaphragm lift-off processing of this group wafer W.
Keep lifter 35 declines of this group wafer W to enter the chemical case of depositing the diaphragm remover.Should organize wafer W and all be immersed in the diaphragm remover, be used for the diaphragm lift-off processing.
When having finished predetermined diaphragm lift-off processing, lifter 35 moves upward, and is used for taking out this group wafer W from the diaphragm remover.Then, lifter 35 moves horizontally and decline enters cleaning box, is used for this group wafer all is immersed in clean solution, so that clean.
Finish after the clean, lifter 35 moves upward, and takes out from clean solution and all should organize wafer W.At this moment, the conveying mechanism 25 of first processing section is on the cleaning unit 31, and clip 25a opens simultaneously.
When lifter 35 was moved upwards up to the position of conveying mechanism 25, clip 25a closed, and all should organize wafer W with contact and support.Lifter 35 descends once more, thereby conveying mechanism 25 is accepted all should organize wafer W.
Conveying mechanism 25 is moved horizontally to the position on the drying unit 29.The slip lid 29b of drying unit 29 slides, and the impeller 29b of drier is moved upwards up to the outside of drying receptacle 29a.When impeller 29d kept all should organizing wafer W, the clip 25a of conveying mechanism 25 opened.Impeller 29d descends once more, is sent to rotation keeper 29c should organize wafer W.Impeller 29d is withdrawn into the bottom of drying receptacle 29a, and slip lid 29b slip, with the hole of closed drying receptacle 29a.Then, carry out predetermined dried, rotation simultaneously is in this group wafer W under the perpendicular attitude.
After finishing dried, open slip lid 29b.Impeller 29d accepts all should organize wafer W from rotation keeper 29c, moves up then the conveying mechanism 25 of this group wafer handling to first processing section.
(step S3) is transported to individual substrate with wafer from batch process station 27 and handles station 43.
The conveying mechanism 25 of first processing section keeps this group wafer W and moves to ready position.Make this group wafer W move to first impeller 23 and move to the first posture changing device 21 from first impeller 23 from conveying mechanism.The first attitude transducer 21 will all should be organized wafer W and rotate to horizontal attitude from perpendicular attitude.The conveying mechanism 13 of delivery area extends and retraction movement in the position relative with the first posture changing device 21, is used for from the first posture changing device 21 wafer W of once taking.Have the conveying mechanism 13 that a keeping arm 13a keeps a wafer W and be moved horizontally to the second processing section 3b, and wafer W is moved to the conveying mechanism 45 of second processing section.The conveying mechanism 13 of delivery area turns back to the position relative with the first posture changing device 21, and identical repeatedly wafer transport work.
After receiving each wafer W, the conveying mechanism 45 of second processing section is moved horizontally to the predetermined relative position, a unit with cleaning and drying unit 51, wafer W is brought in the drying unit 51, and wafer W is placed on the substrate keeper 53a.Then, conveying mechanism 45 also turns back to the position relative with the conveying mechanism 13 of delivery area, with identical repeatedly wafer transport work, is used for wafer W pack into other cleaning and drying unit 51.
Control unit 65 comprises the conveying of the wafer of conveying mechanism 13 operation conveying system controls shown in step S3 of delivery area by operation.
(step S4) carries out the cleaning and the dried of each wafer W.
By clean solution is sent to wafer W from nozzle 53c, by motor 53b rotation wafer W, carry out predetermined clean simultaneously.After finishing clean, carry out dried from the wafer W that unshowned blower unit flows down to high speed rotating by making clean air.The wafer W moisture that sheds from its surface, and become dry.Because individual substrate processing station 43 has four cleanings and drying unit 51 in this embodiment, therefore can clean and dried four wafer W abreast.
(step S5) is transported to box C with wafer W from individual processing of wafers station 43.
When finishing a series of cleaning and dried, carry out with the wafer loading in the opposite process of process.That is, the conveying mechanism 45 of second processing section takes out wafer from cleaning and drying unit 51, and makes wafer W move to the conveying mechanism 13 of delivery area.Conveying mechanism 13 is packed wafer W among the box C.
Control unit 65 comprises the wafer transport of conveying system control shown in step S5 of the conveying mechanism 13 of delivery area by operation.
Substrate processing equipment in embodiment 1 has batch process station 27 as previously discussed and individual substrate is handled station 43, and control unit 63 controls comprise the conveying system of the conveying mechanism 13 of delivery area.Can selectively wafer W be transported to batch process station 27 and individual substrate processing station 43.Can handle in the station 43 at batch process station 27 and/or at individual substrate like this and handle wafer W.
Between the first processing section 3a and the second processing section 3b, separator 7 is set, is used for separately preventing that at the first processing section 3a and the environment in second processing section 31 environmental gas of a processing section is diffused into the zone of another processing section.Thereby, can in each part of the first and second processing section 3a and 3b, suitably handle wafer W.
In the process of transfer wafers W, the first posture changing device 21 has changed the attitude that all should organize wafer W between the conveying mechanism 13 of delivery area and batch process station 27.This provides the convenience that wafer W is transported to the batch process station 27 of this group wafer W that is in perpendicular attitude or is used for depositing or handle individual processing of wafers station 43 of the wafer W that is in horizontal attitude from box C.
The conveying mechanism 25 of first processing section is set, is used for pack into batch process station 27 and take out this group wafer of whole one group of wafer W from this station.Conveying mechanism 25 will all should be organized wafer W by first impeller 23 and be sent to the first posture changing device and accept this group wafer from this converter.This arranges and further to have improved to batch process station 27 with from the transfer efficiency of this station.
Similarly, the conveying mechanism 45 of second processing section be configured to once a wafer W be packed into individual substrate is handled station 43 and is once taken out a wafer from this station.Conveying mechanism 45 once is sent to a wafer W conveying mechanism 13 of delivery area and once accepts a wafer from this mechanism.This arranges further to have improved individual substrate is handled station 43 and from the transfer efficiency of this station.
As described in step S1, S3 and the S5, control unit 65 control conveying systems, be used for from box C take out wafer W to be processed, with wafer W pack batch process station 27 into, the wafer W that will handle at batch process station 27 be transported to individual substrate from batch process station 27 and handle station 43 and will handle wafer W that station 43 handles at individual substrate and handle station 43 from individual substrate and be transported to box C.Like this, this group substrate W can handle station 43 cleaning substrate W at individual substrate after batch process station 27 is stripped from diaphragm.In this mode, can remove diaphragm from substrate W, and can use high accuracy clean wafer W, as last processing.
Individual substrate is handled station 43 and is comprised a plurality of cleanings and the drying unit 51 that is used for many wafer W of parallel processing.Thereby individual substrate is handled station 43 and is had bigger capacity, to improve the output of substrate processing equipment.
Embodiment 2
Secondly will narrate embodiments of the invention 2.
Fig. 9 is the schematic plan view of the substrate processing equipment among the embodiment 2.For with embodiment 1 in identical part use identical label identification, and save narration again to them.
Substrate processing equipment in embodiment 2 comprises box platform 1, treatment region 3, delivery area 5 and auxiliary delivery area 9 generally.Auxiliary delivery area 9 is configured to across treatment region 3 relative with delivery area 5.
The second posture changing device 61 has the pedestal of support and a plurality of keeper (not shown) as the first posture changing device 21.When this support pedestal was in horizontal attitude, the second posture changing device 61 can be around rotatable with the transport path 41 opposing vertical axis of second processing section, so that wafer W is sent to the conveying mechanism 45 of second processing section and accepts substrate from this mechanism.
The conveying mechanism 26 of first processing section in embodiment 2 can move horizontally (the Y direction among Fig. 9) to auxiliary delivery area 9, is used for wafer W is sent to second projectile 63 and accepts wafer from this projectile.
Narrate an example of the operation of the substrate processing equipment among the embodiment 2 with said structure hereinafter with reference to Fig. 8.It is identical with embodiment 1 to be somebody's turn to do operation except step S3, and the conveying mechanism 25 of first processing section is the conveying mechanism 26 of first processing section now in step S3.Therefore, below incite somebody to action only recitation of steps S3.
(step S3) is transported to individual substrate with wafer W from batch process station 27 and handles station 43.
The conveying mechanism 26 of first processing section keeps one group of substrate W and moves to auxiliary delivery area 9.Second impeller 63 moves upward from conveying mechanism 26 belows, to contact and to support this group wafer W.Then, the clip of conveying mechanism 26 is opened, and second projectile 63 descends once more.Its result, this group wafer W all is sent to second impeller 63.
The second posture changing device 61 is pivoted to horizontal attitude, keeps this group wafer W simultaneously.Then, the second posture changing device 61 is used for the transport path 41 in the face of second processing section in direction rotation.
The conveying mechanism 45 of second processing section extends and retraction movement in the position relative with the second posture changing device 61, is used for from the second posture changing device 61 wafer W of once taking.After receiving each wafer, the conveying mechanism 45 that has second processing section of a keeping arm 45a who keeps wafer W is moved horizontally to the relative position of a scheduled unit with cleaning and drying unit 51, bring wafer W into cleaning and drying unit 51, and wafer W is placed on the substrate keeper 53a.Then, conveying mechanism 45 turns back to the position relative with the second posture changing device 61, to repeat identical wafer transport operation, is used for wafer W pack into other cleaning and drying unit 51.
For the substrate processing equipment among the embodiment 2 as previously discussed, change this in the process of the second posture changing device 61 transfer wafers W between the conveying mechanism 45 of the conveying mechanism 26 of first processing section and second processing section and organize the attitude of whole wafer W.This provides the batch process station 27 of the wafer W in handling perpendicular attitude and individual substrate in the processing horizontal attitude to handle the convenience of transfer wafers W between the station 43.
Owing to do not interfere between the conveying mechanism 13 of the second posture changing device 61 and delivery area, control unit 66 can be controlled these parts mutually individually.The second posture changing device 61 is arranged in the auxiliary delivery area 9 in the face of the first processing section 3a and the second processing section 3b, therefore transfer wafers W easily.
The present invention is not limited to the foregoing description, and following modification can be arranged:
(1) in each above-mentioned embodiment, batch process station 27 execute protection film lift-off processing, individual substrate is handled station 43 and is carried out cleaning and dried simultaneously.Be not limited to these and handle, can in design, change according to concrete condition and handle station 27 and 43 for the performed processing of wafer W.
(2) in the various embodiments described above, the conveying mechanism 13 of delivery area has two keeping arm 13a, and each arm is used for once keeping a wafer W.Conveying mechanism 13 can have all keeping arms in multilayer, is used for box C is carried whole one group of wafer W and carries whole this group wafer W from this box.
(3) in the various embodiments described above, each station that batch process station 27 and individual substrate are handled station 43 has a plurality of processing units.But each station can only comprise a processing unit.
(4) in the various embodiments described above, control unit 65 or 66 is controlled on the basis of processing of wafers state, in batch process station 27, handling wafer W, and treatment substrate W in individual substrate is handled station 43 then.According to can suitably changing processing sequence about the state of handling wafer W.For example, can at first wafer W be transported to individual substrate and handle station 43, be transported to batch process station 27 then.Wafer W only can be transported to individual substrate and handle a station of station 43 and batch process station 27.
(5) in the various embodiments described above, box C is placed on the platform box 1.Replace, can use the container that in sealing state, to deposit wafer W.
(6) in the various embodiments described above, use rotary dryer as drying unit 29.Replace, can be pulled upwardly wafer W in the deionized water that this device is deposited from treatment box, to give wafer W by a device drying crystal wafer W with IPA (isopropyl alcohol) and nitrogen supply (NS).
Secondly narrate embodiments of the invention 3 with reference to the accompanying drawings.
Figure 10 is the schematic plan view of the substrate processing equipment among the embodiment 3.
Substrate processing equipment among the embodiment 3 is designed to cleaning, etching and drying crystal wafer W (for example semiconductor wafer), and comprise that the container that is used to accept all sealings (is called FOUPs (container of the one that open in the place ahead), hereinafter referred to as " whole container ") storage area 101 of F, each container is used to deposit many wafer W, and comprises one first treatment region 103 that is used to handle whole many wafer W, one second treatment region 105 that is used for a wafer W of single treatment, and at storage area 101, the delivery area 107 of transfer wafers W between first treatment region 103 and second treatment region 105.Each whole container F is corresponding to the container among the present invention.Storage area 101, first treatment region 103, second treatment region 105 and delivery area 107 correspond respectively to storage area, first treatment region, second treatment region and the delivery area among the present invention.
As shown in figure 10, second treatment region 105 is between first treatment region 103 and storage area 101.Delivery area 107 is between first treatment region 103 and storage area 101, and is and relative with second treatment region 105.In other words, second treatment region 105 and delivery area 107 are along a side setting of storage area 101.Second treatment region 105 and delivery area 107 are also along a side setting of first treatment region 103.Therefore, delivery area 107 is arranged on directly in the face of in the position of storage area 101, first treatment region 103 and second treatment region 105.
Consult Figure 11.Figure 11 is the stereogram of whole container F.Whole container F has the housing 111 of the opening that forms in the one side and removably is assemblied in lid 113 in the opening.Housing 111 has all horizontal grooves 115 that are arranged vertically formation in its inwall, is used to mesh the edge of a plurality of (for example 25) wafer W, with all wafer W in the support level attitude.Lid 113 has latch mechanism 117, is used for when lid 113 is fitted in the opening lid 113 being fixed in housing 111.
Especially, latch mechanism 117 comprise have separately one have two tooth bar 117a of tooth proximal part and 117b and with the pinion 117c of the tooth engagement of tooth bar 117a and 117b.Pinion 117c can rotate, and is used for respectively from outstanding two tooth bar 117a and the 117b in the top and bottom of lid 113.Therefore, lid 113 is fixed in housing 111, to seal the inside of whole container F.
Consult Figure 12 and 13.Figure 12 A is the plane graph of storage area 101.Figure 12 B is the front view of storage area 101 inside.Figure 13 is the end view that all parts of storage area 101 and delivery area 107 are shown.The storage area 101 that is used to accept whole container F comprises all shelfs 119 of being used to keep whole container F, be used to keep whole container F from the delivery area 107 one decks 121 that feed, be used at all shelfs 119, layer 121 and support to carry between the platform 109 the whole container transport mechanism 125 of whole container F.Storage area 101 has all sidewalls 131 in its periphery setting, with inside and the outside atmosphere seal isolation with storage area 101.In this manual, storage area 101 and the sidewall 131 that the delivery area 107 and second treatment region 105 separate are called partition wall 131a specially.Partition wall 131a is corresponding to the separator among the present invention.
Shown in Figure 12 B, be provided in four perpendicular layers on the above-mentioned partition wall 131a by shelf 119.Shelf 119 in each layer has the length that is used for 3 whole container F of row's maintenance.Thereby, see that on the whole 12 whole container F can be placed on all shelfs 119.All shelfs 119 have a breach K who is essentially leg-of-mutton in plane graph, is formed on the position that is used to keep a whole container F.The shape of this breach K also is essentially leg-of-mutton shape corresponding to what the whole container of whole container transport mechanism 125 carried arm 126a in plane graph.Breach K is slightly greater than the profile that whole container carries arm 126a, and less than the outside dimension of each whole container F.
This slide mechanism 122 is the screw conveyer mechanism form, this layer 121 that is used to move, and comprise and be formed on the screw shaft 122a of the protruding 121a engagement on layer 121 the lower surface and the motor 122b that is used for back and forth rotating screw bolt axle 122a.
