CN1773670A - 基板处理方法以及基板处理装置 - Google Patents
基板处理方法以及基板处理装置 Download PDFInfo
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- CN1773670A CN1773670A CNA2005101204399A CN200510120439A CN1773670A CN 1773670 A CN1773670 A CN 1773670A CN A2005101204399 A CNA2005101204399 A CN A2005101204399A CN 200510120439 A CN200510120439 A CN 200510120439A CN 1773670 A CN1773670 A CN 1773670A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004327930A JP4498893B2 (ja) | 2004-11-11 | 2004-11-11 | 基板処理方法および基板処理装置 |
JP2004327930 | 2004-11-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1773670A true CN1773670A (zh) | 2006-05-17 |
CN100367453C CN100367453C (zh) | 2008-02-06 |
Family
ID=36316635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101204399A Active CN100367453C (zh) | 2004-11-11 | 2005-11-10 | 基板处理方法以及基板处理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7682456B2 (zh) |
JP (1) | JP4498893B2 (zh) |
CN (1) | CN100367453C (zh) |
TW (1) | TWI275123B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101226336B (zh) * | 2007-01-19 | 2011-05-18 | 富士通半导体股份有限公司 | 利用液体形成涂层的方法以及半导体器件的制造方法 |
US7964042B2 (en) | 2007-07-30 | 2011-06-21 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN104862772A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备(上海)有限公司 | 电化学抛光装置及方法 |
CN104941948A (zh) * | 2014-03-26 | 2015-09-30 | 斯克林集团公司 | 基板清洗方法及基板清洗装置 |
CN109791883A (zh) * | 2016-09-16 | 2019-05-21 | 株式会社斯库林集团 | 基板处理方法、基板处理装置 |
CN113532065A (zh) * | 2020-04-16 | 2021-10-22 | 杰宜斯科技有限公司 | 基板处理装置及方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4653018B2 (ja) * | 2006-06-02 | 2011-03-16 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP2008034779A (ja) * | 2006-06-27 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP4812563B2 (ja) * | 2006-08-29 | 2011-11-09 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
JP5188216B2 (ja) * | 2007-07-30 | 2013-04-24 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
DE102007044787A1 (de) * | 2007-09-19 | 2009-04-02 | Siltronic Ag | Verfahren zum Reinigen einer Halbleiterscheibe |
JP5192853B2 (ja) * | 2008-03-06 | 2013-05-08 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
JP5016525B2 (ja) * | 2008-03-12 | 2012-09-05 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
KR101992660B1 (ko) * | 2012-11-28 | 2019-09-30 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 반도체 웨이퍼의 세정 방법 및 장치 |
TWI546878B (zh) * | 2012-12-28 | 2016-08-21 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
JP6379400B2 (ja) * | 2013-09-26 | 2018-08-29 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP6593920B2 (ja) * | 2015-08-18 | 2019-10-23 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP6046225B2 (ja) * | 2015-10-05 | 2016-12-14 | 東京エレクトロン株式会社 | 基板処理方法、この基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体、および基板処理装置 |
JP6764288B2 (ja) | 2016-09-12 | 2020-09-30 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP7303688B2 (ja) * | 2019-07-31 | 2023-07-05 | 株式会社ディスコ | ウエットエッチング方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3341873B2 (ja) | 1995-06-19 | 2002-11-05 | 大日本スクリーン製造株式会社 | 基板洗浄方法およびそれに使用する基板洗浄装置 |
US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
US6071831A (en) * | 1998-08-17 | 2000-06-06 | Taiwan Semiconductor Manufacturing Company | Method of reducing spiral defects by adding an isopropyl alcohol rinse step before depositing sog |
EP1077473A2 (en) * | 1999-08-19 | 2001-02-21 | Lucent Technologies Inc. | Method and apparatus for cleaning a surface of a semiconductor wafer |
US6594847B1 (en) * | 2000-03-28 | 2003-07-22 | Lam Research Corporation | Single wafer residue, thin film removal and clean |
JP4532776B2 (ja) * | 2001-05-07 | 2010-08-25 | パナソニック株式会社 | 基板洗浄方法及び電子デバイスの製造方法 |
JP2003124316A (ja) * | 2001-07-12 | 2003-04-25 | Nec Corp | 半導体装置の製造方法及び処理液 |
US6890864B2 (en) | 2001-07-12 | 2005-05-10 | Nec Electronics Corporation | Semiconductor device fabricating method and treating liquid |
JP3973196B2 (ja) * | 2001-12-17 | 2007-09-12 | 東京エレクトロン株式会社 | 液処理方法及び液処理装置 |
JP4494840B2 (ja) * | 2003-06-27 | 2010-06-30 | 大日本スクリーン製造株式会社 | 異物除去装置、基板処理装置および基板処理方法 |
-
2004
- 2004-11-11 JP JP2004327930A patent/JP4498893B2/ja active Active
-
2005
- 2005-11-10 CN CNB2005101204399A patent/CN100367453C/zh active Active
- 2005-11-11 TW TW094139575A patent/TWI275123B/zh active
- 2005-11-11 US US11/272,600 patent/US7682456B2/en active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101226336B (zh) * | 2007-01-19 | 2011-05-18 | 富士通半导体股份有限公司 | 利用液体形成涂层的方法以及半导体器件的制造方法 |
US7964042B2 (en) | 2007-07-30 | 2011-06-21 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN104862772A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备(上海)有限公司 | 电化学抛光装置及方法 |
CN104862772B (zh) * | 2014-02-26 | 2018-09-04 | 盛美半导体设备(上海)有限公司 | 电化学抛光装置及方法 |
CN104941948A (zh) * | 2014-03-26 | 2015-09-30 | 斯克林集团公司 | 基板清洗方法及基板清洗装置 |
CN104941948B (zh) * | 2014-03-26 | 2017-03-22 | 斯克林集团公司 | 基板清洗方法及基板清洗装置 |
CN109791883A (zh) * | 2016-09-16 | 2019-05-21 | 株式会社斯库林集团 | 基板处理方法、基板处理装置 |
CN109791883B (zh) * | 2016-09-16 | 2023-02-28 | 株式会社斯库林集团 | 基板处理方法、基板处理装置 |
CN113532065A (zh) * | 2020-04-16 | 2021-10-22 | 杰宜斯科技有限公司 | 基板处理装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006140285A (ja) | 2006-06-01 |
CN100367453C (zh) | 2008-02-06 |
US7682456B2 (en) | 2010-03-23 |
TWI275123B (en) | 2007-03-01 |
US20060099339A1 (en) | 2006-05-11 |
JP4498893B2 (ja) | 2010-07-07 |
TW200625395A (en) | 2006-07-16 |
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GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |