CN102026538B - Electronic part installation device - Google Patents
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- CN102026538B CN102026538B CN201010287114.0A CN201010287114A CN102026538B CN 102026538 B CN102026538 B CN 102026538B CN 201010287114 A CN201010287114 A CN 201010287114A CN 102026538 B CN102026538 B CN 102026538B
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Abstract
The invention provides an electronic part installation device, wherein electronic parts can be configured in a high density and the installation efficiency can be increased. The electronic part installation device is characterized in that fixing parts used for arranging a plurality of part supplying devices along the width direction are disposed on arranging part at intervals of absorbing nozzles; a first part supplying device can be used to arrange a supplying mechanism in a frame, and a second part supplying device can be used to arrange a plurality of supplying mechanism in a frame. The width of the frame is smaller or equal to the value of the supplying mechanisms minus one and then multiplied by the intervals of the absorbing nozzles. In the first part supplying device, absorbing parts can be arranged relatively to imbedding parts at a determined distance A, and in a second part supplying device, any absorbing part can be arranged relatively to the imbedding parts at the same distance A. Each interval between absorbing parts is the natural number divided by the value of the interval of the absorbing nozzles.
Description
Technical field
The present invention relates to a kind of electronic component mounting apparatus that can carry out carrying as the high density of the electronic unit of mounting object.
Background technology
Electronic component mounting apparatus, makes the boarded head of lift-launch adsorption mouth from the multiple assembly supply device attract electrons parts carrying out electronic unit supply, and boarded head is moved to the optional position on substrate, carries electronic unit.
In addition, above-mentioned assembly supply device, feed mechanism be housed in framework inside and realize blocking, this feed mechanism is made up of following part: the storage unit of electronic unit; Adsorption section, it makes adsorption mouth attract electrons parts; And transferred unit, it transfers electronic unit from storage unit to adsorption section, and this assembly supply device, to arrange multiple states along its width, is removably mounted in the setting unit of electronic component mounting apparatus.
A kind of electronic unit separately supplies to adsorption mouth by each assembly supply device, and the multiple assembly supply devices required for installing at above-mentioned setting unit place prepared substrate, carry out installation exercise (for example, referring to patent document 1).
Patent document 1: Japanese Unexamined Patent Publication 2003-188599 publication
Summary of the invention
In addition, existing assembly supply device 210, as shown in figure 11, a built-in feed mechanism in each framework 211, its adsorption section 212 is also only arranged one (assembly supply devices 210 hereinafter referred to as row).In addition, at setting unit place, with the interval equal with the width W of framework 211, multiple locating hole for assembly supply device 210 being arranged location is set, can by the feed mechanism of the assembly supply device 210 of multiple row, be arranged with W all at equal intervals (strictly speaking, and interval bigger compared with the width W of framework).
But, when using assembly supply device 210 of above-mentioned row, the assembly supply device 211 of the quantity obtained divided by the width W of framework 211 with the width of setting unit can only be set, there is the problem that cannot supply electronic unit more.
For this problem, more electronic unit is supplied in order to identical setting unit can be utilized, can consider to utilize following assembly supply device, that is, as shown in figure 12, in each framework 221, the assembly supply device 220 of built-in two feed mechanisms is (following, be called the assembly supply device 220 of biserial), or as shown in figure 13, the assembly supply device 230 (assembly supply devices 230 hereinafter referred to as three row) of built-in three feed mechanisms in each framework 231.And, in order to the assembly supply device 220,230 of this built-in multiple feed mechanism can be utilized, supply more electronic unit relative to the width occupied in setting unit, need the value after the width of framework is multiplied with W than the number of built-in feed mechanism little.Such as, if the assembly supply device of biserial 220, then the width of framework 221 is less than 2W (being such as W), if the assembly supply device 230 of three row, then the width of framework 231 is less than 3W (being such as 2W).
Thus, relative to the setting unit of same widths, more electronic unit can be supplied.
In addition, electronic component mounting apparatus in order to the raising of installation effectiveness, and carries multiple adsorption mouth 241 with all equidistant on boarded head 240.And the line space design of adsorption mouth is, the frame width W of the assembly supply device 210 arranged with is roughly equal.
In the case, as shown in figure 14, when only using assembly supply device 210 of row, can adsorb each assembly supply device 210 simultaneously.
In addition, only use the situation of the assembly supply device 220 of biserial as shown in figure 15, or as shown in figure 16 only use three row assembly supply devices 230 situation shown in, when using the assembly supply device of identical type, for each assembly supply device 220,230, can adsorb relative to the adsorption section 222,232 of same position simultaneously.
But as shown in figure 17, when the assembly supply device 210,220,230 of row ~ tri-row mixes setting, the configuration dispersion of each adsorption section, produces the problem almost cannot adsorbed simultaneously.In addition, in fig. 17, row ~ tri-row assembly supply device 210,220,230 3 kind of mixing arrange, even but two kinds of mixing arrange also identical.
The object of the invention is to, do not expand setting unit and increase the supply amount of electronic unit, and can reliably implement to adsorb simultaneously.