Whole container transport mechanism 125 comprises horizontal driver 125a, be installed in pedestal 125b on the horizontal driver 125a, with respect to vertically moving elevating lever 125c of pedestal 125b and the hinged manipulator 126 that is connected in the upper end of elevating lever 125c.In storage area 101, screw shaft 129a and guide rod 129b are placed with along shelf between all opposite ends of storage area 101 119 and layer 121 and extend.Horizontal driver 125a can be along these screw shafts 129a and guide rod 129b horizontal movement.Hinged manipulator 126 has successively from its far-end and is essentially leg-of-mutton plane graph, is used for keeping the whole container of whole container F to carry arm 126a, is used for keeping whole container to carry arm 126a at the rotatable first connecting rod 126b of horizontal plane and be used to keep first connecting rod 126b at the rotatable second connecting rod 126c of horizontal plane.Second connecting rod 126c is supported by the upper end of elevating lever 125c, is used at horizontal plane rotatable.
Whole container carry the bending of arm 126a by first connecting rod 126b and second connecting rod 126c with respect to elevating lever 125c extensible and regracting.Whole container carries arm 126a along with elevating lever 125c can freely arrive shelf 119 or layer 121 with respect to pedestal 125b vertical moving and horizontal driver 125a along screw shaft 129a horizontal movement.And whole container carries arm 126a along with second connecting rod 126c can reach support platform 109 so that whole container carries arm 126a around elevating lever 125c rotation with respect to elevating lever 125c rotation.
When whole container transport mechanism 125 is placed on a whole container F on one shelf 119, keeps the whole container of whole container F to carry arm 126a and descend from shelf 119 tops.Along with whole container carries the breach K of arm 126a by shelf 119, whole container F is carried arm 126a from whole container and is moved on the shelf 119.On the contrary, when when shelf 119 lifts whole container F, whole container carries the breach K of arm 126a by shelf 119, from the whole container F of shelf 119 contacts.
When a whole container F is being placed or when layer 121 was taken a whole container F, the whole container of motion carried arm 126a as that works in the situation of above-mentioned shelf by whole container transport mechanism 125 on the layer 121.
Be placed on storage area 101 and support the sidewall 131 between the platform 109 forming two apertures in the position of supporting the whole container F on the platform 109 with respect to being placed on.These apertures are formed and are slightly greater than whole container F, are used to allow whole container F to pass through.Close this all aperture by two vertical movable valve plates 133.These valve plates 133 only arrive in whole container transport mechanism 125 and move both vertically when supporting platforms 109, to open this all aperture.Therefore, whole container carries arm 126a and can whole container F be transported to by this all aperture and support platform 109 and from the whole container F of this conveying.Usually, valve plate 133 is closed this all aperture, with the inner sealing to storage area 101.
Consult Figure 14.Figure 14 is the stereogram of shutter member 135.Shutter member 135 has almost the projection with the passway same size, is used to be engaged in the passway of partition wall 131a and blocks this passway.Shutter member 135 have basically its center be provided with corresponding to the lid 113 that is arranged on each container on a connection piece 135a of the latch mechanism 117 that provides.Connector 135a is formed the pinion 117c of a part that is connected to form latch mechanism 117, and when it is connected rotation pinion 117c.In this mode, lid 113 is locked in housing 111, and allows to pull down lid from housing 111.Making when lid 113 can be when housing 111 be pulled down, and shutter member 135 keeps lids 113 in this situation.Shutter member 135 corresponds respectively to the shutter member among the present invention with connector 135a and is connected/dismantles and maintaining body.
Be used to open and close the operation of the shutter member 135 of passway with reference to the concrete narration of Figure 15.Figure 15 is the end view that the operation of shutter member 135 is shown.When whole container F is placed on the layer 121, whole container F is advanced, with layer 121 so that the lid 113 of whole container F moves, contacts with the shutter member 135 of closing passage mouth.At this moment, connector 135a handles the latch mechanism 117 on the lid 113, and lid 113 can be pulled down from housing 111, and keeps lid 113.Then, valve transmission device 139 descends, and the shutter member 135 of the maintenance lid 113 of withdrawing then.Therefore, the whole container F from layer 121 is pulled down lid 113, by the passway towards the delivery area 107 inside of opening whole container F.
When the closing passage mouth, make the shutter member 135 that keeps lid 113 rise and advance, to be fitted into the passway.At this moment, the lid 113 that is kept by shutter member 135 also is fitted in the aperture of the housing 111 that is placed on the whole container F on the layer 121.Connector 135a operated lock bolt mechanism 117 makes lid 113 be fixed in housing 111.Thereby the passway is closed, and lid 113 is reattached to whole container F.
Secondly, will narrate first treatment region 103.First treatment region 103 comprises the substrate frame 143 that is used for that one group of wafer W is sent to delivery area 107 and receives one group of wafer from this district, be used for that whole one-level wafer W is sent to substrate frame 143 and accept the impeller 144 of whole one group of wafer from substrate frame, be used for that one group of wafer W is sent to impeller 144 and accept the conveying mechanism 145 of one first treatment region of one group of wafer from impeller, and be used for that one group of wafer W is sent to conveying mechanism 145 and accept a processing section 147 in batches of whole this group wafer one group of wafer and that be in perpendicular attitude from this mechanism.Substrate frame 143 has the function that is used for changing the attitude of whole one group of wafer W between horizontal attitude and perpendicular attitude.Conveying mechanism 145 has the another function that is used to change the spacing between all wafer W.Below will narrate various piece.
When supporting that pedestal 143a is in horizontal attitude, substrate frame 143 can be rotated around vertical axis, so that one group of wafer W is sent to impeller and accepts one group of wafer from impeller.
Consult Figure 17.Figure 17 A and 17B be between transmit the impeller 144 of wafer W and the front view of substrate frame 143.When transmitting one group of wafer W between impeller 144 and substrate frame 143, the support pedestal 143a of substrate frame 143 is in perpendicular attitude, shown in Figure 17 A.Impeller 144 is positioned under the substrate frame 143.So, shown in Figure 17 B, impeller 144 moves upward, and the lower end that is placed on this group wafer W on the substrate frame 143 is upwards pushed away, thereby accept all should organize wafer W from substrate frame 143.
By unshowned transmission mechanism the conveying mechanism 145 of the 5th treatment region can be moved horizontally along batch process part 147.Conveying mechanism 145 has the horizontally extending a pair of maintenance bar 145a that is used to keep whole one group of wafer W.Conveying mechanism 145 is sent to one group of wafer W impeller 23 and accepts one group of wafer from impeller at not relative with batch process part 147 ready position.
Keep bar 145a to have pentagon section substantially, each surface forms all predetermined grooves.It is rotatable to keep bar 145a self to be supported as, and changing the layout of all groove opposite, thereby provides at least three different substrate hold modes.That is, one first substrate hold mode Q1 wherein keeps bar not act on by on one group of wafer W between all maintenance bar 145a, but allows this group wafer W just in time to pass through.One second substrate hold mode W2 wherein keeps bar 145a to stop and maintaining being arranged on and one group of wafer W at the uniform distances place on the substrate frame 143 that descends between all maintenance bar 145a (following suitably place be called " wafer set W1 ").But the maintenance bar 145a in this state does not act on one group of wafer W being arranged on half spacing place (following suitably place be called " wafer set W2 "), but allows this group wafer W just in time to pass through.One the 3rd substrate hold mode Q3 wherein keeps bar 145a to stop and maintaining the group wafer set W1 that descends and one group of wafer W of wafer set W2 (following be called " wafer set W3 " in suitable place) between all maintenance bar 145a.
Specifically narrate wafer set W hereinafter with reference to Figure 18 and how to have transmission between these conveying mechanisms 145 that keep bar 145a and the impeller 144.Figure 18 A, 18B, 18C and 18D are the end views that how transmits wafer set W between the impeller 144 of first treatment region and conveying mechanism 145.
At first, all maintenance bar 145a are among the first substrate hold mode Q1, the impeller 144 that keeps one group of wafer W are arranged on the pre-position that keeps under the bar 145a.This group wafer W quantity and between spacing aspect identical with on substrate frame 143.Impeller 144 moves upward, between all maintenance bar 145a.The effect that this group wafer W that kept by impeller 144 this moment is not born all maintenance bar 145a.This group wafer W remains on the impeller 144 (sees Figure 18 A).
Secondly, all maintenance bar 145a are transformed into the second substrate hold mode Q2, and impeller 144 is descended.When impeller 144 passed through between all maintenance bar 145a, this group wafer W that is kept by impeller 144 was maintained (seeing Figure 18 B) by all maintenance bar 145a.
At last, all maintenance bar 145a are transformed into the 3rd substrate hold mode Q3, and impeller 144 is descended.When impeller 144 passed through between all maintenance bar 145a, this group wafer W that is kept by impeller 144 was maintained (seeing Figure 18 D) by all maintenance bar 145a.
Aforesaid operations has been realized the transmission at the conveying mechanism 145 and the wafer set W between the impeller 144 of first treatment region, and the variation aspect the spacing of wafer set W.
Consult Figure 19.Figure 19 is the schematic diagram of drying unit 149.Drying unit 149 is the rotary dryers with drying receptacle 149a and slide lid 149b, and this container is formed for the open top by one group of wafer W, and slip lid is slidably to open and close open top.Drying receptacle 149a have be arranged on wherein be used for remain in rotationally perpendicular attitude one group of wafer W rotation keeper 149c and with the impeller 149d that vertically movably keeps the drier of this group wafer W.In the sidewall of drying receptacle 149a, be formed for the nozzle 149e of the supply of nitrogen and rinsing liquid.And drying receptacle 149a is communicated with the vacuum source of the inner pressure relief that is used to make it, and with discharge the discharge processing unit that disposes waste liquid from drying receptacle 149a and be communicated with.
The impeller 149d of drier moves upward on the drying receptacle 149a, be used for one group of wafer handling is accepted one group of wafer (at Figure 19, be shown in dotted line and passed on the impeller 149d of one group of wafer to conveying mechanism 145 or the drier when this mechanism accepts one group of wafer) to the conveying mechanism 145 of first treatment region with from this mechanism.And in the inside of drying receptacle 149a, the impeller 149d of drier should organize wafer W and be sent to rotation keeper 149c and accept this group wafer from this keeper.Before dried, impeller 149d drops to the bottom of drying receptacle 149a, with avoid and rotate in rotation keeper 149c interfere (in Figure 19, solid line shows the impeller 149d of the drier in this state).
Consult Figure 20, being used to of the bottom that each deionized water cleaning device 153 comprises the cleaning box 153a that is used to deposit clean solution, be arranged on cleaning box 153a supplied the ascending pipe 153b of clean solution and the outer container 153c that is used to collect the overflow of clean solution around cleaning box 153a open-topped.
Each chemical processing device 155 has the structure that is similar to deionized water cleaning device 153, has therefore saved its view.The outer container that being used to of the bottom that chemical processing device 155 comprises the chemical case that is used for depositing the diaphragm remover that is a chemical solution, be arranged on chemical case supplies the ascending pipe of this chemical solution and collect this chemical solution.For example suitably select this chemical solution from APM (hydrogen ammonia peroxidating mixture), HPM (hydrochloric acid peroxidating mixture), FPM (hydrofluoric acid peroxidating mixture), DHF (hydrofluoric acid of dilution) and O3/DIW (Ozone Water).
Each deionized water cleaning device 153 is included in movable lifter 157 between deionized water cleaning device 153 and the chemical processing device 155.Lifter 157 has horizontally extending many (for example three) maintenance bar 157a that is used to contact and keep whole one group of wafer W.In this embodiment, keep bar 157a to support this group wafer W of being provided with half spacing and corresponding to the twice of the quantity of the wafer W on the substrate frame 143.
When transmitting one group of wafer W between the conveying mechanism 145 of the lifter 157 and first treatment region, lifter 157 moves upward between all maintenance bar 145a, and shown in Figure 20 B, thereby all maintenance bar 157a upwards promote and keep this group wafer W.Subsequently, all maintenance bar 145a are transformed into the first substrate hold mode Q1, keep the lifter 157 of this group wafer W to descend then, are used for accepting this group wafer W fully by lifter 157.
In this embodiment, lifter 157 is in one group of wafer W accepting on the chemical processing device 155 to handle in batch process part 147.Lifter 157 is sent to the conveying mechanism 145 of first treatment region in one group of wafer W will handling on the deionized water cleaning device 153 in each cleaning unit 151.
Secondly, will narrate second treatment region 105.Second treatment region 105 comprises and is used for once cleaning and individual processing of wafers part 171 of a dry wafer W, the substrate frame 163 (being designated hereinafter simply as " substrate frame ") of second treatment region that is used to keep many wafer W and the conveying mechanism 167 that is used for once carrying one second treatment region of a wafer W between individual substrate processing section 171 and substrate frame 163.Below will narrate each part.
All substrate frame 163 are two shelfs that same structure is arranged that are arranged side by side near the delivery area.Distinguish this two shelf according to all wafer W that are placed on it.One of them shelf is the preliminary treatment substrate frame 164 that is used for keeping before the processing one group of wafer W in individual substrate processing section 171.Another shelf is to be used for handling in individual substrate processing section 171 the reprocessing substrate frame 165 that keeps one group of wafer W afterwards.
Consult Figure 21.Figure 21 A is the plane graph of preliminary treatment substrate frame 164.Figure 21 B is the front view of preliminary treatment substrate frame 164.Reprocessing substrate frame 165 has same structure with preliminary treatment substrate frame 164, and saves its narration.Two couples of keeper 164b that preliminary treatment substrate frame 164 has pedestal 164a and banks up mutually in two-layer.All keeper 164b have a plurality of horizontal grooves that form in their interior surface opposing.By the relative edge of each wafer W of engagement in all grooves, keeper 164b supports to be in many wafer W in the horizontal attitude.In this embodiment, each keeper 164b forms 25 grooves, thereby two groups of keeper 164b can keep 50 wafer W in two-layer.This is the twice of the quantity (promptly 25) of the wafer W that all keep of the conveying mechanism 175 (following will the narration) of delivery area.Thereby preliminary treatment substrate frame 164 can keep the quantity corresponding to the wafer W of the twice struck capacity of the conveying mechanism 175 of delivery area.
The conveying mechanism 167 of second treatment region has vertical movable pedestal 168 and mutually independent driven two hinged manipulator 169a and the 169b that extend from pedestal 168.Manipulator 169a that each is hinged and 169b have a pair of upper and lower U-shaped keeping arm 170a and the 170b of the far-end that is connected in it, and each manipulator is used for once keeping a wafer W. All keeping arm 170a and 170b can extend individually mutually, withdraw and rotate.And all keeping arm 170a and 170b can synchronously move mutually.
In this embodiment, carry out before the processing in individual substrate processing section, wherein a keeping arm 170a once only keeps a wafer W.Carry out after the processing in individual substrate processing section 171, other keeping arm 170b once only keeps a wafer W.In this mode, all keeping arm 170a and 170b have all independent function of all wafer W that are used for remaining on different conditions.That is, keeping arm 170a only meshes the conveying from preliminary treatment substrate frame 164 to individual substrate processing section 171, and keeping arm 170b is only meshing to the conveying of reprocessing substrate frame 165 from individual substrate processing section 171.
Individual substrate processing section 171 comprises that being arranged on two arranges two-layer four the interior processing units 172 of neutralization.
Consult Figure 22.Figure 22 is the schematic isometric of each processing unit 172.Processing unit 172 comprise a wafer W that is used for remaining in horizontal attitude substrate keeper 173a, be used to rotate the motor 173b of substrate keeper 173a, movably be arranged on and be used on the wafer W clean solution is sent to the nozzle 173c of front surface of wafer W and the back washer jet 173d that is used for clean solution is sent to the rear surface of wafer W.In this embodiment, back washer jet 173d is arranged in the position relative with the edge, rear surface of wafer W, is used for the especially marginal zone of the rear surface of clean wafer W.Around wafer W, be used to prevent the diffusion of clean solution by a cup shell (not shown).Unshowned blower unit is arranged on the wafer W, is used for the downward clean gas of blowing-out in the surface of wafer W.
Consult Figure 10 and 15 once more.Delivery area 107 has the conveying mechanism 175 that is arranged on delivery area wherein.This conveying mechanism 175 comprise level transmission device 175a, be installed in pedestal 175b on the horizontal transmission device 175a, with respect to vertical movable elevating lever 175c of pedestal 175b and the hinged manipulator 176 that is connected in the upper end of elevating lever 175c.The guide rod 177b of the motion path of the horizontal transmission device 175a of screw shaft 177a and formation is placed with from storage area 101 and extends to first treatment region 103.Hinged manipulator 176 has the conveying arm 176a at its far-end.Conveying arm 176a comprises vertically disposed 25 handle shape part 176b, and each handle shape has partly that parallel, horizontal extends is used for remaining in two keepers of many wafer W of horizontal attitude.Conveying arm 176a can extend, withdraws and rotate with respect to elevating lever 175c, and pedestal 175b moves both vertically relatively.
Pulled down the lid 113 that is placed on the whole container F on the layer 121 by shutter member 135 after, the conveying mechanism 175 of delivery area makes conveying arm 176a carry out the admission passage mouth.Then, whole one group of wafer W are packed into whole container F or take out one group of wafer from whole container F.The conveying mechanism 175 of delivery area also works, to take out one group of wafer on the preliminary treatment of the substrate frame 143 that whole one group of wafer W is contained in first treatment region 103 and second treatment region 105 and reprocessing substrate frame 164 and 165 and from those.
Narrate the example of the work of substrate processing equipment with above structure hereinafter with reference to Figure 23.
(step S101) is transported to second treatment region with wafer W from storage area.
The whole container F that one group of wafer W wanting processed will be deposited by integral body container transport mechanism 125 is transported to layer 121 from shelf 119.The whole container F that is placed on the layer 121 makes lid 113 be removed by shutter member 135 after sliding motion.The conveying mechanism 175 of delivery area takes out from whole container F by the passway all should organize wafer W, and will all should organize wafer W and be transported to preliminary treatment substrate frame 164.
After the conveying mechanism 175 of delivery area took out this group wafer W from whole container F, shutter member 135 forward and move upward being fitted into the passway, and connected lid 113 and be fixed in the housing 111 of whole container F.
(step S102) be wafer W of single treatment in second treatment region.
The keeping arm 170a of the conveying mechanism of second treatment region is transported to one of them processing unit 172 from preliminary treatment substrate frame 164 with a substrate W.
When in processing unit 172 wafer W being finished predetermined processing, the keeping arm 170b of the conveying mechanism 167 of second treatment region is transported to reprocessing substrate frame 165 with wafer W from processing unit 172.
(step S103) is transported to first treatment region with wafer W from second treatment region.
The conveying mechanism 175 of delivery area is obtained all from reprocessing substrate frame 165 should organize wafer W, and whole this group wafer W was sent to the substrate frame 143 of first treatment region.
(step S104) integrally handles all wafer W in first treatment region.
At first, substrate frame 143 is rotated around vertical axis.Subsequently, the horizontal axis P that supports pedestal 143a to be centered around its proximal end pivots, to take perpendicular attitude.Along with this motion, 25 wafer W that kept by keeper 143b also are pivoted to perpendicular attitude from horizontal attitude.(in following operation narration, wafer is called wafer set W ").
And impeller 144 is accepted a different wafer set W from substrate frame 143 again.Along with putting between the wafer set that has been kept by conveying mechanism 145, impeller 144 is sent to conveying mechanism 145 with this different wafer set W.Its result, the spacing between all wafer W that kept by conveying mechanism 145 are changed to being placed on half of spacing between all wafer W on the substrate frame 143.
Keep the conveying mechanism 145 of this wafer set W to be moved horizontally to position on one of them chemically cleaning device 155 that its mid-riser 157 is in the next door.
Keep the lifter 157 of this group wafer W to drop in the chemical case of the chemical solution of depositing chemically cleaning device 155.This group wafer W integrally is immersed in the chemical solution.Thereby, on this group wafer W, integrally carry out chemically cleaning and handle.
When finishing predetermined chemically cleaning processing, lifter 157 moves upward, and is pulled upwardly this group wafer W from chemical case.Then, lifter 157 horizontal movements and dropping among the deionization water tank 153a.Thereby, on this group wafer W, integrally carry out the deionized water clean.
When finishing clean, lifter 157 moves upward, and is pulled upwardly this group wafer W from deionization water tank 153a.The lifter 157 straight positions that move upward on the deionized water cleaning device 153 are used for this group wafer W is sent to the conveying mechanism 145 of first treatment region.
The position on the drying unit 149 is arrived in conveying mechanism 145 horizontal movements.The slip lid 149b of drying unit 149 slides, and the impeller 149d of drier is from the moved upward inside of drying receptacle 149a.Impeller 149d generally keeps this group wafer W, and descends once more and be sent to rotation keeper 149c should organize wafer W.Impeller 149d is withdrawn into the bottom of drying receptacle 149a.Slip lid 149b slides to close the opening of drying receptacle 149a.Thereby, carried out predetermined dried, should organize wafer W simultaneously and rotate into perpendicular attitude.
When finishing dried, open slip lid 149b.Impeller 149d integrally accepts this group wafer W from rotating keeper 149c, and moves upward will organize the conveying mechanism 145 that wafer W is sent to first treatment region.
The complement mark of dried the end of the batch process of this group wafer W in first treatment region 103.Then, transmit this group wafer W with opposite order, from the conveying mechanism 145 of first treatment region to impeller 144, and from impeller 144 to substrate frame 143.In the time should organizing wafer W from the conveying mechanism 145 of first treatment region and be sent to impeller 144, the spacing between all wafer W changes to the spacing between all wafer W that are placed on the substrate frame 143 from half spacing.
(step S 105) are transported to storage area with wafer from first treatment region.
The conveying mechanism 175 of delivery area is integrally accepted this group wafer W from the substrate frame 143 of first treatment region 103, and horizontal movement is to storage area 101.At this moment, in advance will whole container F be placed on layers 121, and pulled down the lid 113 of whole container F by shutter member.Conveying mechanism 175 will be organized wafer W and integrally pack in the whole container F by the passway of partition wall 131a.
Subsequently, shutter member 135 upwards and travel forward being fitted into the passway, and connects lid 113 and be fixed in the housing 111 of whole container F.
The substrate processing equipment in embodiment 3 as previously discussed has first treatment region 103 and second treatment region 105, and delivery area 107 can selectively be transported to wafer W first treatment region 103 and second treatment region 105.Thereby, can handle wafer W with the batch processing mode that is used for integrally handling many wafer W with individual substrate processing mode that is used for a wafer W of single treatment.
In this embodiment, first treatment region 103 and second treatment region 105 both be configured to carry out the clean of wafer W.This provides the better quality of handling (result), guarantees the splendid output that chip cleaning is handled simultaneously.
Each processing unit 172 in second treatment region 105 of a wafer W of single treatment has back cleaning nozzle 173d (Figure 22).Like this, can handle the part (for example marginal zone of the rear surface of wafer W) of each wafer W.Second processing unit 105 can only apply desired clean to desired part when whole wafer W of cleaning.This has improved the output of second treatment region 105.
Especially, second treatment region 105 has preliminary treatment substrate frame 164 and the reprocessing substrate frame 165 that is provided with respectively.Each shelf can keep the quantity corresponding to the crystal W of the twice of the quantity of the wafer W that is kept by conveying arm 176a.Thereby the conveying mechanism 175 of delivery area can be transported to one group of wafer W continuously second treatment region 105 and carry one group of wafer from second treatment region, further improves to impel transfer efficiency.This structure can also be avoided the pollution between wafer W, and the wafer W of for example handling is polluted by wafer W to be processed.
Individual wafer treatment region 171 comprises four processing units, to have bigger processing capacity.Because these processing units 172 are arranged among two rows and in two-layer, avoid the increase of floor space.
Because the long side along substrate processing equipment is provided with first treatment region 103, second treatment region 105 and storage area 101 according to the order of sequence, therefore dwindled floor space.In a side of storage area 101 occasion of first treatment region 103 and second treatment region 105 is set,, makes it be difficult to dwindle floor space according to forming a dead angle by the difference between the occupied area of first treatment region 103 and second treatment region 105.
The whole container F of using seal style is as the container of depositing wafer W, thereby wafer W can not be by the environmental air pollution around whole container F.Seal each whole container F by the higher reliability of latch mechanism 117 usefulness that is provided with for lid 113.
For the storage area 101 of accepting whole container F setting is convenient to control whole container F.For example, can be easy to control a plurality of whole container F that leaves in the storage area 101, be used for first in first out.And, carry arm 126a by means of whole container and whole container F can be placed on shelf 119 and the layer 121 and and remove whole container F from these shelfs and layer through the whole container transport mechanism 125 that is formed on breach K in shelf 119 and the layer 121.This feature allows storage area 101 to be of compact construction.
The sidewall 131 that forms around storage area 101 can make the surrounding air in the storage area 101 keep clean.Aspect in addition, partition wall 131 prevents that the surrounding air of storage area 101 from flowing to first treatment region 103, second treatment region 105 and delivery area 107.Like this, the wafer W of taking out from whole container F does not have contaminated.
The passway that is formed among the partition wall 131a that separates storage area 101 and delivery area 107 is closed by shutter member 135, flows into delivery area 107 with the surrounding air that prevents storage area 101.And, connect and pull down the lid of each whole container F by the shutter member 135 of the passway that opens and closes partition wall 131a.Thereby the inside of each whole container F only is open to delivery area 107.Therefore leave in the whole container F or not contaminated from the wafer W of wherein taking out or pack whole container F into.
Separating storage area 101 and supporting two apertures that form in the sidewall 131 of platform 109 to close, so that the surrounding air in the storage area 101 keeps clean by two shutter members 133.
In first treatment region 103, substrate frame 143 has the function that integrally changes one group of wafer W between horizontal attitude and perpendicular attitude.Therefore, 107 one group of wafer W of admitting can be sent to batch process part 147 from the delivery area in horizontal attitude, are used for handling in perpendicular attitude.
When between the conveying mechanism 145 of the impeller 144 and first treatment region, transmitting one group of wafer W, changed the spacing between all wafer W.Owing to can be increased in the quantity of the wafer W of integrally handling in the batch process part 147, therefore first treatment region 103 has higher productivity ratio.
Embodiment 4
Secondly will narrate embodiments of the invention 4.
Figure 24 is the schematic plan view of substrate processing equipment among the embodiment 4.Use identical label represent with embodiment 3 in identical part, and will be no longer to its narration.
Substrate processing equipment among the embodiment 4 comprise about the support platform 110 of all container C of supporting to be used to separately deposit many wafer W (promptly be called open flask, below be called " box " simply), be used for integrally handling many wafer W one first treatment region 103, be used for one second treatment region 105 of a wafer W of single treatment and be used in the delivery area 107 of supporting transfer wafers W between platform 110, first treatment region 103 and second treatment region 105.Each box C and support platform 110 correspond respectively to container and the container platform among the present invention.
As shown in figure 24, the side along first treatment region 103 is provided with second treatment region 105 and delivery area 107.To support platform 110 to be arranged on the side away from second treatment region 105 of delivery area 107.Therefore, delivery area 107 is set in the position of directly facing first treatment region 103, second treatment region 105 and support platform 110.The partition wall or the analog of isolation environment air are not set between delivery area 107 and support platform 110.
Support two box C that platform 110 keeps as 107 directions are provided with along the delivery area.Each box C deposit be in the horizontal attitude and be in many wafer W in the multilayer.Leave the surrounding air that the interior wafer W of box C is exposed to box C outside in.
In embodiment 4, opening box C also can be applicable to have the basic processing unit of first treatment region 103 and second treatment region 105.Can simplify substrate processing equipment by saving the structure that the is used for accommodation box C structure of the storage area 101 of embodiment 3 (promptly corresponding to).
The present invention is not limited to above-mentioned all embodiment, can followingly revise:
(1) in above-described embodiment 3 and 4, batch process part 147 and individual substrate processing section 171 are configured to carry out cleaning and dried, but this is not restrictive.For example, batch process district 147 can be configured to execute protection film lift-off processing.Individual substrate treatment region 171 can be configured to carry out etching and be shaped and handle.
In described example of operation, wafer W at first is transported to second treatment region 105, carries first treatment region 103 then.This order is not restricted.Can be according to the performed processing of wafer W order of preference freely.
(2) in above-described embodiment 3 and 4, each district of batch process district 147 and individual substrate treatment region 171 has a plurality of processing units.Only provided number of processing units, can suitably change number of processing units in way of example.Also can suitably change quantity and other numerical value of the wafer W that in narration, provides.
(3) in above-described embodiment 3, delivery area 107 be configured to wafer W be transported to the layer that is placed in the storage area 101 on 121 single whole container F and from this integral body container F transfer wafers.Replace, a plurality of layer 121 can be set, be used for that delivery area 107 outputs to a plurality of whole container F with wafer W and from these whole container F transfer wafers.This is transported to efficient storage area 101 and that carry from this district with raising.
(4) in above-described embodiment 3 and 4, use rotary dryer as drying unit 149.Replace, can drying crystal wafer W by means of wafer W is pulled upwardly the device that simultaneously IPA (isopropyl alcohol) is put on wafer W from deionized water.
Secondly will narrate embodiments of the invention 5.
Figure 25 is the schematic plan view of substrate processing equipment among the embodiment 5.With identical label represent with above all embodiment in identical part, and no longer to they the narration.
Substrate processing equipment among the embodiment 5 is designed to carry out the predetermined process of wafer, and comprises the storage area 201 that is used to admit whole container F, is used for one second treatment region 205 integrally handling one first treatment region 203 of many wafer W and be used for a wafer W of single treatment.Each whole container F is corresponding to the container among the present invention.
As shown in figure 25, first treatment region 203 and second treatment region 205 are set in the side of storage area 201.Therefore, storage area 201 is directly in the face of first treatment region 203 and second treatment region 205.
Consult Figure 26,27 and 28.Figure 26 is the plane graph of storage area 201.Figure 27 is the front view of shelf 219.Figure 28 is the end view that the part of the storage area 201 and first treatment region 203 is shown.The storage area 201 that is used to accept whole container F comprises the shelf 219 that is used to keep whole container F, first stand 221 of whole container F of first treatment region 203 is used to keep to come in and go out, three second stands 223 of whole container F of second treatment region 205 are used to keep to come in and go out, be used between the shelf 219 and first stand 221 carrying one first whole container transport mechanism 225 of whole container F, and be used for supporting platform 209, carry one second whole container transport mechanism 227 of whole container F between the shelf 219 and second stand 223.Storage area 201 have its periphery be provided with the inside of storage area 201 and the sidewall 231 of external environment condition seal isolation.In this explanation, storage area 201 and the sidewall 231 that first treatment region 203 separates are called partition wall 231a, and will deposit in and distinguish 201 sidewalls 231 that separate with second treatment region 205 and be called partition wall 231b.
First stand 221 is arranged near the first partition wall 231a, is used for once keeping a whole container F.First stand 221 is C shape (or channel shape) in plane graph, is used to allow whole container to carry arm 226a vertically by its central authorities.First stand 221 has can be towards and away from the slide mechanism 222 of first partition wall 231a motion in the laterally disposed of it.
This slide mechanism 222 is the screw conveyer mechanism form, first stand 221 that is used to move, and comprise and the screw shaft 222a and the unshowned motor of rotating screw bolt axle 222a back and forth that is used for of projection 221 engagements that form in a side of first stand 221.First stand 221 is corresponding to first among the present invention.
Be horizontally disposed with three second stands 223 along the second partition wall 231b, each layer is used for once keeping a whole container F.Each second stand 223 is C shape (or tunnel-shaped) in plane graph, is used to allow whole container to carry arm 228a vertically by its central authorities.Each second stand 223 have unshowned its be provided with down can be towards and away from the slide mechanism of the second partition wall 231b.This slide mechanism is screw conveyer mechanism as slide mechanism 222.Each second stand 223 is corresponding to second among the present invention.
As shown in figure 28, the first whole container transport mechanism 225 comprise horizontal transmission device 225a, be installed in pedestal 225b on the horizontal transmission device 225a, with respect to vertical movable lifter 225c of pedestal 225b and the hinged manipulator 226 that is connected in the upper end of elevating lever 225c.In storage area 201, screw shaft 229a and guide rod 229b are configured to extend between the shelf 219 and first treatment region 203 along shelf 219.Screw shaft 229a and guide rod 229b extend near the position first stand.Horizontal transmission device 225a is movable along these screw shafts 229a and guide rod 229b level.Hinged manipulator 226 have according to the order of sequence from its far-end plane graph, be essentially leg-of-mutton and be used for keeping the whole container of whole container F to carry arm 226a, be used for keeping whole container carry arm 226a at the rotating first connecting rod 226b of horizontal plane and the rotating second connecting rod 226c of horizontal plane that is used to keep first connecting rod 226b.Second connecting rod 226c is supported in upper end by elevating lever 225c, and this connecting rod is rotatable in horizontal plane.
Carrying arm 226a by the crooked whole container F of first connecting rod 226b and second connecting rod 226c can extend and withdrawal with respect to elevating lever 225c.Second connecting rod 226 also can rotate with respect to elevating lever 225c, carries arm 226a around elevating lever 225c rotation.When elevating lever 225c moves both vertically with respect to pedestal 225b and horizontal transmission device 225a during along screw shaft 229a horizontal movement, whole container F is carried arm 226a can freely move to position with respect to shelf 219 or layer 221.
When the first whole container transport mechanism 225 is placed on a whole container F on the shelf 219, keeps the whole container of whole container F to carry arm 226a and on a pair of receiver member 219b, descend.Along with whole container carry arm 226a between this is to receiver member 219b by the time, whole container F is carried arm 226a from whole container and is transferred on the shelf 219.On the contrary, when when a pair of receiver member 219b obtains a whole container F, whole container carry arm 226a from this to rising under the receiver member 219b.Pass through between this is to receiver member 219b along with whole container carries arm 226a, accept whole container F from shelf 219.
When the first whole container transport mechanism 225 is placed on first stand 221 with a whole container F or when first stand 221 is taken a whole container F, carries arm 226a as whole container in the situation of above-mentioned shelf 219 and can move.The first whole container transport mechanism 225 is corresponding to the 3rd conveying mechanism among the present invention.
The second whole container transport mechanism 227 has the same structure as the first whole container transport mechanism 225.Promptly, as marking in Figure 28 brace, the hinged manipulator 228 of elevating lever 227c that the second whole container transport mechanism 227 comprises horizontal transmission device 227a, be installed in pedestal 227b on the horizontal transmission device 227a, can move both vertically with respect to pedestal 227b and the upper end that is connected in elevating lever 227c.Hinged manipulator 226 has whole container and carries arm 228a, first connecting rod 228b and a second connecting rod 228c.Whole container carries arm 228a and can extend, withdraw and rotate with respect to elevating lever 227c, and can move both vertically with respect to pedestal 227b.
The screw shaft 230a and the guide rod 230b that form the transport path of the second whole container transport mechanism 227 are configured to extend along the side away from first treatment region 203 (or second treatment region 205) of shelf 219.Screw shaft 230a and guide rod 230b are from extending to the position with respect to second treatment region 205 with respect to the position of supporting platform 209.Thereby screw shaft 230a and guide rod 230b surpass the screw shaft 229a and the guide rod 229b of the transport path of the first whole container transport mechanism 225 that forms with respect to shelf 219.
The second whole container transport mechanism 227 is supporting to carry whole container F between platform 209, shelf 219 and second stand 223.When to supporting platform 209, shelf 219 and second stand 223 to transmit whole container F and when they accept whole container F, as in the situation of the first whole container F conveying mechanism 225 vertical movably.The second whole container transport mechanism 227 is corresponding to the 4th conveying mechanism among the present invention.
Four holes of formation on the sidewall 231 between storage area 201 and the support platform 209, in corresponding to the position of all whole container F of supporting to place on the platform 209.These holes are formed and are a bit larger tham whole container F, pass through to allow whole container F.Close these holes by four vertical movable valve plates 233.Only enter into that valve plate 233 just moves both vertically when supporting platform 209, to open these holes in the second whole container transport mechanism 227.Therefore, whole container carries arm 226a and can whole container F be transported to by these holes and support platform 209 and carry whole container F from this support platform.Usually, the inside of storage area 201 is by tight seal.
The first partition wall 231a forms unidimensional relatively with a whole container F basically first passage mouth in the position relative with the whole container F of placing on first stand 221.The wafer W that this first passage mouth allows to carry between the whole container F and first treatment region 203 is passed through.When having whole container F on first stand 221, do not close the first passage mouth by one first shutter member 235.
Consult Figure 29.Figure 29 is the stereogram of first shutter member 235.First shutter member 235 has and first through port projection of size much at one, so that be fitted into and block the first passage mouth.One first connector 235a of the latch mechanism 117 that first shutter member 235 is provided with on its central authorities have corresponding to the lid 113 of each container basically.The shape of connector 235a is confirmed as being used to being connected to form the pinion 117c of the part of latch mechanism 117, and when it is connected rotation pinion 117c.In this mode, lid 113 is locked in housing 111, and allows to pull down lid from housing 111.When lid 113 is formed into can remove from housing 111 time, first shutter member 235 remains on the lid 113 in this situation.First shutter member 235 is connected/dismantles and maintaining body with first with first shutter member that the first connector 235a corresponds respectively among the present invention.
Below will consult the operation of the concrete narration of Figure 30 about first shutter member 235 of opening and closing first passage mouth.Figure 30 is the end view that the operation of first shutter member 235 is shown.When placing a whole container F on first stand 221, whole container F is advanced with first stand 221, the lid of the whole container F that contacts with first shutter member of closing the first passage mouth of being used to move.At this moment, the first connector 235a operates in the latch mechanism 117 on the lid 113, and lid 113 is pulled down from housing 111, and keeps lid 113.Then, valve transmission device 239 descends, and withdrawal keeps first shutter member of lid 113 then.Therefore, the whole container F from first stand 221 is pulled down lid 113, by the first passage mouth towards inside that first treatment region 203 is opened whole container F.
When closing the first passage mouth, make to keep first shutter member 235 of lid 113 to rise and advance to be fitted into the first passage mouth.At this moment, the lid 113 that is kept by first shutter member 235 also is fitted in the aperture of housing 111 of the whole container F on first stand 221.The first connector 235a operable lock bolt mechanism 117 is used for lid 113 is fixed in housing 111.Like this, the first passage mouth is closed with lid 113 and is connected in whole container F once more.
The second partition wall 231b forms basically three second channel mouths with whole container F same size in all positions relative with all whole container F of placing on second stand 223.The wafer W that these second channel mouths allow to carry between the whole container F and second treatment region 205 is passed through.When having whole container F on second stand 223, do not close all second channel mouths by three second shutter members 236.
Secondly, will narrate first treatment region 203.First treatment region 203 comprises and is used for all wafer W are integrally carried one second conveying mechanism 241 that enters and shift out on first stand 221 the whole container F of placing, be used for one group of wafer W is sent to a substrate frame 143 first conveying mechanism 241 and accept one group of wafer from this mechanism, be used for to organize the impeller 244 that wafer W integrally is sent to substrate frame 143 and accepts this group wafer from this substrate frame, be used for to organize the conveying mechanism 145 that wafer W integrally is sent to projectile 244 and accepts one first treatment region of this group wafer from this projectile, and be used for this group wafer W be sent to conveying mechanism 145 and accept this group wafer from conveying mechanism 145 and integrally handle batch process district 147 in this group wafer W of perpendicular attitude.Substrate frame 143 has the another function of the attitude that is used for integrally changing this group wafer W between horizontal attitude and perpendicular attitude.The conveying mechanism 145 of first treatment region has the another function that is used to change the spacing between all wafer W.Below will narrate each part.
As shown in figure 30, first conveying mechanism 241 comprises being fixed in across the pedestal 241a in the first partition wall 231a position relative with first stand and being installed in the hinged manipulator 241b on the pedestal 241a, hinged manipulator 241b to have conveying arm 242 at its far-end.By hinged manipulator 241b drive transfer arm 242, to extend, to withdraw and to rotate with respect to pedestal 241a.Supporting arm 242 comprises all to handle shape spare 242a with parallel horizontally extending many wafers that are used for remaining in horizontal attitude (following be called in suitable place one group of wafer W) who is arranged in the multilayer.The number of plies of handle shape spare 242a is 25 layers in this embodiment preferably corresponding to the quantity that leaves the wafer W in each whole container F in.
After the lid 113 of having been pulled down the whole container F of placing by first shutter member 235 on first stand 221, first conveying mechanism 241 advances conveying arm 242 and enters the first passage mouth.Then, one group of wafer W is integrally packed into whole container F and take out one group of wafer from whole container F.Conveying arm 242 is rotatable, and the one group of wafer W that is used for being in horizontal attitude integrally is sent to the substrate frame 143 that is arranged on first conveying mechanism, 241 next doors or accepts one group of wafer from this substrate frame.
Secondly, will narrate second treatment region 205.Second treatment region 205 comprises one of all second stands 223 that is used for once a wafer W being packed into one second conveying mechanism 261 of going up the whole container F of placing and once transmitting a wafer from this integral body container F, be used for the conveying mechanism 267 that once a wafer W is sent to second conveying mechanism 261 and once accepts one second treatment region of a wafer from this mechanism, and be used for once cleaning and drying individual basic handling part 171 from a wafer W of conveying mechanism 267 acceptance of second treatment region.Below will narrate each part.
Consult Figure 31.Figure 31 is the end view of second conveying mechanism 261.The hinged manipulator 263 of elevating lever 262c that second conveying mechanism 261 comprises horizontal transmission device 262a, be installed in pedestal 262b on the horizontal transmission device 262a, can move both vertically with respect to pedestal 262b and the upper end that is connected in elevating lever 262c.Second treatment region 205 has and is arranged on screw shaft 265a and guide rod 265b in the position relative with storage area 201, that extend along the second partition wall 231b.These screw shafts 265a and guide rod 265b extend on the zone relative with three second stands 223.Horizontal transmission device 262a is movable along screw shaft 265a and guide rod 265b level.
Hinged manipulator 263 has the I shape keeping arm 263a that is used to keep a wafer W at its far-end.263 keeping arm 263a can extend, withdraw and rotate by hinged manipulator.And, can vertical and horizontal movement by horizontal transmission device 262a and elevating lever 262c keeping arm 263c.
Use above-described structure, second conveying mechanism 261 carries out following operation.At first, one of them second shutter member 236 is pulled down the lid 113 of a whole container F of placing on corresponding second stand 223.261 horizontal movements of second conveying mechanism are to the position relative with this integral body container F, and keeping arm 263a moves vertically to the height corresponding to a wafer W in whole container F.Keeping arm 263a advances and enters the second channel mouth, and arrives the position under the wafer W that leaves in the whole container F.Keeping arm 263a keeps this wafer W thereon.Then, keeping arm 263a withdrawal is to take out this wafer W from whole container F.In case taking-up wafer W, 261 horizontal movements of second conveying mechanism be to the position relative with the conveying mechanism 267 of second treatment region of following narration, and the wafer W of being taken is sent to the conveying mechanism 267 of second treatment region.
When the conveying mechanism 267 of second treatment region is accepted a wafer W, second conveying mechanism 261 delivers into a whole container F with this wafer W.
The conveying mechanism 267 of second treatment region have be installed on the vertical movable pedestal mutually separately by two of transmission hinged manipulators.Each hinged manipulator has the keeping arm 270a and the 270b of the far-end that is connected to it, and each keeping arm is used for wafer W of once-through operation.Keeping arm 270a and 270b are U-shaped, are used for easily wafer W being sent to I shape keeping arm 263a and accept wafer from this I shape keeping arm.Keeping arm 270a and 270b can extend individually mutually, withdraw and rotate.And keeping arm 270a and 270b can synchronously move both vertically mutually.
The conveying mechanism 267 of second treatment region once is sent to a wafer W first conveying mechanism 261 and once accepts a wafer from first conveying mechanism, and with pack into individual substrate treatment region 171 and take out wafer from this treatment region of wafer.
In this embodiment, a wherein keeping arm 270a of the conveying mechanism 267 of second treatment region carries out processing to it and ad hoc once keeps a wafer W in individual substrate treatment region 171.Another keeping arm 270b carries out processing to it and ad hoc once keeps a wafer W afterwards in individual basic handling part 171.In this mode, keeping arm 270a and 270b have independent function for the wafer W in the different conditions.
Individual substrate processing section 171 comprises four processing units 172 that are provided with in the four direction of the conveying mechanism 167 that centers on second processing section.
Narrate the example of the operation of substrate processing equipment with said structure with reference to Figure 32.
＜step S201〉from storage area wafer W is transported to second treatment region.
The whole container F that one group of wafer W to be processed will be deposited from shelf 219 by the second whole container transport mechanism 227 is transported to one of them second stand 223.After sliding, the whole container F that is placed on second stand 223 has by the lid of pulling down corresponding to second shutter member 236 of second stand 223 113.The keeping arm 263a of second conveying mechanism 261 once obtains a wafer W by the second channel mouth from whole container F.
Repeat this operation with after whole container F obtains whole wafers at second conveying mechanism 261, second shutter member 236 forward and move upward being fitted into the second channel mouth and connects lid 113 and be fixed in the housing 111 of whole container F.This has finished the work that wafer W is transported to second treatment region 205 from storage area 201.
All wafer W of once taking down a wafer from whole container F by second conveying mechanism 261 are sent to the conveying mechanism 267 of second treatment region from second conveying mechanism 261 by ground.Its keeping arm 270a that accepts each wafer W of conveying mechanism 267 usefulness of second treatment region is transported to a wherein processing unit 172 with this wafer W.
＜step S202〉wafer W of single treatment in second treatment region.
In processing unit 172, wafer is carried out predetermined processing.
＜step S203〉from second treatment region wafer W is transported to storage area.
When in processing unit 172 each wafer W having been finished predetermined processing, the conveying mechanism 167 of second treatment region is placed on wafer W on the keeping arm 270b, and from processing unit 172 transfer wafers W.
Second conveying mechanism 261 is accepted wafer W, and level moves rearwards to the position relative with second stand 223.The whole container F of in advance on second stand 223, having placed a sky, and pulled down the lid 113 of whole container F by second shutter member 236.Second conveying mechanism 261 should be organized ground of wafer W by the second channel mouth whole container F of packing into.In the time of in whole grooves 115 in all wafer W have been placed on whole container F, second shutter member 236 upwards and travel forward closing the second channel mouth, and connects lid 113 and be fixed in the housing 111 of whole container F.This has finished the work that wafer W is transported to storage area 201 from second treatment region 205.
＜step S204〉whole container F is transported to first stand from second stand.
The whole container F that the wafer W of having handled in second treatment region 205 will be left in the second whole container transport mechanism 227 is transported to shelf 219 from second stand 223.
After being placed on whole container F on the shelf 219, the first whole container transport mechanism 225 is transported to first stand 221 with whole container F from shelf 219 again.When whole container F was placed in first stand 221, first stand 221 slided towards the first partition wall 231a, was placed to first shutter member 235 with the lid 113 with whole container F to contact.
＜step S205〉from storage area wafer W is transported to first treatment region.
After taking out this group wafer W from whole container F, first shutter member 235 is fitted into the first passage mouth once more, is used for lid 111 is connected and is fixed in the housing 111 of whole container F.
