CN1494136A - Chip packaging structure having internal set heat radiation fin - Google Patents
Chip packaging structure having internal set heat radiation fin Download PDFInfo
- Publication number
- CN1494136A CN1494136A CNA021377715A CN02137771A CN1494136A CN 1494136 A CN1494136 A CN 1494136A CN A021377715 A CNA021377715 A CN A021377715A CN 02137771 A CN02137771 A CN 02137771A CN 1494136 A CN1494136 A CN 1494136A
- Authority
- CN
- China
- Prior art keywords
- fin
- chip
- packaging structure
- heat emission
- integral heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
There are disadvantages of large volume and poor effect of heat dispersion for traditional external type and built-in type structure of hat dispersion. The invented built-in type structure of heat dispersion includes base plate, chips on the base plate, thermal fins and plastic package body. The said thermal fins through lobes and agglomerant are setup at base plate. There are multiple grooves on top of the fins. Base on traditional structure, multiple grooves are added to the invented structure so as to increase contact area between thermal fins and air effectively. Thus, heat dispersion is raised.
Description
Technical field
The present invention relates to the new design of internal set heat radiation fin, relate in particular to improvement the internal set heat radiation fin in the chip-packaging structure.
Background technology
Because the operating power of some integrated circuits is bigger, therefore, generally all needs to be provided with radiator structure on this adhesive integrated circuit.Radiator structure on the existing chip is divided into external and built-in two kinds.
The structure of external promptly at chip (integrated circuit) 101 upper surfaces through encapsulation, is provided with metal sheet 102 as shown in Figure 1, and this metal sheet 102 is fin, plays the effect of heat radiation.Though this outlet structure radiating effect is preferable, general volume is bigger, and the incompatibility electron trade is to the compact requirement of package dimension.
Internal set heat radiation fin generally is embedded to the plastic packaging glue inside of chip, is transmitted to substrate or is dispersed in the air with the heat that chip is produced.Built-in structure as shown in Figures 2 and 3, wherein Fig. 2 is the profile of traditional built-in structure, Fig. 3 is the vertical view of Fig. 2.As shown in Figure 2, on traditional ball bar battle array encapsulation BGA form basis, imbed fin 22 in plastic-sealed body 21, the bottom of fin 2 has some protruding 24, and these projectioies 24 bond on substrate 25 by binding agent 26.The effect of these projectioies 24 is to guarantee to leave certain clearance 28 between the lower edge 27 of fin 22 and the substrate 25, so that plastic packaging glue can successfully flow into and be full of the cavity 29 of fin 22 inside in injection moulding process.Behind the plastic packaging, the top 30 of fin 22 will be exposed in the air, and will be identical with the height on plastic-sealed body top.Because fin 22 generally by heat conductivility material preferably, for example make, and adopted such structure by copper, aluminium etc., the heat that produces on the chip 31 just can be dispersed in the air by fin.But, can be clear that more that from Fig. 3 the shortcoming of this built-in structure is that the radiating surface of its fin 22 is a plane, and is limited with the contact area of air, radiating effect is not as having the external radiator structure of blade construction.
Summary of the invention
The objective of the invention is to, the characteristics in conjunction with the built-in and outlet structure of tradition provide the chip-packaging structure that have integral heat emission sheet of a kind of radiating effect near external.
According to above-mentioned purpose of the present invention, the chip-packaging structure that has the integral heat emission sheet of the present invention comprises: substrate, be arranged at chip on the described substrate, be arranged at fin and plastic-sealed body on the described substrate by projection and binding agent, it is characterized in that, offer many grooves at the top of described fin.
The chip-packaging structure of aforesaid band integral heat emission sheet, described groove can be linear pattern, annular, the outside diverging in center or snakelike.
The chip-packaging structure of aforesaid band integral heat emission sheet, the top of described fin are circular or square.
As mentioned above, the present invention is traditional built-in architecture advances part, has offered groove at the top of fin, and its effect is the contact area that increases fin and air, thereby improves radiating effect effectively.
Description of drawings
Describe specific embodiments of the invention in detail below in conjunction with accompanying drawing.In the accompanying drawing:
Fig. 1 is the schematic diagram of traditional external heat radiating fin structure;
Fig. 2 and Fig. 3 are the schematic diagrames of traditional integral heat emission chip architecture.
Fig. 4-8 is of the present invention to have the structural representation of a plurality of embodiment of the chip-packaging structure of internal set heat radiation fin.
