CN1662133A - Electronic parts installation device - Google Patents
Electronic parts installation device Download PDFInfo
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- CN1662133A CN1662133A CN 200510051027 CN200510051027A CN1662133A CN 1662133 A CN1662133 A CN 1662133A CN 200510051027 CN200510051027 CN 200510051027 CN 200510051027 A CN200510051027 A CN 200510051027A CN 1662133 A CN1662133 A CN 1662133A
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- 238000009434 installation Methods 0.000 title claims description 91
- 239000000758 substrate Substances 0.000 claims abstract description 240
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 230000007723 transport mechanism Effects 0.000 description 18
- 238000011144 upstream manufacturing Methods 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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Abstract
he objective of the invention is to provide an apparatus for mounting electronic components capable of improving efficiency in mounting work to a substrate. The electronic component mounting device is provided with substrate-holding means 31 and 32 in the middle of the transfer path by transfer means 21 and 22 of a substrate K, a first positioning mechanism that positions the head along the guide frame with the aid of head guide frames 51 and 52 arranged over the transfer path, and a second positioning mechanism that positions the head along the transfer direction. Each head 40 is arranged at the mutually opposite surface side of each guide frame. The heads held by one guide frame and the heads held by the other guide frame perform mounting operation only to the mutually different substrates held by the substrate-holding means.
Description
Technical field
The present invention relates to the electronic component mounting apparatus that a kind of relative substrate is positioned at electronic unit assigned position and installs.
Background technology
[patent documentation 1] spy opens the 2003-243894 communique
In electronic component mounting apparatus in the past, have: the substrate transferring unit, it is along regulation side To carrying out substrate transferring; The substrate maintaining part, it is arranged in the way in substrate transferring path; 2 guiding Frame, it is crossed over the substrate transferring path and arranges along its quadrature direction. And, also have: be used for absorption Head unit along the substrate of each leading truck conveyance; The guiding that leading truck is moved along the substrate transferring direction Travel mechanism; With the supply that is configured in respectively both sides, substrate transferring path across the substrate transferring path each Plant the electronic unit feed unit (for example, with reference to patent document 1) of electronic unit.
And, above-mentioned each electronic unit feed unit constitutes by arrange a plurality of electronic unit feed arrangements set along the substrate transferring direction, and the electronic unit feed unit of both sides all is divided into to the zone of the head unit handing-over electronic unit of a leading truck with to the zone of another head unit handing-over electronic unit.
And, in the installation exercise of electronic unit, at first, utilize the substrate transferring unit to carry out substrate transferring, and remain on the substrate maintaining part.Then, by each leading truck move and along the moving of the head unit of leading truck, each head unit moves back and forth between each the electronic unit feed arrangement of regulation and substrate, thereby carries out the installation of electronic unit.
Above-mentioned electronic component mounting apparatus is in the past realized the downsizing of the shift motion of the head unit on the conveyance direction by in the mutual opposite face side configured head unit of each leading truck, and passes through the high efficiency of the rapidization realization operation of installation exercise.
And, at a head unit substrate being carried out between installation period, another head unit utilizes the electronic unit feed unit to carry out the reception of electronic unit, realizes the further raising of operating efficiency by the control of the installation action that hockets.
But in above-mentioned action control, when the set-up time of a head unit was longer than the electronic unit time of reception of another head unit, another head unit produced the stand-by period, has the inadequate problem of high efficiency of its installation exercise.
Summary of the invention
The objective of the invention is to improve the efficient of installation exercise.
Invention 1 has: the conveyance unit, and it is carried out the substrate that electronic unit is installed along the prescribed direction conveyance; The substrate holding unit, it is located in the way in conveyance path of conveyance unit, is used to carry out the installation exercise of electronic unit; Head unit, it can keep and discharge electronic unit; The leading truck that head unit is used, it crosses over the conveyance path along the direction setting of substrate transferring direction intersection relatively.And, also have: carry out along first detent mechanism of the running fix of the head unit of this leading truck; Leading truck is moved carry out along second detent mechanism of the running fix of the head unit of conveyance direction; Head unit is supplied with the electronic unit feed unit of various electronic units; Carry out the action control unit of the installation action control of the relative substrate of electronic unit.And, adopt following structure: the substrate holding unit and first detent mechanism all respectively are provided with two along the conveyance path, and at the mutual opposite face side configuration head unit separately of the leading truck of each detent mechanism, action control unit is carried out following control: the head unit that is supported by a leading truck the and only substrate that is kept by different mutually substrate holding units is carried out installation action by the head unit that another leading truck supports.