First conveying mechanism 241 is placed on the wafer set W that still is in horizontal attitude that is taken on the substrate frame 143.This group wafer W of being placed is transported to one of them cleaning unit 151 by the conveying mechanism 145 and the lifter 157 of impeller 144, first treatment region.
＜step S206〉in first treatment region, integrally handle all wafer W.
In cleaning unit 151, should the group wafer W accept predetermined processing.Then, should organize wafer W and be transported to drying unit 149, to be dried therein.
＜step S207〉from first treatment region wafer W is transported to storage area.
This group wafer W that has stood a series of processing in batch process district 147 is transported to first conveying mechanism 241 by conveying mechanism 145, impeller 144 and the substrate frame 143 of delivery area.
First conveying mechanism 241 is accepted this group wafer, and plane of rotation is to first stand 221.At this moment, on first stand 221, place the whole container F of a sky, and pulled down the lid 113 of whole container F by first shutter member 235.First conveying mechanism 241 should be organized wafer W by the first passage mouth of partition wall 231a and integrally pack in the whole container F.
Subsequently, first shutter member 235 upwards and travel forward closing the first passage mouth, and connects lid 113 and be fixed in the housing 111 of whole container F.
The wafer W of handling will be contained in whole container transport mechanism of the first whole container transport mechanism 225 and second 227 in first treatment region 203 whole container F is transported to by shelf 219 from first stand 221 supports platform 209.
Aforesaid substrate processing equipment has first treatment region 203 and second treatment region 205 in embodiment 5, and can selectively wafer W be transported to first treatment region 203 and second treatment region 205 from storage area 201.Thereby wafer W can integrally be handled many wafer W and by individual substrate processing mode single treatment wafer W wherein by batch processing mode.
By means of storage area 201 transfer wafers W between first treatment region 203 and second treatment region 205.Wafer W never directly transmits between first treatment region 203 and second treatment region 205.Therefore, the master control of first treatment region 203 and second treatment region 205 does not require between this two treatment region and coordinates, but can control this two district individually.Can coordinate and control this two treatment region by the conveying that is controlled at the whole container F in the storage area 201.
As previously discussed, first treatment region 203 and second treatment region 205 are set in the side of storage area 201.This layout is convenient at transfer wafers W between the storage area 201 and first treatment region 203 and between the storage area 201 and second treatment region 205.
And, three second stands 223 are set are used for accepting whole container F thereon, so as between these the whole container F and second processing unit 205 transfer wafers W.This has realized the raising of the quality of the wafer W of being carried between second treatment region 205 and storage area 201.
The storage area 201 that has therein the shelf 219 that is provided with can hold many whole container F in mode easily.And, can lead to shelf 219 from opposite side, and whole container transport mechanism of the first whole container transport mechanism 225 and second 227 can be along the opposite side horizontal movement of shelf 219.Like this, first and second conveying mechanisms 225 and 227 can arrive shelf 219 effectively, and can the phase mutual interference.The first and second whole container transport mechanisms 225 and 227 can carry whole container F individually.
In this embodiment, first treatment region 203 and second treatment region 205 are configured for the clean of carrying out wafer W.This provides the better quality of handling (result), guarantees the very high output that chip cleaning is handled simultaneously.
Whole container F is placed on the shelf 219 and from this shelf obtains whole container F by carry arm 226a and 228a at all whole containers that vertically passes through between to receiver member 219b.This feature allows storage area 201 to be of compact construction.
Described equipment has the first partition wall 231a and the second partition wall 231b and is used for being closed in partition wall 231a and first and second shutter members 335 and 336 of first and second passwaies that 231b forms.These parts prevent that the surrounding air of storage area 201 from flowing to first treatment region 203 and second treatment region 205.Thereby the wafer that whole container F is taken out does not have contaminated.
Close the aperture that separates storage area 201 and support to form in the sidewall 231 of platform 209 by valve plate 233, to keep the surrounding air cleaning in the storage area 201.
Embodiment 6
Secondly will narrate embodiments of the invention 6.
Figure 33 is the schematic plan view of substrate processing equipment among the embodiment 6.Utilize same tag represent with above all embodiment in identical part, and no longer narrate them.
As shown in figure 33, as a side among the embodiment 5 first treatment region 203 and second treatment region 205 are set at storage area 201.But second treatment region 205 is than have width smaller in embodiment 5.Therefore, the quantity of second stand 223 is reduced to two in the storage area 201.
In second treatment region 205, the keeping arm 266a of second conveying mechanism 266 only can arrive the whole container F that is placed on each second stand 223 by the operation of hinged manipulator.Therefore, do not require that second conveying mechanism 266 is along the second partition wall 231b horizontal movement.
In this embodiment, second conveying mechanism 266 is used for wafer W is sent to the conveying mechanism 267 of second treatment region and accepts wafer from this mechanism perpendicular to the second partition wall 231b horizontal movement.
Individual wafer treatment region 171 have be arranged on two row in and all processing units 172 in two-layer.
Embodiment 6 as described above, and this substrate is handled to be provided with has less floor space.Second conveying mechanism 266 can save the structure that is used for along the second partition wall 231b horizontal movement.
The present invention is not limited to above-mentioned all embodiment, and following modification can be arranged:
(1) in the foregoing description 5 and 6, first treatment region 203 and second treatment region 205 are set in a side of storage area 201.The present invention is not limited to this layout.For example, first treatment region 203 can be relative mutually across storage area 201 with second treatment region 205.In this case, in a side of storage area 201 first treatment region 203 is set, and second treatment region 205 is set at opposite side.Also in this layout, storage area 201 can transmit wafer W easily between first and second treatment regions 203 and 205.
(2) in the foregoing description 5 and 6, carrying whole container F is the second whole container transport mechanism 227 to what support platform 209.Can change this layout, make the first whole container transport mechanism 225 that whole container F is transported to the support platform.In this case, the transport path of the first whole container transport mechanism 225 be along shelf 219 with a side layout of supporting that platform 209 is relative, and first stand 221 is arranged on the expanded range of shelf.The transport path of the second whole container transport mechanism 227 arranges that in a side relative with second treatment region 205 of shelf 219 second stand, 223 layouts are in an end or the opposite end of this transport path simultaneously.
(3) in the foregoing description 5 and 6, second treatment region 205 comprises the conveying mechanism 267 of second conveying mechanism 266 and second treatment region.This does not limit.For example, can save the conveying mechanism 267 of second treatment region, while second conveying mechanism 266 is transfer wafers W between the whole container F of putting on second stand 223 and individual substrate treatment region 171 directly.
Second conveying mechanism 266 is configured to once carry a wafer W, integrally carries many wafer W but can be modified as.
(4) in described example of operation, wafer is at first to be transported to second treatment region 205, is transported to first treatment region 203 then.This order is not restrictive.Can be according to the performed processing of wafer W order of preference freely.
(5) in the foregoing description 5, storage area 201 comprises one first stand 221 and a plurality of second stand 223, but this is not restrictive.For example, storage area 201 can comprise a plurality of first stands 221 and one second stand 223.
Secondly will narrate embodiments of the invention 7.
Figure 34 is the schematic plan view of the substrate processing equipment of embodiment 7.Use identical label represent with above all embodiment in identical part, and no longer to they the narration.
Substrate processing equipment among the embodiment 7 is designed to carry out the predetermined process of wafer W, and comprises the storage area 301 that is used to accept whole container F, is used for one second treatment region 305 integrally handling one first treatment region 303 of many wafer W and be used for a wafer W of single treatment.Each whole container is corresponding to the container among the present invention.
As shown in figure 34, second treatment region 305 is arranged on first treatment region 303 and forms between the support platform 309 (following will the narration) of a part of storage area 301.In other words, second treatment region 305 is arranged on the direction expanded range of the batch process part 147 that a part that forms first treatment region 303 wherein is set.Therefore, the side along substrate processing equipment is provided with first treatment region 303 and second treatment region 305.Storage area 301 in this embodiment in plane graph is and first treatment region 303 and second treatment region, 305 opposing L shapes.
Consult Figure 35,36 and 37.Figure 35 A is the plane graph of storage area 301.Figure 35 B is the front view of shelf 319.Figure 36 is the end view that all parts of the storage area 301 and first treatment region 303 are shown.Figure 37 is the end view of whole container transport mechanism 325.The storage area 301 that holds whole container F comprises the support platform 309 that is used to accept be supported at the whole container F of this substrate processing equipment, be used for when disposed thereon, supporting all shelfs 319 of a plurality of whole container F, be used to support one first stand 321 of the whole container F that enters from first treatment region 303, be used to support second stand 323 of the whole container F that enters from second treatment region 305, be used to transmit whole container F to support platform 309 and the 3rd layer 381 of accepting whole container F from this support platform, and be used for supporting platform 309, shelf 319 and the one the second and the 3rd layer 321, carry the whole container transport mechanism 325 of whole container F between 323 and 381.Storage area 301 has the sidewall 331 that the periphery in its zone (following be called in suitable place " storage area 310 ") except supporting platform 309 is provided with, with storage area 310 and external environment condition seal isolation.In this explanation, the sidewall 331 relative with first stand 321 is called one first partition wall 331a, the sidewall 331 relative with second stand 323 is called one second partition wall 331b.
At the laterally disposed support platform 309 of storage area 301, this can support two whole container F.Support platform 309 to support to be admitted to a whole container F of storage area 301 and a whole container F of taking out from storage area 301.Support platform 309 corresponding to the 3rd among the present invention.In supporting the direction of extending between the platform 309 and first treatment region 303, a plurality of shelfs 319 are set along the side away from second treatment region 305 of storage area 301.Thereby all shelfs 319 are relative with second treatment region 305.In this embodiment, along sidewall 331 away from a side of second treatment region 305 (this side in Figure 35 A mark " 331S " and at following will being called " sidewall 331S ") and be parallel to sidewall 331 in the direction of supporting to extend between the platform 309 and first treatment region 303 (promptly perpendicular to the first partition wall 331a sidewall 331) all shelfs 319 are set.
The a plurality of receiver member 319a that supported by sidewall 331S form shelf 319.Whole container F can be placed on the receiver member 319a of two adjacent levels, and the opposite end of whole container F is shelved on the receiver member 319a simultaneously.All shelfs 319 are arranged to four layers of vertical direction.The two-layer of below can keep horizontally disposed four whole container F separately.Two whole container F of two-layer each self-sustaining of top.Like this, all shelfs 319 can keep 12 whole container F together.
Spacing between all receiver member 319a is carried the width of arm 326a greater than the whole container of whole container transport mechanism 235 and less than the width of whole container F.Therefore, whole container carries arm 326a and can vertically pass through between each is to receiver member 319b.
In the unappropriated space that one first stand 321 is installed near first treatment region 303 the shelf 319 and side direction forms.First stand 321 is C shape (or channel shape) in plane graph, to be formed for allowing whole container to carry the central gap that arm 326a vertically passes through betwixt.Support first stand 321 by sidewall 331S by slide mechanism 322, so that movable with respect to sidewall 331S level.First stand 321 once keep coming in and going out a whole container F of first treatment region 303, and should the integral body container F towards first partition wall 331a motion with leave this wall motion.
Slide mechanism 322 is the form of screw conveyer mechanism, first stand 321 that is used to move, and comprise and the screw shaft 322b and the unshowned motor that is used to add rotating screw bolt axle 322b of the protruding 321a engagement that on the side of first stand 321, forms.
First stand 321 also has the function of shelf 319.For example, when only operating second treatment region 305 and storage area 301, first stand 321 can be used as shelf 319.First stand 321 is corresponding to first among the present invention.
Two second stands 323 are vertically set on across the relative position of the transport path of whole container transport mechanism 325 and shelf 319, and relative with the second partition wall 331b.As second stand 323 is C shape (or channel shape) in plane graph, to be formed for allowing whole container F to carry the central gap that arm 326a vertically passes through therein.Each second stand 323 is supported by slide mechanism 324 by near the sidewall the second partition wall 331b 331.Thereby, but all second stands 323 are with respect to sidewall 331 horizontal movement individually mutually.As slide mechanism 322, slide mechanism 324 is screw conveyer mechanisms.Each second stand 223 is corresponding to second among the present invention.
In the unappropriated space that one the 3rd stand 381 is installed near the shelf of supporting the platform 309 319 and side direction forms.The 3rd stand 381 is C shape (or channel shape) in plane graph, to be formed for allowing whole container to carry the central gap that arm 326a vertically passes through betwixt.The 3rd stand 381 is supported by slide mechanism 322 by sidewall 331S, so that can move both vertically with respect to sidewall 331S.The 3rd stand 381 once transmits a whole container F and arrives support platform 309 and once accept a whole container from this support platform.In two whole container F of placing on supporting platform, only the whole container F near the 3rd stand 381 is transmitted or accepts.
Be described in the operation of carrying whole container F between the 3rd stand 381 and the support platform 309 simply with reference to Figure 35.As shown in figure 35, support that platform 309 has the L shaped whole container control arm 391 that is used to keep whole container F.This arm 391 can be towards and away from 381 motions of the 3rd stand by unshowned transmission mechanism.During position under the 3rd stand 381 drops to whole container control arm 391, keep the arm 391 of whole container F to move forward to the breach of the 3rd stand 381.Then, the 3rd stand 381 rises on the whole container control arm 391.Thereby whole container F is transferred to the 3rd stand 381 from whole container control arm 391.After whole container F was transferred, whole container control arm 391 is withdrawn into supported platform 309.
As shown in figure 37, the hinged manipulator 326 of the elevating lever 325c that comprises horizontal transmission device 325a, be installed in pedestal 325b on the horizontal transmission device 325a, can move both vertically with respect to pedestal 325b of whole container transport mechanism 325 and the upper end that is connected in elevating lever 325c.Storage area 301 have be arranged on basically it central authorities and the screw shaft 329a and the guide rod 329b that extend along shelf 319.Screw shaft 329a and guide rod 329b have and are positioned near its opposite end of supporting the platform 309 and first treatment region 303.Horizontal transmission device 325a is movable along screw shaft 32a and guide rod 329b level.Hinged manipulator 326 sequentially has from its far-end and is essentially triangle is used to keep the whole container of whole container F to carry arm 326a, is used to the rotating second connecting rod 326c in horizontal plane that keeps whole container to carry the rotating first connecting rod 326b in horizontal plane of arm 326a and be used to keep first connecting rod 326b plane graph.Second connecting rod 326c supports in horizontal plane rotatable by the upper end of elevating lever 325c.
Crooked whole container by first connecting rod 326b and second connecting rod 326c carries arm 326b and can extend and withdrawal with respect to elevating lever 325c.Carrying arm 326a by second connecting rod 326c with respect to the whole container of the rotation of elevating lever 325c can rotate around elevating lever 325c.Along with horizontal transmission device 325a along screw shaft 329a horizontal movement, whole container carries arm 326a and can freely move to and the position of supporting that platform 309, shelf 319, first stand 321, second stand 323 are relative with the 3rd stand 381.In the position relative with supporting platform 309, whole container carries the whole container F that arm 326a only can arrive to be had on the expanded range of placing on the platform 309 all whole container F, at transport path supporting.
When whole container transport mechanism 325 is placed on whole container F on the shelf 319, keeps the whole container of whole container F to carry arm 326a and between all receiver member 319a, descend.Pass through between all receiver member 319a along with whole container carries arm 326a, whole container F is carried arm 326a from whole container and is transferred to shelf 319a.On the contrary, when when shelf 319 is obtained whole container F downwards, whole container carries arm 326a and rises between all receiver member 319a that keep whole container F.Pass through between all receiver member 319a along with whole container carries arm 326a, accept whole container F from shelf 319.
