CN1490160A - Piezo ink-jet head and pressure cavity shaping method - Google Patents
Piezo ink-jet head and pressure cavity shaping method Download PDFInfo
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- CN1490160A CN1490160A CNA021473471A CN02147347A CN1490160A CN 1490160 A CN1490160 A CN 1490160A CN A021473471 A CNA021473471 A CN A021473471A CN 02147347 A CN02147347 A CN 02147347A CN 1490160 A CN1490160 A CN 1490160A
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- silicon
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- ink jet
- pressure chamber
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Abstract
A piezoelectric ink-jet printhead features that the deformation of piezoelectric material can squeeze via a vibration layer the pressure cavity to jet the ink from the pressure cavity onto medium. Said pressure cavity is prepared through providing a substrate with at least one big hole on it, filling photoresist in the big hole, etching to form several isolated small recesses in photoresist layer which is just the pressure cavity, and sticking a thin silicon chip to it for forming the vibration layer.
Description
Technical field
The present invention relates to the method for forming of a kind of piezoelectric ink jet head and pressure chamber thereof, be particularly related to a kind of utilize silicon as framework to make a macroscopic void, in macroscopic void, carry out the filling and the etching step of photoresist layer again, to form the little groove of a plurality of isolation, as the pressure chamber of piezoelectric ink jet head.
Background technology
Piezoelectric type (Piezoelectric) inkjet technology is to utilize to apply voltage system and make piezoelectricity pottery magnetic produce deformation, via the high pressure that squeezeout ink produced ink is sprayed.Piezoelectric ink-jet head can not produce chemical change because of high-temperature gasification, so have splendid durability.And piezoelectricity pottery magnetic response speed is fast, can not be subject to heat conduction velocity, so can promote print speed.Produce the mechanism of distortion according to different piezoelectricity, business-like at present piezoelectric ink-jet head can be divided into bending-type (bend mode) and plug-type (push mode) two kinds.The operating principle of the piezoelectric ink jet head of bending-type is that the voltage that passes through to be applied makes piezoelectricity pottery disk (piezo ceramic) produce contraction distortion, and can be subjected to pining down of vibrating reed (diaphragm) and form lateral thrust, and then the ink in squeeze pressure chamber (pressure chamber), the ink that then is positioned at the nozzle place can quicken ejection because of bearing the external and internal pressure difference.The operating principle of plug-type piezoelectric ink jet head is that applied voltage by two electrodes is rapidly during conversion, make piezoelectricity pottery disk produce contraction distortion, and make vibrating reed produce bigger flexural deformation, and the ink of the thrust of its generation in can the squeeze pressure chamber, and then make ink quicken the jetting nozzle place.
Yet, known piezoelectric ink jet head technology adopt mostly laminated ceramic altogether the burning method come assemblies such as moulding vibrating plate and pressure chamber, its method of forming includes powder stock (PZT, ZrO
2, PbO, TiO
2, other suitable additive) steps such as synthetic, mixing, drying, calcination, pulverizing, granulation, compression, moulding, sintering and polarization, but loaded down with trivial details and difficulty is high for fear of above-mentioned processing procedure, exist always that yield is low, cost is high, be unfavorable for shortcoming such as a large amount of productions.In view of this, how to utilize etch process to replace ceramic co-fired method commonly used, become the current important topic of needing research and development badly to improve the stability of pressure chamber molding manufacture procedure.
In recent years, in the semi-conductive etch process field, many etched researchs of making deep hole on the silicon of being devoted to are arranged, in order to be applied to micro electromechanical structure.Yet no matter be Wet-type etching (wet etching) that utilizes chemical reaction to carry out or the dry-etching (dry etching) that utilizes physical reactions to carry out, all unavoidable generation directional etch, etch-rate are crossed low and shortcoming such as processing procedure costliness.Therefore, as if the pressure chamber of making piezoelectric ink jet head in the mode of direct etching silicon chip, accurately the profile in controlled pressure chamber, the degree of depth and homogeneity also can't be produced high-resolution pressure chamber structure.