The invention that technical scheme 1 is recorded is a kind of electronic component mounting apparatus, and it has: board holder, and it keeps the substrate carrying out electronic unit installation, assembly supply device, it supplies the electronic unit installed, setting unit, the width of multiple described assembly supply device along this assembly supply device can arrange and assemble by it, boarded head, it is by multiple liftable adsorption mouth for adsorbing the electronic unit carried to described substrate, along the direction identical with the width of described assembly supply device all equidistantly to arrange and to keep, and travel mechanism, it makes described boarded head move between described board holder and described parts supply unit, it is characterized in that, in described setting unit, along described width with the gap-forming location division equal with the spacing of described adsorption mouth, this location division is used for multiple described assembly supply device to arrange in the width direction, multiple described assembly supply device, there is the first component feedway arranging a feed mechanism and the second component feedway arranging multiple feed mechanism, in described setting unit, mixing arranges described first component feedway and described second component feedway, described first component feedway and second component feedway, respectively there is framework, this framework has the fitting portion chimeric with the location division of described setting unit, described feed mechanism has respectively: adsorption section, described adsorption mouth carries out the absorption of electronic unit at this adsorption section place, and transferred unit, it transfers electronic unit from the storage unit of electronic unit to adsorption section, described first component feedway, on described width, becoming on the position of predetermined distance from described fitting portion to a direction, configure the adsorption section of described feed mechanism, described second component feedway is set as, when the number of described multiple feed mechanism is set to n, the spacing that the width of framework is less than or equal to described adsorption mouth is multiplied by n-1 and the value obtained, on described width, becoming on the position of predetermined distance from described fitting portion to a described direction, configure the adsorption section of feed mechanism described in any one, the adsorption section of described multiple feed mechanism, be configured with following interval in the direction of the width, the value that the spacing that this interval equals described adsorption mouth obtains divided by natural number.
The feature of the invention that technical scheme 2 is recorded is to have the structure identical with the invention that technical scheme 1 is recorded, and, by used in combination for multiple described second component feedwaies different for the number of described feed mechanism.
The feature of the invention that technical scheme 3 is recorded is, there is the structure identical with the invention that technical scheme 2 is recorded, and, the adsorption section of multiple feed mechanisms of described multiple second component feedway, be configured with following interval respectively in the direction of the width, the value that the spacing that this interval equals described adsorption mouth obtains divided by same natural number.
The feature of the invention that technical scheme 4 to 6 is recorded is, there is the structure identical with the invention recorded any one of technical scheme 1 to 3, and, at least 2 in multiple described assembly supply device, the number of feed mechanism described in it is different, but the casing structure of described at least 2 assembly supply devices is general.
The feature of the invention that technical scheme 7 is recorded is, there is the structure identical with the invention recorded any one of technical scheme 1 to 6, and, in described first component feedway and second component feedway, described transferred unit is with the parts of impartial separation seal collecting band by multiple electronic unit, described storage unit is the tep reel being wound with described parts collecting band, by extracting described parts collecting band out from described tep reel, and to described adsorption section transfer electronic unit.
The feature of the invention that technical scheme 8 is recorded is, there is the structure identical with the invention recorded any one of technical scheme 1 to 6, and, described first and second assembly supply devices, accommodate multiple electronic unit by described storage unit with the state of bulk storage respectively, described transferred unit transfers each electronic unit from the bottom of described storage unit.
The effect of invention
The invention that technical scheme 1 is recorded, because the width of the framework by second component feedway is set to, be less than or equal to the number n of the feed mechanism kept from this each assembly supply device and subtract the value after 1 (n-1) and be multiplied with above-mentioned adsorption mouth spacing and the value obtained, so such as when second component feedway carries two feed mechanisms, the width of framework is less than or equal to adsorption mouth spacing × 1, when lift-launch three feed mechanisms, the width of framework is less than or equal to adsorption mouth spacing × 2, for after this increased number is also identical.Thus, in the scope narrow with the scope of " number × adsorption mouth spacing of the feeder of electronic unit can be supplied ", adsorption mouth can be utilized to adsorb each electronic unit, the arranged in high density of electronic unit can be realized.
In addition, first component feedway and second component feedway, all utilize fitting portion, so that the location division of the spaced setting unit identical with adsorption mouth spacing to be located, and arranges.
In addition, for the adsorption section of first component feedway, width (orientation of the orientation=adsorption mouth of=each assembly supply device) becomes relative to fitting portion the position of predetermined distance, configure this adsorption section, for the adsorption section of second component feedway, width (orientation of the orientation=adsorption mouth of=each assembly supply device) becomes relative to fitting portion the position of predetermined distance (distance identical with first component feedway), configure in this adsorption section, relative to this adsorption section, other adsorption sections are configured with the interval equal with the value that obtains divided by natural number of adsorption mouth spacing.
Therefore, if each assembly supply device makes its fitting portion chimeric with any one position and is arranged in setting unit, the then adsorption section of first component feedway and multiple adsorption sections of second component feedway, all be positioned in the width direction with the spacing of adsorption mouth divided by each aspect spaced after natural number, if in the adsorption mouth of boarded head to be positioned at the position of any one adsorption section, then the probability of other adsorption mouth and other adsorption section position consistency uprises, even if when first component feedway and the mixing of second component feedway are arranged, also can high probability and simultaneously adsorbing efficiently.
That is, the intensive configuration of the adsorption section of electronic unit can be realized, and improve the probability of happening simultaneously adsorbed.
In addition, adsorption section also can be made to comprise 0 relative to the fitting portion " predetermined distance " in the direction of the width of first component feedway, the configuration adsorption section, position identical in the direction of the width relative to fitting portion.
The invention that technical scheme 2 is recorded, above-mentioned second component feedway, is not limited to the feedway that feed mechanism is same number, the feedway that there is multiple number used in combination, even if but in this case, also can realize efficiently adsorbing simultaneously.