Embodiment
See also Fig. 4 A and Fig. 4 B.Fig. 4 A is the cutaway view of an embodiment of the chip-packaging structure that has an internal set heat radiation fin of the present invention, and Fig. 4 B is its vertical view.Overall, this structure is similar substantially to traditional built-in structure.On traditional ball bar battle array encapsulation BGA form basis, in plastic-sealed body 1, imbed fin 2, the bottom of fin 2 has some protruding 4, and these projectioies 4 bond on substrate 5 by binding agent 6.The effect of these projectioies 4 is to guarantee to leave certain clearance 8 between the lower edge 7 of fin 2 and the substrate 5, so that plastic packaging glue can successfully flow into and be full of the cavity 9 of fin 2 inside in injection moulding process.Behind the plastic packaging, the top 10 of fin 2 will be exposed in the air, and will be identical with the height on plastic-sealed body top.Fin 2 generally by heat conductivility material preferably, for example make by copper, aluminium etc.The present invention is the improvements of traditional built-in structure, offers many grooves 3 at the top of fin 2, and these grooves 3 make the fin 2 and the contact area of air increase, thereby improve radiating effect effectively.The shape of these grooves 3 can change, and for example in the embodiment of Fig. 4, groove is a linear pattern; In the embodiment of Fig. 5, groove 3A is annular; In the embodiment of Fig. 6 and Fig. 7, groove 4A and 5A are the outside diverging in center; In the embodiment of Fig. 8, groove 6A is snakelike.For the groove structure of direct current shape, can in the applied environment of chip, make the trend of air-flow direction along this groove, so more can show the heat dispersion that it is superior.
Moreover the shape at fin 2 tops also can change, and for example, among the embodiment of Fig. 4, Fig. 5 and Fig. 7, the top of fin 2 is circular, and in the embodiment of Fig. 6 and Fig. 8, the top of fin 2 is square.Should be appreciated that groove shapes as described herein and fin top shape just as an example, any other suitable shape all can adopt for the present invention.
Claims (7)
1, a kind of chip-packaging structure that has the integral heat emission sheet comprises: substrate, be arranged at chip on the described substrate, be arranged at fin and plastic-sealed body on the described substrate by projection and binding agent, it is characterized in that, offer many grooves at the top of described fin.
2. the chip-packaging structure of band integral heat emission sheet as claimed in claim 1 is characterized in that, described groove is a linear pattern.
3. the chip-packaging structure of band integral heat emission sheet as claimed in claim 1 is characterized in that, described groove is an annular.
4. the chip-packaging structure of band integral heat emission sheet as claimed in claim 1 is characterized in that, described groove is the outside diverging in center.
5. the chip-packaging structure of band integral heat emission sheet as claimed in claim 1 is characterized in that, described groove is snakelike.
6. as the chip-packaging structure of the described band integral heat emission of one of claim 1 to 5 sheet, it is characterized in that the top of described fin is circular.
7. as the chip-packaging structure of the described band integral heat emission of one of claim 1 to 5 sheet, it is characterized in that the top of described fin is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021377715A CN1494136A (en) | 2002-11-01 | 2002-11-01 | Chip packaging structure having internal set heat radiation fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021377715A CN1494136A (en) | 2002-11-01 | 2002-11-01 | Chip packaging structure having internal set heat radiation fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1494136A true CN1494136A (en) | 2004-05-05 |
Family
ID=34231698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021377715A Pending CN1494136A (en) | 2002-11-01 | 2002-11-01 | Chip packaging structure having internal set heat radiation fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1494136A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010143080A1 (en) * | 2009-06-10 | 2010-12-16 | Green Arrow Asia Limited | Integrated circuit package having a castellated heatspreader |
| CN102842542A (en) * | 2011-06-21 | 2012-12-26 | 中兴通讯股份有限公司 | Plastic package chip and manufacturing method thereof |
| CN106057747A (en) * | 2015-04-09 | 2016-10-26 | 三星电子株式会社 | Semiconductor package including heat spreader and method for manufacturing the same |
| CN109863596A (en) * | 2019-01-22 | 2019-06-07 | 长江存储科技有限责任公司 | Integrated circuit package structure and its manufacturing method |
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
-
2002
- 2002-11-01 CN CNA021377715A patent/CN1494136A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010143080A1 (en) * | 2009-06-10 | 2010-12-16 | Green Arrow Asia Limited | Integrated circuit package having a castellated heatspreader |
| CN102842542A (en) * | 2011-06-21 | 2012-12-26 | 中兴通讯股份有限公司 | Plastic package chip and manufacturing method thereof |
| WO2012174833A1 (en) * | 2011-06-21 | 2012-12-27 | 中兴通讯股份有限公司 | Plastic packaged chip and manufacturing method thereof |
| CN106057747A (en) * | 2015-04-09 | 2016-10-26 | 三星电子株式会社 | Semiconductor package including heat spreader and method for manufacturing the same |
| CN109863596A (en) * | 2019-01-22 | 2019-06-07 | 长江存储科技有限责任公司 | Integrated circuit package structure and its manufacturing method |
| CN109863596B (en) * | 2019-01-22 | 2020-05-26 | 长江存储科技有限责任公司 | Integrated circuit package structure and manufacturing method thereof |
| US11476173B2 (en) | 2019-01-22 | 2022-10-18 | Yangtze Memory Technologies Co., Ltd. | Manufacturing method of integrated circuit packaging structure |
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |