CN1787726A - Method for drilling deep hole and PCB product obtained by same method - Google Patents
Method for drilling deep hole and PCB product obtained by same method Download PDFInfo
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- CN1787726A CN1787726A CN 200510123910 CN200510123910A CN1787726A CN 1787726 A CN1787726 A CN 1787726A CN 200510123910 CN200510123910 CN 200510123910 CN 200510123910 A CN200510123910 A CN 200510123910A CN 1787726 A CN1787726 A CN 1787726A
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Abstract
This invention discloses a new method for deep drilling and PCB products got from it, which sets the platform control loop on the POWER layer in the board and begins computing the designed depth from the place contacting the POWER by the drilling pin or drills the test holes of Z1,Z2 and Z3 on the necessary drilled regions of the upper surface, the upper target layer and the lower target layer then adds G87, G88 and G89 functional instructions on the control software of the platform to detect the depth values of Z1 and Z2 and judges the drilled depth value based on their positions, finally the platform adds a compensation value of a drill point to the depth of (Z2+Z3)/2 to drill.
Description
Technical field
The invention belongs to printed circuit board (PCB) (PCB) manufacturing technology field, relate to a kind of deep drilling new method, and the PCB manufactured goods that obtain by the boring of this method.
Background technology
So-called PCB deep drilling, promptly the mode by machine drilling is drilled to a perforation in the hole of being made up of a part of perforation and a part of not perforation, the degree of depth of perforation is not controlled between certain two adjacent inner layer usually, and depth accuracy requires to be controlled at ± 1mil (mil) (as shown in Figure 1, wherein: which layer L1......Ln represents).
Existing P CB method for deep drilling is to adopt chuck conduction feedback system, promptly utilize existing deep drilling board, producing the Aluminum cover 1 that the plate surface adds a conduction, drill point 2 tail ends join with the production plate by conductive switch 3, conductive chuck 4, connect conductive switch, when drill point contact Aluminum cover,, begin to calculate from the Aluminum cover upper surface and down be drilled with the fixed degree of depth (as shown in Figure 2) at the inner control loop that forms of board.
There is following shortcoming in said method:
1, the precision of the following drilling depth that board can only control itself, thus and can not change each following drilling depth along with the variation of thickness of slab and meet the requirements of ± precision of 1mil.
2, because use Aluminum cover to have Aluminum cover and the difference that combines of producing between the plate, this also can influence drilling accuracy.
Owing to there is above defective, the depth accuracy of the not perforation that therefore present PCB deep drilling operation obtains generally can only be controlled at ± 2.5mil above (promptly more than or equal to 2.5mil).
Summary of the invention
The technical problem to be solved in the present invention is: provides a kind of and can effectively solve the relatively poor problem of deep drilling precision that the thickness of slab uniformity is brought, thereby promote the deep drilling new method of the control precision of deep drilling, and the PCB manufactured goods that obtain by this method boring.
Technical scheme of the present invention is as follows:
A kind of deep drilling new method (method one), it is with the board control loop design POWER layer (big copper foil layer fingerboard in) in plate, and begins to calculate from the drill point position that apex point touches the POWER layer during brill down and down be drilled with the fixed degree of depth.Specifically comprise the following steps:
1) in the above position, upper strata (promptly going up destination layer) that produces adjacent two internal layers (being destination layer) that reach of needing to hole on the plate, searching links to each other with this POWER layer at plate peripheral hardware one via B from the nearest POWER layer of lower floor (promptly descending destination layer);
2) begin boring after strengthening the drill point diameter, the apex point conducting that links to each other with this POWER layer causes board formation control loop when drill point bores down;
3) the A point that apex point and this POWER layer of drill point are collided is considered as zero point, resetting the degree of depth of boring under the need continuation then in drilling program is the H value, the degree of depth that need control when the H value is considered as down boring continues down to bore, and can promote the control precision of deep drilling.
In the said method, choosing of POWER layer need be near more good more from destination layer.
The another kind of deep drilling new method (method two) identical with the said method principle, it be earlier respectively the upper surface of production plate, on destination layer and following destination layer, need to get out some little instrument connection Z1, Z2, Z3 on the regional edge of deep drilling; Then, on the board Control Software, increase function commands such as G87, G88, G89, make board can detect the depth value of Z1, Z2, and can make down the judgement of drilling depth value according to the position of Z1 and Z2; At last, board is with the depth value offset boring of an additional apex point again of (Z2+Z3)/2.Specifically comprise the following steps:
1) on the upper surface of producing plate needs the regional edge of deep drilling, adds and bore a plurality of depth tests hole Z1, and add drilling depth instrument connection Z2, add drilling depth instrument connection Z3 at the edges of boards that descend destination layer at the edges of boards of last destination layer;
2) increase G87, G88 function command on the board Control Software, make board can detect the depth value of Z1, Z2; And increase the G89 function command, make board can make down the judgement of drilling depth value according to the position of Z1 and Z2;
3) earlier the board control loop is designed outside plate, when the brill apex point touched the AL cover plate of producing the plate upper surface under the drill point, board formed control loop, and board detects the depth value of a plurality of instrument connection Z1 thus, determines a datum plane, i.e. zero point; Again with board control loop design in plate on destination layer, promptly instrument connection Z2 place designs conductive layer on last destination layer, when the brill apex point touched instrument connection Z2 place under the drill point, board formed control loop, and board detects the depth value of instrument connection Z2 on the destination layer thus;
4) board with the depth value of (Z2+Z3)/2 again the offset of an additional apex point carry out deep drilling, then can the more accurate ground keyhole degree of depth.
In the said method, step 1) and 2) order can exchange.
The principle of said method one and method two is identical, shows as: (1) all needs by form the degree of depth that control loop is detected a benchmark aspect in plate; (2) all need to select a datum level, as zero point, hole as the following drilling depth of needs control with a theoretical value of determining with this datum level.
By the PCB manufactured goods that the boring of said method one and method two obtains, its not the depth accuracy of perforation all can be controlled in ± 1.5mil following (promptly being less than or equal to 1.5mil).
The present invention has following advantage:
Method one can reduce the influence that the thickness of slab uniformity produces the deep drilling precision, thereby promotes the control precision of deep drilling; Method two can be controlled the influence to the deep drilling precision that the thickness of slab variation brings effectively; The PCB manufactured goods that adopt method of the present invention boring to obtain, its not the depth accuracy of perforation be increased dramatically.
Description of drawings:
Fig. 1 is the schematic diagram of PCB deep drilling;
Fig. 2 is the schematic diagram of existing method for deep drilling;
Fig. 3 is the schematic diagram of deep drilling new method one of the present invention;
Fig. 4 is the schematic diagram of deep drilling new method two of the present invention;
Fig. 5 is the partial enlarged drawing that adopts the product photo that method for deep drilling operation of the present invention obtains;
Fig. 6 is the photo that adopts the product that method for deep drilling operation of the present invention obtains.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment 1:
According to client's needs drilling depth is controlled at requirement between the L12-L13, the present invention carries out the deep drilling operation to producing plate by the following method:
As shown in Figure 3, between the L20-L13 layer, seek, link to each other with this POWER layer at plate peripheral hardware one via B from the nearest POWER layer of L12 (supposing that the POWER layer is the L13 layer); Strengthen as shown and begin boring behind drill point 2 diameters, the conducting that links to each other with this POWER layer (L13) when drill point bores down causes the formation of board control loop; A point among the figure is considered as zero point, and the degree of depth that need control when the H value is considered as down boring is done like this and can be avoided the inhomogeneous influence that control brings to the degree of depth of thickness of slab, can improve the control precision of boring greatly.
Embodiment 2:
According to client's needs drilling depth is controlled at requirement between the L12-L13, the present invention carries out the deep drilling operation by the following method:
As shown in Figure 4, be to need on the Aluminum cover 1 to add on the regional edge of deep drilling to bore some depth test hole Z1 at the upper surface of producing plate, and add drilling depth instrument connection Z2, add drilling depth instrument connection Z3 at the edges of boards that descend destination layer L12 at the edges of boards of last destination layer L13;
On the board Control Software, increase function commands such as G87, G88, G89, make board can detect the depth value of Z1, Z2, and make down the judgement of drilling depth value according to the position of Z1 and Z2;
G87, G88, these three kinds of instructions of G89 write in the program, the upper surface position that plate is produced in the board detecting when carrying out the G87 instruction, i.e. Z1 position among the figure---the number of concrete detecting is decided by concrete condition, generally detects 3 Z1 values, can determine datum plane, i.e. a zero point; Then carry out G88 instruction, board is detected the i.e. Z2 position among the figure of conduction position for the second time; Carry out G89 instruction at last, finish detecting, board is with the depth value of (Z2+Z3)/2 drilling depth that need control of the compensation value calculation of an additional apex point again, and, strengthen drill point 2 diameters and begin deep drilling.
In the said method:
The degree of depth of Z2=last destination layer is to the distance of datum plane;
The thickness of insulating barrier between the degree of depth of the degree of depth=Z2 of Z3+upper and lower destination layer
(,, and do not need detecting so as long as the degree of depth of Z2 is known, then the degree of depth of Z3 also is known because the thickness of insulating barrier is known between the upper and lower destination layer.The instrument connection Z3 that gets out uses when cutting into slices.)
Subprogram is as follows:
T02
M25
G87X017Y0005
G87X001
G87Y007
G88X017
G89
X0055Y0017
.
.
.)，
Board is with the offset boring of an additional apex point again of the depth value of (Z2+Z3)/2, then can the more accurate ground keyhole degree of depth, and also reduced the degree of depth simultaneously and controlled the inhomogeneity dependence of thickness of slab.
Test case:
Use the test data of the PCB manufactured goods that as above embodiment 2 described method bore operations obtain as follows:
(the section photo after the boring such as Fig. 5, shown in Figure 6.Section measures and to be the bottom of boring L size in distance between lower floor's Copper Foil such as the figure, the degree of depth of customer requirement need be controlled between e layer and the f layer, and the smaller the better to the distance of f layer, therefore when operation the depth value of L has been done a setting, set point is 4mil, is central value with 4mil during calculating)
| 1 | 2 | 3 | 4 | 5 | MAX | MIN | AVERAGE | R |
| 5.60 | 4.92 | 5.90 | 5.87 | 5.81 | 5.90 | 4.92 | 5.62 | 0.98 |
| 5.31 | 4.53 | 5.71 | 5.12 | 5.12 | 5.71 | 4.53 | 5.16 | 1.18 |
| 5.95 | 5.31 | 5.91 | 5.51 | 5.96 | 5.96 | 5.31 | 5.73 | 0.65 |
| 5.71 | 4.33 | 5.80 | 5.51 | 5.88 | 5.88 | 4.33 | 5.45 | 1.55 |
| 5.31 | 5.12 | 5.61 | 4.92 | 5.41 | 5.61 | 4.92 | 5.28 | 0.69 |
| 5.91 | 5.31 | 5.90 | 5.81 | 5.71 | 5.91 | 5.31 | 5.73 | 0.60 |
| 5.51 | 4.72 | 5.79 | 5.61 | 5.41 | 5.79 | 4.72 | 5.41 | 1.07 |
| 5.71 | 5.31 | 5.61 | 5.31 | 5.61 | 5.71 | 5.31 | 5.51 | 0.39 |
| 5.91 | 4.92 | 5.51 | 5.51 | 5.51 | 5.91 | 4.92 | 5.47 | 0.98 |
| 5.51 | 4.92 | 5.81 | 5.96 | 5.31 | 5.96 | 4.92 | 5.50 | 1.04 |
| 5.71 | 5.31 | 5.57 | 5.93 | 5.51 | 5.93 | 5.31 | 5.61 | 0.62 |
| 5.91 | 5.12 | 5.71 | 5.51 | 5.51 | 5.91 | 5.12 | 5.55 | 0.79 |
| 5.91 | 4.53 | 5.98 | 5.71 | 4.92 | 5.98 | 4.53 | 5.41 | 1.45 |
| 5.51 | 5.71 | 5.91 | 5.22 | 5.71 | 5.91 | 5.22 | 5.61 | 0.69 |
| 4.92 | 5.12 | 5.12 | 5.31 | 4.92 | 5.31 | 4.92 | 5.08 | 0.39 |
| SPEC：4mil±1.5mil | ||||||||
| X＝5.474 | ||||||||
| Δ＝0.374 | ||||||||
| Ca＝0.983 T＝3.00 | |
| Cp＝1.336 | |
| Cpk＝0.023 |
From the section metric data of above PCB manufactured goods as can be known, degree of depth control precision is improved significantly.Adopt former chuck conduction feedback system method for deep drilling CP value (accuracy) under the specification of ± 2.5mil can only reach 1.0; And use method for deep drilling of the present invention, the CP value can reach more than 1.3 under the specification of ± 1.5mil.