In addition, as shown in the record of technical scheme 3, adsorption mouth spacing divided by above-mentioned " natural value ", for all second component feedwaies be arranged in setting unit, be general value.
In the invention that technical scheme 4 to 7 is recorded, by the casing structure generalization of assembly supply devices different for the number of feed mechanism.The number of feed mechanism such as differs one.Namely, for first component feedway and the second component feedway with two feed mechanisms, by framework generalization, or, as shown in technical scheme 2, when for second component feedway by used in combination for feedwaies different for the number of feed mechanism, and be the second component feedway of n (n is natural number) and the second component feedway for " n+1 " for the number of feed mechanism, by framework generalization.
Its result, by in the structure from a fairly large number of assembly supply device of feed mechanism, remove the structure of a feed mechanism, another assembly supply device of the negligible amounts of feed mechanism can be manufactured, for parts, structure, manufacture method etc., unitized key element can be realized and become many, therefore, the productivity of each assembly supply device can be improved.
In addition, as shown in technical scheme 8 and technical scheme 9, for assembly supply device, be no matter the tep reel of boarded parts collecting band mode and accommodate in the space of storage unit bulk storage electronic unit so-called bulk type mode in which kind of assembly supply device, all can realize efficiently adsorbing simultaneously.
Accompanying drawing explanation
Fig. 1 is the oblique view of the entirety of the electronic component mounting apparatus represented involved by present embodiment.
Fig. 2 represents the key diagram of electronic component feeder relative to the state that arranges of the flat part of feeder resettlement section.
Fig. 3 is the top view of a part for the electronic component feeder that omission one arranges.
Fig. 4 is the top view of a part for the electronic component feeder omitting biserial.
Fig. 5 is the top view of a part for the electronic component feeder that omission three arranges.
Fig. 6 represents that one ~ tri-electronic component feeder arranged mixes the key diagram of when being arranged on feeder resettlement section and between the adsorption mouth of boarded head correspondence position relation.
Fig. 7 be the interval of the adsorption section representing the electronic component feeder making ~ tri-to arrange consistent with adsorption mouth spacing when the key diagram of correspondence position relation.
Fig. 8 is the key diagram representing the unitized example realizing framework.
Fig. 9 is the key diagram representing other examples unitized realizing framework.
Figure 10 is the profile of the section along Y-Z plane of the electronic component feeder of row of bulk type.
Figure 11 is the top view of the assembly supply device representing existing row.
Figure 12 is the top view of the assembly supply device representing biserial.
Figure 13 is the top view of the assembly supply device representing three row.
Figure 14 be illustrate relative to one row assembly supply device while absorption action top view.
Figure 15 be the assembly supply device relative to biserial is described while absorption action top view.
Figure 16 be illustrate relative to three row assembly supply device while absorption action top view.
Figure 17 is the key diagram of problem when representing the assembly supply device mixing and arrange one ~ tri-row.
Detailed description of the invention
(working of an invention mode)
Based on Fig. 1 to Fig. 6, working of an invention mode is described.Below, as shown in the drawing, using both direction orthogonal in the horizontal plane as X-direction and Y direction, using the vertical orthogonal with them as Z-direction.
Electronic component mounting apparatus 100 carries various electronic unit on substrate S.Electronic component mounting apparatus 100 has: parts supply unit, it has the multiple electronic component feeder 10,20,30 (hreinafter referred to as " electronic component feeder 10 etc. ") as assembly supply device for supplying carried electronic unit and arranges the feeder resettlement section 102 as setting unit keeping multiple electronic component feeders 10 etc.; Substrate supply unit 103, it is along X-direction conveying substrate; As the substrate clamp system 104 of board holder, it, for relative to the substrate transport path substrate S being halfway arranged on this substrate supply unit 103, carries out electro part carrying operation; Boarded head 106, it liftably keeps adsorption mouth 105, thus keeps electronic unit; As the X-Y portal frame 107 of travel mechanism, boarded head 106 is driven conveying to the optional position in the operating area comprising parts supply unit and substrate clamp system 104 by it; And abase frame 114, it carries and supports above-mentioned each structure.
First camera 120 is mounted on boarded head 106, takes the telltale mark of substrate to carry out the installation of electronic unit.Second camera 130 is fixedly mounted in abase frame 114, and angle and the position of carrying out taking obtaining the electronic unit adsorbed by adsorption mouth 105 offset.
In electronic component mounting apparatus 100, not shown action control unit preserves installation data, the various setting contents that this installation data record is relevant to the installation of electronic unit, from installation data, read the parts receiving position of the setting position based on electronic component feeder 10 etc. representing electronic unit and the electronic unit that should install, and the data of installation site on substrate, and X-Y portal frame 107 is controlled, by boarded head 106 to the receiving position of electronic unit and installation site conveying, in position, boarded head 106 is controlled, carry out the lifting action of adsorption mouth 105 and absorption or release movement, the installation action performing electronic unit controls.
(substrate supply unit and board holder)
Substrate conveying single 103 has not shown conveyer belt, utilizes this conveyer belt to be carried along X-direction by substrate.
In addition, as noted above, in the midway of the substrate transport path of substrate supply unit 103, be provided with substrate clamp system 104, it keeps substrate for the job position place when being carried to substrate by electronic unit is fixing.Substrate clamp system 104, the both ends of the substrate S on the direction orthogonal with substrate throughput direction, clamping substrate S.
In addition, in the below of substrate clamp system 104, be provided with multiple support stick, it abuts with the lower face side of substrate S when clamping, and the supporting substrate S when electro part carrying, can not bend downwards to make it.Substrate S, under the state kept by these parts, carries out stable electro part carrying operation.
(X-Y portal frame)
X-Y portal frame 107 has: X-axis guide rail 107a, and it guides the movement of boarded head 106 along X-direction; Two Y-axis guide rail 107b, boarded head 106 guides along Y direction by it together with this X-axis guide rail 107a; X-axis motor 109, it makes boarded head 106 along the drive source of X-direction movement; And Y-axis motor 110, it is via X-axis guide rail 107a, makes boarded head 106 along the drive source of Y direction movement.In addition, by the driving of each motor 109,110, the roughly whole region of boarded head 106 between two Y-axis guide rail 107b can be carried.
In addition, each motor 109,110, by making respective rotation amount by action control unit identification, being controlled to the rotation amount into expecting, carrying out the location of adsorption mouth 105 thus via boarded head 106.
In addition, according to the needs of electronic unit installation exercise, feeder resettlement section 102 and substrate clamp system 104 are all configured in the region of the boarded head carried 106 of X-Y portal frame 107.
(boarded head)
Boarded head 106 is provided with: adsorption mouth 105 (with reference to Fig. 1), and it utilizes leading section, is attracted and keep electronic unit T by air; Z axis motor 111, it makes adsorption mouth 105 be elevated along Z-direction; And θ axle motor 112, it rotates for making adsorption mouth 105, makes kept electronic unit rotate around Z-direction and carry out angular adjustment.
In addition, above-mentioned adsorption mouth 105, with along Z-direction state liftable and be rotatably supported on boarded head 106, the reception of electronic unit or installation can be carried out by being elevated and by rotating the angular adjustment of carrying out electronic unit.
In addition, adsorption mouth 105 keeps multiple (being 6 in this example) (with reference to Fig. 6) along X-direction all equidistantly to arrange, electronic unit erection sequence and become absorption object electronic component feeder the approximating situation of configuration under, can adsorb simultaneously.In addition, in explanation afterwards, the disposition interval of each adsorption mouth 105 is the width of W in the X-axis direction.
(feeder resettlement section)
Feeder resettlement section 102, to be arranged on Y direction one end (on front side of Fig. 1) of abase frame 114 along the state of X-direction.Feeder resettlement section 102 has the rectangular par along X-Y plane, at the upper surface of this par, multiple electronic component feeder 10 grade is installed (in FIG along X-direction arrangement mounting, only an electronic component feeder 10 is illustrated, but in fact, arrangement is provided with multiple electronic component feeders 10 etc.).
In addition, feeder resettlement section 102 has not shown latching mechanism, and each electronic component feeder 10 grade, for keeping each electronic component feeder 10 etc., as required, can install or be separated by it on feeder resettlement section 102.
In addition, feeder resettlement section 102, as shown in Figure 2, has the flat part 102a along X-Z plane, and it abuts with the leading section of each electronic component feeder 10 grade.On above-mentioned flat part 102a, along X-direction with the interval W identical with above-mentioned adsorption mouth 105, form hole, the location 102b as location division over the whole length, it inserts the positioning convex 11,21,31 as fitting portion be arranged on the leading section of each electronic component feeder 10 ~ 30.
Above-mentioned electronic component feeder 10 etc., tep reel TL (storage unit of electronic unit) is kept respectively in rearward end, supply electronic unit from upper front end to boarded head 106, this tep reel TL is wound with the parts collecting band 14 electronic unit being spaced sealing with equalization.
(electronic component feeder 10)
Below, electronic component feeder 10 is described.As shown in Figure 3, electronic component feeder 10 has: the framework 12 of substantially planar; And feed mechanism, it supplies electronic unit to adsorption mouth 105.
Above-mentioned framework 12 is rectangular substantially planar, makes, under its platen surface and the parallel plane state of Y-Z, with the state making an end of length direction abut with the flat part 102a of above-mentioned feeder resettlement section 102, to be arranged on feeder resettlement section 102.In addition, on the leading section abutted with the flat part 102a of framework 12, the positioning convex 11 of the convex forwards protruded is formed with.
Feed mechanism has: parts collecting band 14, is drawn out of in its tep reel TL from the rearward end side (with the end of positioning convex 11 opposition side) being held in framework 12, carries in the inside of framework 12; And adsorption section 13, electronic unit transmits to adsorption mouth 105 from parts collecting band 14 at this adsorption section 13 place.Parts collecting band 14 is drawn out of from tep reel TL, along the feeding path by adsorption section 13, carries with the sealed spacer of electronic unit.Therefore, above-mentioned parts collecting band 14 forms transferred unit.
Above-mentioned adsorption section 13 be formed at framework 12 leading section near the opening portion of upper surface, can, for by the parts collecting band 14 immediately below this opening portion, utilize adsorption mouth 105 to carry out parts absorption.
Conveying mechanism has: sprocket wheel, and it is chimeric with the inlet ports of impartial gap-forming with the length direction of accommodating band 14 along parts, carries out the feeding of collecting band by rotating; Motor, it makes this sprocket wheel rotate; And the feeding path of collecting band, it is formed at the inside of framework 12.
In addition, feed mechanism has stripping unit, and it is peelled off by reeling to the seal parts film be pasted onto on the upper surface of parts collecting band.Peeling off unit carries out diaphragm seal stripping in the dead ahead of adsorption section 13, by making the electronic unit after stripping be adsorbed by adsorption mouth 105 in short-term, and preventing the loss etc. of electronic unit.
