CN104582292A - Thick copper circuit board processing method - Google Patents
Thick copper circuit board processing method Download PDFInfo
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- CN104582292A CN104582292A CN201310493292.2A CN201310493292A CN104582292A CN 104582292 A CN104582292 A CN 104582292A CN 201310493292 A CN201310493292 A CN 201310493292A CN 104582292 A CN104582292 A CN 104582292A
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- groove
- copper coin
- location hole
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- dark
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a thick copper circuit board processing method. The method comprises the following steps: etching a first groove in the area, where a circuit pattern does not need to be formed, of a first surface of a copper board through etching; laminating an insulation layer on the first surface of the copper plate; processing a second groove communicated with the first groove in the area, where a circuit pattern does not need to be formed, of a second surface opposite to the first surface through the deep milling control process, so as to form a circuit pattern. Through the method adopting the technical scheme, influence of side etching can be greatly reduced, so that a circuit with enough precision can be produced, and the technical problem in the prior art that production of the precision circuit on the thick copper circuit board is hard is solved.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of processing method of heavy copper circuit board.
Background technology
Along with power supply product walks the increase of big current demand, its copper is thick more and more thicker, and loaded current is increasing, and proof voltage requires more and more higher, and meanwhile, circuit is also more and more intensive; When copper thick more than 1mm after, conventional etch process making fine-line and figure is adopted to there will be more problem, mainly limit because of because of etching factor the serious lateral erosion problem caused, the situation of owing corrosion or excessive erosion is easily there is during processing fine-line, thus cause, substantially cannot make fine-line.
Summary of the invention
The embodiment of the present invention provides a kind of processing method of heavy copper circuit board, to solve the technical problem that existing prior art is difficult to make fine-line on heavy copper circuit board.
First aspect present invention provides a kind of processing method of heavy copper circuit board, comprising:
At the first surface of copper coin, etch process is adopted to etch the first groove not needing to form the region of line pattern; At the first surface lamination insulating barrier of described copper coin; At relative with first surface second of described copper coin, adopt the second groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove, thus form line pattern.
First aspect present invention provides the processing method of another kind of heavy copper circuit board, comprising:
At the first surface of the first copper coin, etch process is adopted to etch the first groove not needing to form the region of line pattern; And, at the first surface of the second copper coin, adopt etch process to etch the second groove not needing to form the region of line pattern; Insulating barrier is provided, described first copper coin and described insulating barrier and described second copper plate layer are pressed into one, and the first surface of described first copper coin and the second copper coin is all towards described insulating barrier; At relative with first surface second of described first copper coin, adopt the 3rd groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove, thus form first line figure; And, at relative with first surface second of described second copper coin, adopt the 4th groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described second groove, thus form the second line pattern.
The embodiment of the present invention adopts one side etching, the technical scheme of the dark milling of another side control, make etch depth can reduce about half relative to conventional wet etch process, therefore, significantly can reduce the impact of lateral erosion, produced the fine and closely woven circuit with enough accuracy, solved the technical problem that prior art is difficult to make fine-line on heavy copper circuit board.
Accompanying drawing explanation
Fig. 1 is the flow chart of the processing method of the heavy copper circuit board that one embodiment of the invention provides;
Fig. 2 is schematic diagram copper coin being carried out to one side etching;
Fig. 3 is the schematic diagram of lamination insulating barrier on copper coin;
Fig. 4 is schematic diagram copper coin another side being controlled to dark milling;
Fig. 5 is the flow chart of the processing method of the heavy copper circuit board that another embodiment of the present invention provides;
Fig. 6 is schematic diagram copper coin being carried out to one side etching;
Fig. 7 is the schematic diagram of lamination insulating barrier on copper coin;
Fig. 8 is schematic diagram copper coin another side being controlled to dark milling.
Embodiment
The embodiment of the present invention provides a kind of processing method of heavy copper circuit board, to solve the technical problem that existing prior art is difficult to make fine-line on heavy copper circuit board.The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
At present, for the thick circuit board more than 1mm of copper, the processes of two-sided etching or Double Milling can be adopted.But all there is certain problem in these two kinds of techniques.