The described boring method control precision of method two is higher, and has operability, is the prefered method of volume production operation.Though the control specification of this kind boring method when the CP value reaches 1.33 be ± 1.5mil, than the feasibility of method one described boring method much higher.
Claims (6)
1, a kind of deep drilling new method is characterized in that it comprises the following steps:
1) produce need to hole on the plate reach on the above position of destination layer, seek from the nearest POWER layer of destination layer down, link to each other with this POWER layer at plate peripheral hardware one via B;
2) begin boring after strengthening the drill point diameter, the apex point conducting that links to each other with this POWER layer causes board formation control loop when drill point bores down;
3) the A point that apex point and this POWER layer of drill point are collided is considered as zero point, and resetting the degree of depth of boring under the need continuation then in drilling program is the H value, and the degree of depth that need control when the H value is considered as down boring continues down to bore.
2, deep drilling new method according to claim 1 is characterized in that, in the said method, choosing of POWER layer need be near more good more from destination layer.
3, a kind of deep drilling new method of the principle according to the described method of claim 1 is characterized in that it comprises the following steps:
1) on the upper surface of producing plate needs the regional edge of deep drilling, adds and bore a plurality of depth tests hole Z1, and add drilling depth instrument connection Z2, add drilling depth instrument connection Z3 at the edges of boards that descend destination layer at the edges of boards of last destination layer;
2) on the board Control Software, increase G87, G88 function command, make board can detect the depth value of Z1, Z2; And increase the G89 function command, make board can make down the judgement of drilling depth value according to the position of Z1 and Z2;
3) earlier the board control loop is designed outside plate, when the brill apex point touched the AL cover plate of producing the plate upper surface under the drill point, board formed control loop, and board detects the depth value of a plurality of instrument connection Z1 thus, determines a datum plane, i.e. zero point; Again with board control loop design in plate on destination layer, promptly instrument connection Z2 place designs conductive layer on last destination layer, when the brill apex point touched instrument connection Z2 place under the drill point, board formed control loop, and board detects the depth value of instrument connection Z2 on the destination layer thus;
4) board with the depth value of (Z2+Z3)/2 again the offset of an additional apex point carry out deep drilling.
4, deep drilling new method according to claim 3 is characterized in that, in the said method, step 1) and 2) order can exchange.
5, according to claim 3 or 4 described deep drilling new methods, it is characterized in that the number of the instrument connection Z1 of above-mentioned detecting is 3.
6, a kind of use as PCB manufactured goods that claim 1 or 3 described methods are holed and obtained is characterized in that, its not the depth accuracy of perforation all can be controlled in ± below the 1.5mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510123910 CN1787726A (en) | 2005-11-22 | 2005-11-22 | Method for drilling deep hole and PCB product obtained by same method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510123910 CN1787726A (en) | 2005-11-22 | 2005-11-22 | Method for drilling deep hole and PCB product obtained by same method |
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| Publication Number | Publication Date |
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| CN1787726A true CN1787726A (en) | 2006-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200510123910 Pending CN1787726A (en) | 2005-11-22 | 2005-11-22 | Method for drilling deep hole and PCB product obtained by same method |
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| CN102883522A (en) * | 2012-09-28 | 2013-01-16 | 华为机器有限公司 | Printed circuit board, method and device for drilling printed circuit board |
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| CN103302329A (en) * | 2013-06-04 | 2013-09-18 | 广州兴森快捷电路科技有限公司 | PCB (printed circuit board) back drilling method |
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-
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- 2005-11-22 CN CN 200510123910 patent/CN1787726A/en active Pending
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| CN113286430A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Method for improving drilling depth precision |
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| CN113286429A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Back drill manufacturing method |
| CN113286428A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Back drilling depth control method |
| CN111935912A (en) * | 2020-09-22 | 2020-11-13 | 维嘉数控科技（苏州）有限公司 | Method for acquiring characteristic parameters of multilayer circuit board and drilling process data acquisition device |
| CN112797887A (en) * | 2020-11-17 | 2021-05-14 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
| CN112797887B (en) * | 2020-11-17 | 2023-01-24 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
| CN113840479A (en) * | 2021-11-29 | 2021-12-24 | 深圳市大族数控科技股份有限公司 | Back drilling depth determination method, back drilling method and drilling system |
| CN113840479B (en) * | 2021-11-29 | 2022-02-11 | 深圳市大族数控科技股份有限公司 | Back drilling depth determination method, back drilling method and drilling system |
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