In above-mentioned electronic component feeder 10, framework 12 only keeps a feed mechanism, is equivalent to " first component feedway ".In addition, when this electronic component feeder 10 is distinguished with other electronic component feeders 20,30, be sometimes referred to as " electronic component feeders 10 of row ".
In addition, for framework 12, its X-direction width is set as the width roughly the same or slightly narrow with above-mentioned adsorption mouth spacing W.Above-mentioned feed mechanism adopts the inside being substantially housed in framework 12, not along the structure that X-direction is protruded compared with this framework 12.Therefore, the width of electronic component feeder 10 is equal with the width of framework 12, become when inserting positioning convex 11 in hole, the location 102b of the gap-forming of W and position, the width that can not interfere with the electronic component feeder of the left and right sides.
In addition, be formed at the positioning convex 11 of the leading section of framework 12, configure near side (left side in Fig. 3) in the X-axis direction, be formed at the adsorption section 13 in framework 12, in the X-axis direction, be arranged in the right side of Fig. 3 relative to positioning convex 11, be formed in and become on the position of distance A relative to positioning convex 11.
(electronic component feeder 20)
Below, electronic component feeder 20 is described.As shown in Figure 4, electronic component feeder 20 has: the framework 22 of substantially planar and supply the feed mechanism of electronic unit to adsorption mouth 105, and is equipped with two these feed mechanisms.In addition, when this electronic component feeder 20 is distinguished with other electronic component feeders 10,30, be sometimes referred to as " electronic component feeder 20 of biserial ".
In addition, because electronic component feeder 20 and above-mentioned electronic component feeder 10 have a lot of identical point, so main, different parts is described.
Framework 22 is rectangular tabular, is inserted in hole, the location 102b of flat part 102a by the positioning convex 21 be arranged on its leading section, and is arranged on feeder resettlement section 102.Framework 22 identically with above-mentioned framework 12, forms the width roughly equal with adsorption mouth spacing W in the X-axis direction.
Each feed mechanism is identical with the feed mechanism of electronic component feeder 10, has parts collecting band 14 (transferred unit) and adsorption section 23.These feed mechanisms are mounted in framework 22.
In addition, the feed mechanism of electronic component feeder 20, adopt the structure identical with the feed mechanism of above-mentioned electronic component feeder 10, but for adsorption section, for convenience of explanation, the adsorption section of electronic component feeder 10 is called " 13 ", the adsorption section of electronic component feeder 20 is called " 23 ", thus distinguishes.
In addition, above-mentioned two feed mechanisms, utilize framework 22 to keep side by side along X-direction.Therefore, the adsorption section 23,23 of two feed mechanisms, framework 22 upper surface with along X-direction by their two arrangement modes formed.
In above-mentioned electronic component feeder 20, framework 22 maintains two feed mechanisms, is equivalent to " second component feedway ".
In addition, for framework 22, its X-direction width is set as the width roughly the same or slightly narrow with above-mentioned adsorption mouth spacing W.For each feed mechanism, the width of its X-direction is less than 1/2 of W, even if adopt two to configure the structure that also can not protrude along X-direction compared with framework 22 side by side.Therefore, the width of electronic component feeder 20 is equal with the width of framework 22, become when inserting positioning convex 21 in hole, the location 102b of the gap-forming of W and position, the width that can not interfere with the electronic component feeder of the left and right sides.
In addition, be formed at the positioning convex 21 of the leading section of framework 22, configure near side (left side in Fig. 4) in the X-axis direction, be set as from the left surface of framework 22 to the distance of positioning convex 21, with equal to the distance of positioning convex 11 from the left surface of the framework 12 in above-mentioned electronic component feeder 10.
In addition, the adsorption section 23 close with positioning convex 21, in the X-axis direction, is arranged in the right side of Fig. 4, is formed in and becomes on the position of distance A relative to positioning convex 21 relative to positioning convex 21.That is, positioning convex 21 and and its close adsorption section 23 between position relationship, identical with the position relationship of adsorption section 13 with the positioning convex 11 of electronic component feeder 10.
In addition, interval in the X-axis direction, two adsorption sections 23,23 is set as following values, that is, by the value that adsorption mouth spacing W obtains divided by natural number n.Preferred natural number n is more than or equal to 2, n=2 in the present embodiment, is spaced apart 1/2 of W between adsorption section 23.
(electronic component feeder 30)
Below, electronic component feeder 30 is described.As shown in Figure 5, electronic component feeder 30 has: the framework 32 of substantially planar and supply the feed mechanism of electronic unit to adsorption mouth 105, and is equipped with three these feed mechanisms.In addition, when this electronic component feeder 30 is distinguished with other electronic component feeders 10,20, be sometimes referred to as " electronic component feeders 30 of three row ".
In addition, because electronic component feeder 30 and above-mentioned electronic component feeder 10 have a lot of identical point, so main, different parts is described.
Framework 32 is rectangular tabular, is inserted in hole, the location 102b of flat part 102a by the positioning convex 31 be arranged on its leading section, and is arranged on feeder resettlement section 102.Because framework 32 arranges maintenance three feed mechanisms in the X-axis direction, so compared with above-mentioned framework 12, the width of X-direction sets larger, in the present embodiment, forms the width (than 2W slightly narrow) roughly equal with 2 times of adsorption mouth spacing W in the X-axis direction.
Each feed mechanism is identical with the feed mechanism of electronic component feeder 10, has parts collecting band 14 (transferred unit) and adsorption section 23.These feed mechanisms are mounted in framework 32.
In addition, the feed mechanism of electronic component feeder 30, adopt the structure identical with the feed mechanism of above-mentioned electronic component feeder 10, but for adsorption section, for convenience of explanation, and the adsorption section of electronic component feeder 10 is called " 13 ", the adsorption section of electronic component feeder 30 is called " 33 ", thus distinguishes.
In addition, above-mentioned three feed mechanisms, utilize framework 32 to keep side by side along X-direction.Therefore, the adsorption section 33,33,33 of three feed mechanisms, framework 32 upper surface with along X-direction by their three arrangement modes formed.
In above-mentioned electronic component feeder 30, framework 32 maintains three feed mechanisms, is equivalent to " second component feedway ".
In addition, for framework 32, X-direction width is as noted above is set as it, the width (or slightly narrow width) roughly the same with 2 times of adsorption mouth spacing W.Due to for each feed mechanism, the width of its X-direction is less than 1/2 of W, even if become three to configure the structure that also can not protrude along X-direction compared with framework 32 side by side, so become (width of the width=framework 32 of electronic component feeder 30).In addition, when inserting positioning convex 31 in hole, the location 102b of the gap-forming of W and position, the location hole 102b adjacent with right side becomes and is covered by framework 32 and the state that cannot use.
In addition, be formed at the positioning convex 31 of the leading section of framework 32, configure near side (left side in Fig. 5) in the X-axis direction, be set as from the left surface of framework 32 to the distance of positioning convex 31, with equal to the distance of positioning convex 11 from the left surface of the framework 12 in above-mentioned electronic component feeder 10.
In addition, adsorption section 33 immediate with positioning convex 31, in the X-axis direction, is arranged in the right side of Fig. 5, is formed in and becomes on the position of distance A relative to positioning convex 31 relative to positioning convex 31.That is, the position relationship between positioning convex 31 and immediate adsorption section 33, identical with the position relationship of adsorption section 13 with the positioning convex 11 of electronic component feeder 10.
In addition, interval in the X-axis direction, three adsorption sections 33,33,33 is all set as following values, that is, by the value that adsorption mouth spacing W obtains divided by natural number n.Preferably this natural number n is equal with the natural number in electronic component feeder 20.That is, n=2 in the present embodiment, is spaced apart 1/2 of W between adsorption section 33.
(mixing of each electronic component feeder is arranged)
In figure 6, the diagram of feeder resettlement section 102 is omitted.
When each electronic component feeder 10,20,30 is mixed setting, because positioning convex 11,21,31 inserts with in hole, the location 102b of the feeder resettlement section 102 of adsorption mouth spacing W arrangement respectively, so be arranged on apart from the adsorption section 13,23,33 on the position of each positioning convex 11,21,31 distance A of each electronic component feeder 10,20,30, be all positioned at the point arranged along X-direction with the interval of adsorption mouth spacing W some on.
In addition, in the electronic component feeders 20,30 of biserial and three row, the adsorption section 23,33 be separated with distance A with each positioning convex 21,31, be positioned at the point arranged along X-direction with the interval of 1/2 of adsorption mouth spacing W some on.
Therefore, all adsorption sections 13,23,33 of all electronic component feeders 10,20,30, be positioned on some points of arranging along X-direction with the interval of 1/2 of adsorption mouth spacing W, therefore, can guarantee more the adsorption section 13,23,33 that position in X-direction is consistent with each adsorption mouth 105 of adsorption mouth spacing W, the frequency of the electronic unit that can simultaneously adsorb can be improved.
(effect of embodiment)
As noted above, in electronic component mounting apparatus 100, for the electronic component feeder 20,30 being equivalent to second component feedway, make the width of respective framework 22,32, be less than or equal to the number of the feed mechanism kept respectively from this each electronic component feeder 20,30 and subtract the value after 1 and be multiplied with adsorption mouth spacing W and the value obtained.That is, if the electronic component feeder of biserial 20, then the X-direction width of framework 22 is set to, is less than or equal to and from the number of feed mechanism that is 2, subtracts 1 and the width (in this example, be set as by width slightly narrower than W) being multiplied by the value after W.
In addition, if the electronic component feeder 30 of three row, then the X-direction width of framework 32 is set to, is less than or equal to and from the number of feed mechanism that is 3, subtracts 1 and the width (in this example, be set as by width slightly narrower than 2W) being multiplied by the value after W.Thus, the ratio of the width of the X-direction that adsorbable electronic unit number is shared on feeder resettlement section 102 relative to each electronic component feeder 10 ~ 30, can be higher compared with ratio when taking the width of W with each electronic unit, the densification that electronic unit is arranged can be realized.
And while the high density realizing this electronic unit is arranged, as noted above, the frequency of absorption while can improving multiple adsorption mouth 105 further, can also realize the raising of installation effectiveness.
(changing the example of the ratio between adsorption mouth spacing and the interval of adsorption section)
In the above example, exemplify for the electronic component feeder 20,30 corresponding with second component feedway, respectively by adsorption section 23,33 be spaced be set to adsorption mouth spacing W 1/2 (establish adsorption mouth spacing divided by natural number n=2) situation, but such as also can be as shown in Figure 7, for the electronic component feeder 20,30 corresponding with second component feedway, respectively by adsorption section 23,33 be spaced be set to equal with adsorption mouth spacing (establish adsorption mouth spacing divided by natural number n=1).In addition, in the example of fig. 7, exemplify and the interval of each adsorption section 23,33 is not set to W, and the spacing of adsorption mouth is set to the situation of W/2.
As noted above, due to when making the interval of each adsorption section 23,33 consistent with adsorption mouth spacing, all adsorption sections 13,23,33 are positioned on the point that arranges along X-direction with adsorption mouth spacing, so can adsorb relative to all adsorption sections 13,22,33 in the scope of adsorption mouth arrangement simultaneously.
In addition, also the interval of adsorption section 23,33 can be set to W, but as noted above when adsorption mouth spacing is narrowed, and the high density that also can realize electronic unit is arranged.But if owing to adsorption mouth spacing being narrowed, then the problems such as the interference easily between the electronic unit that adsorbs of generation, so there is limit in its width simultaneously.
(other examples of electronic component feeder)
In addition, also by from other electronic component feeders of many one of the number of the feed mechanism than electronic component feeder, a feed mechanism can be removed, and manufacture the electronic component feeder with the feed mechanism of carried number.
Such as, as shown in Figure 8, also can pass through the feed mechanism that removal one is inner from the electronic component feeder 20 of above-mentioned biserial, and manufacture the electronic component feeder 10A of row.
In addition, in the above example, only illustrate the electronic component feeder 30 to three row being equipped with three feed mechanisms, but also can use the electronic component feeder being equipped with more feed mechanism (such as four).In the case, also any one adsorption section is set to A relative to the distance of positioning convex in the X-axis direction, the interval in the X-direction of each adsorption section is set to adsorption mouth spacing W divided by the value (such as W/2) after natural number.
In addition, as shown in Figure 9, also can pass through the feed mechanism that removal one is inner from the electronic component feeder of above-mentioned four row, and manufacture the electronic component feeder 30A of three row.
As shown in the example of above-mentioned electronic component feeder 10A and 30A, due to two kinds of electronic component feeders that the number for feed mechanism is different, the at least structure generalization of framework, and feed mechanism also generalization, so for two kinds of electronic component feeders, its manufacturing cost can be reduced, improve productivity.
(bulk type electronic component feeder)
In the above example, exemplify the example that electronic component feeder 10 ~ 30 is collecting belt, but also can use so-called bulk type electronic component feeder (assembly supply device).
In Fig. 10, electronic component feeder 10B, multiple along X-direction spread configuration in the setting unit of electronic component mounting apparatus, and can dismantle.
In addition, electronic component feeder 10B has: framework 12B (diagram is omitted in the location division of front end); Feed mechanism; And storage unit 15B, electronic unit is accommodated with the state of bulk storage by it.
At the top of framework 12B configuration storage unit 15B.Storage unit 15B with the region of the mode of bulk storage from top collecting electronic unit, can be formed as taper bottom it, is guided to singly on the transport path of the electronic unit be formed in framework 12B by electronic unit.
Feed mechanism has: as the conveying device 14B of the conveyor type of transferred unit, its transport path along electronic unit and being formed; And relative to the adsorption section 13B of adsorption mouth 105, it is positioned at the end of conveying device 14B.
In addition, as the electronic component feeder of the biserial of second component feedway or the electronic component feeder of three row, in a framework, two or three feed mechanisms (adsorption section 13B, conveying device 14B etc.) are disposed with along X-direction.
In addition, the electronic component feeder of one ~ tri-row is all configured to, and any one adsorption section becomes distance A relative to location division in the X-axis direction.In addition, for biserial and three electronic component feeders arranged, the width of the X-direction of respective framework is set to, be less than or equal to and from the number of feed mechanism, subtract the value after 1 be multiplied with adsorption mouth spacing W and the value obtained, the interval of the X-direction between each adsorption section is set as adsorption mouth spacing is divided by the distance after natural number, this point and above-mentioned each electronic component feeder 10,20,30 identical.
For bulk type electronic component feeder, the effect identical with the situation of above-mentioned collecting belt electronic component feeder 10,20,30 also can be obtained.
(other)
In addition, also can by above-mentioned from positioning convex 11,21, distance A the X-direction of 31 to adsorption section 13,23,33 is set to 0.That is, also can be configured to, positioning convex 11,21,31 is positioned on straight line along identical Y direction with adsorption section 13,23,33.
In addition, for each electronic component feeder 20,30, as being the adsorption section of A relative to positioning convex 11 distance in the X-axis direction, all have selected the adsorption section being positioned at leftmost, but also can select other adsorption sections relative to each electronic component feeder 20,30.
Such as, for electronic component feeder 20, also the mode making to become distance A between the adsorption section on right side in two adsorption sections 23 and positioning convex 21 can be set as, configuration projection and each adsorption section, for electronic component feeder 30, also the mode making to become distance A in three adsorption sections 33 between middle adsorption section and positioning convex 21 can be set as, configuration projection and each adsorption section.
