CN1605790B - Led灯设备及方法 - Google Patents
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Abstract
一种用于替代商业标准灯泡的LED照明装置。例如,商业标准的灯泡典型地具有外表面轮廓,通常定义了其形状,并且LED照明装置具有本身的表面轮廓,该表面轮廓基本上模拟商业标准灯泡的表面轮廓。另外,LED照明装置还包括用于消散由LED照明装置产生的能量的散热片。根据不同实施例,散热片造就了LED照明装置的外表面轮廓,并且被构造为基本上模拟商业标准灯泡的外表面轮廓。
Description
技术领域
本申请通常涉及LED照明产品。
背景技术
发光二极管(LED)已在需要相对低能量的指示灯、数值读出装置等的应用中使用了数十年。然而,近些年来,单个LED的亮度和功率已充分增大,导致可获得具有1瓦和5瓦的装置。
而小LED相比于传统的照明产品显示出高功效和较长预期寿命。例如,典型的白炽灯泡的功效为10-12流明/瓦,并可持续照明1000至2000小时;普通的荧光灯泡的功效为40-80流明/瓦,并可持续照明10000至20000小时;典型的卤灯的功效为20流明,并持续照明2000至3000小时。大不相同的是,橙红色LED可发射55流明/瓦,并且其预期寿命约为100,000小时。
尽管最近在LED效率方面有所发展,并有希望产生令人注目的能源节省,但已有的***不能用于替代用于商业和消费领域中的标准照明产品的LED所需的特性和生产***。这主要是由于目前已知的光学引擎中固有的限制。
例如,商业大功率LED装置产生极大的热量-约在50W/cm2左右。为了获得可靠性和长寿命,保持相当低的LED装置温度是非常重要的。目前已有的***不能在维持必须的热传输特性的同时以紧凑的型式组装多个LED。
另外,混合多个彩色LED产生白光的尝试也不理想,这是因为即使LED装置极靠近地组装(再次受到热传输原因的限制),由这种***产生的光也不能很好的混合,其结果为产生不均匀的各个颜色的斑点而不是白光的均匀投影。类似地,目前生产合成半导体LED颜色还不能有效地产生某一波长(如,575nm的黄光)。但易于得到有效红和绿光LED灯的混合。
因此,需要一种LED光学引擎装置以克服现有技术的这些和其它限制。
发明内容
总体而言,本发明提供一种用于商业标准灯泡的新颖的LED照明装置。例如,商业标准灯泡典型地具有第一外表面轮廓,一般限定其形状,并且LED照明装置具有其本身的表面轮廓(如,第二轮廓),该表面轮廓基本上模拟商业标准灯泡的表面轮廓。
另外,根据不同实施例,LED照明装置还包括散热片,用于消散由LED照明装置产生的能量。根据本发明的不同方面,该散热片包括上述第二外表面轮廓并且被构造为基本上模拟该第一外表面轮廓。
以这种方式,本发明提供一种适于广泛的照明用途的高效LED照明装置。
附图说明
可参考结合附图得出的详细描述获得本发明的更完整的理解,其中在所有附图中相同的参考标记表示相同的元件,以及
图1为商业标准的灯泡的等比例视图;
图2为根据本发明实施例的一种LED照明装置的等比例视图;
图3为根据本发明实施例的一种光学引擎的等比例视图,该光学引擎具有多个混联构成的表面安装式(surface-mounted)LED芯片;
图4为根据本发明另一替换实施例的光学引擎的顶视图,该光学引擎具有多个混联构成的引线接合(wire-bonded)的LED芯片,其中每个LED芯片包括两个接合焊盘;
图5为根据本发明另一替换实施例的光学引擎的顶视图,该光学引擎具有多个串联构成的引线接合LED芯片;
图6为根据本发明另一替换实施例的光学引擎的顶视图,该光学引擎具有多个混联构成的引线接合的LED芯片,其中每个LED芯片包括单个接合焊盘;
图7为示例性的光学引擎的等比例局部剖视图,该光学引擎包括一安装在金属覆层的,高导热性的PCB基底上的LED电路管芯;
图8为包括有一内围堤和一***堤的光学引擎的等比例视图;
图9A和图9B分别示出光学引擎的顶视图和侧视图,该光学引擎包括填充有密封剂材料的***堤和内围堤;
图10为包括反射器和内围堤的光学引擎的等比例视图;
图11A和图11B分别为图10所示的光学引擎的顶视图和侧视图;
图12A和图12B分别为包含有一示例性透镜的光学引擎的顶视图和侧视图;
图13为表示不同温度白光的光谱的曲线图;以及
图14为根据本发明的一实施例,具有串联连接的LED芯片的电路图。
具体实施方式
下文的描述仅是本发明示例性实施例的描述,并不以任何方式来限定本发明的范围、适用性或结构。相反,下文的描述欲为实现本发明的不同实施例提供方便的描述。显而易见,在不脱离本发明范围的情况下,这些实施例中描述的元件的功能和排列可作出多种变化。
概述
整体而言,根据本发明的LED照明装置包括提供所需输出电压的置于电路板上或独立的电源变换器(如,整流器)和具有高导热性基底(如,金属覆层的PCB)的光学引擎,机械地连接到该基底上的多个发光二极管(LED)半导体装置,固定在该基底上并且环绕该LED装置的至少一部分(优选地为全部)的***堤,以及设置在多个LED装置上并由***堤限制的基本上透明的聚合体密封剂(如,光学等级的硅树脂)。在一个实施例中,该光学引擎包括固定在基底上的反射器(如,一般的锥形反射器),以形成***堤并帮助引导及聚焦光和/或来自两个或多个不同颜色的LED装置的光的混合。在其它实施例中,如下文进一步描述的,一个或多个光学元件如滤光片、透镜等等被固定在密封剂涂层上。
主体结构
如上所述,根据本发明的不同方面,LED照明装置构造为替代商业标准灯泡,并通常包括主体20,光学引擎100,电连接器22(如,将LED照明装置连接至插座上的标准Edison式连接器)和各种其它元件。
根据现在描述的实施例,主体20一般包括一个或多个元件,该元件容纳、保护和/或另外包含或带有LED照明装置的电源变换、光产生和电连接元件。在不同实施例中,主体20为具有适当刚度的固体材料,该材料具有适当的高导热性以消散来自LED照明装置的其它元件的热量。例如,诸如铝合金、铜合金黄铜、镁合金、碳聚合体、碳合成物的各种金属和/或陶瓷,高导热陶瓷在这方面具有所需特性。
另外,在不同实施例中,主体20基本上可构造为任何形状,并有从连续的、基本“平滑”的表面到中断的不连续的表面(如,稽状物)的任何地方。此外,在各种应用和如下所述中,主体20可具有与商业标准灯泡相似的形状。
尤其是,根据本发明的不同实施例,如上所述,LED照明装置欲代替和/或模拟商业标准灯泡。例如,商业标准灯泡,诸如图1所示的灯泡(如,BR30泛光灯泡),具有第一外表面轮廓10,通常限定其形状。在本发明的范围中,LED照明装置具有其自身的第二表面轮廓24,该轮廓基本上与商业标准灯泡的第一表面轮廓10相一致,并且同样的,在不同实施例中模拟或是近似模拟商业标准灯泡的尺寸和形状。应当理解,在本发明范围中,几乎可模拟或基本上模拟任何灯泡的形状,并且第二外表面轮廓基本上可构造为任何形状并仍落在本发明的范围之内。
如上所述,目前已知的商业上的大功率LED装置产生大量的能量(热能)。根据本发明不同实施例的LED照明装置还包括与LED照明装置的各种元件相连接的散热片以消散这种能量。通常,散热片包括任何通过传导和/或对流帮助热量消散的物理设备。根据不同实施例,散热片可为与LED照明装置分离的单独元件,或者可替换地,LED照明装置的其它元件除了该特定元件可具有的任何其它功能外还可作为散热片。
例如,根据本发明的不同实施例,主体20可作为散热片。在该实施例中,主体20可构造为便于热能消散的各种形状和尺寸,例如,通过增大主体20的表面积。例如,如图2中所示,主体20可构造为多个稽状物26,由此增加主体20的表面积,主体20因此可消散大量的热。
另外,根据本发明的不同实施例。散热片还定义了第二外表面轮廓20。例如,继续参照图2,主体20和冷却稽状物26可用作散热片。各个稽状物26被这样构造以使外边缘28呈现商业标准灯泡的第一外表面轮廓10的横截面的一段。这样,例如在图2中多个稽状物26在LED照明装置的位置形成第二外表面轮廓20,该轮廓顺次基本上与商业标准灯泡相似,并且其还有作为散热片的好处。
LED连通性
首先,参照示出了适于本发明的示例性电拓扑的图3,光学引擎100包括多个连接到高导热性基底(或简称为“基底”)102上的LED装置104(在本实施例中,表面安装式LED芯片)。在本实施例中,基底102包括与多个LED装置104电学或机械连接的导电轨迹图案106。
轨迹图案106根据其应用被构造为与AC或DC电源相连接。例如,在所示的实施例中,提供DC V+端108和V。端110。在一些实例中,这些端在此一般称为“输入端”。
LED装置104以任何适当的方式电学相互连接。如图3所示,例如,LED装置104可构造为电路以使多个装置组串联相接,其中这些组本身相对于输入端并联连接。在所示的实施例中,每列包括五个串联相接的LED装置的七个平行列本身并联连接于横跨端108和110。可替代地,暂时参考图5,多个LED装置104(在本实施例中,49个引线接合的芯片)于端110和108串联相接。
通常,尽管上述所示的实施例,本发明包括使用构造为任何适合电拓扑(串联、并联或它们的结合)和任何合适的几何形状的任何数目的LED装置。例如,该LED装置可定位在直线形图案(例如,正方形或矩形阵列)、圆形或曲线图案、任意或随机图案,或它们的任意组合图案中。另外,LED装置可设置在多个区域中,其中每个区域具有不同的图案和数量的装置。
引入到装置中的LED装置104的数量可根据多个设计变量选择,例如包括电源的性质(AC转换为DC,有效DC电压,有效功率等),该LED装置自身的性质(如,正向电压(Vf),额定功率,发光强度,波长等),所需的颜色混合(下文描述),基底102的性质(如,导热性,几何形状等),以及应用和外部热条件的性质。
简言之,在被输入至LED组之前,所施加的电压通常必须在由所使用的特定LED的功率所指定的范围内。同样,根据本发明的不同实施例,LED照明装置包括电源转换器,该电源转换器根据其构造可升高电压、降低电压和/或将AC转换为DC。例如,在不同实施例中,电源转换器包括整流器,例如与多个LED电连接的桥接电路,与图14中所示的类似,其中LED(1402)与电源转换器104及电源1406耦合。优选地,电源转换器1404在LED照明装置和/或主体20中是完全独立的。
