CN105592626A - Connecting hole structure in printed circuit board and manufacturing method of connecting hole structure - Google Patents
Connecting hole structure in printed circuit board and manufacturing method of connecting hole structure Download PDFInfo
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- CN105592626A CN105592626A CN201410557969.9A CN201410557969A CN105592626A CN 105592626 A CN105592626 A CN 105592626A CN 201410557969 A CN201410557969 A CN 201410557969A CN 105592626 A CN105592626 A CN 105592626A
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a connecting hole structure in a printed circuit board and a manufacturing method of the connecting hole structure. The printed circuit board comprises a plurality of single-layer plates which are laminated together; the printed circuit board is provided with a first surface and a second surface which are opposite to each other. The connecting hole structure comprise a through hole which passes through the first surface and the second surface of the printed circuit board; the through hole includes a conductive section and an insulated section; the conductive section is arranged between the first surface to a target single-layer plate or is arranged between the second surface and the target single-layer plate; the hole wall of the conductive section is provided with conductive copper; and the conductive copper is communicated with circuit patterns on the single-layer plate at the first surface or the second surface and circuit patterns on the target single-layer plate. The through hole is adopted to form the connecting hole structure, so that the number of the times of lamination can be decreased, lamination is just needed to performed once. The connecting hole structure can be realized by drilling the through hole, a secondary hole drilling technique and a primary lamination technique are utilized in a production process, and therefore, the production cost of the printed circuit board can be greatly reduced.
Description
Technical field
The present invention relates to electronic applications, relate in particular to connecting hole structure in a kind of printed circuit board (PCB) andPreparation method.
Background technology
Blind hole (Blindhole) in printed circuit board (PCB), be one side of finger-hole in the one side of circuit board,Till passing to circuit board inside, namely refer to the hole of not getting through. Blind hole is positioned at the top of printed circuit board (PCB)The surface of layer and bottom, has certain depth, for the connection of top layer circuit and internal layer circuit below,The degree of depth in hole is no more than certain ratio conventionally.
Consult shown in Fig. 1, shown the structural representation of the existing printed circuit board (PCB) with blind hole and through holeFigure. As shown in Figure 1, printed circuit board (PCB) includes the first lamina 11 laminated together, secondLamina 12, the 3rd lamina 13, the 4th lamina 14 and the 5th lamina 15, blind holeCircuit pattern 111 on 20 connection the first laminas 11 and the circuit pattern on the 4th lamina 14141, by the conductive copper 201 on blind hole 20 inwalls by circuit pattern 111 and circuit pattern 141Be communicated with. Existing through hole 30, for running through the structure of whole printed circuit board (PCB), is established on the hole wall of through hole 30There is conductive copper 201, can be communicated with the top layer of printed circuit board (PCB) and the lamina of bottom.
Existing blind hole preparation method adopts sequential layer platen press conventionally, and it exists printed circuit board (PCB) laminationCount many and the high problem of print circuit plates making cost.
Summary of the invention
The object of the invention is to overcome the defect of prior art, the company in a kind of printed circuit board (PCB) is providedConnect pore structure and preparation method thereof, can solve existing sequential layer platen press and make the printing electricity that blind hole existsRoad flaggy is pressed often and the high problem of print circuit plates making cost.
The technical scheme that realizes above-mentioned purpose is:
The preparation method of connecting hole in a kind of printed circuit board (PCB) of the present invention, comprising:
Multiple laminas are pressed together, form printed circuit board (PCB), described printed circuit board (PCB) comprises phaseRight first surface and second;
On described printed circuit board (PCB), form through hole, described through hole connects described first surface and described secondFace;
Deposited copper on the inwall of described through hole, forms conductive copper; And
Described through hole is holed, be drilled into target lamina from described first surface or described the second facePlace, bores the conductive copper on described through-hole wall, makes described through hole form leading with conductive copperLead to section and the insulating segment without conductive copper, the conduction period that sees through described through hole makes described second or instituteThe circuit pattern of stating on the lamina at first surface place is connected with the circuit pattern on described target laminaLogical.