Summary of the invention
Main purpose of the present invention is to propose a kind of method of utilizing technology such as silicon combination, grinding, oxidation, photoresistance filling, the little shadow of photoresistance to make the pressure chamber moulding of piezoelectric ink jet head, to solve the problem that known technology suffers from.
According to above-mentioned purpose, piezoelectric ink jet head of the present invention includes: a silicon base, and it includes at least one macroscopic void; One photoresist layer is filled in the macroscopic void of this silicon base, and includes a plurality of isolated little grooves in this photoresist layer, and this little groove is used as a pressure chamber; One first silicon oxide layer is to cover this silicon base, and the surface of this photoresist layer and this little groove is used as the barrier layer of the gold-tinted micro-photographing process of this little groove; One silicon layer is formed on this first silicon oxide layer surface; And one second silicon oxide layer, be formed on this silicon surface.
According to above-mentioned purpose, the method of forming of the pressure chamber of piezoelectric ink jet head of the present invention, be to form a macroscopic void prior to etching in the presumptive area of a silicon, in macroscopic void, fill a photoresist layer again, follow-up photoresist layer is carried out yellow light lithography or etch process, to form the little groove of a plurality of isolation in the photoresist layer of macroscopic void, then this little groove can be used as a pressure chamber.And pressure chamber forming technique of the present invention can combine and carry out technology such as bonding, grinding, etching with another silicon, to finish the making of vibrations layer simultaneously, and before the etching that forms macroscopic void is not limited to the silicon wafer combination, and before inserting photoresist layer, all can carry out.
One of advantage of the present invention is, the pressure chamber forming step only needs photoresist layer is adopted general yellow light lithography mode, and do not need silicon is carried out wet etching or dry ecthing, so the problem that can avoid general silicon etching to be suffered from, as: oblique angle defective, etch-rate are crossed low and shortcoming such as processing procedure costliness.
Another advantage of the present invention is, technology such as the joint of use silicon, grinding, oxidation, yellow light lithography, can utilize the vibrations layer of lip-deep silicon layer as piezoelectric ink jet head, and can directly in the photoresist layer at the back side, make pressure chamber, therefore have that fabrication steps is simplified, the processing procedure degree of difficulty is low and processing procedure stability advantages of higher, the yield of piezoelectric ink jet head is improved, cost reduces, output increases.
Brief Description Of Drawings
Figure 1A to Fig. 1 C is the schematic diagram of pressure chamber forming technique of the piezoelectric ink jet head of the embodiment of the invention 1.
Fig. 2 A to Fig. 2 H is the pressure chamber and the generalized section that shakes the formable layer technology of the piezoelectric ink jet head of the embodiment of the invention 2.
Fig. 3 A to Fig. 3 F is the pressure chamber and the generalized section that shakes the formable layer technology of the piezoelectric ink jet head of the embodiment of the invention 3.
Symbol description
10 first silicons, 12 macroscopic voids
14 photoresist layers 16 SiO
2Layer
17 hydrogen bonds solvent layers 18 the 2nd SiO
2Layer
20 second silicon 20A silicon layers
S22iO
2Adhesion coating 26 piezoelectricity pottery magnetospheres
28 little grooves
The specific embodiment
For above and other objects of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and cooperate Figure of description, be described in detail below:
The invention provides a kind of pressure chamber and forming technique thereof of piezoelectric ink jet head, be to form a macroscopic void prior to etching in the presumptive area of a silicon, in macroscopic void, fill a photoresist layer again, follow-up photoresist layer is carried out yellow light lithography or etch process, to form the little groove of a plurality of isolation in the photoresist layer of macroscopic void, then this little groove can be used as a pressure chamber.And pressure chamber forming technique of the present invention can combine and carry out technology such as bonding, grinding, etching with another silicon, to finish the making of vibrations layer.The vibrations layer of piezoelectric ink jet head of the present invention and pressure chamber forming technique can be applied in the piezoelectric ink-jet head of piezoelectric deforming mechanism, for example bending-type (bend mode) and plug-type (push mode) two kinds of piezoelectric ink-jet heads.