When whole container F conveying mechanism 325 arrived first stand 321, second stand 323, the 3rd stand 381 or supports platform 309, whole container carried arm 326a and can rise, as in the situation of above-mentioned shelf 319.Integral body container transport mechanism 325 is corresponding to the conveying device among the present invention.
Be arranged on the sidewall of supporting between platform 309 and the storage area 310 131 be formed on support platform 309 on two apertures in the relative position of the whole container F of placing.One of them aperture is formed greatlyyer than another aperture, enters to allow whole container control arm 391.These apertures are formed and are a bit larger tham whole container F, pass through to allow whole container F.Close these apertures by two vertical movable valve plates 333.These valve plates 333 are only supporting to carry whole container F to move both vertically to open these apertures between platform 309 and whole container transport mechanism 325 or the 3rd stand 381.Usually, shutter member 333 is closed these apertures, with the inside of sealing storage area 310.
The first partition wall 331a forms the single first passage mouth with the basic identical size of whole container F in the position relative with the whole container F of placing on first stand 321.The wafer W that the first passage mouth allows to carry between the whole container F and first treatment region 303 is passed through.When having whole container F on first stand 321, do not close the first passage mouth by one first shutter member 335.
Consult Figure 38.Figure 38 is the stereogram of first shutter member 335.First shutter member 335 has almost the projection with first passage mouth same size, to be fitted into and to block the first passage mouth.One first connector 335a of the latch mechanism 117 that first shutter member 335 is provided with on its central authorities have corresponding to the lid 113 at each container basically.The first connector 335a is formed the pinion 117c that is connected to form to the part of latch mechanism 117, and when it is connected rotation pinion 118c.In this mode, lid 113 is locked to housing 111, and when allowing from housing 111 dismountings, first shutter member 335 remains in the lid 113 of this state.First shutter member 335 is connected/dismantles and maintaining body with first with the shutter member that the first connector 335a corresponds respectively among the present invention.
Be used to open and close the operation of first shutter member 335 of first passage mouth hereinafter with reference to the concrete narration of Figure 39.Figure 39 is the end view that the operation of first shutter member 335 is shown.When a whole container F was placed on first stand 321, whole container F was advanced with first stand 121, so that make lid 113 motions of the whole container F that contacts with first shutter member 335 of closing the first passage mouth.At this moment, the latch mechanism 117 on the first connector 335a operation lid 113 can be dismantled lid 113 from housing 111, and is kept lid 113.Then, first shutter member 135 that valve transmission device 339 descends and withdrawal keeps lid 113 then.Therefore, the whole container F from first stand 321 is pulled down lid 113, by the first passage mouth towards inside that first treatment region 303 is opened whole container F.
When closing the first passage mouth, keep first shutter member 135 of lid 113 to rise and advance, to be fitted into the first passage mouth.At this moment, the lid 113 that is kept by first shutter member 135 also is fitted into the aperture of the housing of the whole container F of placing on first stand 321.The first connector 335a operated lock bolt mechanism 117 is used for lid 113 is fixed in housing 111.Thereby, closed the first passage mouth and lid 113 is connected in whole container F once more.
The second partition wall 331b forms two second channel mouths with the substantially the same size of whole container F in the position relative with the whole container F of placing on second stand 323.The wafer W that the second channel mouth allows to carry between the whole container F and second treatment region 305 is passed through.Do not close the second channel mouth by two second shutter members 336 when on second stand 323, having whole container F.
L shaped arm 338 is provided, is used for to be connected in one of two second shutter members 336 and separately from a shutter member.Unshowned valve transmission device is transmission arm 338 flatly and vertically.Thereby arm 338 is different from the arm 337 of supporting first shutter member 335 regularly.Each second shutter member 336 is connected/dismantles and maintaining body with second with the shutter member that the second connector 336a corresponds respectively among the present invention.
Be used to open and close the respectively operation of second shutter member 336 of second channel mouth hereinafter with reference to Figure 40 narration.Figure 40 is the end view that the operation of second shutter member 336 is shown.By unshowned valve transmission device transmission arm 338, be used for combining with a shutter member 336 (being the last shutter member 336 of Figure 40) wherein.In conjunction with the withdrawal of second shutter member 336, descend then.Thereby pull down the lid 113 of whole container F, the inside of second treatment region 305 being opened whole container F by the second channel mouth.Two second channel mouths are not opened simultaneously.
Secondly, will narrate first treatment region 303.First treatment region 303 comprises one first conveying mechanism 341 that is used for integrally all wafer W being brought in the whole container F of placing on first stand 321 and takes out all wafers from this integral body container F, be used to arrive/leave the substrate frame 143 that first conveying mechanism 341 transmitted and accepted one group of wafer W, be used to arrive/leave the impeller 144 that substrate frame 143 transmitted and accepted this group wafer W, be used to arrive/leave the conveying mechanism 145 that impeller 144 integrally transmitted and accepted one first treatment region of this group wafer W, and be used for arriving/leave conveying mechanism 145 transmission and accept this group wafer W and the vertical batch processing section 147 of supporting this group wafer W of attitude of processing integrally.Substrate frame 143 has the another function of the attitude that is used for integrally changing this group wafer W between horizontal attitude and perpendicular attitude.The conveying mechanism 145 of first treatment region has the another function that is used to change the spacing between all wafer W.Below will narrate each part.
First conveying mechanism 341 comprises the pedestal 341a that is fixed in across first a partition wall 331a position relative with first stand 321, is installed in the hinged manipulator 341b on the pedestal 341a.Hinged mechanical 341b has the conveying arm 342 at its far-end.By hinged manipulator 341b drive transfer arm 342, be used for extending, withdrawing and rotation with respect to pedestal 341a.Conveying arm 342 comprises all to handle shape spare 342a of many wafer W that are used for remaining in horizontal attitude that the horizontal parallel that is arranged in the multilayer extends (following be called in suitable place one group of wafer W).The number of plies of all handle shape spare 342a is 25 layers preferably corresponding to the quantity of the wafer W of depositing in each whole container F in this embodiment.
As shown in figure 39, after the lid 113 of being pulled down the whole container F of placing on first stand 321 by first valve 335, first conveying mechanism 341 advances conveying arm 342 and enters the first passage mouth.Then, one group of wafer W integrally is brought into whole container F or takes out from whole container F.Conveying arm 342 is rotatable, is used to arrive/leave one group of wafer W that the substrate frame 143 that is provided with on first conveying mechanism, 341 next doors integrally transmitted or accepted to be in horizontal attitude.
Secondly, will narrate second treatment region 305.Second treatment region 305 comprise be used for once a wafer W being brought in the whole container F of placing on one of them second stand and from this integral body container F once take out a wafer one second conveying mechanism 361, be used to arrive/leave that second conveying mechanism 361 once transmits and the conveying mechanism 367 and being used for of accepting one second treatment region of a wafer W cleans each time and individual processing of wafers part 171 of a dry wafer W of accepting from the conveying mechanism 367 of second treatment region.Below will narrate each part.
Shown in Figure 34 and 40, second conveying mechanism 361 comprises a movable base 362 and is installed in two hinged manipulator 363a and 363b on the upper end of movable base 362.Manipulator 363a that each is hinged and 363b have the U-shaped keeping arm 364a and the 364b that are used to keep individual wafer W at its far-end.
Each keeping arm 364a or 364b can extend individually mutually, withdraw and rotate by hinged manipulator 363a or 363b.And, keeping arm 364a and 364b by movable base 362 mutually mutually synchronization move both vertically.
Second conveying mechanism 361 is once carried a wafer W between the whole container F of placing on second stand 323 and individual substrate processing section 171.
In this embodiment, before in individual substrate processing section 171, handling, the keeping arm 364a of second conveying mechanism 361 and 364b one (for example keeping arm 364a) only keeps a wafer W, and another keeping arm (for example keeping arm 364b) only keeps a wafer W after handling in individual substrate processing section 171.In this mode, use the wafer W under different keeping arm 364a and the 364b maintenance different conditions.
Especially, the operation of second conveying mechanism 361 is as described below.At first, one of them of all second shutter members 336 pulled down the lid 113 of the whole container F of placing on a corresponding stand of second stand 323.Keeping arm 364a rotates and moves vertically to the position relative with this integral body container F.Keeping arm 364a advances and enters the second channel mouth then, arrives the position under the wafer W that deposits in the whole container F.Keeping arm 363a withdrawal is to take out this wafer W from whole container F.In case take out this wafer W, second conveying mechanism 361 just rotates and carries out other motion, is used for this wafer W is delivered to individual substrate processing section 171.
When from wafer W of individual substrate processing section 171 conveyings, use keeping arm 364b.The wafer W that is transferred is turned back to the whole container F of on second stand 323, placing.
Individual substrate processing section 171 have be arranged on two row in and four processing units 172 in two-layer.Processing unit 172 is set up a side of second conveying mechanism 361.
Narrate the example of the operation of substrate processing equipment with said structure hereinafter with reference to Figure 41.
＜step S301〉wafer W is transported to second treatment region from storage area.
Withdraw, descend then with arm 338 second shutter members 336 with the lid 113 that keeps whole container F that combine.This has opened the second channel mouth and has pulled down lid 113.
Second conveying mechanism 361 advances keeping arm 364a and enters whole container F, the wafer W of taking once by the second channel mouth.Will be from each wafer W that whole container F is taken one of them processing unit 172 of packing into.
After second conveying mechanism 361 repeats to take from whole container F this operations of whole wafer W, second shutter member 336 forward and move upward, being fitted into the second channel mouth, and the housing 111 that lid 113 is connected and is fixed in whole container F.This has finished the work that wafer W is transported to second treatment region 305 from storage area 301.
＜step S302〉wafer W of single treatment in second treatment region.
In processing unit 172, carry out predetermined processing for wafer W.
＜step S303〉wafer W is transported to storage area from second treatment region.
When in processing unit 172 each wafer W being finished predetermined process, second conveying mechanism 361 is placed on wafer W on the keeping arm 364b, and from processing unit 172 transfer wafers W.
Second conveying mechanism 361 turns to the position relative with second stand 323.The whole container F of in advance having incited somebody to action is placed on one of them second stand 323, and the lid 113 of having been pulled down whole container F by second shutter member 336.Second conveying mechanism 361 once will be organized the whole container F of packing in the wafer W by the second channel mouth.When all wafer W having been put into the whole groove 115 of whole container F, second shutter member 236 upwards and travel forward closing the second channel mouth, and connects lid 113 and be fixed in the housing 111 of whole container F.This has finished the work that wafer W is transported to storage area 301 from treatment region 305.
＜step S304〉whole container F is transported to the 3rd stand from second stand.
The whole container that the wafer W of having handled in second treatment region 305 will be left in integral body container transport mechanism 325 is transported to first stand 321 from second stand 323.
When whole container F had been placed on first stand 321, first stand 321 slided towards the first partition wall 331a, was used for lid 113 with whole container F and was placed to first shutter member 335 and contacts.
＜step S305〉wafer W is transported to first treatment region from storage area.
335 withdrawals of first shutter member and decline are pulled down lid 113 with the whole container F of placing from first stand, and are opened the first passage mouth.The keeping arm 342 of first conveying mechanism 341 integrally takes out all wafer W by the second channel mouth from whole container F.
After taking out this group wafer W from whole container F, the first passage mouth of once more first shutter member 335 being packed into is to connect lid 113 and be fixed in the housing 111 of whole container F.
This obtained group wafer W that first conveying mechanism 341 will still remain in the horizontal attitude is placed on the substrate frame 143.Conveying mechanism 145 and lifter 157 by impeller 144, first treatment region are transported to one of them cleaning unit 151 with this group wafer W of being placed.
＜step S306〉in first treatment region, integrally handle all wafer W.
In cleaning unit 151, should the group wafer W accept predetermined processing.Then, should organize wafer W and be transported to drying unit 149, with dry therein.
＜step S307〉wafer W is transported to storage area from first treatment region.
This group wafer W that will experience a series of processing in batch process part 147 is transported to first conveying mechanism 341 by conveying mechanism 145, impeller 144 and the substrate frame 143 of delivery area.
First conveying mechanism 341 is accepted this group wafer, and rotates to face first stand 321.At this moment, on first stand 321, placed the whole container F of a sky, and the lid 113 of having pulled down whole container F by first shutter member 335.First conveying mechanism 341 integrally should be organized the wafer W whole container F of packing into by the first passage mouth of partition wall 331a.
Subsequently, first shutter member 335 upwards and travel forward closing the first passage mouth, and connects a housing 111 that is fixed in whole container F with lid 113.
The wafer W of handling will be contained in integral body container transport mechanism 325 in first treatment region 303 whole container F is transported to support platform 309 from first stand 321.
Substrate processing equipment in embodiment 7 has first treatment region 303 and second treatment region 305 as previously discussed, and can selectively wafer W be transported to first treatment region 303 and second treatment region 305 from storage area 301.Like this, can be to be used for integrally handling the batch processing mode and one individual substrate processing mode processing wafer that is used for all wafer W of single treatment of many wafer W.
By means of storage area 301 can be between first treatment region 303 and second treatment region 305 transfer wafers W.Never direct transfer wafers W between first treatment region 303 and second treatment region 305.Therefore, do not require the master control of coordinating first treatment region 303 and second treatment region 305 at two treatment regions, but can control these districts individually.This two treatment region can be coordinated and control to conveying by the whole container F of control in storage area 301.
Such as described, first treatment region 303 and second treatment region 305 are set in the side of storage area 301.This layout is convenient to transmitting wafer W between the storage area 301 and first treatment region 303 and between the storage area 301 and second treatment region 305.
Between first treatment region 303 and support platform 309, second treatment region 305 is set.The situation that first treatment region 303 and second treatment region 305 is set with a side at storage area 301 relatively, this layout has realized the shortening of the short side of substrate processing equipment.This layout can also be eliminated the dead angle, to reduce floor space.
And, vertically provide and two second stands 323 have been realized the quality of the wafer W of being carried between second treatment region 305 and storage area 301 raising is set, stoped the increase of floor space simultaneously.
At first treatment region 303 with support between the platform 309 that to allow to deposit in district 301 compacter with the shelf 319 that is provided with in the position relative with second treatment region 305.
Side at the transport path of whole container transport mechanism 325 is provided with shelf 319 and at opposite side second stand 323 is set, and is provided with at an end of this transport path and supports platform 309.It is short straight line that this layout allows transport path, and only requires a whole container transport mechanism 325.This has reached higher transfer efficiency.
Because all whole container F (or all lids 113) are all the time in the face of identical direction, so storage area 301 does not need to be used to rotate the mechanism of whole container F.
Side at shelf 319 is provided with first stand 321 near first treatment region 303.Thereby, effectively utilized the space in storage area 301, make storage area 301 compacter.
Side at shelf 319 is used to arrive/leave the 3rd stand of supporting platform 309 to transmit and accept whole container F near supporting platform 309 to be provided with.This provides about shelf 319 being set and effectively using the bigger degree of freedom in the space in the storage area 301.
When whole container F is placed on the shelf 319 or when this shelf was taken whole container F, the whole container that moves both vertically between all receiver member 319a carried arm 326a.This feature allows storage area 301 to be of compact construction.
In this embodiment, first treatment region 303 and second treatment region 305 are configured for the clean of carrying out wafer W.This provides the better quality of handling (effect), guarantees the higher output of water clean simultaneously.
Described equipment has the first partition wall 331a and the second partition wall 331b and is used for being closed in partition wall 331a and first and second shutter members 335 and 336 of first and second passwaies that 331b forms.These parts prevent that the surrounding air of storage area 301 from flowing into first treatment region 303 and second treatment region 305.Thereby the wafer W of taking out from whole container F does not have contaminated.
Two second shutter members 336 are enjoyed single arm 338 and a valve transmission device jointly.This has realized reducing the desired quantity of part in addition.
Be closed in the aperture that forms in the sidewall 331, separate storage area 301 and support platform 309 by valve plate 333, to form the surrounding airs cleaning in the storage area 301.