In said structure, by the conveyance unit with two substrates respectively conveyance keep to the substrate maintaining part.And by the cooperation of first and second detent mechanisms, each head unit carries out the reception of electronic unit from the electronic unit feed unit, and only carries out the installation exercise of electronic unit to remaining on substrate on any one the substrate maintaining part that is predetermined.
Like this since each head unit determined the substrate of which substrate maintaining part is carried out installation exercise by leading truck, so do not produce the stand-by period for fear of interference can be when a substrate is installed with two head units.On the other hand, though the electronic unit to unit interval of every substrate is installed number, may be more under the situation that two stature units alternatelies are installed, but in structure of the present invention, owing to two substrates are carried out installation exercise simultaneously, exceed the situation of utilizing two stature units alternatelies to install so the electronic unit in the time per unit of per two substrates is installed number.
Invention 2 has and invention 1 described invention identical structure, and adopts following structure: action control unit is carried out following action and is controlled: will take out of and can't help another substrate holding unit and keep once more with the substrate that a substrate holding unit has carried out installation exercise.
In said structure, move into two substrates, after each substrate maintaining part is carried out installation exercise, take out of together respectively.
Invention 3 has and the identical structure of invention 1 described invention, and adopts following structure: action control unit is carried out following action control: after a substrate is carried out installation action with two substrate maintaining parts, take out of this substrate.
In said structure, when to a substrate, carry out installation exercise with a substrate maintaining part after, its conveyance to another substrate maintaining part, is carried out installation exercise again.In addition, move to the stage of next substrate maintaining part, next substrate is carried out installation exercise with substrate maintaining part nearby, can carry out the installation exercise of forming by two operations thus in order continuously at substrate in advance.
Invention 4 has and invents 1,2 or 3 described any structures that invention is identical, and adopts following structure: be provided with a plurality of head units on each leading truck.
In said structure, each substrate all carries out parts by a plurality of head units and installs.
Invention 5 has and invents the identical structure of 4 described inventions, and adopts following structure: each substrate holding unit is provided with the substrate mobile unit that this substrate holding unit is moved along the conveyance direction.
For example, when there is not the situation of substrate mobile unit in supposition, when a plurality of head units of each leading truck carry out the parts installation to a substrate, when a head unit is installed for relative substrate and when leading truck positioned on the conveyance direction, other head unit also was located in same position on the conveyance direction.Therefore in the meantime, can not go to carry out the reception of electronic unit, produce the stand-by period.
Therefore, in said structure, when leading truck being located on the conveyance direction, utilize the substrate mobile unit that the substrate maintaining part is moved to along the conveyance direction on the position of regulation, so that other head unit can carry out installation exercise to substrate for the head unit that makes any one receives electronic unit.Can not establish the stand-by period like this and carry out the reception and the installation of electronic unit concurrently.
In the invention described in the invention 1, owing to determined two head units that the substrate that remains on which substrate maintaining part is carried out installation exercise, so not needing to resemble under the situation that a substrate is installed with two head units be not set the stand-by period that avoids interference, and simultaneously two substrates carried out installation exercise.Therefore, by improving the installation exercise efficient to two substrates, the result can improve the installation exercise efficient of continuous substrate.
And,,, can save the space significantly than the situation that two electronic component mounting apparatus are set in the past because a shared conveyance path is provided with two substrate maintaining parts.
In addition because at the opposite face of two leading trucks two head units of configuration relatively, so compare with the situation that same side at two leading trucks is provided with head unit since between each head unit not across leading truck, correspondingly can make between head unit distance close mutually.And, meanwhile, can be with two substrate maintaining parts near configuration.Therefore, miniaturization that can implement device integral body.
Invent 2 described inventions and need not it is remained on another substrate holding unit once more, carry out the independently installation exercise of two kinds of substrates so can walk abreast by this control owing to taking out of with the substrate that a substrate holding unit has carried out installation exercise.In addition, independently the installation exercise of two kinds of substrates is not meant the installation exercise of being mutually related that has the when part that for example should be installed in the electronic unit on the substrate and other parts are installed respectively, but is illustrated in the installation exercise on two kinds of different substrates.