Double Milling technique, needs first to carry out controlling dark milling in the one side of copper coin, then carry out controlling dark milling at another side, that is, control dark milling twice, thus, easily occur Burr Problem, and the process velocity controlling dark milling is slower.In addition, the lower cutter precision controlling dark milling is not easy to control, when the complete copper coin first surface of milling and after lamination, be easy to lower cutter when controlling dark milling to second cross dark and hurt resin bed, further, if the design of thick copper coin is at internal layer, the starved after causing again lamination and layering is also easy to.
Double-sided etching process, needs first at a facet etch certain depth of copper coin, then at another side by remaining partially-etched removal, thus remove the region not needing to form line pattern completely.Due to the impact of lateral erosion all can be subject to during two facet etches, easily occurring owing corrosion or the problem of excessive erosion, in order to ensure that contiguous line pattern can not short circuit, just cannot make the very little fine-line of distance between centers of tracks.
In addition, the alignment mode that current Double Milling and two-sided etching adopt is: directly on copper coin, make target aligning graph with inner figure, after etching target patterns, adopts target patterns to do Double Milling or two-sided etching registration holes.Above localization method is used on general thick copper, such as below 12OZ can also realize, if but be used in the copper of more than 20OZ thick time, because copper is too thick, carry out lamination after etching one side or mill off one side, bore target machine and cannot penetrate thick copper identification target point, alignment system can be caused abnormal.In addition, said method is that first figure bores target again, and thus the different alignment system of two covers also can have a strong impact on aligning accuracy.
To sum up, for the heavy copper circuit board more than more than 12OZ, it is more to there is burr in Double Milling technique, easy injury resin bed, and the problem of starved and layering can be caused, then there is the problem limited in one's ability of processing fine-line in double-sided etching process, above-mentioned two kinds of techniques also exist two-sided man-hour and the different layers of adding of same layer simultaneously and add the not high problem of the positioning precision in man-hour.
For the problems referred to above, the invention provides the processing method of following thick copper circuit.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of heavy copper circuit board, comprising:
110, at the first surface of copper coin, etch process is adopted to etch the first groove not needing to form the region of line pattern.
Copper coin described in the present embodiment is generally the copper coin of more than 1mm thickness, and its concrete thickness can be determined according to required current capacity.Because copper coin is thicker, if at copper coin one side circuit etching figure, because of serious impact of side etching, and qualified precise circuit can cannot be processed.In the present embodiment, process on the two sides of copper coin respectively, to obtain qualified precise circuit.As shown in Figure 2, in the present embodiment, at the first surface of copper coin 210, adopting etch process processing, by not needing the region etching forming line pattern to remove certain depth, forming the first groove 2101.The degree of depth of the first groove 2101 is substantially equal to the half of copper coin 210 thickness, can be specifically the 40%-60% of copper coin 210 thickness.
For the ease of following process, before etching step, can first clean copper coin surface, cleaning comprises oil removing, microetch and rough surface process.The step of etching and processing first groove can comprise: according to top layer line requirements, and adopt inner figure and etch process to carry out Graphic transitions, top layer line pattern is determined according to customer requirement; Pattern transfer step comprises subsides dry film, exposure and development, after development, is only needing the region forming circuitous pattern to retain dry film; Then, carrying out one side etching, by not needing the region etching forming line pattern to remove certain depth, forming the first groove; Then, dry film is removed.
In practical application, usually adopt the copper coin of 1-1.2mm thickness to process heavy copper circuit board, then, in this etching step, the first groove that the degree of depth is 0.4-0.6 millimeter can be etched, to reduce the impact of lateral erosion.
120, at the first surface lamination insulating barrier of described copper coin.
As shown in Figure 3, after etching the first surface of copper coin 210, at first surface lamination insulating barrier 220, this insulating barrier 220 can be played a supporting role, so that next step is processed the second face of copper coin 210.Described insulating barrier 220 can comprise the above prepreg of one deck (PP sheet), and the configuration number of plies of PP is determined according to the factor such as etch depth of previous step, generally should guarantee that the thickness of insulating barrier 220 is at least more than the degree of depth of the first groove 2101.After lamination, the first groove 2101 is by filling insulating material.
130, at relative with first surface second of described copper coin, adopt the second groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove, thus form line pattern.
