CN1516200A - 具有测试装置的存储模块 - Google Patents
具有测试装置的存储模块 Download PDFInfo
- Publication number
- CN1516200A CN1516200A CNA2003101131079A CN200310113107A CN1516200A CN 1516200 A CN1516200 A CN 1516200A CN A2003101131079 A CNA2003101131079 A CN A2003101131079A CN 200310113107 A CN200310113107 A CN 200310113107A CN 1516200 A CN1516200 A CN 1516200A
- Authority
- CN
- China
- Prior art keywords
- memory module
- test
- storage
- proving installation
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 claims abstract description 91
- 238000011990 functional testing Methods 0.000 claims abstract description 16
- 230000006870 function Effects 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 50
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000013461 design Methods 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012353 t test Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56012—Timing aspects, clock generation, synchronisation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/26—Accessing multiple arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/36—Data generation devices, e.g. data inverters
- G11C2029/3602—Pattern generator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Tests Of Electronic Circuits (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10260184.4 | 2002-12-20 | ||
DE10260184A DE10260184B4 (de) | 2002-12-20 | 2002-12-20 | Speichermodul mit einer Testeinrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1516200A true CN1516200A (zh) | 2004-07-28 |
CN100580815C CN100580815C (zh) | 2010-01-13 |
Family
ID=32519232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200310113107A Expired - Lifetime CN100580815C (zh) | 2002-12-20 | 2003-12-22 | 具有测试装置的存储模块 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7315969B2 (zh) |
CN (1) | CN100580815C (zh) |
DE (1) | DE10260184B4 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112714542A (zh) * | 2020-12-15 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Pcb测试板、电子设备、pcb板及其制作方法 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7266634B2 (en) * | 2000-01-05 | 2007-09-04 | Rambus Inc. | Configurable width buffered module having flyby elements |
US20050010737A1 (en) * | 2000-01-05 | 2005-01-13 | Fred Ware | Configurable width buffered module having splitter elements |
US7356639B2 (en) * | 2000-01-05 | 2008-04-08 | Rambus Inc. | Configurable width buffered module having a bypass circuit |
US7404032B2 (en) * | 2000-01-05 | 2008-07-22 | Rambus Inc. | Configurable width buffered module having switch elements |
US7363422B2 (en) * | 2000-01-05 | 2008-04-22 | Rambus Inc. | Configurable width buffered module |
US8001439B2 (en) * | 2001-09-28 | 2011-08-16 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
US7370256B2 (en) * | 2001-09-28 | 2008-05-06 | Inapac Technology, Inc. | Integrated circuit testing module including data compression |
US7365557B1 (en) | 2001-09-28 | 2008-04-29 | Inapac Technology, Inc. | Integrated circuit testing module including data generator |
US8166361B2 (en) * | 2001-09-28 | 2012-04-24 | Rambus Inc. | Integrated circuit testing module configured for set-up and hold time testing |
US7265570B2 (en) * | 2001-09-28 | 2007-09-04 | Inapac Technology, Inc. | Integrated circuit testing module |
US7446551B1 (en) | 2001-09-28 | 2008-11-04 | Inapac Technology, Inc. | Integrated circuit testing module including address generator |
US8286046B2 (en) | 2001-09-28 | 2012-10-09 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
US7234099B2 (en) * | 2003-04-14 | 2007-06-19 | International Business Machines Corporation | High reliability memory module with a fault tolerant address and command bus |
US7900099B2 (en) * | 2005-01-25 | 2011-03-01 | Micron Technology, Inc. | Enabling test modes of individual integrated circuit devices out of a plurality of integrated circuit devices |
CN101167141A (zh) * | 2005-04-21 | 2008-04-23 | 富士通株式会社 | 在mcp或sip中的存储芯片的测试*** |
US7562271B2 (en) | 2005-09-26 | 2009-07-14 | Rambus Inc. | Memory system topologies including a buffer device and an integrated circuit memory device |
US11328764B2 (en) | 2005-09-26 | 2022-05-10 | Rambus Inc. | Memory system topologies including a memory die stack |
US7464225B2 (en) * | 2005-09-26 | 2008-12-09 | Rambus Inc. | Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology |
US7779311B2 (en) * | 2005-10-24 | 2010-08-17 | Rambus Inc. | Testing and recovery in a multilayer device |
US7561027B2 (en) * | 2006-10-26 | 2009-07-14 | Hewlett-Packard Development Company, L.P. | Sensing device |
US7725783B2 (en) * | 2007-07-20 | 2010-05-25 | International Business Machines Corporation | Method and apparatus for repeatable drive strength assessments of high speed memory DIMMs |
JP2009266258A (ja) | 2008-04-22 | 2009-11-12 | Hitachi Ltd | 半導体装置 |
KR20100079378A (ko) * | 2008-12-31 | 2010-07-08 | 삼성전자주식회사 | 메모리 모듈 테스트 장치 |
EP2372379B1 (en) * | 2010-03-26 | 2013-01-23 | Imec | Test access architecture for TSV-based 3D stacked ICS |
TWI451428B (zh) | 2010-06-03 | 2014-09-01 | Sunplus Technology Co Ltd | 於完整記憶體系統中具有先進特徵的記憶體測試系統 |
KR101796116B1 (ko) | 2010-10-20 | 2017-11-10 | 삼성전자 주식회사 | 반도체 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 그 동작방법 |
KR102282191B1 (ko) * | 2014-06-05 | 2021-07-27 | 삼성전자 주식회사 | 인쇄 회로 기판, 반도체 패키지 및 반도체 패키지의 제조방법 |
US10768230B2 (en) | 2016-05-27 | 2020-09-08 | International Business Machines Corporation | Built-in device testing of integrated circuits |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5428624A (en) * | 1993-10-12 | 1995-06-27 | Storage Technology Corporation | Fault injection using boundary scan |
JP3059349B2 (ja) * | 1994-12-19 | 2000-07-04 | シャープ株式会社 | Icカード、及びフラッシュメモリの並列処理方法 |
US5815426A (en) * | 1996-08-13 | 1998-09-29 | Nexcom Technology, Inc. | Adapter for interfacing an insertable/removable digital memory apparatus to a host data part |
JP3866444B2 (ja) * | 1998-04-22 | 2007-01-10 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置及びその内部信号モニタ方法 |
US6058056A (en) * | 1998-04-30 | 2000-05-02 | Micron Technology, Inc. | Data compression circuit and method for testing memory devices |
US6769081B1 (en) * | 2000-08-30 | 2004-07-27 | Sun Microsystems, Inc. | Reconfigurable built-in self-test engine for testing a reconfigurable memory |
US6928593B1 (en) * | 2000-09-18 | 2005-08-09 | Intel Corporation | Memory module and memory component built-in self test |
JP4401319B2 (ja) * | 2005-04-07 | 2010-01-20 | 株式会社日立製作所 | Dram積層パッケージ並びにdram積層パッケージの試験および救済方法 |
-
2002
- 2002-12-20 DE DE10260184A patent/DE10260184B4/de not_active Expired - Lifetime
-
2003
- 2003-12-18 US US10/737,776 patent/US7315969B2/en active Active
- 2003-12-22 CN CN200310113107A patent/CN100580815C/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112714542A (zh) * | 2020-12-15 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Pcb测试板、电子设备、pcb板及其制作方法 |
CN112714542B (zh) * | 2020-12-15 | 2022-07-08 | 苏州浪潮智能科技有限公司 | Pcb测试板、电子设备、pcb板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
DE10260184B4 (de) | 2005-08-25 |
DE10260184A1 (de) | 2004-07-15 |
US7315969B2 (en) | 2008-01-01 |
CN100580815C (zh) | 2010-01-13 |
US20040145935A1 (en) | 2004-07-29 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: INFINEON TECHNOLOGIES AG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120920 Address after: Munich, Germany Patentee after: QIMONDA AG Address before: Munich, Germany Patentee before: Infineon Technologies AG |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160112 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: QIMONDA AG |
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CX01 | Expiry of patent term |
Granted publication date: 20100113 |
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CX01 | Expiry of patent term |