也就是说,在一个实施例中,该LED装置串联或并联连接以使LED装置的全部联合正电压与电输入匹配。例如,在美国和加拿大的家庭应用中,在输入至LED之前,120V AC必须由电源转换器整流为162V DC。一般来说,根据各个LED的Vf,40至80只LED装置可串行连接,以接受162V整流过的DC输入。众所周知,典型的红和琥珀色的LED装置的额定Vf约为1.8至2.5V,绿和蓝色LED的额定Vf约为3.0至4.5V。
通过使联合正电压和输入电源的电压相匹配,可简化光学引擎的电源提供,不需要大体积、复杂的电压升高或降低的整流器,或是切换电源供给来与***连接;简单、有效的AC转换为DC的整流电路就足够了。这就使得光学引擎被结合到结构紧凑的组件中-例如,适于标准灯泡插座的灯泡组件。
LED装置
任何适合种类的LED装置104可用于与本发明连接,包括单独管芯,芯片级封装,传统封装,表面安装式装置(SMD),或是任何其它现在已知的或是未来发展的LED装置。在结合图3描述的实施例中,例如,LED装置104包括具有电连接的表面安装式装置,该表面安装式装置具有直接安装到轨迹图案106的表面上的电接点,例如,“倒装晶片(flip-chip)”或是焊料凸起的管芯上。
现参照图4和图5,作为选择,该LED装置可包括连接到各自PCB衬垫206上的LED芯片204(经过热导环氧接合剂等),其中每个管芯204具有至少两个焊盘,用于经过引线接合互连202而提供电连接。可选地,中间的PCB衬垫208可用于方便各个管芯之间的引线接合。该实施例示出七组平行的七个管芯串联;然而,如上所述,本发明不限于此,而可包括任何数目的管芯串联连接、并联连接或是混合连接。
图7描述了图4和图5中所示的单个LED装置的等比例局部剖视图。如图所示,基底102包括其上覆盖有高导热性、电绝缘材料502的高导热性底座504。各个PCB轨迹208和206置于层502上,并且LED管芯204接合至PCB轨迹206上。引线接合(未示出)用于使管芯204和邻近的电管芯相互连接(例如,利用中间PCB轨迹208)。
图6还示出了本发明的另一实施例。根据这种设计,各个LED电路管芯204被接合(经过焊料接合或是其它导电连接)到PCB衬垫206上。然后各个引线接合202用于将PCB衬垫206连接至邻近管芯的接合区域上。也就是说,每个LED管芯204包括单个焊盘,该管芯的背面用作第二电路连接。
利用一个或多个适当的半导体材料制造LED装置104,例如,包括GaAsP、GaP、AlGaAs AlGaInP、GaInN等。选定的该LED装置104的尺寸可使用不同的设计参数来确定。在一个实施例中,LED装置104是厚约100微米、750×750平方微米的管芯。本领域的技术人员将会认识到本发明并不限于此。
各个LED装置具有对应于特定波长(或频率)的特定颜色。本发明的不同方面涉及不同的光选择,现在和下文将讨论增强和平滑的机械装置和/或技术。例如,不同颜色的多个LED产生发射光的所需颜色。通常,安装在基底上的一组LED装置包括x只红LED、y只绿LED和z只蓝LED,其中选定x∶y∶z比例以获得特定相关色温(CCT)的白光。
通常,任意数量的LED颜色可以以任意所需的比例使用。典型的白炽灯泡产生具有2700K CCT的光(暖白光),荧光灯泡产生约5000K CCT的光。这样,典型地将需更多的红和黄LED以获得2700K的光,而对于5000K的光则需更多的蓝LED。为了获得高彩色再现指数(CRI,Color Rendering Index),光源必须发射具有几乎覆盖可见光全部范围(308nm至770nm波长)的光谱的白光,以使在混合中出现暗红、淡红、琥珀色、淡绿、暗绿、淡蓝和深蓝颜色。
为了达到这些目的,本发明允许具有不同波长的LED装置被包含到光学引擎中。在一个实施例中,例如,为了获得3200K的光,R(620nm)∶Y(590nm)∶G(525nm)∶B(465nm)的混合比例(相对于LED的数目)为6∶2∶5∶1。根据另一实施例,R∶Y∶G∶B的混合比例为7∶3∶7∶2,用于获得3900K的光。在另一实施例中,10∶3∶10∶4的比例用于获得5000K的光。上述三个实施例中的每个的光谱示于图13中。
将会意识到,列举的混合比例由芯片的强度以及它们的波长决定。因此,本发明不局限于可用于形成所需光输出的LED种类的数量。
除了白光之外,本发明还可利用类似的颜色混合技术产生特定颜色的光。即,虽然经常可利用多个单色LED产生所需的颜色,但在某些实例中也可利用两种或多种颜色的LED组合形成复合颜色。
更具体的说,由于LED化合物半导体的材料特性,某些波长的功效是不期望的。例如,没有传统的化合物半导体材料可有效发射575nm的黄光。该波长(575nm)位于AlGaInP和GaInN半导体之间的性能谷。然而,通过混合由这两种材料制造的LED装置,可产生具有所需功效的黄光。
基底
基底102包括能够提供机械支撑LED装置104或LED管芯204的任意结构,该结构同时提供所需的热特性-即,通过帮助消散由LED装置104或LED管芯204产生的全部或部分热量。在这一点上,基底102优选包括高导热性基底。
此处所使用的术语“高导热性基底”是指其有效导热率大于1W/°K-m,优选大于约3W/°K-m的基底。因此该基底102的几何形状和材料可根据其应用变化。在一个实施例中,基底102包括一金属包覆的PCB,例如,ThermagonT-Lam或是Bergquist热包覆基底。可利用传统的FR-4PCB工艺制造该金属包覆PCB,并因此相对有成本效益。其它适合的基底包括各种混合陶瓷基底和搪瓷金属基底。另外,通过在基底上应用白色掩模以及使轨迹电路镀银,可增强来自基底的光反射。
密封剂层
优选地,基本上透明的聚合物密封剂设置在LED装置上,然后适当地固化以提供保护层。在优选实施例中,该密封剂包括光学等级的硅树脂。可选择该密封剂的特性以获得其它的光学特性,例如,通过滤除由LED装置产生的光。与此同时,该保护密封剂层足够柔软以抵挡组件承受的热漂移,而不使管芯、引线接合和其它元件老化。
图8、9A和图9B表示本发明一实施例的不同视图,其中覆盖LED装置的密封剂适于由围堤结构限定。更具体的说,图8的光学引擎100包括一***堤602,其环绕LED管芯204的至少一部分。在优选实施例中,围堤602通常为环绕整个LED管芯204的阵列的矩形、正方形、六边形、圆形、八边形或是椭圆结构。***堤602适于利用粘合剂或是其它所需的连接方法连接到基底102上。由于光学的原因优选圆形围堤。
如图所示,密封剂材料优选地沉积在LED管芯204上,以使其填满由***堤602限定的空间。也就是说,参照图9B所示的横截面(截面A-A),密封剂材料606填充到***堤602的上表面上。另外,***堤602优选由基本上透明的材料成,例如,透明塑料(例如,聚碳酸酯)材料。其透明度允许围绕光学引擎边缘的光发射。
在可选择的实施例中,第二、内围堤604位于LED管芯204的中心附近。内围堤604的作用是限制密封剂,并优选为透明材料。内围堤604的出现允许通过电路板中心的连接。
反射器
根据本发明的另一实施例,LED装置还包括反射器32,其构造为帮助聚焦和/或引导由光学引擎100产生的光。例如,根据一个示例性实施例,反射器32通常为圆锥形。当然,本领域的技术人员应认识到,根据所需的结果和效应可在本发明范围中使用多种形状反射器32的。例如,反射器32可为抛物线形、角形或其它所需的形状和尺寸。另外,通常需要反射器32的结构和材料为高反射。这样,在该实施例中,反射器32优选地通常为平滑的、抛光的、镜面状内表面。
然而,在LED装置的应用中,其中基本上以白光(或其它特定颜色)作为目标,并且两个或多个颜色的LED用于混合产生该颜色,优选反射器32的内表面起到散射由LED装置产生的光的作用,从而提供最佳的颜色混合,即使光学引擎的效率或聚焦会因此而稍微地降低(由于光散射)。例如,在本发明的一些实施例中,其中使用两个或多个LED颜色,该反射器32的内表面由“构造表面的质地”的现在已知的或还未知的工艺来构成。在这一点上,该反射器32可为小刻面的、喷砂处理的、化学方法使表面粗糙的,或另外其质地被构造来提供所需散射率。另外,质地或小刻面可为任意的、有规律的、随机的或是它们的结合。
在另一实施例中,光学引擎包括反射器环,其基本上环绕LED装置并帮助聚焦和/或引导***产生的光。
参照图10,示例性的反射器802以所有的LED管芯204都位于反射器底座上的方式合适地连接到光学引擎的基底102上。在所示的实施例中,反射器802通常为圆锥形。然而,将会认识到,反射器802可为抛物面形、角形或具有任何其它所需的形状和尺寸。如所示出的,反射器802通过限制密封剂起到***堤的作用。
就反射器802被设计用来引导和聚焦LED管芯204产生的光来说,需要反射器802的质地和材料具有高反射率。在这一点上,反射器802优选地通常具有平滑的、抛光的、镜面状的内表面。
在基本上以白光(或其它特定颜色)作为目标,并且LED的两个或多个颜色用于混合产生该颜色的应用中,优选的是反射器802的内表面起到散射由LED装置产生的光的作用,从而提供最佳的颜色混合,即使光学引擎的效率或聚焦会因此而稍微地降低(由于光散射)。因此,在使用两个或多个LED颜色的应用中,该反射器802的内表面优选通过适当的工艺并以适当的比例构造质地。例如,该反射器802可为小刻面的、喷砂处理的、化学方法使表面粗糙的,或另外质地被构造来提供所需散射率。另外,质地或小刻面可为任意的、有规律的、随机的或是它们的结合。
其它光学元件
根据本发明的另一实施例,该LED装置包括用于保护光学引擎100的透镜30。例如,如图2所示,透镜30贴近环绕光学引擎100的中空部分。根据不同实施例,该透镜30由硬质玻璃、塑料(如,聚碳酸酯)或相似的材料构成,该材料有助于防止光学引擎100受到损害,但仍允许光经过。更优选的是,透镜30由光学品质的材料构成。
根据本发明的另一实施例,具有一个或多个光学元件的集成光学引擎设置在密封剂的表面上,以相对于由LED装置发射的光提供所需的光学效应。这些光学元件本身可为硬质玻璃或是塑料,当密封剂层作为保护表面时,不引起对LED装置的损坏。适当的光学元件包括,例如,各种透镜(凹透镜、凸透镜、平面透镜、“泡状(bubble)”透镜、菲涅尔透镜等等)以及各种滤光片(偏振滤光片、彩色滤光片等)。
根据本发明的另一实施例,一个或多个光学元件设置在密封剂的表面上,以相对于由LED装置发射的光提供所需的光学效应。这些光学元件本身可为硬质玻璃或是塑料,当密封剂层作为保护表面时,不引起对LED装置的损坏。适当的光学元件包括,例如,各种透镜(凹透镜、凸透镜、平面透镜、“泡状(bubble)”透镜、菲涅尔透镜等等)以及各种滤光片(偏振滤光片、彩色滤光片等)。
图12A、12B和12C示出根据本发明的一个实施例的光学引擎的顶视图、剖面图和等比例视图,其中光学引擎含有“泡状”透镜。更多的泡状透镜102包括与密封剂606连接的平面侧,并且泡状侧包括多个凸起区域1004。在所示的实施例中,泡状透镜102包括4×4格子的这种泡状凸起。本发明认真考虑了这种透镜特征的任何数目和尺寸。
结论
简言之,本发明提供一种新型的、高效的板上多芯片LED光学引擎,该光学引擎能够用于任何现在已知的或未来发展的可以想象的照明应用中。例如,这样的光学引擎可用于要求灯泡安装到标准家用装置(标准螺旋灯泡、荧光灯、卤素灯等)的应用,汽车应用(尾灯、头灯、闪光信号灯等等),便携照明应用和交通控制应用(交通信号等)中。另外,所请求保护的光学引擎可用于要求特定颜色或颜色范围的应用中,包括任意所需色温的白光。在本申请中没有什么欲限定其中可使用本发明的应用的范围。
本发明其它的优点和结构上的细节从所附的图中显而易见,本领域的技术人员会很好的理解。上面已根据特定的示例性实施例描述了本发明。然而,在不背离本发明的范围下可对示例性实施例作出许多改变、结合和变形。
相关申请的交叉参考
本申请要求2003年10月1日递交的美国临时专利申请第60/507,858号、2004年1月30日递交的美国临时专利申请第60/540,743号和2004年8月23日递交的美国临时专利申请第(TBD)号的优选权,这些文件在此全文引作参考。
Claims (3)
1.一种用于替代商业标准灯泡的LED照明装置,该商业标准灯泡具有第一外表面轮廓,该LED照明装置包括:
LED光学引擎和独立的电源转换器,所述LED光学引擎具有基底和连接到该基底上的多个LED装置;
作为主体的散热片,连接所述的LED光学引擎和所述独立的电源转换器中的至少一个用于消散由LED照明装置产生的能量,所述散热片具有被构造为基本上模拟所述第一外表面轮廓的第二外表面轮廓,所述主体容纳并保护所述LED光学引擎;
连接到所述基底上并且环绕全部所述LED装置的***堤;
设置在所述多个LED装置上并由所述***堤限制的基本上透明的聚合物密封剂;和
环绕全部所述LED装置的反射器,所述反射器包括小刻面,所述小刻面被任意地构造在所述反射器上。
2.一种根据权利要求1的LED照明装置,其中所述散热片包括鳍状体。
3.一种根据权利要求1的LED照明装置,还包括透镜,其设置在所述聚合物密封剂的表面上。
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US10/924,389 US6942360B2 (en) | 2003-10-01 | 2004-08-23 | Methods and apparatus for an LED light engine |
US10/924389 | 2004-08-23 |
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CN2004100903315A Expired - Fee Related CN1605790B (zh) | 2003-10-01 | 2004-09-30 | Led灯设备及方法 |
Country Status (6)
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US (2) | US6942360B2 (zh) |
JP (1) | JP2007507115A (zh) |
KR (1) | KR20060066742A (zh) |
CN (1) | CN1605790B (zh) |
TW (1) | TWI245103B (zh) |
WO (1) | WO2005034198A2 (zh) |
Families Citing this family (203)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
US7824065B2 (en) * | 2004-03-18 | 2010-11-02 | Lighting Science Group Corporation | System and method for providing multi-functional lighting using high-efficiency lighting elements in an environment |
US7114841B2 (en) * | 2004-03-22 | 2006-10-03 | Gelcore Llc | Parallel/series LED strip |
US7215086B2 (en) | 2004-04-23 | 2007-05-08 | Lighting Science Group Corporation | Electronic light generating element light bulb |
US7367692B2 (en) * | 2004-04-30 | 2008-05-06 | Lighting Science Group Corporation | Light bulb having surfaces for reflecting light produced by electronic light generating sources |
US7387403B2 (en) * | 2004-12-10 | 2008-06-17 | Paul R. Mighetto | Modular lighting apparatus |
US20060126346A1 (en) * | 2004-12-10 | 2006-06-15 | Paul R. Mighetto | Apparatus for providing light |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20060171157A1 (en) * | 2005-01-31 | 2006-08-03 | Karras Steve A | Glowrims |
JP4583956B2 (ja) * | 2005-02-10 | 2010-11-17 | Necライティング株式会社 | 面状光源装置の製造方法 |
EP2280430B1 (en) * | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
EP1872400A4 (en) * | 2005-04-05 | 2009-06-24 | Tir Technology Lp | ASSEMBLY ASSEMBLY FOR OPTOELECTRONIC DEVICES |
US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
US7633177B2 (en) * | 2005-04-14 | 2009-12-15 | Natural Forces, Llc | Reduced friction wind turbine apparatus and method |
US8272757B1 (en) * | 2005-06-03 | 2012-09-25 | Ac Led Lighting, L.L.C. | Light emitting diode lamp capable of high AC/DC voltage operation |
US20060290891A1 (en) * | 2005-06-23 | 2006-12-28 | Augux Co., Ltd. | Device for cooling light emitting diode projector |
JP2007036073A (ja) * | 2005-07-29 | 2007-02-08 | Hitachi Displays Ltd | 照明装置およびこの照明装置を用いた表示装置 |
US8901575B2 (en) | 2005-08-09 | 2014-12-02 | Seoul Viosys Co., Ltd. | AC light emitting diode and method for fabricating the same |
US8163580B2 (en) | 2005-08-10 | 2012-04-24 | Philips Lumileds Lighting Company Llc | Multiple die LED and lens optical system |
US7518236B2 (en) * | 2005-10-26 | 2009-04-14 | General Electric Company | Power circuit package and fabrication method |
KR101281342B1 (ko) * | 2005-11-22 | 2013-07-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 발광용품 어레이 및 이의 제조 방법 |
TWM291088U (en) * | 2005-12-08 | 2006-05-21 | Upec Electronics Corp | Illuminating device |
JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
US7488097B2 (en) * | 2006-02-21 | 2009-02-10 | Cml Innovative Technologies, Inc. | LED lamp module |
US7476013B2 (en) * | 2006-03-31 | 2009-01-13 | Federal Signal Corporation | Light bar and method for making |
US20070211866A1 (en) * | 2006-02-22 | 2007-09-13 | Federal Signal Corporation | Public safety warning network |
US7746794B2 (en) | 2006-02-22 | 2010-06-29 | Federal Signal Corporation | Integrated municipal management console |
US9346397B2 (en) | 2006-02-22 | 2016-05-24 | Federal Signal Corporation | Self-powered light bar |
US9002313B2 (en) | 2006-02-22 | 2015-04-07 | Federal Signal Corporation | Fully integrated light bar |
US7784969B2 (en) * | 2006-04-12 | 2010-08-31 | Bhc Interim Funding Iii, L.P. | LED based light engine |
US7863639B2 (en) * | 2006-04-12 | 2011-01-04 | Semileds Optoelectronics Co. Ltd. | Light-emitting diode lamp with low thermal resistance |
US8373195B2 (en) | 2006-04-12 | 2013-02-12 | SemiLEDs Optoelectronics Co., Ltd. | Light-emitting diode lamp with low thermal resistance |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
CN101449391B (zh) * | 2006-05-30 | 2011-02-23 | 株式会社藤仓 | 发光元件安装用基板、光源、照明装置、显示装置、交通信号机及发光元件安装用基板的制造方法 |
WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US20080074884A1 (en) * | 2006-09-25 | 2008-03-27 | Thye Linn Mok | Compact high-intensty LED-based light source and method for making the same |
US20090275157A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device shaping |
JP2010506402A (ja) | 2006-10-02 | 2010-02-25 | イルミテックス, インコーポレイテッド | Ledのシステムおよび方法 |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
WO2008064068A2 (en) * | 2006-11-17 | 2008-05-29 | 3M Innovative Properties Company | Planarized led with optical extractor |
KR20090089431A (ko) * | 2006-11-17 | 2009-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Led 광원용 광학 접합 조성물 |
EP2087532A1 (en) * | 2006-11-20 | 2009-08-12 | 3M Innovative Properties Company | Optical bonding composition for led light source |
JP4561732B2 (ja) * | 2006-11-20 | 2010-10-13 | トヨタ自動車株式会社 | 移動***置測位装置 |
US7701055B2 (en) * | 2006-11-24 | 2010-04-20 | Hong Applied Science And Technology Research Institute Company Limited | Light emitter assembly |
US20080123340A1 (en) * | 2006-11-27 | 2008-05-29 | Mcclellan Thomas | Light device having LED illumination and electronic circuit board in an enclosure |
US20080122364A1 (en) * | 2006-11-27 | 2008-05-29 | Mcclellan Thomas | Light device having LED illumination and an electronic circuit board |
WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
CN101210664A (zh) * | 2006-12-29 | 2008-07-02 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
TWI342075B (en) * | 2007-01-08 | 2011-05-11 | Ledtech Electronics Corp | Ceramic package for led |
CN101067479A (zh) * | 2007-02-06 | 2007-11-07 | 宁波安迪光电科技有限公司 | 大功率led照明装置 |
JP4753904B2 (ja) | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
US7918596B2 (en) * | 2007-04-20 | 2011-04-05 | Federal Signal Corporation | Warning light |
US20080258900A1 (en) * | 2007-04-20 | 2008-10-23 | George Frank | Warning light |
US7566147B2 (en) * | 2007-05-04 | 2009-07-28 | Ruud Lighting, Inc. | Multi-LED light fixture with secure arrangement for LED-array wiring |
US7651245B2 (en) | 2007-06-13 | 2010-01-26 | Electraled, Inc. | LED light fixture with internal power supply |
US20090279278A1 (en) * | 2007-08-03 | 2009-11-12 | Rohm Co., Ltd. | Light emitting device and method for manufacturing the same |
CN101377292B (zh) * | 2007-08-27 | 2010-09-29 | 宏齐科技股份有限公司 | 具有高效率散热功能的发光二极管灯具结构及*** |
US7670021B2 (en) * | 2007-09-27 | 2010-03-02 | Enertron, Inc. | Method and apparatus for thermally effective trim for light fixture |
US8240871B2 (en) * | 2007-09-27 | 2012-08-14 | Enertron, Inc. | Method and apparatus for thermally effective removable trim for light fixture |
CN100554764C (zh) * | 2007-09-29 | 2009-10-28 | 四川新力光源有限公司 | 嵌入式led灯具 |
JP4569683B2 (ja) | 2007-10-16 | 2010-10-27 | 東芝ライテック株式会社 | 発光素子ランプ及び照明器具 |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US8018139B2 (en) * | 2007-11-05 | 2011-09-13 | Enertron, Inc. | Light source and method of controlling light spectrum of an LED light engine |
TW200924229A (en) * | 2007-11-23 | 2009-06-01 | Gigno Technology Co Ltd | LED package module and manufacturing method thereof |
CN101451698A (zh) * | 2007-11-30 | 2009-06-10 | 上海三思电子工程有限公司 | 与散热器一体的大功率led照明光源单元 |
WO2009076579A2 (en) | 2007-12-12 | 2009-06-18 | Innotec Corporation | Overmolded circuit board and method |