As shown in Figure 4, second of copper coin 210 processing in this step, by do not need formed line pattern region, not by etching remove part, remove completely, to obtain required line pattern; Processing technology is selected to adopt the dark miller skill of control, directly by needing the part removed to prune, processes the second groove 2102 of connection first groove 2101, that is, all removes not needing the copper coin forming line pattern region.Be the copper coin of 1-1.2mm for thickness, generally should determine at more than 0.6mm to the dark milling degree of depth of the control of major general's milling cutter, that is, process the second groove that the degree of depth is not less than 0.6mm.The diameter of milling cutter can with diameter than the little 0.1-0.3 millimeter of the spacing of line pattern for Standard Selection, to make the line pitch processed meet designing requirement.
In order to better realize the precision contraposition of the step such as accurate contraposition and lamination of two-sided processing, and avoid starved and layering in follow-up lamination process, the present embodiment can also comprise the step in locating and machining hole on described copper coin 210 in advance before step 110.The location hole processed can comprise two rivet location hole, and inner figure makes location hole and control dark milling location hole three kinds.Accordingly, follow-up etching step can adopt inner figure to make location hole and position, and lamination step can adopt two rivet location hole to position, and controls dark milling step and the dark milling location hole of control can be adopted to position.
Preferably, same software control system can be adopted to be got out by above-mentioned three kinds of location holes, well to ensure layer and layer and the contraposition with sandwich circuit simultaneously.The application flow adopting above-mentioned location hole to locate comprises: after above three kinds of location holes get out, and adopts inner figure registration holes to carry out Graphic transitions at copper coin first surface, is covered by other location hole dry films, etch; After having etched, adopt two rivet location hole as lamination location hole, carry out lamination; After lamination completes, controlling dark milling location hole can be filled by dielectric; Control in dark milling step, boring target drone needs to punch on the dark milling location hole of this control according to the dark milling location hole figure of control to position again, if the dark milling registration holes of the control of the first copper coin and the second copper coin does not have deviation, will be easy to drilled target drone and drill; If there is deviation, bores target drone and will get on another copper coin after the dark milling location hole of the control drilling a copper coin, cause being difficult to continue boring; Thus contraposition just can be checked out whether to have deviation.
In a kind of execution mode, in order to control etch depth, avoiding controlling dark milling and hurting insulating barrier, before etching step, can control the dark milling degree of depth in the etching corner of copper coin is the step groove of 0.5mm, and the non-step surface dry film of step groove covers, and only exposes step groove.Whether, during etching, only need the copper monitored in step groove to etch totally, whether the thick degree of depth of copper can knowing first time one side etching is control dark milling precision at 0.5+/-0.075mm(0.075mm) scope in.By above-mentioned technique, be not only convenient to control etch depth, good foundation and reference value can also be provided for the lower cutter degree of depth controlling the other face of dark milling after lamination.Excessive to avoid the controlling dark milling degree of depth, the resin of milling cutter to insulating barrier caused dark injury, it also avoid starved and layering after lamination.
To sum up, embodiments provide a kind of processing method of heavy copper circuit board, the method adopts one side etching, the technical scheme of the dark milling of another side control, the fine and closely woven circuit with enough accuracy can be produced, solve the technical problem that prior art is difficult to make fine-line on heavy copper circuit board.And further solve that figure contraposition in heavy copper circuit board manufacturing process is forbidden, the technical barrier of burr, starved and layering.
Relative to customary etch line pattern technique, in the present embodiment, etch depth can reduce about half, therefore, significantly can reduce the impact of lateral erosion, avoids excessive erosion or owes corrosion, being produced the fine and closely woven circuit with enough accuracy.
Control dark Milling Machining line pattern technique relative to routine, control the dark milling degree of depth in the present embodiment and reduce about half, and very slow owing to controlling dark milling speed, therefore, working (machining) efficiency significantly can be improved; Further, can avoiding because controlling dark milling precision not high, easily because the degree of depth crosses major injury layer insulation medium, affecting withstand voltage problem.
Relative to the dark miller skill of two-sided control, the present embodiment technical scheme decreases the dark milling of a secondary control, therefore can reduce Burr Problem, can improve working (machining) efficiency; Further, control the dark milling degree of depth of control by processing step groove, can avoid injuring insulating barrier, and avoid starved and lamination problem.
Relative to double-sided etching process, the present embodiment technical scheme decreases the impact of owing corrosion or excessive erosion, can produce the fine-line that distance between centers of tracks is less.
In addition, Double Milling and two-sided etching all need to adopt target patterns to carry out two-sided contraposition, but copper coin is thicker such as more than 12OZ and even 20OZ(ounce, thickness unit, 1OZ approximates 0.035mm) time, bore and marking machine is difficult to penetrate thick copper coin identification target patterns, can cause cannot contraposition, the present embodiment technical scheme, then by processing three kinds of location holes, achieve accurate contraposition.
Embodiment two,
Please refer to Fig. 5, the embodiment of the present invention provides a kind of processing method of heavy copper circuit board, comprising:
510, as shown in Figure 6, at the first surface of the first copper coin 310, etch process is adopted to etch the first groove 3101 not needing to form the region of line pattern; And, at the first surface of the second copper coin 320, adopt etch process to etch the second groove 3201 not needing to form the region of line pattern;
520, as shown in Figure 7, provide insulating barrier 330, described first copper coin 310 and described insulating barrier 330 and described second copper coin 330 are laminated to one, make the first surface of described first copper coin 310 and the second copper coin 320 all towards described insulating barrier 330;
530, as shown in Figure 8, at relative with first surface second of described first copper coin 310, adopt the 3rd groove 3102 that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove 3101, thus form first line figure 3103; And, at relative with first surface second of described second copper coin 320, adopt the 4th groove 3202 that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described second groove 3201, thus form the second line pattern 3203.
Optionally, the present embodiment method can also comprise: locating and machining hole on described first and second copper coins in advance, and described location hole comprises two rivet location hole, and inner figure makes location hole and the dark milling location hole of control; Accordingly, described etching step adopts described inner figure to make location hole and positions, and described lamination step adopts described pair of rivet location hole to position, and described control dark milling step adopts the dark milling location hole of described control to position.
Optionally, the thickness of described first copper coin and the second copper coin is all between 1-1.2 millimeter; In described etching step, etch the first groove and the second groove that the degree of depth is 0.4-0.6 millimeter; Accordingly, in the dark milling step of described control, process the 3rd groove and the 4th groove that the degree of depth is not less than 0.6 millimeter.
Optionally, in the dark milling step of described control, with than the little 0.1-0.3 millimeter of the spacing of described line pattern for diameter criteria selects milling cutter.
To sum up, embodiments provide a kind of processing method of heavy copper circuit board, the method adopts one side etching, the technical scheme of the dark milling of another side control, the fine and closely woven circuit with enough accuracy can be produced, solve the technical problem that prior art is difficult to make fine-line on heavy copper circuit board.About the more detailed description of the present embodiment method, please refer to the description in embodiment one.
Above the processing method of the heavy copper circuit board that the embodiment of the present invention provides is described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art are in the technical scope that the present invention discloses, and the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a processing method for heavy copper circuit board, is characterized in that, comprising:
At the first surface of copper coin, etch process is adopted to etch the first groove not needing to form the region of line pattern;
At the first surface lamination insulating barrier of described copper coin;
At relative with first surface second of described copper coin, adopt the second groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove, thus form line pattern.
2. method according to claim 1, is characterized in that, also comprises:
Locating and machining hole on described copper coin in advance, described location hole comprises two rivet location hole, and inner figure makes location hole and the dark milling location hole of control;
Accordingly, described etching step adopts described inner figure to make location hole and positions, and described lamination step adopts described pair of rivet location hole to position, and described control dark milling step adopts the dark milling location hole of described control to position.
3. method according to claim 1, is characterized in that:
The thickness of described copper coin is between 1-1.2 millimeter;
In described etching step, etch the first groove that the degree of depth is 0.4-0.6 millimeter;
Accordingly, in the dark milling step of described control, process the second groove that the degree of depth is not less than 0.6 millimeter.
4. method according to claim 1, is characterized in that:
In the dark milling step of described control, the diameter 0.1-0.3 millimeter less of the spacing of described line pattern of milling cutter.
5. a processing method for heavy copper circuit board, is characterized in that, comprising:
At the first surface of the first copper coin, etch process is adopted to etch the first groove not needing to form the region of line pattern; And, at the first surface of the second copper coin, adopt etch process to etch the second groove not needing to form the region of line pattern;
Insulating barrier is provided, described first copper coin and described insulating barrier and described second copper plate layer are pressed into one, and the first surface of described first copper coin and the second copper coin is all towards described insulating barrier;
At relative with first surface second of described first copper coin, adopt the 3rd groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described first groove, thus form first line figure; And, at relative with first surface second of described second copper coin, adopt the 4th groove that the dark miller skill of control is not needing the region processing forming line pattern to be communicated with described second groove, thus form the second line pattern.
6. method according to claim 5, is characterized in that, also comprises:
Locating and machining hole on described first and second copper coins in advance, described location hole comprises two rivet location hole, and inner figure makes location hole and the dark milling location hole of control;
Accordingly, described etching step adopts described inner figure to make location hole and positions, and described lamination step adopts described pair of rivet location hole to position, and described control dark milling step adopts the dark milling location hole of described control to position.
7. method according to claim 5, is characterized in that:
The thickness of described first copper coin and the second copper coin is all between 1-1.2 millimeter;
In described etching step, etch the first groove and the second groove that the degree of depth is 0.4-0.6 millimeter;
Accordingly, in the dark milling step of described control, process the 3rd groove and the 4th groove that the degree of depth is not less than 0.6 millimeter.
8. method according to claim 5, is characterized in that:
In the dark milling step of described control, the diameter 0.1-0.3 millimeter less of the spacing of described line pattern of milling cutter.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310493292.2A CN104582292B (en) | 2013-10-18 | 2013-10-18 | A kind of processing method of heavy copper circuit board |
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| CN201310493292.2A CN104582292B (en) | 2013-10-18 | 2013-10-18 | A kind of processing method of heavy copper circuit board |
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| CN104582292A true CN104582292A (en) | 2015-04-29 |
| CN104582292B CN104582292B (en) | 2018-01-26 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN105430925A (en) * | 2015-12-21 | 2016-03-23 | 深圳市迅捷兴电路技术有限公司 | Fabrication method of thick copper circuit board |
| CN105960102A (en) * | 2016-05-31 | 2016-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of high-copper thick type printed circuit board |
| CN110087397A (en) * | 2019-03-28 | 2019-08-02 | 深圳市众阳电路科技有限公司 | A kind of PCB thickness copper sheet segmentation etch method |
| CN110944455A (en) * | 2019-12-23 | 2020-03-31 | 东莞市五株电子科技有限公司 | Positioning hole-free routing method, printed circuit single board and connecting board |
| CN111479401A (en) * | 2020-04-28 | 2020-07-31 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| CN113692124A (en) * | 2021-07-21 | 2021-11-23 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
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| US7008549B2 (en) * | 2003-03-26 | 2006-03-07 | Dowa Mining Co., Ltd. | Circuit board, process for producing the same and a power module employing the same |
| CN103188875A (en) * | 2011-12-29 | 2013-07-03 | 深南电路有限公司 | Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7008549B2 (en) * | 2003-03-26 | 2006-03-07 | Dowa Mining Co., Ltd. | Circuit board, process for producing the same and a power module employing the same |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN105430925A (en) * | 2015-12-21 | 2016-03-23 | 深圳市迅捷兴电路技术有限公司 | Fabrication method of thick copper circuit board |
| CN105430925B (en) * | 2015-12-21 | 2018-06-01 | 深圳市迅捷兴科技股份有限公司 | Thick copper circuit board manufacturing method |
| CN105960102A (en) * | 2016-05-31 | 2016-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of high-copper thick type printed circuit board |
| CN105960102B (en) * | 2016-05-31 | 2019-03-29 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method of high-copper thicker printed circuit board |
| CN110087397A (en) * | 2019-03-28 | 2019-08-02 | 深圳市众阳电路科技有限公司 | A kind of PCB thickness copper sheet segmentation etch method |
| CN110944455A (en) * | 2019-12-23 | 2020-03-31 | 东莞市五株电子科技有限公司 | Positioning hole-free routing method, printed circuit single board and connecting board |
| CN111479401A (en) * | 2020-04-28 | 2020-07-31 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| CN113692124A (en) * | 2021-07-21 | 2021-11-23 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
| CN113692124B (en) * | 2021-07-21 | 2022-08-02 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
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| CN104582292B (en) | 2018-01-26 |
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