Invent 3 described inventions, owing to a substrate is shifted into two substrate maintaining parts and carries out installation exercise respectively by it, so can carry out the installation exercise of forming by two operations in order continuously.Therefore, can carry out installation exercise expeditiously to a plurality of substrates.
Invent 4 described inventions because each substrate is carried out the parts installation by a plurality of head units, so can realize the further high efficiency of operation.
Invent 5 described inventions and utilize the substrate mobile unit under the state of having located leading truck, the electronic unit that carries out any one head unit of can walking abreast receives and the electronic unit of other head unit is installed, and can realize the further high efficiency of installation exercise.
Description of drawings
Fig. 1 is the stereogram of the electronic component mounting apparatus of embodiments of the present invention.
Fig. 2 is the vertical view of electronic component mounting apparatus.
Fig. 3 is the amplification stereogram of head unit shown in Figure 1.
Fig. 4 is the block diagram of the control system of expression electronic component mounting apparatus.
Fig. 5 is the action specification figure of substrate mobile unit shown in Figure 1.
Symbol description
10: electronic component mounting apparatus; 21,22: band transport mechanism (conveyance unit); 31,32: the substrate objective table; 40: head unit; 51,52: leading truck; 70: the electronic unit feed unit; 80: action control unit; K: substrate.
Embodiment
--overall structure of execution mode--
Below, according to Fig. 1 to Fig. 5 the electronic component mounting apparatus 10 of embodiments of the present invention is described.Fig. 1 is the stereogram of electronic component mounting apparatus 10, and Fig. 2 represents vertical view.
In addition, electronic component mounting apparatus 10 is along conveyance direction conveyance substrate K, is fixed on the assigned position in substrate transferring path and the device of electronic unit is installed on this substrate K.
In the following description, the conveyance direction of substrate K is decided to be X-direction, will with the conveyance direction conveyance direction of substrate K roughly the direction of quadrature be decided to be Y direction (with reference to Fig. 1～Fig. 5).
Electronic component mounting apparatus 10 has as depicted in figs. 1 and 2: rectangular box-like base 2; Conveyance unit 21,22 (carrying out conveyance) along X-direction conveyance substrate K in Fig. 2 direction from right to left; Be arranged in the way in conveyance path of conveyance unit 21,22, as the substrate objective table 31,32 of two substrate holding units of the installation exercise that is used to carry out electronic unit.And have: the substrate mobile unit 33,34 that each substrate objective table 31,32 is carried out running fix along X-direction; Can keep and discharge a plurality of head units 40 of electronic unit; Two Y-axis detent mechanisms as first detent mechanism of the running fix of each head unit 40 being carried out Y direction; X-axis detent mechanism as second detent mechanism of the running fix of each head unit 40 being carried out X-direction.And possess the electronic unit feed unit 70 of the various electronic units of each head unit 40 supplies and the action control unit 80 (with reference to Fig. 4) of substrate K being carried out the action control of electronic unit installation.
--base and conveyance unit--
The upper surface of base 2 is formed flatly along X-Y plane, and portion is formed with recess in the central.In the inboard of this recess, hold and dispose each substrate objective table 31,32 and substrate mobile unit 33,34.
The conveyance unit is on the upper surface of base 2, and two band transport mechanisms 21,22 that are provided with respectively by the both ends in the X-direction in the centre position of Y direction constitute.All along the same line configuration along X-direction, the line that disposes this transport mechanism 21,22 becomes the conveyance path with transport mechanism 21,22 for each.
--substrate objective table and substrate mobile unit--
Two substrate objective tables 31,32 at the central portion of base 2 along conveyance path alignment arrangements upstream side and downstream (substrate objective table 31 is a upstream side, and substrate objective table 32 is the downstream).
And each substrate mobile unit 33,34 possesses can guide guide rail that each substrate objective table 31,32 moves along X-direction and the not shown actuator (for example linear motor) of giving the power of moving back and forth along this guide rail.
Utilize this substrate mobile unit 33, substrate objective table 31 moves back and forth between the approximated position of above-mentioned relatively band transport mechanism 21 and the installation exercise position (position shown in Figure 2) near the central authorities of base 2.
In addition, utilize substrate mobile unit 34, substrate objective table 32 moves back and forth between the approximated position near the installation exercise position (position shown in Figure 2) of the central authorities of base 2 and relative above-mentioned band transport mechanism 22.
On the upper surface of each substrate objective table 31,32, be provided with and clamp the not shown clamp system that keeps substrate K along the not shown band mechanism of X-direction conveyance substrate with on the position of regulation.
And the band mechanism of each substrate objective table 31,32 all is configured to consistent with the height of described band transport mechanism 21,22.Like this, substrate objective table 31 is from immediate band transport mechanism 21 handing-over substrate K.
In addition, between substrate objective table 31-32, substrate objective table 31,32 moves to the installation exercise position mutually, under mutual immediate state, carries out the handing-over of substrate by the driving of mutual band mechanism.
And, between the substrate objective table 32 1 band transport mechanisms 22, under substrate objective table 32 and band transport mechanism 22 immediate states, carry out the handing-over of substrate K.
In addition, keeping on each substrate objective table 31,32 under the situation of substrate K, utilize on each substrate objective table 31,32 the not shown substrate sensor that is provided with, the leading section that detects substrate K has arrived the assigned position on the substrate objective table 31,32, starts clamp system thus.Like this, on each substrate objective table 31,32, always under the state that leading section is positioned at assigned position, carry out the maintenance of substrate K.
--electronic unit feed unit--
The Y direction both ends that it is base 2 that electronic unit feed unit 70 is located at across the both sides substrate transferring path, Y direction respectively.
This each electronic unit feed unit 70 is by constituting at a plurality of belts (tape) feed arrangement 71 (feed arrangements) of X-direction alignment arrangements and the feed arrangement platform (バ Application Network) 72 of each belt feed device 71 of mounting.Each belt feed device 71 is following devices: be wound on being with on the spool, for example accommodate the electronic units such as capacitor that are rectangular shape with about equally interval, make electronic unit be exposed to desirable position by this band is sent, each head unit is given in handing-over.In addition, as depicted in figs. 1 and 2, a plurality of belt feed devices 71 of each electronic unit feed unit 70 are divided into a plurality of (being 3 in Fig. 1,2) feed arrangement group and dispose.
--Y-axis detent mechanism--
Two Y-axis detent mechanisms are configured in the upstream side and the downstream of substrate transferring direction (X-direction) respectively on the upper surface of base 2.And the Y-axis detent mechanism of substrate transferring direction upstream side has and supports two head units 40 and make it leading truck 51 that can move along Y direction and the linear motor 53 (with reference to Fig. 4) of giving each head unit 40 amount of movement.And the Y-axis detent mechanism in substrate transferring direction downstream has and supports two head units 40 and make it leading truck 52 that can move along Y direction and the linear motor 54 (with reference to Fig. 4) of giving each head unit 40 amount of movement.
Above-mentioned each leading truck 51,52 be under the state of crossing over the conveyance path and at its length direction for along the roughly member of door shape shape that has that disposes under the state of Y direction.And each leading truck 51,52 all is to support head unit 40 in mutual opposite face side.
In addition, the linear motor of each Y-axis detent mechanism disposes stator along its length direction in each leading truck 51,52, by disposing mover on the head unit 40.And, can position along Y direction each head unit 40 according to its resolution.
--X-axis detent mechanism--
Above-mentioned two leading trucks 51,52 are provided with foot near the bottom both ends separately respectively.On the other hand, the X-axis detent mechanism is at the both ends of the Y direction of the upper surface of base 2, has by each leading truck 51,52 of this foot support to make it the guide rail 61,62 that can move along X-direction; With give the linear motor 63,64 (with reference to Fig. 4) of each leading truck 51,52 along the amount of movement of X-direction.
A linear motor 63 carries out the driving of leading truck 51, and another linear motor 64 carries out the driving of leading truck 52.Like this, can each head unit 40 be positioned along X-direction according to its resolution by each leading truck 51,52.
Utilize the Y-axis detent mechanism of this X-axis detent mechanism and above-mentioned upstream side, two head units 40 that supported by leading truck 51 can move freely in Y direction and X-direction, can move to the receiving port of each belt feed device in part zone of the conveyance direction upstream side of the roughly Zone Full of substrate K of substrate objective table 31 of installation exercise position and two electronic unit feed units 70.
In addition, utilize the Y-axis detent mechanism in X-axis detent mechanism and above-mentioned downstream, two head units 40 that supported by leading truck 52 can move freely in Y direction and X-direction, can move to the receiving port of each belt feed device in the remaining part zone, conveyance direction downstream of the roughly Zone Full of substrate K of substrate objective table 32 of installation exercise position and two electronic unit feed units 70.
At this, the total moving area of the total moving area of two head units 40 of leading truck 51 and two head units 40 of leading truck 52, whole belt feed devices 71 with respect to two electronic unit feed units 70, preferably can both not having omission does not have repeatedly yet and distributes, but can make it produce the setting that part repeats to the electronic unit that the high part of frequency is installed yet.In addition, even in this case, the roughly Zone Full of the substrate K of the substrate objective table 31 of installation exercise position also is set in the total moving area that makes its two head units 40 that only are comprised in leading truck 51.And the roughly Zone Full of the substrate K of the substrate objective table 32 of installation exercise position also is set in the total moving area that makes its two head units 40 that only are comprised in leading truck 52.
In addition, at this, X-axis detent mechanism and each Y-axis detent mechanism also can replace using the travel mechanism of linear motor 53,54,63,64, and adopt the travel mechanism that has made up motor and band, in addition, also can be the travel mechanism that has made up motor and ball-screw.
--head unit--
Fig. 3 represents the stereogram of head unit 40.Each head unit 40 has the main part 41 that supported by separately leading truck 51,52 and in each three total arranged side by side of the upper edge, Y direction both ends of main part 41 X-direction six suction nozzle 42 has been installed.This suction nozzle 42 keeps electronic unit by utilizing not shown getter device to draw in its lower end, in addition, can discharge electronic unit by stopping to draw.In addition, each suction nozzle 42 can be supported on above-below direction movably, when the reception of carrying out electronic unit and installation, can carry out running fix at above-below direction.
--control system of electronic component mounting apparatus--
Fig. 4 is the block diagram of the control system of expression electronic component mounting apparatus 10.As shown in Figure 4, the control system of electronic component mounting apparatus 10 is mainly used in the linear motor 53,54 to the Y-axis detent mechanism, the linear motor 63,64 of X-axis travel mechanism and the linear motor of substrate mobile unit 33,34 and controls.And as shown in Figure 4, its control program that possesses is at least according to the rules carried out the CPU81 of various processing and control and the system ROM82 that storage is used to carry out program, the various processing of various processing and control and controls needed data.And, constitute and comprise: the RAM83 of the working region of the various processing of conduct of store various kinds of data; Realize the I/F that is connected (interface) 84 of CPU81 and various device; Be used to carry out the guidance panel 85 of various setting inputs, operation indication input; Exterior storage medium is carried out the auxilary unit 87 of read/write.In addition, each above-mentioned linear motor is connected with I/F84 by not shown motor driver.
Have the function of auxilary unit 87 performances of above-mentioned CPU81, ROM82, RAM83 and exterior storage medium 86 as the action control unit 80 of the installation action control of carrying out electronic unit.
And, in said external storage medium 86, store the position coordinate data of X-Y coordinate system of installation site of expression electronic unit relative substrate K and the electronic unit that expression should be installed receiving position the X-Y coordinate system position coordinate data with and erection sequence etc.
Above-mentioned CPU81 is according to being stored in the program on the ROM82 and being recorded in expression electronic unit installation site on the exterior storage medium 86 and the position coordinate data of receiving position, the moving range of two head units 40 that restriction is supported by the leading truck 51 of conveyance direction upstream side (Fig. 2 right side).And, in whole of the substrate K of its moving range on comprising the substrate objective table 31 of installation exercise position and the scope (R1 of Fig. 2) to whole receiving positions of 71 groups in the belt feed device of the part of the conveyance direction upstream side of electronic unit feed unit 70.
In addition, CPU81 is according to being stored in the program on the ROM82 and being recorded in expression electronic unit installation site on the exterior storage medium 86 and the position coordinate data of receiving position moves control.And restriction is by the moving range of two head units 40 of leading truck 52 supports in conveyance direction downstream (Fig. 2 left side).And, in whole of the substrate K of its moving range on comprising the substrate objective table 32 of installation exercise position and the scope (R2 of Fig. 2) to whole receiving positions of 71 groups in the belt feed device of the residue part in the conveyance direction downstream of electronic unit feed unit 70.