Adopt through hole to form connecting hole structure, reach the effect suitable with blind hole, on processing procedure, can subtractSubstratum is pressed number of times, only a lamination. This connecting hole structure is by realization that through hole is holed,Production process is utilized secondary drilling technique, and a laminating technology can greatly reduce printed circuitThe cost of manufacture of plate.
In printed circuit board (PCB) of the present invention, the further improvement of the preparation method of connecting hole is, to described logicalBefore holing in hole, the circuit pattern on lamina to be holed, away from described through hole setting, is increasedDistance on described through hole and described lamina between circuit pattern.
In printed circuit board (PCB) of the present invention, the further improvement of the preparation method of connecting hole is, adopts sizeBe greater than the drill bit of described through hole, described through hole is holed, bore unwanted conductive copper, formDescribed insulating segment.
In printed circuit board (PCB) of the present invention, the further improvement of the preparation method of connecting hole is, each individual layerOn plate, be equipped with circuit pattern.
In printed circuit board (PCB) of the present invention, the further improvement of the preparation method of connecting hole is, to described logicalWhile boring in hole, be drilled into the endface position of described target lamina, make the conduction period forming in neighbourIn another lamina of nearly described target lamina, leave extension.
Connecting hole structure in a kind of printed circuit board (PCB) of the present invention, described printed circuit board (PCB) comprises and being laminated toMultiple laminas together, described printed circuit board (PCB) comprises relative first surface and second, described companyConnect pore structure and comprise the through hole that runs through described printed circuit board (PCB) first surface and second, described through hole comprisesConduction period and insulating segment, described conduction period is located at described first surface between target lamina or be located at instituteThe hole wall of described conduction period is provided with conductive copper between described target lamina to state second, described inConductive copper be communicated be positioned at circuit pattern on described first surface place or described second lamina of locating andCircuit pattern on described target lamina.
Adopt through hole to form connecting hole structure, reach the effect suitable with blind hole, on processing procedure, can subtractSubstratum is pressed number of times, only a lamination. This connecting hole structure is by realization that through hole is holed,Production process is utilized secondary drilling technique, and a laminating technology can greatly reduce printed circuitThe cost of manufacture of plate.
The further improvement of the connecting hole structure in printed circuit board (PCB) of the present invention is, described insulating segment passes throughCircuit pattern on the lamina of wearing is away from the hole wall setting of described insulating segment.
The further improvement of the connecting hole structure in printed circuit board (PCB) of the present invention is, described through hole passes throughDescribed printed circuit board drilling is formed, and described insulating segment is by forming described through hole boring.
The further improvement of the connecting hole structure in printed circuit board (PCB) of the present invention is, described insulating segment withThe junction of described conduction period is positioned at the lamina that described insulating segment is placed in.
The further improvement of the connecting hole structure in printed circuit board (PCB) of the present invention is, on each laminaBe equipped with circuit pattern.
Brief description of the drawings
Fig. 1 is the structural representation of the existing printed circuit board (PCB) with blind hole and through hole; And
Fig. 2 is the schematic diagram of the connecting hole structure in printed circuit board (PCB) of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Refer to shown in Fig. 1, shown the blind hole in existing printed circuit board (PCB), consult Fig. 2, aobviousShow the schematic diagram of the connecting hole structure in printed circuit board (PCB) of the present invention. Compared with existing blind hole, thisConnecting hole structure in bright printed circuit board (PCB) is the design that adopts through hole, only adopts lamination one timeTechnique, by laminated together required lamina, then holes to the printed circuit board (PCB) after lamination,Form through-hole structure, more heavy copper forms conductive copper structure on through-hole wall, above-mentioned technique is with existing skillThe manufacture craft of through hole in art. Then, adopt the drill bit of large-size by unnecessary at the back side of through holeCopper bores, and retains the conductive copper at circuit pattern place on the lamina that needs to be communicated with, and has so just formed thisBright connecting hole structure, has realized the connection of top layer circuit and internal layer circuit below. The present invention adoptsThrough hole forms connecting hole structure, can reduce lamination number of times, only a lamination. This connecting hole knotStructure is by realization that through hole is holed, and production process has been utilized secondary drilling technique, a lamination workSkill, can greatly reduce the cost of manufacture of printed circuit board (PCB). Below in conjunction with accompanying drawing to of the present inventionConnecting hole structure in printed circuit board (PCB) and preparation method thereof describes.
Consult Fig. 2, shown the schematic diagram of the connecting hole structure in printed circuit board (PCB) of the present invention. BelowIn conjunction with Fig. 2, the connecting hole structure in printed circuit board (PCB) of the present invention is described.
As shown in Figure 2, the connecting hole structure in printed circuit board (PCB) of the present invention is located in printed circuit board (PCB),This printed circuit board (PCB) comprises successively the first lamina 11 laminated together, the second lamina 12,Three laminas 13, the 4th lamina 14 and the 5th lamina 15, wherein on the first lamina 11Being provided with circuit pattern 111, the second laminas 12 is provided with on circuit pattern 121, the three ply boards 13Be provided with circuit pattern 131, the four laminas 14 and be provided with circuit pattern 141, the five laminas 15Be provided with circuit pattern 151, printed circuit board (PCB) comprises relative first surface 101 and second 102.Connecting hole structure in printed circuit board (PCB) of the present invention comprises the through hole 40 that runs through printed circuit board (PCB), through hole40 run through the first surface 101 of printed circuit board (PCB) and second 102, and this through hole 40 comprises conduction period 401With insulating segment 402, conduction period 401 is located at first surface 101 between target lamina or be located at secondFace 102 is between target lamina, and in the present embodiment, conduction period 401 is located at first surface 101Between target lamina, this target lamina is the 4th lamina 14 in the present embodiment. ConductingSection 401 hole wall is provided with conductive copper 4011, and conductive copper 4011 is communicated with and is positioned at first surface 101 placesCircuit pattern on circuit pattern on lamina and target lamina, or connection is positioned at secondCircuit pattern on circuit pattern on the lamina at 102 places and target lamina, at the present embodimentIn, this conductive copper 4011 connects on the lamina (i.e. the first lamina 11) at first surface 101 placesCircuit pattern 141 on circuit pattern 111 and target lamina (i.e. the 4th lamina 14), will showThe circuit of layer and internal layer circuit are communicated with. Wherein on insulating segment 402 without conductive copper, be insulated viasPart, does not have conductive copper on hole wall, the aperture of insulating segment 402 is greater than the aperture of conduction period 401.
In the present embodiment, through hole 40 adopts printed circuit board drilling is formed, the insulation of through hole 40The drill bit that section 401 adopts drill bit to be greater than through hole 40 is holed and is formed. Through hole 40 is being adoptedWhen larger drill bit is holed, between the circuit pattern 151 on the 5th lamina 15 and through hole 40Distance tunes up, and while avoiding holing, circuit pattern 151 is produced and is damaged. Electricity on the 5th lamina 15Distance d2 between the hole wall of road pattern 151 and through hole 30 is greater than the circuit on the 3rd lamina 13Distance d1 between the hole wall of pattern 131 and through hole 30, is carrying out the back side of through hole 30 like thisWhen boring, can not have influence on circuit pattern 151 on the 5th lamina 15, boring forms insulating segment 402After, between the circuit pattern 151 on the 5th lamina 15 and the hole wall of insulating segment 402, be also installed withOne fixed gap.
The present invention adopts secondary drilling is carried out in the back side of through hole 30, forms the structure of insulating segment 402,The junction of insulating segment 402 and conduction period 401 is positioned at the 4th lamina 14, wherein conduction period 401There is fraction to extend in the 4th lamina 14, prevent that boring is to the circuit diagram on the 4th lamina 14Case 141 impacts.
Each lamina on printed circuit board (PCB) is provided with circuit pattern, at printed circuit patternTime, need the consideration later stage to form the position of blind hole, the circuit pattern on corresponding lamina is designed,Between circuit pattern on the lamina that does not need to be communicated with and setting blind hole position, stay and establish space, need to connectCircuit pattern on logical circuit board is connected with setting blind hole position, heavy after boring forms through hole like thisCopper forms when conductive copper, can ensure that conductive copper is communicated with the circuit pattern on corresponding lamina, realityNow be communicated with the function of top layer circuit and internal layer circuit.
The beneficial effect of the connecting hole structure in printed circuit board (PCB) of the present invention is:
Adopt through hole to form connecting hole structure, reach the effect suitable with blind hole, on processing procedure, can subtractSubstratum is pressed number of times, only a lamination. This connecting hole structure is by realization that through hole is holed,Production process has been utilized secondary drilling technique, and a laminating technology is compared existing connecting hole structure and adoptedRepeatedly lamination in laminating, can greatly reduce the cost of manufacture of printed circuit board (PCB).
Below in conjunction with accompanying drawing, the preparation method of the connecting hole structure in printed circuit board (PCB) of the present invention is carried outExplanation.
In printed circuit board (PCB) of the present invention, the preparation method of connecting hole comprises:
Shown in Fig. 2, multiple laminas are pressed together, form printed circuit board (PCB), this printingCircuit board comprises relative first surface 101 and second 102; Blind to needing on printed circuit board (PCB) to arrangeHoling in the position in hole, forms through hole 30, and through hole 30 connects the first surface 101 of printed circuit board (PCB)With second 102; Deposited copper on the inner hole wall of through hole 30, forms conductive copper 301; To through hole30 hole, and the size of drill bit is greater than through hole 30 internal diameters, from first surface 101 or second 102Be drilled into target lamina place, the conductive copper 301 at the lamina place that does not need conducting is bored, form bandThere are the conduction period 401 of conductive copper 4011 and the insulating segment 402 without conductive copper, insulating segment 402Aperture be greater than the aperture of conduction period 401, see through with the conduction period 401 of conductive copper 4011 theCircuit pattern on circuit pattern on the lamina at two 102 places and target lamina be communicated with orCircuit pattern on circuit pattern on the lamina at first surface 101 places and target lamina is communicated with,Formation is from the blind hole structure of the lamina connection target lamina of second 102 or from first surfaceThe lamina at 101 places is communicated with the blind hole structure of target lamina.
In the present embodiment, printed circuit board (PCB) comprises the first lamina 11, the second lamina 12,Three laminas 13, the 3rd lamina 14 and the 5th lamina 15, each lamina lamination itBefore be equipped with circuit pattern, the first lamina 11 is provided with circuit pattern 111, the second laminas 12Be provided with circuit pattern 121, the three laminas 13 and be provided with circuit pattern 131, the four laminas14 are provided with circuit pattern 141, the five laminas 15 is provided with circuit pattern 151, at laminaOn when circuit pattern is set, need design in advance the position that starts blind hole, below with in Fig. 2Through hole 30 places are that example describes, and the printed circuit board drilling after lamination is formed to through hole 30, are enteringWhen the circuit pattern of row on each lamina arranges, the second lamina 12, the 3rd lamina 13, withAnd the 5th be installed with between circuit pattern 121,131,151 on lamina 15 and the position of through hole 30Space, d1 as shown in Figure 2, especially, because rear extended meeting is carried out again the back side of through hole 30Boring, between circuit pattern 151 and through hole 30, distance d2 is bigger, and d2 is greater than d1, for guaranteeingWhile again boring, can not affect circuit pattern 151. And the first lamina 11 and the 4th lamina 14Upper circuit pattern 111,141 need be communicated with the conductive copper 301 on through hole 30, and circuit pattern is being set111 and when circuit pattern 141, cover the position of through hole 30, form through hole 30 in boring and sinkAfter copper, conductive copper 201 and circuit pattern 111 and circuit pattern 141 are communicated with. To through hole 30Carry out secondary drilling, should be noted that borehole drilling, to the endface position near the 4th lamina 14, makesConduction period 401 leaves an extension in the 4th lamina 14, prevents that boring is too deeply to the 4th individual layerCircuit pattern 141 on plate 14 exerts an influence.
The beneficial effect of the preparation method of the connecting hole structure in printed circuit board (PCB) of the present invention is:
Adopt through hole to form connecting hole structure, reach the effect suitable with blind hole, on processing procedure, can subtractSubstratum is pressed number of times, only a lamination. This connecting hole structure is by realization that through hole is holed,Production process has been utilized secondary drilling technique, and a laminating technology is compared existing connecting hole structure and adoptedRepeatedly lamination in laminating, can greatly reduce the cost of manufacture of printed circuit board (PCB).