US7655954B2 (en) * | 2007-12-17 | 2010-02-02 | Ledtech Electronics Corp. | Array type light-emitting device with high color rendering index |
TWI416202B (zh) * | 2007-12-24 | 2013-11-21 | Kolon Inc | 光學元件 |
JP5353216B2 (ja) * | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
US7815339B2 (en) | 2008-01-09 | 2010-10-19 | Innotec Corporation | Light module |
JP2011512037A (ja) | 2008-02-08 | 2011-04-14 | イルミテックス, インコーポレイテッド | エミッタ層成形のためのシステムおよび方法 |
TW200937668A (en) * | 2008-02-20 | 2009-09-01 | Harvatek Corp | LED chip package structure with different LED arrangement spacing and its packaging method |
TW200939869A (en) * | 2008-03-05 | 2009-09-16 | Harvatek Corp | An LED chip package structure with a high-efficiency heat-dissipating substrate and packaging method thereof |
WO2009111872A1 (en) * | 2008-03-11 | 2009-09-17 | Phoster Industries | Illumination of multiple types of objects using warm and cool light |
GB2458345B (en) * | 2008-03-12 | 2012-05-23 | Dialight Lumidrives Ltd | Method and apparatus for providing illumination |
CN101532644A (zh) * | 2008-03-14 | 2009-09-16 | 鸿富锦精密工业(深圳)有限公司 | 灯具 |
KR100928728B1 (ko) * | 2008-03-28 | 2009-11-27 | 홍지영 | 펠티어 효과를 이용한 발광다이오드 조명기구의 냉각장치 |
US7832896B2 (en) | 2008-04-18 | 2010-11-16 | Lumination Llc | LED light engine |
US20090296387A1 (en) * | 2008-05-27 | 2009-12-03 | Sea Gull Lighting Products, Llc | Led retrofit light engine |
KR101448153B1 (ko) * | 2008-06-25 | 2014-10-08 | 삼성전자주식회사 | 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자 |
CN103470983A (zh) * | 2008-06-27 | 2013-12-25 | 东芝照明技术株式会社 | 发光元件灯以及照明设备 |
JP4366431B1 (ja) * | 2008-07-30 | 2009-11-18 | シーシーエス株式会社 | 光照射装置 |
TWI419360B (zh) * | 2008-08-11 | 2013-12-11 | Formosa Epitaxy Inc | Solid crystal light-emitting device having an insulating layer and a method for manufacturing the same |
US8022626B2 (en) | 2008-09-16 | 2011-09-20 | Osram Sylvania Inc. | Lighting module |
DE102008047934B4 (de) * | 2008-09-19 | 2015-02-26 | Osram Gmbh | Beleuchtungsvorrichtung mit einem Kühlkörper |
WO2010044866A1 (en) * | 2008-10-16 | 2010-04-22 | Superbulbs, Inc. | White ac led |
EP2177818A1 (de) * | 2008-10-17 | 2010-04-21 | BöSha Technische Produkte GmbH & Co. KG | Leuchteinheit einer Straßenlaterne |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8251543B2 (en) | 2008-11-22 | 2012-08-28 | Innovative Lighting, Inc. | Interior corner mounting module for rope light system |
US8278837B1 (en) | 2008-11-24 | 2012-10-02 | Switch Bulb Company, Inc. | Single inductor control of multi-color LED systems |
US8104929B2 (en) * | 2008-11-26 | 2012-01-31 | Spring City Electrical Manufacturing Company | Outdoor lighting fixture using LEDs |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
TW201026177A (en) * | 2008-12-23 | 2010-07-01 | Starchips Technology Inc | Electronic device module |
TWI462350B (zh) * | 2008-12-24 | 2014-11-21 | Ind Tech Res Inst | 多晶發光二極體 |
TWI473246B (zh) * | 2008-12-30 | 2015-02-11 | Epistar Corp | 發光二極體晶粒等級封裝 |
JP5333758B2 (ja) * | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | 照明装置および照明器具 |
EP2403017A4 (en) * | 2009-02-27 | 2014-07-02 | Toshiba Lighting & Technology | LIGHT-EMITTING MODULE AND LIGHTING DEVICE |
CN101625079B (zh) | 2009-03-05 | 2012-01-25 | 华桂潮 | 中空式液冷led灯 |
US9915409B2 (en) | 2015-02-19 | 2018-03-13 | Cree, Inc. | Lens with textured surface facilitating light diffusion |
US10422503B2 (en) * | 2009-10-30 | 2019-09-24 | Ideal Industries Lighting Llc | One-piece multi-lens optical member and method of manufacture |
US9416926B2 (en) | 2009-04-28 | 2016-08-16 | Cree, Inc. | Lens with inner-cavity surface shaped for controlled light refraction |
US20100302789A1 (en) * | 2009-05-28 | 2010-12-02 | Qing Li | LED Light Source Module and Method for Producing the Same |
WO2010151600A1 (en) | 2009-06-27 | 2010-12-29 | Michael Tischler | High efficiency leds and led lamps |
JP5348410B2 (ja) | 2009-06-30 | 2013-11-20 | 東芝ライテック株式会社 | 口金付ランプおよび照明器具 |
JP5354191B2 (ja) * | 2009-06-30 | 2013-11-27 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
JP2011049527A (ja) | 2009-07-29 | 2011-03-10 | Toshiba Lighting & Technology Corp | Led照明装置 |
KR100981442B1 (ko) * | 2009-08-10 | 2010-09-13 | (주)아스트로닉 | 고휘도 백색 엘이디 다이칩 집적화 패키징 소자 제조방법 |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US9303861B2 (en) | 2009-09-14 | 2016-04-05 | Us Vaopto, Inc. | Light emitting diode light source modules |
JP5601512B2 (ja) * | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
CN102577635B (zh) | 2009-09-17 | 2015-03-25 | 皇家飞利浦电子股份有限公司 | 光源模块和发光设备 |
US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
JP2011071242A (ja) * | 2009-09-24 | 2011-04-07 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2011091033A (ja) | 2009-09-25 | 2011-05-06 | Toshiba Lighting & Technology Corp | 発光モジュール、電球形ランプおよび照明器具 |
CN102032481B (zh) * | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | 附带灯口的照明灯及照明器具 |
CN102032480B (zh) | 2009-09-25 | 2013-07-31 | 东芝照明技术株式会社 | 灯泡型灯以及照明器具 |
CN102032479B (zh) * | 2009-09-25 | 2014-05-07 | 东芝照明技术株式会社 | 灯泡型灯以及照明器具 |
JP2011187922A (ja) * | 2009-10-30 | 2011-09-22 | Toshiba Lighting & Technology Corp | 発光装置、発光装置の製造方法および照明装置 |
US20110109220A1 (en) * | 2009-11-09 | 2011-05-12 | Han-Ming Lee | Intermittent cyclic permanent illuminating LED lamp |
JP5623062B2 (ja) | 2009-11-13 | 2014-11-12 | シャープ株式会社 | 発光装置およびその製造方法 |
JP5349260B2 (ja) | 2009-11-19 | 2013-11-20 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
US20110122614A1 (en) * | 2009-11-26 | 2011-05-26 | Thermoking Technology International Co. | Luminaire with Scattered Light Collection Device |
US8511851B2 (en) | 2009-12-21 | 2013-08-20 | Cree, Inc. | High CRI adjustable color temperature lighting devices |
KR101035483B1 (ko) * | 2009-12-28 | 2011-05-20 | 주식회사 삼광산전 | 조명용 led 광원램프 |
TWI499347B (zh) * | 2009-12-31 | 2015-09-01 | Epistar Corp | 發光元件 |
US8493000B2 (en) | 2010-01-04 | 2013-07-23 | Cooledge Lighting Inc. | Method and system for driving light emitting elements |
US8613530B2 (en) | 2010-01-11 | 2013-12-24 | General Electric Company | Compact light-mixing LED light engine and white LED lamp with narrow beam and high CRI using same |
US8568012B2 (en) * | 2010-01-18 | 2013-10-29 | Lg Innotek Co., Ltd. | Lighting unit and display device having the same |
JP2011151268A (ja) | 2010-01-22 | 2011-08-04 | Sharp Corp | 発光装置 |
US20110186874A1 (en) * | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
DE202010002125U1 (de) * | 2010-02-10 | 2011-08-30 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit punktförmigen Lichtquellen und Reflektor |
JP5257622B2 (ja) | 2010-02-26 | 2013-08-07 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
TWM389208U (en) * | 2010-04-01 | 2010-09-21 | Lebensstil Technology Co Ltd | Assembled structure of illumination lamp |
CN102214776B (zh) * | 2010-04-09 | 2013-05-01 | 亿广科技(上海)有限公司 | 发光二极管封装结构、照明装置及发光二极管封装用基板 |
US8492777B2 (en) | 2010-04-09 | 2013-07-23 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
US9377173B2 (en) | 2010-04-21 | 2016-06-28 | Cooper Technologies Company | LED luminaire assembly |
DE102010028481A1 (de) * | 2010-05-03 | 2011-11-03 | Osram Gesellschaft mit beschränkter Haftung | Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe |
KR101283867B1 (ko) * | 2010-05-14 | 2013-07-08 | 엘지이노텍 주식회사 | 발광소자 어레이, 백라이트 장치 및 조명 장치 |
KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
WO2012024792A1 (en) * | 2010-08-25 | 2012-03-01 | Cooledge Lighting Inc. | Failure mitigation in arrays of light-emitting devices |
US9627361B2 (en) * | 2010-10-07 | 2017-04-18 | Cree, Inc. | Multiple configuration light emitting devices and methods |
EP2458260A1 (de) * | 2010-11-24 | 2012-05-30 | Belux IP AG | LED-Modul für Beleuchtungszwecke |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
CN102692592B (zh) * | 2011-03-22 | 2014-08-27 | 展晶科技(深圳)有限公司 | 发光二极管测试方法及在该方法中使用的发光二极管型材 |
US8632213B2 (en) | 2011-05-05 | 2014-01-21 | Cree, Inc. | Lighting fixture with flow-through cooling |
DE102011078619A1 (de) * | 2011-07-04 | 2013-01-10 | Osram Ag | LED-Lichtquelle und Verfahren zu deren Herstellung |
USD700584S1 (en) | 2011-07-06 | 2014-03-04 | Cree, Inc. | LED component |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
CN103016965B (zh) * | 2011-09-22 | 2016-06-08 | 欧司朗股份有限公司 | Led发光模块及其制造方法 |
CN103104899A (zh) * | 2011-10-24 | 2013-05-15 | 深圳市福明电子科技有限公司 | 一种可调色温led照明灯具的线路板及其制作方法 |
US20130120986A1 (en) | 2011-11-12 | 2013-05-16 | Raydex Technology, Inc. | High efficiency directional light source with concentrated light output |
JP5836780B2 (ja) * | 2011-12-02 | 2015-12-24 | 日立アプライアンス株式会社 | 発光ダイオードモジュール及びそれを利用した照明器具 |
US10090442B2 (en) | 2012-04-06 | 2018-10-02 | Philips Lighting Holding B.V. | White light emitting module |
TWI495056B (zh) * | 2012-04-24 | 2015-08-01 | Genesis Photonics Inc | 基板結構 |
US8901831B2 (en) | 2012-05-07 | 2014-12-02 | Lighting Science Group Corporation | Constant current pulse-width modulation lighting system and associated methods |
US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
US9887327B2 (en) | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
US9818919B2 (en) | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
WO2013188678A1 (en) | 2012-06-13 | 2013-12-19 | Innotec, Corp. | Flexible light pipe |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
TWI495167B (zh) * | 2012-08-22 | 2015-08-01 | Phostek Inc | 半導體發光裝置 |
DE102012215514A1 (de) * | 2012-08-31 | 2014-03-06 | Osram Gmbh | Verfahren zum Herstellen eines LED-Moduls und LED-Modul |
US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
US9626884B2 (en) | 2013-03-15 | 2017-04-18 | General Led, Inc. | LED light engine for signage |
US10400984B2 (en) | 2013-03-15 | 2019-09-03 | Cree, Inc. | LED light fixture and unitary optic member therefor |
EP2970695A2 (en) | 2013-03-15 | 2016-01-20 | Dow Corning Corporation | Powdered resin linear organopolysiloxane compositions |
US9920901B2 (en) | 2013-03-15 | 2018-03-20 | Cree, Inc. | LED lensing arrangement |
US10217387B2 (en) | 2013-03-15 | 2019-02-26 | General Led Opco, Llc | LED light engine for signage |
US9464780B2 (en) | 2013-03-15 | 2016-10-11 | General Led, Inc. | LED light engine for signage |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
US8928023B1 (en) | 2013-08-08 | 2015-01-06 | Osram Sylvania Inc. | Arrangement of solid state light sources and lamp using same |
USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
US9374859B2 (en) * | 2013-09-11 | 2016-06-21 | Advancetrex Corporation | Lighting interconnection and lighting control module |
US9273833B2 (en) | 2013-11-01 | 2016-03-01 | Cree, Inc. | LED light fixtures with arrangement for electrical connection |
USD751240S1 (en) | 2013-11-01 | 2016-03-08 | Cree, Inc. | Light fixture |
US9419189B1 (en) | 2013-11-04 | 2016-08-16 | Soraa, Inc. | Small LED source with high brightness and high efficiency |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
US9757912B2 (en) | 2014-08-27 | 2017-09-12 | Cree, Inc. | One-piece multi-lens optical member with ultraviolet inhibitor and method of manufacture |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
US10207440B2 (en) | 2014-10-07 | 2019-02-19 | Cree, Inc. | Apparatus and method for formation of multi-region articles |
US9470394B2 (en) | 2014-11-24 | 2016-10-18 | Cree, Inc. | LED light fixture including optical member with in-situ-formed gasket and method of manufacture |
CN104613427A (zh) * | 2015-01-19 | 2015-05-13 | 江苏翠钻照明有限公司 | 一种smd led组件及其制备方法 |
USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
JP6485243B2 (ja) * | 2015-03-02 | 2019-03-20 | 豊田合成株式会社 | 発光装置 |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
US10077896B2 (en) | 2015-09-14 | 2018-09-18 | Trent Neil Butcher | Lighting devices including at least one light-emitting device and systems including at least one lighting device |
US11827318B2 (en) | 2016-07-08 | 2023-11-28 | Liquid Lumens, Llc | High-output multifunction submersible marine lighting apparatus |
CN111140773A (zh) * | 2018-11-06 | 2020-05-12 | 朗德万斯公司 | 用于半导体灯的多色光引擎 |
DE102019111175A1 (de) * | 2019-04-30 | 2020-11-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anordnung und Verfahren zur Herstellung einer Anordnung sowie eines Bauteils |
US11650484B1 (en) * | 2019-08-07 | 2023-05-16 | Apple Inc. | Electronic device with camera status indicator |
USD933881S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture having heat sink |
US11032976B1 (en) | 2020-03-16 | 2021-06-15 | Hgci, Inc. | Light fixture for indoor grow application and components thereof |
USD933872S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1341966A (zh) * | 2001-09-29 | 2002-03-27 | 葛世潮 | 大功率发光二极管发光装置 |
CN1348608A (zh) * | 1999-04-22 | 2002-05-08 | 奥斯兰姆奥普托半导体股份有限两合公司 | 具有透镜的led光源 |
CN1404564A (zh) * | 2000-12-21 | 2003-03-19 | 皇家菲利浦电子有限公司 | 带反射器和发光二极管的光源 |
CN1426117A (zh) * | 2001-12-13 | 2003-06-25 | 诠兴开发科技股份有限公司 | 具有微小透镜的表面黏著型发光二极管 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4211955A (en) * | 1978-03-02 | 1980-07-08 | Ray Stephen W | Solid state lamp |
JPS5871671A (ja) * | 1981-10-23 | 1983-04-28 | Idec Izumi Corp | 発光ダイオ−ドランプ |
US4499145A (en) * | 1982-04-19 | 1985-02-12 | Sumitomo Bakelite Company Limited | Metal-clad laminate and process for producing the same |
JPH0416447Y2 (zh) * | 1985-07-22 | 1992-04-13 | ||
US5210440A (en) * | 1991-06-03 | 1993-05-11 | Vlsi Technology, Inc. | Semiconductor chip cooling apparatus |
JPH0545812U (ja) * | 1991-11-22 | 1993-06-18 | 株式会社小糸製作所 | 車輌用灯具 |
EP0619608B1 (en) * | 1993-04-07 | 1999-11-03 | Mitsui Chemicals, Inc. | Circuit board for optical devices |
US5655830A (en) * | 1993-12-01 | 1997-08-12 | General Signal Corporation | Lighting device |
US5463280A (en) * | 1994-03-03 | 1995-10-31 | National Service Industries, Inc. | Light emitting diode retrofit lamp |
US5698866A (en) * | 1994-09-19 | 1997-12-16 | Pdt Systems, Inc. | Uniform illuminator for phototherapy |
US5575459A (en) * | 1995-04-27 | 1996-11-19 | Uniglo Canada Inc. | Light emitting diode lamp |
US5688042A (en) * | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
ATE180118T1 (de) * | 1995-11-27 | 1999-05-15 | Koninkl Philips Electronics Nv | Leistungsversorgungsschaltung |
US5726535A (en) * | 1996-04-10 | 1998-03-10 | Yan; Ellis | LED retrolift lamp for exit signs |
JPH1125919A (ja) * | 1997-07-04 | 1999-01-29 | Moriyama Sangyo Kk | 電球装置および照明装置 |
ES2289822T3 (es) * | 1998-09-17 | 2008-02-01 | Koninklijke Philips Electronics N.V. | Lampara de led. |
US6149283A (en) * | 1998-12-09 | 2000-11-21 | Rensselaer Polytechnic Institute (Rpi) | LED lamp with reflector and multicolor adjuster |
JP4341122B2 (ja) * | 1999-11-09 | 2009-10-07 | 船井電機株式会社 | 発光ダイオード表示装置 |
KR100389469B1 (ko) * | 2000-03-31 | 2003-06-25 | 홍삼표 | 발광 전구 |
US6431728B1 (en) * | 2000-07-05 | 2002-08-13 | Whelen Engineering Company, Inc. | Multi-array LED warning lights |
US6481130B1 (en) * | 2000-08-11 | 2002-11-19 | Leotek Electronics Corporation | Light emitting diode linear array with lens stripe for illuminated signs |
JP2002100812A (ja) * | 2000-09-21 | 2002-04-05 | Rohm Co Ltd | 側面発光2チップ半導体発光装置 |
US6441558B1 (en) * | 2000-12-07 | 2002-08-27 | Koninklijke Philips Electronics N.V. | White LED luminary light control system |
US20020070643A1 (en) * | 2000-12-13 | 2002-06-13 | Chao-Chin Yeh | Structure of lamp |
JP3708026B2 (ja) * | 2001-04-12 | 2005-10-19 | 豊田合成株式会社 | Ledランプ |
US6834365B2 (en) * | 2001-07-17 | 2004-12-21 | International Business Machines Corporation | Integrated real-time data tracing with low pin count output |
US6632892B2 (en) * | 2001-08-21 | 2003-10-14 | General Electric Company | Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst |
US6719446B2 (en) * | 2001-08-24 | 2004-04-13 | Densen Cao | Semiconductor light source for providing visible light to illuminate a physical space |
US7204602B2 (en) * | 2001-09-07 | 2007-04-17 | Super Vision International, Inc. | Light emitting diode pool assembly |
KR100439402B1 (ko) | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
US8100552B2 (en) * | 2002-07-12 | 2012-01-24 | Yechezkal Evan Spero | Multiple light-source illuminating system |
JP4284990B2 (ja) * | 2002-12-16 | 2009-06-24 | パナソニック電工株式会社 | 発光装置 |
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
-
2004
- 2004-08-23 US US10/924,389 patent/US6942360B2/en not_active Expired - Fee Related
- 2004-09-24 TW TW093128941A patent/TWI245103B/zh not_active IP Right Cessation
- 2004-09-30 JP JP2006528332A patent/JP2007507115A/ja active Pending
- 2004-09-30 KR KR1020067006206A patent/KR20060066742A/ko active Search and Examination
- 2004-09-30 WO PCT/US2004/032397 patent/WO2005034198A2/en active Application Filing
- 2004-09-30 CN CN2004100903315A patent/CN1605790B/zh not_active Expired - Fee Related
-
2005
- 2005-04-22 US US11/112,918 patent/US7431477B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1348608A (zh) * | 1999-04-22 | 2002-05-08 | 奥斯兰姆奥普托半导体股份有限两合公司 | 具有透镜的led光源 |
CN1404564A (zh) * | 2000-12-21 | 2003-03-19 | 皇家菲利浦电子有限公司 | 带反射器和发光二极管的光源 |
CN1341966A (zh) * | 2001-09-29 | 2002-03-27 | 葛世潮 | 大功率发光二极管发光装置 |
CN1426117A (zh) * | 2001-12-13 | 2003-06-25 | 诠兴开发科技股份有限公司 | 具有微小透镜的表面黏著型发光二极管 |
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TWI245103B (en) | 2005-12-11 |
CN1605790A (zh) | 2005-04-13 |
US7431477B2 (en) | 2008-10-07 |
US20050073840A1 (en) | 2005-04-07 |
US20060239002A1 (en) | 2006-10-26 |
KR20060066742A (ko) | 2006-06-16 |
US6942360B2 (en) | 2005-09-13 |
WO2005034198A3 (en) | 2005-06-09 |
WO2005034198A2 (en) | 2005-04-14 |
JP2007507115A (ja) | 2007-03-22 |
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