And the moving area R2 that sets two head units 40 that make the moving area R1 of two head units 40 being supported by leading truck 51 and supported by leading truck 52 does not produce repetition, still, comprises whole belt feed devices 71 altogether.
In addition, CPU81 is according to the program that is stored on the ROM82, by being located at band mechanism on the substrate objective table 31, being located at the cooperation of band mechanism, substrate mobile unit 34 and band transport mechanism 22 on the substrate objective table 32, the substrate K of installation that carries out carrying out electronic unit on substrate objective table 31 is to the outside action control of taking out of of device.
In addition, CPU81 is according to the program that is stored on the ROM82, by being located at the cooperation of band mechanism, substrate mobile unit 34 and band transport mechanism 22 on the substrate objective table 32, the substrate K that carries out carrying out the installation of electronic unit on substrate objective table 32 controls to the outside action of taking out of of device.
That is,,, on another substrate objective table, do not carry out next installation and just take out of the auto levelizer outside on substrate objective table 31,32, having carried out the substrate K that installs by above-mentioned two action controls.
In addition, as shown in Figure 5, CPU81 is according to the program that is stored on the ROM82, about two head units 40 that support by same leading truck 51 (52), when a head unit 40 is positioned on the receiving position in order to receive electronic unit from one of them belt feed device 71, on Y direction, utilize linear motor 53 (54) another head unit 40 to be positioned at the installation site of regulation.And, meanwhile, make on its installation site that reaches regulation utilizing substrate mobile unit 33 (34) that head unit 40 and substrate K are carried out relative positioning on the X-direction.
Promptly, when on the receiving position of any one the belt feed device 71 that a head unit 40 (head unit of the upside of Fig. 5) is positioned at electronic unit feed unit 70, another head unit 40 that is supported by same leading truck 51 (52) also is fixed in same position on X-direction.Therefore, this another head unit 40 can only carry out in Y direction to the location of the installation site of substrate K.So, carry out following action control under this situation: utilize substrate mobile unit 33 (34) that substrate objective table 31 (32) is moved in X-direction from the installation exercise position, and on X-direction, head unit 40 (head unit of Fig. 5 downside) is relatively navigated to the installation site of substrate K.
Like this, during the reception of carrying out electronic unit by one in two head units 40 of same leading truck 51 (52) supports, another can carry out the installation to substrate.
--action specification of electronic component mounting apparatus--
In the electronic component mounting apparatus 10 that constitutes by said structure, at first utilize the band transport mechanism to move into first substrate K, give substrate objective table 31.Then, first substrate K moved to the conveyance direction downstream of substrate objective table 31, give substrate objective table 32 again by utilizing substrate mobile unit 33, and with its clamping.In addition, utilize band transport mechanism 21 to move into second substrate K, give substrate objective table 31, and clamp, then, utilize substrate mobile unit 33 to arrive the installation exercise position with 31 conveyances of substrate objective table.
And, when each substrate objective table 31,32 by conveyance to substrate mounting position the time, the installation exercise of beginning electronic unit feed unit.But, at this, about first substrate K, with substrate objective table 32 by conveyance to the locational moment of installation exercise, second substrate K also can not wait for substrate objective table 31 and just be begun installation exercise by conveyance to installation exercise position.
Each head unit 40 that is installed on each leading truck 51,52 is moved the location respectively, the reception of the electronic unit of stipulating repeatedly and installation action in the scope of above-mentioned region R 1, R2.
At this moment, be installed in two head units 40 of same leading truck 51 (52), move under the receiving position state of electronic unit in the cooperation of a head unit by X-axis detent mechanism and Y-axis detent mechanism, another head unit is positioned in the installation site of substrate K by the cooperation of Y-axis detent mechanism and substrate mobile unit 33 (34).That is can walk abreast the reception operation of carrying out a head unit and the installation exercise of another head unit of two head units 40 that support by same leading truck 51 (52).
And when to the substrate K installation on the substrate objective table 32, the driving by substrate mobile unit 34 moves to the downstream with substrate objective table 32, removes substrate clamping state, and the driving by band mechanism joins substrate K to band transport mechanism 22.Utilize this band transport mechanism 22, substrate K is taken out of to device outside.
On the other hand, in the moment of the installation that the substrate K on the substrate objective table 31 is carried out, take out of under the uncompleted situation at the substrate of substrate objective table 32 and to wait for that it finishes.In addition, take out of under the situation about finishing, remove substrate clamping state, give substrate objective table 32 with substrate from 31 handing-over of substrate objective table by the driving of band mechanism at the substrate on the substrate objective table 32.And the driving by substrate mobile unit 34 moves to the downstream with substrate objective table 32, and the driving by band mechanism joins substrate K to band transport mechanism 22.Utilize this band transport mechanism 22, substrate K is taken out of to device outside.
--effect of execution mode--
The electronic component mounting apparatus 10 that is made of said structure carries out installation exercise by the substrate K that each leading truck 51,52 has determined 40 pairs of head units to remain on which substrate objective table 31,32.And, determined head unit 40 which from one group of the substrate transferring direction upstream side of the belt feed device 71 of each electronic unit feed unit 70 and downstream one group partly to carry out parts by each leading truck 51,52 and received.
Therefore, each leading truck 51,52 head unit when installing and receive, can not produce interference.Therefore, do not need to establish and avoid the stand-by period of disturbing, and because two substrates are carried out installation exercise simultaneously, therefore by improving the installation exercise efficient to two substrates, the result can improve the installation exercise efficient of continuous substrate.
In addition, because on a conveyance path, be provided with two substrate objective tables 31,32, can save the space significantly so compare with the situation of the electronic component mounting apparatus that two single objective tables are set.
And, because two leading trucks 51,52 are relatively set with each head unit 40 in opposite face side mutually, so it is farthest close that the head unit 40 of the head unit 40 of a leading truck 51 and another leading truck 52 is not produced on X-direction in the scope of interference.Meanwhile, each substrate objective table 31,32 also can be when carrying out installation exercise, near configuration, so can be implemented in the miniaturization of X-direction electronic component mounting apparatus 10.
And, two head units 40 being installed on each leading truck 51,52 and leading truck 51,52 being positioned under the state of electronic unit receiving position of one of them head unit 40, can utilize substrate mobile unit 33,34 another head unit 40 to be navigated to the installation site of substrate K.Therefore, the reception and the installation of electronic unit can be carried out simultaneously, the high efficiency of installation exercise can be further realized.
--other--
In above-mentioned structure, when utilizing action control unit 80 on each substrate objective table 31,32, to carry out the installation of electronic unit, carried out the action control that the substrate on the substrate objective table 31,32 is all directly taken out of, but also can carry out other action control.For example, CPU81 is according to the control program that is stored on the ROM82, will move on the substrate objective table 32 in downstream and keeps at the substrate K that has carried out installing on the substrate objective table 31 of upstream side.Can also constitute and carry out following action control: upstream the substrate objective table 31 of side is supplied with new substrate K, and the substrate of moving in turn carries out the installation exercise of two operations on each substrate objective table 31,32.
Like this, because a substrate K carries out installation exercise respectively through two substrate objective tables 31,32,, can carry out installation exercise more efficiently to a plurality of substrates so can carry out the installation exercise of forming by two operations in turn continuously.
Claims (4)
1. electronic component mounting apparatus is characterized in that having:
The conveyance unit, it carries out the substrate that electronic unit is installed along the prescribed direction conveyance;
The substrate holding unit, it is located in the way in conveyance path of described conveyance unit, is used to carry out the installation exercise of described electronic unit;
Head unit, it can keep and discharge described electronic unit;
First detent mechanism, it has crosses over the leading truck that described conveyance path is used along the described head unit of the direction setting of substrate transferring direction intersection relatively, carries out along the running fix of the described head unit of this leading truck;
Second detent mechanism, it moves described leading truck, carries out along the running fix of the described head unit of described conveyance direction;
The electronic unit feed unit, it supplies with various electronic units to described head unit; And
Action control unit, its installation action to the described relatively substrate of electronic unit is controlled;
Described substrate holding unit and described first detent mechanism all respectively are provided with two along described conveyance path, and, on the leading truck of described each detent mechanism at mutual opposite face side configuration head unit separately;
Described action control unit is carried out following control: by the head unit of a leading truck support and the head unit that is supported by another leading truck, only the substrate that is kept by different mutually substrate holding units is carried out installation action.