Embodiment 8
Secondly will narrate embodiments of the invention 8.
Figure 42 is the schematic plan view of substrate processing equipment among the embodiment 8.Use identical label represent with above all embodiment in identical part, and no longer to they the narration.
As shown in figure 42, the substrate processing equipment among the embodiment 8 has at first treatment region 303 as in embodiment 7 and forms second treatment region 305 of setting between the support platform 309 (following will the narration) of a part of storage area 301.In other words, second treatment region 305 is arranged on wherein on the expanded range in the direction of the batch process part 147 of arranging a part that forms first treatment region 303.Therefore, the side along substrate processing equipment is provided with first treatment region 303 and second treatment region 305.Be L shaped in the plane graph of storage area 301 in this embodiment, with relative with second treatment region 305 with first treatment region 303.
But, different among the setting of individual substrate processing section 171 in the transport path of the whole container transport mechanism 325 in the storage area 301 in embodiment 8 and second treatment region 305 and the embodiment 7.
The shelf 319 and first and second stands 321 and 323 support that along being parallel to a straight line of platform 309 is arranged side by side.In this embodiment, shelf 319 and first and second stands 321 and 323 are arranged on a straight line of one second partition wall 331b extension and are provided with.
First stand, 321 levels are moveable to corresponding on a distance of the spacing between the first partition wall 331a and the second partition wall 331b, thereby this group wafer W in the whole container F of placing thereon can be transported to first treatment region 303.
In position, be horizontally disposed with two second stands 323 with respect to the second partition wall 331b.
Forming the screw shaft 329a of transport path of whole container transport mechanism 325 and guide rod 329b is arranged between the straight line supporting platform 309 and extend along the second partition wall 331b (promptly thereon the straight lines of shelf 319 and first and second stands 321 and 323) side by side.Screw shaft 329a and guide rod 329b have by with its opposite end of supporting that platform 309, shelf 319 and first and second stands 321 and 323 relative zones are extended.
The second partition wall 331b forms two corresponding second channel mouths of horizontally disposed and all second stands 323.Open and close these two second channel mouths by two second shutter members 336.Each second shutter member 336 is supported regularly by an arm (not shown).By an independent valve transmission device each arm of transmission individually.
Individual substrate processing section 171 in second treatment region 305 comprises the two mutual relative cover processing units 172 that are stacked in two-layer, has second conveying mechanism 361 simultaneously betwixt.
The present invention is not limited to above-mentioned all embodiment, but following modification can be arranged.
(1) in described example of operation, at first wafer W is transported to second treatment region 305, be transported to first treatment region 303 then.This order is not restrictive.Can be according to the processing that wafer W is carried out selecting sequence freely.
(2) in above-described embodiment 7 and 8, second conveying mechanism 361 is configured to once carry a wafer in all wafers.Can revise second conveying mechanism 361 integrally to carry many wafer W.
And second treatment region 305 can also comprise and is used for the interim shelf that keeps the wafer W of being carried by second conveying mechanism 361.This allows second conveying mechanism 361 transfer wafers W more reposefully.
(3) in above-described embodiment 7, storage area 301 comprises one first stand 321 and a plurality of second stand 323, but whether restrictive.For example, storage area 301 can comprise a plurality of first stands 321 and one second stand 323.
The present invention can be presented as other specific pattern and not depart from its principle and fundamental characteristics, should be noted that it is that appended claims rather than above specification have been pointed out scope of the present invention.
Claims (87)
1. a substrate processing equipment, this equipment comprises:
Be used to support deposit a container platform of a container of many substrates;
Comprise and be used for integrally handling one first processing section of many substrates and be used for a substrate treatment region one second processing section of a substrate of many substrate single treatments;
Be used between described container platform, described first processing section and described second processing section, carrying a conveying mechanism of all substrates; And
Be used for controlling a control device that is used for a conveying operations of the described conveying mechanism of all substrates of conveying between described container platform, described first processing section and described second processing section according to the substrate treatment state.
2. equipment as claimed in claim 1, it is characterized in that, described substrate treatment region is divided into two zones, described first processing section is configured to relative mutually with described second processing section, described first processing section is set in one of them zone, and described second processing section is set in another zone.
3. equipment as claimed in claim 2 is characterized in that, also is included in the separator between described two zones.
4. equipment as claimed in claim 1 is characterized in that, described first processing section comprises:
Be in a processing unit of many substrates in the perpendicular attitude with a Treatment Solution;
Be used for a processed dry afterwards drying unit that is in many substrates of perpendicular attitude in described processing unit;
Be used to transmit and accept that many substrates arrive/leave described conveying mechanism and a posture changing mechanism of many substrates of conversion between horizontal attitude and perpendicular attitude; And
The conveying mechanism that is used to transmit and accepts that many substrates arrive/leave described posture changing mechanism and between described processing unit and described drying unit, carry one first processing section of many substrates.
5. equipment as claimed in claim 1, it is characterized in that the conveying mechanism that described second processing section comprises individual substrate processing unit that is used for a substrate of single treatment and be used for carrying one second processing section of many substrates between described conveying mechanism and described individual substrate processing unit.
6. equipment as claimed in claim 4, it is characterized in that, the described posture changing mechanism that is included in described first processing section is one first posture changing mechanism, and described equipment also comprises that be oppositely arranged across described substrate treatment region and described conveying mechanism, be used for carrying many substrates between described first processing section and described second processing section and in one second posture changing mechanism of horizontal attitude and many substrates of perpendicular attitude conversion.
7. equipment as claimed in claim 1 is characterized in that, many substrates that described conveying mechanism is configured to handle in described first processing section are transported to described second processing section.
8. equipment as claimed in claim 1 is characterized in that, many substrates that described conveying mechanism is configured to handle in described second processing section are transported to described first processing section.
9. a substrate processing equipment, this equipment comprises:
Be used to accept deposit a storage area of a container of many substrates;
Be used for integrally handling one first treatment region of many substrates;
Be used for one second treatment region to a substrate of many substrate single treatments; And
Be used for carrying between the described container of in described storage area, being accepted, described first treatment region and described second treatment region delivery area of many substrates.
10. equipment as claimed in claim 9, it is characterized in that, described second treatment region is arranged between described first treatment region and the described storage area, and described delivery area is set between described first treatment region and the described storage area and relative with described second treatment region.
11. equipment as claimed in claim 9 is characterized in that, grows side along one of substrate processing equipment described first treatment region, described second treatment region and described storage area are set.
12. equipment as claimed in claim 9 is characterized in that, described first treatment region is configured to integrally clean and dry many substrates, and second treatment region is configured to many substrates are once cleaned and dry substrate.
13. equipment as claimed in claim 12 is characterized in that, described second treatment region is configured to clean the fringe region at least on the back side of each substrate.
14. equipment as claimed in claim 12 is characterized in that, described second treatment region also is configured to substrate of an etching of many substrates.
15. equipment as claimed in claim 9 is characterized in that, described delivery area is configured to carry many substrates of having handled in described second treatment region to arrive described first treatment region from described second treatment region.
16. equipment as claimed in claim 9 is characterized in that, described delivery area is configured to carry many described second treatment regions of having handled of basic arrival from described first treatment region in described first treatment region.
17. equipment as claimed in claim 9, it is characterized in that described delivery area is configured to many wafer transport that many substrates will have been handled from described container transport to described second treatment region, from described second treatment region are arrived described container to described first treatment region and from many substrates conveyings that described first treatment region will have been handled in described first treatment region in described second treatment region.
18. equipment as claimed in claim 9 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described second treatment region comprises:
Be used for many substrates are once cleaned and individual substrate processing section of a dry substrate;
Be used to keep the substrate frame of one second treatment region of many substrates;
Be used between the substrate frame of described individual substrate processing section and described second treatment region, many substrates once being carried the conveying mechanism of one second treatment region of a substrate;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described second treatment region and from this substrate frame and obtains many substrates.
19. equipment as claimed in claim 18 is characterized in that,
The substrate frame of described second treatment region comprises:
A preliminary treatment substrate frame that keeps many substrates before being used in individual substrate processing section, handling; And
A reprocessing substrate frame that keeps many substrates after being used in individual substrate processing section, handling;
The conveying mechanism of described second treatment region once carries a substrate to arrive described individual substrate processing section from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from described individual substrate processing section to many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the described preliminary treatment substrate frame, and integrally obtains many substrates from described reprocessing substrate frame.
20. equipment as claimed in claim 19 is characterized in that, in the occasion that the conveying mechanism of described delivery area can carry N to open substrate, it is many substrates of the multiple of N that each substrate frame of described preliminary treatment substrate frame and described reprocessing substrate frame can keep quantity.
21. equipment as claimed in claim 19 is characterized in that,
Described individual substrate processing section is included among many rows and a plurality of processing units that are provided with in multilayer;
The conveying mechanism of described second treatment region once carries a substrate to arrive each described processing unit from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from each described processing unit to many substrates.
22. equipment as claimed in claim 9 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described first treatment region comprises:
Be used for a batch processing section of many substrates of liquid handling and drying integrally;
Be used to keep the substrate frame of one first treatment region of many substrates; And
Be used between the substrate frame of described batch process part and described first treatment region, integrally carrying the conveying mechanism of one first treatment region of many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described first treatment region and from this substrate frame and obtains many substrates.
23. equipment as claimed in claim 22 is characterized in that,
The conveying mechanism of described delivery area is configured to transmit and accept to be in the substrate frame that many substrates in the horizontal attitude arrived/left described first treatment region;
Many the substrates that the conveying mechanism of described first treatment region is configured to transmit and accept to be in perpendicular attitude arrive/leave the substrate frame of described first treatment region; And
The substrate frame of described first treatment region is provided in many substrates of conversion integrally between horizontal attitude and the perpendicular attitude, so that be sent to the conveying mechanism of described delivery area and the conveying mechanism of described first treatment region.
24. equipment as claimed in claim 9 is characterized in that, also comprises:
Described container in that described storage area is separated with described second treatment region and described delivery area and formation and the described storage area relative, to allow a separator of the passway that many substrates pass through; And
Be used to open and close a shutter member of described passway;
Described delivery area is configured to by described passway many substrate load and unloading be entered/leave described container in the described storage area.
25. equipment as claimed in claim 24, it is characterized in that, described container has the aperture in its side formation, and a lid that is used to close described aperture, described shutter member has one of the described lid that is used to connect, dismantle and remain on the described container in the described storage area and is connected/dismantles and maintaining body.
26. a substrate processing equipment, this equipment comprises:
Be used to support deposit a container platform of a container of many substrates;
Be used for integrally handling one first treatment region of many substrates;
Be used for one second treatment region to a substrate of many substrate single treatments; And
Be used between the described container of placing on the described container platform, described first treatment region and described second treatment region, carrying a delivery area of many substrates;
Wherein said second treatment region is arranged between described first treatment region and the described container platform, and described delivery area is arranged between described first treatment region and the described container platform and relative with described second treatment region.
27. equipment as claimed in claim 26 is characterized in that, described first treatment region is configured to integrally clean and dry many substrates, and described second treatment region is configured to many substrates are once cleaned and dry substrate.
28. equipment as claimed in claim 27 is characterized in that, described second treatment region is configured to clean the fringe region at least on the back side of each substrate.
29. equipment as claimed in claim 27 is characterized in that, described second treatment region also is configured to substrate of an etching of many substrates.
30. equipment as claimed in claim 26 is characterized in that, described delivery area is configured to carry many substrates of having handled in described second treatment region to arrive described first treatment region from described second treatment region.
31. equipment as claimed in claim 26 is characterized in that, described delivery area is configured to carry many described second treatment regions of having handled of basic arrival from described first treatment region in described first treatment region.
32. equipment as claimed in claim 26, it is characterized in that described delivery area is configured to many wafer transport that many substrates will have been handled from described container transport to described second treatment region, from described second treatment region are arrived described container to described first treatment region and from many substrates conveyings that described first treatment region will have been handled in described first treatment region in described second treatment region.
33. equipment as claimed in claim 26 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described second treatment region comprises:
Be used for many substrates are once cleaned and individual substrate processing section of a dry substrate;
Be used to keep the substrate frame of one second treatment region of many substrates;
Be used between the substrate frame of described individual substrate processing section and described second treatment region, many substrates once being carried the conveying mechanism of one second treatment region of a substrate;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described second treatment region and from this substrate frame and obtains many substrates.
34. equipment as claimed in claim 33 is characterized in that,
The substrate frame of described second treatment region comprises:
A preliminary treatment substrate frame that keeps many substrates before being used in individual substrate processing section, handling; And
A reprocessing substrate frame that keeps many substrates after being used in individual substrate processing section, handling;
The conveying mechanism of described second treatment region once carries a substrate to arrive described individual substrate processing section from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from described individual substrate processing section to many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the described preliminary treatment substrate frame, and integrally obtains many substrates from described reprocessing substrate frame.
35. equipment as claimed in claim 34 is characterized in that, in the occasion that the conveying mechanism of described delivery area can carry N to open substrate, it is many substrates of the multiple of N that each substrate frame of described preliminary treatment substrate frame and described reprocessing substrate frame can keep quantity.
36. equipment as claimed in claim 34 is characterized in that,
Described individual substrate processing section is included among many rows and a plurality of processing units that are provided with in multilayer;
The conveying mechanism of described second treatment region once carries a substrate to arrive each described processing unit from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from each described processing unit to many substrates.
37. equipment as claimed in claim 26 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described first treatment region comprises:
Be used for a batch processing section of many substrates of liquid handling and drying integrally;
Be used to keep the substrate frame of one first treatment region of many substrates; And
Be used between the substrate frame of described batch process part and described first treatment region, integrally carrying the conveying mechanism of one first treatment region of many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described first treatment region and from this substrate frame and obtains many substrates.
38. equipment as claimed in claim 37 is characterized in that,
The conveying mechanism of described delivery area is configured to transmit and accept to be in the substrate frame that many substrates in the horizontal attitude arrived/left described first treatment region;
Many the substrates that the conveying mechanism of described first treatment region is configured to transmit and accept to be in perpendicular attitude arrive/leave the substrate frame of described first treatment region; And
The substrate frame of described first treatment region is provided in many substrates of conversion integrally between horizontal attitude and the perpendicular attitude, so that be sent to the conveying mechanism of described delivery area and the conveying mechanism of described first treatment region.
39. a substrate processing equipment, this equipment comprises:
Be used to support deposit a container platform of a container of many substrates;
Be used for integrally handling one first treatment region of many substrates;
Be used for one second treatment region to a substrate of many substrate single treatments; And
Be used between the described container of placing on the described container platform, described first treatment region and described second treatment region, carrying a delivery area of many substrates;
Wherein the long side along substrate processing equipment is provided with described first treatment region, described second treatment region and described container platform according to the order of sequence.
40. equipment as claimed in claim 39 is characterized in that, described first treatment region is configured to integrally clean and dry many substrates, and described second treatment region is configured to many substrates are once cleaned and dry substrate.
41. equipment as claimed in claim 40 is characterized in that, described second treatment region is configured to clean the fringe region at least on the back side of each substrate.
42. equipment as claimed in claim 40 is characterized in that, described second treatment region also is arranged to substrate of an etching of many substrates.
43. equipment as claimed in claim 39 is characterized in that, described delivery area is configured to carry many substrates of having handled in described second treatment region to arrive described first treatment region from described second treatment region.
44. equipment as claimed in claim 39 is characterized in that, described delivery area is configured to carry many described second treatment regions of having handled of basic arrival from described first treatment region in described first treatment region.
45. equipment as claimed in claim 39, it is characterized in that described delivery area is configured to many wafer transport that many substrates will have been handled from described container transport to described second treatment region, from described second treatment region are arrived described container to described first treatment region and from many substrates conveyings that described first treatment region will have been handled in described first treatment region in described second treatment region.
46. equipment as claimed in claim 39 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described second treatment region comprises:
Be used for many substrates are once cleaned and individual substrate processing section of a dry substrate;
Be used to keep the substrate frame of one second treatment region of many substrates;
Be used between the substrate frame of described individual substrate processing section and described second treatment region, many substrates once being carried the conveying mechanism of one second treatment region of a substrate;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described second treatment region and from this substrate frame and obtains many substrates.
47. equipment as claimed in claim 46 is characterized in that,
The substrate frame of described second treatment region comprises:
A preliminary treatment substrate frame that keeps many substrates before being used in individual substrate processing section, handling; And
A reprocessing substrate frame that keeps many substrates after being used in individual substrate processing section, handling;
The conveying mechanism of described second treatment region once carries a substrate to arrive described individual substrate processing section from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from described individual substrate processing section to many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the described preliminary treatment substrate frame, and integrally obtains many substrates from described reprocessing substrate frame.
48. equipment as claimed in claim 47 is characterized in that, in the occasion that the conveying mechanism of described delivery area can carry N to open substrate, it is many substrates of the multiple of N that each substrate frame of described preliminary treatment substrate frame and described reprocessing substrate frame can keep quantity.
49. equipment as claimed in claim 47 is characterized in that,
Described individual substrate processing section is included among many rows and a plurality of processing units that are provided with in multilayer;
The conveying mechanism of described second treatment region once carries a substrate to arrive each described processing unit from described preliminary treatment substrate frame to many substrates, and once carries a substrate to arrive described reprocessing substrate frame from each described processing unit to many substrates.
50. equipment as claimed in claim 39 is characterized in that,
Described delivery area comprises the conveying mechanism of a delivery area that is used for integrally carrying many substrates; And
Described first treatment region comprises:
Be used for a batch processing section of many substrates of liquid handling and drying integrally;
Be used to keep the substrate frame of one first treatment region of many substrates; And
Be used between the substrate frame of described batch process part and described first treatment region, integrally carrying the conveying mechanism of one first treatment region of many substrates;
The conveying mechanism of described delivery area integrally is placed on many substrates on the substrate frame of described first treatment region and from this substrate frame and obtains many substrates.
51. equipment as claimed in claim 50 is characterized in that,
The conveying mechanism of described delivery area is configured to transmit and accept to be in the substrate frame that many substrates in the horizontal attitude arrived/left described first treatment region;
Many the substrates that the conveying mechanism of described first treatment region is configured to transmit and accept to be in perpendicular attitude arrive/leave the substrate frame of described first treatment region; And
The substrate frame of described first treatment region is provided in many substrates of conversion integrally between horizontal attitude and the perpendicular attitude, so that be sent to the conveying mechanism of described delivery area and the conveying mechanism of described first treatment region.
52. a substrate processing equipment, this equipment comprises:
Be used to accept deposit separately a storage area of a plurality of containers of many substrates;
Be used for integrally handling one first treatment region of many substrates; And
Be used for one second treatment region to a substrate of many substrate single treatments;
Described storage area comprises:
Be used to keep one first of a plurality of containers, so that can arrive from described first treatment region;
Be used to keep one second of a plurality of containers, so that can arrive from described second treatment region; And
Be used between described first and described second, carrying a container conveyance apparatus of a plurality of containers;
Wherein said first treatment region comprises and is used for one first conveying mechanism that many substrates of loading and unloading entered/left a plurality of containers that are placed on described first platform; And
Described second treatment region comprises and is used for one second conveying mechanism that many substrates of loading and unloading entered/left a plurality of containers that are placed on described second platform.
53. equipment as claimed in claim 52 is characterized in that, described container conveyance apparatus is configured to arrive described first from many substrates of having handled are deposited in described second conveying in described second treatment region a plurality of containers.
54. equipment as claimed in claim 52 is characterized in that, described container conveyance apparatus is configured to arrive described second from many substrates of having handled are deposited in described first conveying in described first treatment region a plurality of containers.
55. equipment as claimed in claim 52 is characterized in that, in a side of described storage area described first treatment region and described second treatment region is set.
56. equipment as claimed in claim 52 is characterized in that, described first treatment region is relative mutually with described second treatment region.
57. equipment as claimed in claim 52 is characterized in that, described storage area also comprises a shelf that is used to keep a plurality of containers, and described container conveyance apparatus has the another function that is used for a plurality of container transport are arrived and leave described shelf.
58. equipment as claimed in claim 57 is characterized in that, described shelf is set on the container transport path between described first and described second.
59. equipment as claimed in claim 57 is characterized in that, described shelf is configured to keep a plurality of containers when the container transport path along described container conveyance apparatus is provided with.
60. equipment as claimed in claim 57, it is characterized in that described container conveyance apparatus comprises and is used at one the 3rd conveying mechanism of carrying a plurality of containers between described first and the described shelf, is used for one the 4th conveying mechanism of transport box between described second and described shelf.
61. equipment as claimed in claim 57, it is characterized in that, described the 3rd conveying mechanism can move, be used in a described side a plurality of containers to be loaded on the described shelf and from this shelf along a side of described shelf and unload a plurality of containers, and described the 4th conveying mechanism can move, be used at described opposite side a plurality of containers to be loaded on the described shelf and from this shelf along the opposite side of described shelf and unloads a plurality of containers.
62. equipment as claimed in claim 61 is characterized in that, described second is included in a plurality of stands that are provided with on the expanded range of described shelf, and described the 4th conveying mechanism can move along the described opposite side away from described first treatment region of described shelf.
63. equipment as claimed in claim 52 is characterized in that, also comprises:
A plurality of containers that described storage area is separated with described first treatment region and that form and place on described first platform relatively are used to allow one first separator of the first passage mouth that many substrates pass through;
Be used to open and close one first shutter member of described first passage mouth;
Relative being used to of a plurality of containers that described storage area is separated with described second treatment region and that form and place on described second platform allows one second separator of the second channel mouth that many substrates pass through;
Be used to open and close one second shutter member of described second channel mouth;
Described first conveying mechanism is configured to integrally many substrate load and unloading be entered/leave described a plurality of containers on described first platform by described first passage mouth;
Described second conveying mechanism is configured to by described second channel mouth substrate of loading and unloading of many substrates be entered/leave described a plurality of containers on described second platform.
64. as the described equipment of claim 63, it is characterized in that,
Each described container has an aperture that forms in its side, and a lid that is used to close described aperture;
Described first shutter member has and is used to connect, dismantle and keep one first of described lid to be connected/to dismantle and maintaining body;
Described second shutter member has and is used to connect, dismantle and keep one second of described lid to be connected/to dismantle and maintaining body.
65. equipment as claimed in claim 52 is characterized in that, described first treatment region is configured to integrally clean and dry many substrates, and described second treatment region is configured to many substrates are once cleaned and dry substrate.
66., it is characterized in that described second treatment region is configured to clean the fringe region at least on the back side of each substrate as the described equipment of claim 65.
67. a substrate processing equipment, this equipment comprises:
Be used to accept deposit separately a storage area of a plurality of containers of many substrates;
Be used for integrally handling one first treatment region of many substrates; And
Be used for one second treatment region to a substrate of many substrate single treatments;
Described storage area comprises:
Be used to keep one first of a plurality of containers, so that can arrive from described first treatment region;
Be used to keep one second of a plurality of containers, so that can arrive from described second treatment region;
Be used to keep the 3rd of a plurality of containers, so that can arrive from the outside of described substrate processing equipment; And
Be used between described first and described second and described the 3rd, carrying a container conveyance apparatus of a plurality of containers;
Wherein said first treatment region comprises and is used for one first conveying mechanism that many substrates of loading and unloading entered/left a plurality of containers that are placed on described first platform; And
Described second treatment region comprises and is used for that many substrates of loading and unloading enter/leave a plurality of containers of being placed on described second platform and is arranged on one second conveying mechanism between described first treatment region and described the 3rd.
68. as the described equipment of claim 67, it is characterized in that, be placed on a plurality of containers on described first and described second platform and have its substrate load and unloading plane in the face of equidirectional.
69. as the described equipment of claim 67, it is characterized in that, also comprise an a plurality of shelfs transport path setting, that be used to keep a plurality of containers when disposed thereon along described container conveyance apparatus, described container conveyance apparatus carries a plurality of containers to arrive and leave described a plurality of shelf.
70. as the described equipment of claim 69, it is characterized in that, between described first treatment region and described the 3rd, a position relative with described second treatment region be provided with described a plurality of shelf.
71., it is characterized in that described a plurality of shelfs have their side that plays described first effect as the described equipment of claim 70.
72. as the described equipment of claim 69, it is characterized in that, on described second expanded range that is arranged on described a plurality of shelfs.
73., it is characterized in that described second comprises vertically disposed a plurality of stand as the described equipment of claim 67.
74. as the described equipment of claim 67, it is characterized in that, also comprise:
A plurality of containers that described storage area is separated with described first treatment region and that form and place on described first platform relatively are used to allow one first separator of the first passage mouth that many substrates pass through;
Be used to open and close one first shutter member of described first passage mouth;
Relative being used to of a plurality of containers that described storage area is separated with described second treatment region and that form and place on described second platform allows one second separator of the second channel mouth that many substrates pass through;
Be used to open and close one second shutter member of described second channel mouth;
Described first conveying mechanism is configured to integrally many substrate load and unloading be entered/leave described a plurality of containers on described first platform by described first passage mouth;
Described second conveying mechanism is configured to by described second channel mouth substrate of loading and unloading of many substrates be entered/leave described a plurality of containers on described second platform.
75. as the described equipment of claim 74, it is characterized in that,
Each described container has an aperture that forms in its side, and a lid that is used to close described aperture;
Described first shutter member has and is used to connect, dismantle and keep one first of described lid to be connected/to dismantle and maintaining body;
Described second shutter member has and is used to connect, dismantle and keep one second of described lid to be connected/to dismantle and maintaining body.
76., it is characterized in that described first treatment region is configured to integrally clean and dry many substrates as the described equipment of claim 67, and described second treatment region is configured to many substrates are once cleaned and dry substrate.
77., it is characterized in that described second treatment region is configured to clean the fringe region at least on the back side of each substrate as the described equipment of claim 76.
78. a substrate processing equipment, this equipment comprises:
Be used to accept deposit separately a storage area of a plurality of containers of many substrates;
Be used for integrally handling one first treatment region of many substrates; And
Be used for one second treatment region to a substrate of many substrate single treatments;
Described storage area comprises:
Be used to keep one first of a plurality of containers, so that can arrive from described first treatment region;
Be used to keep one second of a plurality of containers, so that can arrive from described second treatment region; And
Be used between described first and described second, carrying a container conveyance apparatus of a plurality of containers;
Described first treatment region comprises:
Be used for many substrate load and the unloading enter/leave a container of on described first platform, placing one first conveying device; And
Be used for integrally using a batch processing section of a solution-treated and dry many substrates;
Wherein said second treatment region comprises and is used for many substrate load and unloading are entered/leave one second conveying mechanism on an expanded range container of placing on described second platform and that be arranged on the direction that described batch process part wherein is set.
79. as the described equipment of claim 78, it is characterized in that, be placed on a plurality of containers on described first and described second platform and have its substrate load and unloading plane in the face of equidirectional.
80. as the described equipment of claim 78, it is characterized in that, also comprise an a plurality of shelfs transport path setting, that be used to keep a plurality of containers when disposed thereon along described container conveyance apparatus, described container conveyance apparatus carries a plurality of containers to arrive and leave described a plurality of shelf.
81., it is characterized in that described a plurality of shelfs have their side that plays described first effect as the described equipment of claim 80.
82. as the described equipment of claim 80, it is characterized in that, on described second expanded range that is arranged on described a plurality of shelfs.
83., it is characterized in that described second comprises vertically disposed a plurality of stand as the described equipment of claim 78.
84. as the described equipment of claim 78, it is characterized in that, also comprise:
A plurality of containers that described storage area is separated with described first treatment region and that form and place on described first platform relatively are used to allow one first separator of the first passage mouth that many substrates pass through; Be used to open and close one first shutter member of described first passage mouth;
Relative being used to of a plurality of containers that described storage area is separated with described second treatment region and that form and place on described second platform allows one second separator of the second channel mouth that many substrates pass through;
Be used to open and close one second shutter member of described second channel mouth;
Described first conveying mechanism is configured to integrally many substrate load and unloading be entered/leave described a plurality of containers on described first platform by described first passage mouth;
Described second conveying mechanism is configured to by described second channel mouth substrate of loading and unloading of many substrates be entered/leave described a plurality of containers on described second platform.
85. as the described equipment of claim 84, it is characterized in that,
Each described container has an aperture that forms in its side, and a lid that is used to close described aperture;
Described first shutter member has and is used to connect, dismantle and keep one first of described lid to be connected/to dismantle and maintaining body;
Described second shutter member has and is used to connect, dismantle and keep one second of described lid to be connected/to dismantle and maintaining body.
86., it is characterized in that described first treatment region is configured to integrally clean and dry many substrates as the described equipment of claim 78, and described second treatment region is configured to many substrates are once cleaned and dry substrate.
87., it is characterized in that described second treatment region is configured to clean the fringe region at least on the back side of each substrate as the described equipment of claim 86.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004372882 | 2004-12-24 | ||
| JP2004372882A JP4401285B2 (en) | 2004-12-24 | 2004-12-24 | Substrate processing equipment |
| JP2005079587 | 2005-03-18 | ||
| JP2005079585 | 2005-03-18 | ||
| JP2005079586 | 2005-03-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1805126A true CN1805126A (en) | 2006-07-19 |
| CN100452340C CN100452340C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101370825A Active CN100452340C (en) | 2004-12-24 | 2005-12-23 | Substrate treating apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4401285B2 (en) |
| CN (1) | CN100452340C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673665B (en) * | 2008-09-12 | 2012-02-29 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN103311166A (en) * | 2012-03-09 | 2013-09-18 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN106206371A (en) * | 2015-05-29 | 2016-12-07 | 细美事有限公司 | The device of process substrate |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP7336956B2 (en) | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
| JP7336955B2 (en) * | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
| JP2024029982A (en) * | 2022-08-23 | 2024-03-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus |
| JP2024044507A (en) * | 2022-09-21 | 2024-04-02 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate Processing Equipment |
| JP2024046367A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| JP2024046366A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2920584B2 (en) * | 1992-09-25 | 1999-07-19 | 大日本スクリーン製造株式会社 | Substrate cleaning device |
| JP3118681B2 (en) * | 1993-10-29 | 2000-12-18 | 東京エレクトロン株式会社 | Processing device and processing method |
| JPH10163292A (en) * | 1996-12-03 | 1998-06-19 | Canon Sales Co Inc | Treating device |
| US6368040B1 (en) * | 1998-02-18 | 2002-04-09 | Tokyo Electron Limited | Apparatus for and method of transporting substrates to be processed |
| US6488778B1 (en) * | 2000-03-16 | 2002-12-03 | International Business Machines Corporation | Apparatus and method for controlling wafer environment between thermal clean and thermal processing |
| JP2002359225A (en) * | 2001-06-01 | 2002-12-13 | Smt:Kk | Substrate-cleaning apparatus and system |
| JP4342147B2 (en) * | 2002-05-01 | 2009-10-14 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2004281580A (en) * | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | Apparatus and method for conveying |
| JP4397646B2 (en) * | 2003-07-30 | 2010-01-13 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
-
2004
- 2004-12-24 JP JP2004372882A patent/JP4401285B2/en active Active
-
2005
- 2005-12-23 CN CNB2005101370825A patent/CN100452340C/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN100452340C (en) | 2009-01-14 |
| JP2006179757A (en) | 2006-07-06 |
| JP4401285B2 (en) | 2010-01-20 |
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