Below embodiment has been described in detail the present invention by reference to the accompanying drawings, ordinary skill people in this areaMember can make many variations example to the present invention according to the above description. Thereby, some details in embodimentShould not form limitation of the invention, the present invention by the scope defining using appended claims as thisThe protection domain of invention.
Claims (10)
1. a preparation method for connecting hole in printed circuit board (PCB), is characterized in that, comprising:
Multiple laminas are pressed together, form printed circuit board (PCB), described printed circuit board (PCB) comprises phaseRight first surface and second;
On described printed circuit board (PCB), form through hole, described through hole connects described first surface and described secondFace;
Deposited copper on the inwall of described through hole, forms conductive copper; And
Described through hole is holed, be drilled into target lamina from described first surface or described the second facePlace, bores the conductive copper on described through-hole wall, makes described through hole form leading with conductive copperLead to section and the insulating segment without conductive copper, the conduction period that sees through described through hole makes described second or instituteThe circuit pattern of stating on the lamina at first surface place is connected with the circuit pattern on described target laminaLogical.
2. the preparation method of connecting hole in printed circuit board (PCB) as claimed in claim 1, its feature existsIn, before described through hole is holed, the circuit pattern on lamina to be holed is led to away from describedHole arranges, and increases the distance between circuit pattern on described through hole and described lamina.
3. the preparation method of connecting hole in printed circuit board (PCB) as claimed in claim 1, its feature existsIn, adopt size to be greater than the drill bit of described through hole, described through hole is holed, bore unwantedConductive copper, forms described insulating segment.
4. the preparation method of connecting hole in printed circuit board (PCB) as claimed in claim 1, its feature existsIn, on each lamina, be equipped with circuit pattern.
5. the preparation method of connecting hole in printed circuit board (PCB) as claimed in claim 1, its feature existsIn, when described through hole is holed, be drilled into the endface position of described target lamina, make to formConduction period in another lamina of contiguous described target lamina, leave extension.
6. the connecting hole structure in printed circuit board (PCB), described printed circuit board (PCB) comprises and is laminated to oneThe multiple laminas that rise, described printed circuit board (PCB) comprises relative first surface and second, its feature existsComprise the through hole that runs through described printed circuit board (PCB) first surface and second, institute in, described connecting hole structureState through hole and comprise conduction period and insulating segment, described conduction period be located at described first surface to target lamina itBetween or be located at described second between described target lamina, the hole wall of described conduction period is provided with leadsElectrolytic copper, described conductive copper is communicated with the electricity being positioned on described first surface place or described second lamina of locatingCircuit pattern on road pattern and described target lamina.
7. the connecting hole structure in printed circuit board (PCB) as claimed in claim 6, is characterized in that,Between circuit pattern on the lamina that described insulating segment runs through and the hole wall of described insulating segment, be installed withSpace.
8. the connecting hole structure in printed circuit board (PCB) as claimed in claim 7, is characterized in that,Described through hole is by described printed circuit board drilling is formed, and described insulating segment is by boring described through holeHole forms.
9. the connecting hole structure in printed circuit board (PCB) as claimed in claim 8, is characterized in that,The junction of described insulating segment and described conduction period is positioned at the lamina that described insulating segment is placed in.
10. the connecting hole structure in printed circuit board (PCB) as claimed in claim 6, is characterized in that,On each lamina, be equipped with circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557969.9A CN105592626A (en) | 2014-10-20 | 2014-10-20 | Connecting hole structure in printed circuit board and manufacturing method of connecting hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557969.9A CN105592626A (en) | 2014-10-20 | 2014-10-20 | Connecting hole structure in printed circuit board and manufacturing method of connecting hole structure |
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| CN105592626A true CN105592626A (en) | 2016-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410557969.9A Pending CN105592626A (en) | 2014-10-20 | 2014-10-20 | Connecting hole structure in printed circuit board and manufacturing method of connecting hole structure |
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| CN111642085A (en) * | 2020-06-19 | 2020-09-08 | 苏州浪潮智能科技有限公司 | Printed circuit board manufacturing method, system, equipment and computer storage medium |
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Application publication date: 20160518 |