2. electronic component mounting apparatus according to claim 1 is characterized in that,
Described action control unit is carried out following action control: will take out of and need not to be kept once more by another substrate holding unit with the substrate that a substrate holding unit has carried out installation exercise.
3. electronic component mounting apparatus according to claim 1 is characterized in that,
Described action control unit is carried out following action control: a substrate is being carried out taking out of this substrate behind the installation action with described two substrate maintaining parts.
4. according to any described electronic component mounting apparatus in the claim 1,2 or 3, it is characterized in that, on described each leading truck, be provided with a plurality of head units.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004049367 | 2004-02-25 | ||
| JP2004049367A JP4354845B2 (en) | 2004-02-25 | 2004-02-25 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1662133A true CN1662133A (en) | 2005-08-31 |
| CN100508723C CN100508723C (en) | 2009-07-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100510274A Expired - Fee Related CN100508723C (en) | 2004-02-25 | 2005-02-25 | Electronic components mounting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4354845B2 (en) |
| CN (1) | CN100508723C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026538A (en) * | 2009-09-16 | 2011-04-20 | Juki株式会社 | Electronic part installation device |
| CN102548384A (en) * | 2010-12-13 | 2012-07-04 | Juki株式会社 | Electronic component installing device |
| CN103781341A (en) * | 2012-10-17 | 2014-05-07 | 松下电器产业株式会社 | Element installation device and element installation method |
| CN104137666A (en) * | 2012-02-21 | 2014-11-05 | 富士机械制造株式会社 | Substrate conveying device |
| CN102197243B (en) * | 2008-11-19 | 2014-12-10 | 本田技研工业株式会社 | Structure for attachment of electronic component to control unit |
| CN104206050A (en) * | 2012-04-12 | 2014-12-10 | 富士机械制造株式会社 | Component mounting machine |
| CN104509235A (en) * | 2012-08-01 | 2015-04-08 | 富士机械制造株式会社 | Component mounting apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4865336B2 (en) * | 2006-01-17 | 2012-02-01 | Ｊｕｋｉ株式会社 | Component mounting control method for surface mount equipment |
| JP4969977B2 (en) * | 2006-09-29 | 2012-07-04 | 株式会社日立ハイテクインスツルメンツ | Component mounting equipment |
| JP4784995B2 (en) * | 2006-11-22 | 2011-10-05 | 富士機械製造株式会社 | Electronic component mounting machine |
| JP2011124461A (en) * | 2009-12-14 | 2011-06-23 | Juki Corp | Electronic component mounting apparatus |
-
2004
- 2004-02-25 JP JP2004049367A patent/JP4354845B2/en not_active Expired - Fee Related
-
2005
- 2005-02-25 CN CNB2005100510274A patent/CN100508723C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102197243B (en) * | 2008-11-19 | 2014-12-10 | 本田技研工业株式会社 | Structure for attachment of electronic component to control unit |
| CN102026538A (en) * | 2009-09-16 | 2011-04-20 | Juki株式会社 | Electronic part installation device |
| CN102026538B (en) * | 2009-09-16 | 2015-03-25 | Juki株式会社 | Electronic part installation device |
| CN102548384A (en) * | 2010-12-13 | 2012-07-04 | Juki株式会社 | Electronic component installing device |
| CN104137666A (en) * | 2012-02-21 | 2014-11-05 | 富士机械制造株式会社 | Substrate conveying device |
| CN104137666B (en) * | 2012-02-21 | 2017-06-20 | 富士机械制造株式会社 | Substrate transfer apparatus |
| CN104206050A (en) * | 2012-04-12 | 2014-12-10 | 富士机械制造株式会社 | Component mounting machine |
| CN104509235A (en) * | 2012-08-01 | 2015-04-08 | 富士机械制造株式会社 | Component mounting apparatus |
| CN103781341A (en) * | 2012-10-17 | 2014-05-07 | 松下电器产业株式会社 | Element installation device and element installation method |
| CN103781341B (en) * | 2012-10-17 | 2017-11-03 | 松下知识产权经营株式会社 | Element fixing apparatus and component mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100508723C (en) | 2009-07-01 |
| JP4354845B2 (en) | 2009-10-28 |
| JP2005243774A (en) | 2005-09-08 |
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