Claims (9)
1. an electronic component mounting apparatus, it has:
Board holder, it keeps the substrate carrying out electronic unit installation;
Assembly supply device, it supplies the electronic unit installed;
Setting unit, the width of multiple described assembly supply device along this assembly supply device can arrange and assemble by it;
Boarded head, it is by multiple liftable adsorption mouth for adsorbing the electronic unit carried to described substrate, along the direction identical with the width of described assembly supply device all equidistantly to arrange and to keep; And
Travel mechanism, it makes described boarded head move between described board holder and described parts supply unit,
It is characterized in that,
In described setting unit, along described width with the gap-forming location division equal with the spacing of described adsorption mouth, this location division is used for multiple described assembly supply device to arrange in the width direction,
Multiple described assembly supply device, there is the first component feedway arranging a feed mechanism and the second component feedway arranging multiple feed mechanism, in described setting unit, mixing arranges described first component feedway and described second component feedway
Described first component feedway and second component feedway, have framework respectively, and this framework has the fitting portion chimeric with the location division of described setting unit,
Described feed mechanism has respectively: adsorption section, and described adsorption mouth carries out the absorption of electronic unit at this adsorption section place; And transferred unit, it transfers electronic unit from the storage unit of electronic unit to adsorption section,
Described first component feedway, on described width, becoming on the position of predetermined distance from described fitting portion to a direction, configures the adsorption section of described feed mechanism,
Described second component feedway is set as, when the number of described multiple feed mechanism is set to n, the spacing that the width of framework is less than or equal to described adsorption mouth is multiplied by n-1 and the value obtained,
On described width, becoming on the position of predetermined distance from described fitting portion to a described direction, configure the adsorption section of feed mechanism described in any one,
The adsorption section of described multiple feed mechanism, is configured with following interval in the direction of the width, the value that the spacing that this interval equals described adsorption mouth obtains divided by natural number.
2. electronic component mounting apparatus according to claim 1, is characterized in that,
By used in combination for multiple described second component feedwaies different for the number of described feed mechanism.
3. electronic component mounting apparatus according to claim 2, is characterized in that,
The adsorption section of multiple feed mechanisms of described multiple second component feedway, is configured with following interval in the direction of the width respectively, the value that the spacing that this interval equals described adsorption mouth obtains divided by same natural number.
4. electronic component mounting apparatus according to claim 1, is characterized in that,
At least 2 in multiple described assembly supply device, the number of feed mechanism described in it is different, but the casing structure of described at least 2 assembly supply devices is general.
5. electronic component mounting apparatus according to claim 2, is characterized in that,
At least 2 in multiple described assembly supply device, the number of feed mechanism described in it is different, but the casing structure of described at least 2 assembly supply devices is general.
6. electronic component mounting apparatus according to claim 3, is characterized in that,
At least 2 in multiple described assembly supply device, the number of feed mechanism described in it is different, but the casing structure of described at least 2 assembly supply devices is general.
7. the electronic component mounting apparatus according to any one of claim 4 to 6, is characterized in that,
At least 2 in multiple described assembly supply device, the number of feed mechanism described in it is different, differ one, but the casing structure of described at least 2 assembly supply devices is general.
8. electronic component mounting apparatus according to any one of claim 1 to 6, is characterized in that,
In described first component feedway and second component feedway, described transferred unit is with the parts of impartial separation seal collecting band by multiple electronic unit, described storage unit is the tep reel being wound with described parts collecting band, by extracting described parts collecting band out from described tep reel, and to described adsorption section transfer electronic unit.
9. electronic component mounting apparatus according to any one of claim 1 to 6, is characterized in that,
Described first component feedway and second component feedway, accommodate multiple electronic unit by described storage unit with the state of bulk storage respectively, described transferred unit transfers each electronic unit from the bottom of described storage unit.
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| JP2009-214496 | 2009-09-16 | ||
| JP2009214496A JP5507169B2 (en) | 2009-09-16 | 2009-09-16 | Electronic component mounting equipment |
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| JP5746593B2 (en) * | 2011-09-27 | 2015-07-08 | 富士機械製造株式会社 | Electronic component feeder |
| WO2014207807A1 (en) * | 2013-06-24 | 2014-12-31 | 富士機械製造株式会社 | Device for calculating component-suction-position height |
| JP6328316B2 (en) * | 2015-02-16 | 2018-05-23 | 株式会社Ｆｕｊｉ | Mounting management device |
| JP6824101B2 (en) * | 2017-04-24 | 2021-02-03 | Juki株式会社 | Feeder and mounting device |
| EP4061109A4 (en) * | 2019-11-14 | 2022-11-16 | Fuji Corporation | Component mounter |
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| JP2001142519A (en) * | 1999-11-16 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Production system |
| CN1662133A (en) * | 2004-02-25 | 2005-08-31 | 重机公司 | Electronic parts installation device |
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| JP3935579B2 (en) * | 1997-10-29 | 2007-06-27 | 富士機械製造株式会社 | Cover tape feeding device, cover tape processing device and feeder unit |
| JP3955210B2 (en) * | 2001-12-19 | 2007-08-08 | 松下電器産業株式会社 | Component mounting method and component mounting apparatus |
| JP4013655B2 (en) * | 2002-05-31 | 2007-11-28 | 松下電器産業株式会社 | Electronic component mounting equipment |
| CN100563417C (en) * | 2003-08-26 | 2009-11-25 | 松下电器产业株式会社 | Component collating method |
| JP2005216945A (en) * | 2004-01-27 | 2005-08-11 | Yamaha Motor Co Ltd | Method and device for setting arrangement of feeder |
| WO2007111296A1 (en) * | 2006-03-27 | 2007-10-04 | Matsushita Electric Industrial Co., Ltd. | Nozzle mechanism, mounting head, and electronic component mounting equipment |
| JP4728278B2 (en) * | 2007-04-26 | 2011-07-20 | パナソニック株式会社 | Component mounter downtime derivation method |
| JP2008103747A (en) * | 2007-11-16 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Method for acquiring component information |
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| JP2001142519A (en) * | 1999-11-16 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Production system |
| CN1662133A (en) * | 2004-02-25 | 2005-08-31 | 重机公司 | Electronic parts installation device |
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