CN1755526A - 基板处理*** - Google Patents

基板处理*** Download PDF

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Publication number
CN1755526A
CN1755526A CNA2005101079651A CN200510107965A CN1755526A CN 1755526 A CN1755526 A CN 1755526A CN A2005101079651 A CNA2005101079651 A CN A2005101079651A CN 200510107965 A CN200510107965 A CN 200510107965A CN 1755526 A CN1755526 A CN 1755526A
Authority
CN
China
Prior art keywords
substrate
table top
treating
resist
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101079651A
Other languages
English (en)
Chinese (zh)
Inventor
归山武郎
坂井光广
梶原拓伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1755526A publication Critical patent/CN1755526A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
CNA2005101079651A 2004-09-30 2005-09-30 基板处理*** Pending CN1755526A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004287596 2004-09-30
JP2004287596A JP2006100722A (ja) 2004-09-30 2004-09-30 基板処理システム

Publications (1)

Publication Number Publication Date
CN1755526A true CN1755526A (zh) 2006-04-05

Family

ID=36240209

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101079651A Pending CN1755526A (zh) 2004-09-30 2005-09-30 基板处理***

Country Status (4)

Country Link
JP (1) JP2006100722A (ja)
KR (1) KR20060051463A (ja)
CN (1) CN1755526A (ja)
TW (1) TWI281704B (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102166559A (zh) * 2010-01-08 2011-08-31 大日本网屏制造株式会社 基板处理装置
CN102046840B (zh) * 2008-03-25 2012-08-01 奥宝科技Lt太阳能有限公司 处理装置及处理方法
CN102687240A (zh) * 2009-12-28 2012-09-19 龙云株式会社 基板用涂布装置及基板涂布方法
CN101281372B (zh) * 2007-04-04 2012-11-28 细美事有限公司 涂布机及使用该涂布机以涂布溶液涂布基板的方法
CN103199031A (zh) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 全自动胶膜涂覆、显影装置
CN104597716A (zh) * 2013-10-31 2015-05-06 上海和辉光电有限公司 曝光及显影设备以及曝光及显影方法
CN117184835A (zh) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 涂布设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065000A (ja) * 2007-09-07 2009-03-26 Tokyo Electron Ltd 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP4900397B2 (ja) * 2009-01-29 2012-03-21 東京エレクトロン株式会社 液処理装置
JP2011156482A (ja) * 2010-02-01 2011-08-18 Sharp Corp 液体塗布装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101281372B (zh) * 2007-04-04 2012-11-28 细美事有限公司 涂布机及使用该涂布机以涂布溶液涂布基板的方法
CN102046840B (zh) * 2008-03-25 2012-08-01 奥宝科技Lt太阳能有限公司 处理装置及处理方法
CN102687240A (zh) * 2009-12-28 2012-09-19 龙云株式会社 基板用涂布装置及基板涂布方法
CN102166559A (zh) * 2010-01-08 2011-08-31 大日本网屏制造株式会社 基板处理装置
CN102166559B (zh) * 2010-01-08 2013-08-21 大日本网屏制造株式会社 基板处理装置
CN103199031A (zh) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 全自动胶膜涂覆、显影装置
CN103199031B (zh) * 2012-01-04 2015-10-14 沈阳芯源微电子设备有限公司 全自动胶膜涂覆、显影装置
CN104597716A (zh) * 2013-10-31 2015-05-06 上海和辉光电有限公司 曝光及显影设备以及曝光及显影方法
CN117184835A (zh) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 涂布设备

Also Published As

Publication number Publication date
JP2006100722A (ja) 2006-04-13
TWI281704B (en) 2007-05-21
KR20060051463A (ko) 2006-05-19
TW200627519A (en) 2006-08-01

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20060405