[embodiment 1]
See also Figure 1A to Fig. 1 C, the schematic perspective view of the pressure chamber forming technique of the piezoelectric ink jet head of its demonstration embodiment of the invention 1.At first, shown in Figure 1A, provide one first silicon 10, then first silicon 10 is used as a framework, so that a presumptive area etching is formed a macroscopic void 12.In preferred embodiment, the etching mode of macroscopic void 12 can be selected sand-blast, Wet-type etching, dry-etching or other etch process that can implement for use, and according to product demand and processing procedure collocation variation, the number of macroscopic void 12, area and profile all can be done suitable variation, and a preferred embodiment is that the area with macroscopic void 12 is controlled to be 10000 μ m * 10000 μ m.Then, shown in Figure 1B, utilize general photoresistance coating technique, in the macroscopic void 12 of first silicon 10, fill a photoresist layer 14.At last, shown in Fig. 1 C, photoresist layer 14 in the macroscopic void 12 of first silicon 10 is carried out yellow light lithography or etch process, then can form a plurality of little grooves 28 in photoresist layer 14, then these isolated mutually little grooves 28 become the pressure chamber of piezoelectric ink jet head of the present invention.According to the design of product demand and macroscopic void 12, the number of little groove 28, area and profile all can be done suitable variation, and a preferred embodiment is that the area with little groove 28 is made into 200 μ m * 3000 μ m.
[embodiment 2]
The technology of the embodiment of the invention 2 is in conjunction with technology such as bonding, the grinding of another silicon, etchings, to finish the making of vibrations layer with above-mentioned pressure chamber forming technique.
See also Fig. 2 A to Fig. 2 H, it shows the pressure chamber and the generalized section that shakes the formable layer technology of the piezoelectric ink jet head of the embodiment of the invention 2.
At first, shown in Fig. 2 A neutral body figure,,, a presumptive area etching is formed macroscopic void 12 with the framework of first silicon 10 as pressure chamber according to embodiment 1 described mode.
The follow-up insulating barrier that carries out covers silicon (silicon-on-insulator, SOI) technology can become first silicon 10 and another silicon fluid-tight engagement one insulating barrier and cover silicon base.See also the generalized section of Fig. 2 B, aforementioned first silicon 10 is provided and carries out the surface oxidation program, can go up in first silicon, 10 surfaces and form one the one SiO
2Layer 16 is subsequently in a SiO
2Coating one hydrogen bonds solvent layer 17 is gone up on layer 16 surface, as: acetone or alcohol.In addition, one second silicon 20 is provided and carries out the surface oxidation program, on the surface of second silicon 20, form one the 2nd SiO
2Layer 18 is subsequently in the 2nd SiO
2Coating one hydrogen bonds solvent layer 17 is gone up on layer 18 surface, as: acetone or alcohol.Next, shown in Fig. 2 C, utilize technology such as temporary adhesion that hydrogen bonds solvent layer 17 provides, chip contraposition, chip pressing, can make a SiO
2Layer the 16 and the 2nd SiO
2The layer 18 bonding SiO that becomes
2 Adhesion coating 22, and then make first silicon 10 and second silicon 20 form fluid-tight engagement.Then, can grind processing procedure to second silicon 20, for example (chemical mechanicalpolishing CMP), makes residual silicon layer 20A thickness reach 5～20 μ m approximately to the cmp technology, is used for as a vibrations layer 20A.In addition, also can grind processing procedure to the bottom of first silicon 10, for example the cmp technology (chemical mechanicalpolishing, CMP) so that the thickness of first silicon 10 reaches the desired depth of pressure chamber.
Shown in Fig. 2 E, on silicon layer 20A surface, form a piezoelectricity pottery magnetosphere 26.Shown in Fig. 2 F, insert a photoresist layer 14 in the macroscopic void 12 prior to first silicon 10, again photoresist layer 14 is carried out yellow light lithography or etch process, and utilize SiO
2Adhesion coating 16 is as a barrier layer, then can in photoresist layer 14, form a plurality of little grooves 28, then these isolated mutually little grooves 28 become the pressure chamber of piezoelectric ink jet head of the present invention, and this result can consult the generalized section of Fig. 2 G and the schematic perspective view of the pressure chamber shown in Fig. 2 H.
Follow-up piezoelectric ink jet head processing procedure can carry out the making of ink container, through hole and spray nozzle sheet below pressure chamber, no longer write at this.
Compared to known technology, the pressure chamber forming step of the technology of the present invention only needs photoresist layer 14 is adopted general yellow light lithography mode, for example: soft roasting, exposure, develop, hard step such as roasting, and do not need first silicon 10 is carried out wet etching or dry ecthing, so the problem that can avoid general silicon etching to be suffered from, as: oblique angle defective, etch-rate are crossed low and shortcoming such as processing procedure costliness.And, the present invention uses technology such as the joint, grinding, oxidation, little shadow of silicon, can utilize the vibrations layer of silicon layer 20A as piezoelectric ink jet head, and can directly in the photoresist layer 14 at first silicon, 10 back sides, make pressure chamber, therefore have that fabrication steps is simplified, the processing procedure degree of difficulty is low and processing procedure stability advantages of higher, the yield of piezoelectric ink jet head is improved, cost reduces, output increases.
[embodiment 3]
The pressure chamber forming technique of the piezoelectric ink jet head of the embodiment of the invention 3, similar to embodiment 2, difference is to adopt the cement mode to replace the SOI technology, can further reduce cost of manufacture and simplify the making flow process.
See also Fig. 3 A to Fig. 3 F, it shows the pressure chamber and the generalized section that shakes the formable layer technology of the piezoelectric ink jet head of the embodiment of the invention 3.
At first, as shown in Figure 3A,, a presumptive area etching is formed macroscopic void 12 with the framework of first silicon 10 as pressure chamber.Then, one cement is provided on the surface of first silicon 10, and its material can be: and resin, phosphorosilicate glass (phosphosi1icate glass, PSG), spin-coating glass (spin on glass, SOG) or dry film (dry film) or the like, to provide as an adhesive layer 24.Simultaneously, provide one second silicon 20, and a cement is provided on its surface, its material can be: resin, phosphorosilicate glass (phosphosilicate glass, PSG), spin-coating glass (spin on glass, SOG) or dry film (dry film) or the like, to provide as an adhesive layer 24.
Then, shown in Fig. 3 B, carry out the chip adhesive technology, adhesive layer 24 can make first chip 10 and second chip 20 temporarily fit, utilize contraposition, the pressing technology of chip again, just the bottom of second silicon 20 can be pressure bonded to downwards on the surface of first silicon 10.
Then, shown in Fig. 3 C, grind processing procedure, for example (chemical mechanicalpolishing CMP), grinds second silicon 20 of removing a part to the cmp technology, until making residual silicon layer 20A thickness reach 5～20 μ m approximately, can be used for as a vibrations layer.In addition, also can grind processing procedure to the bottom of first silicon 10, for example the cmp technology (chemical mechanical polishing, CMP) so that the thickness of first silicon 10 reaches the desired depth of pressure chamber.
Shown in Fig. 3 D, on silicon layer 20A surface, form a piezoceramics layer 26.Shown in Fig. 3 E, insert a photoresist layer 14 in the macroscopic void 12 prior to first silicon 10, again photoresist layer 14 is carried out yellow light lithography or etch process, and utilize adhesive layer 24 as a barrier layer, then can form a plurality of little grooves 28 in photoresist layer 14, then these isolated mutually little grooves 28 become the pressure chamber of piezoelectric ink jet head of the present invention.
Follow-up piezoelectric ink jet head processing procedure can carry out the making of ink container, through hole and spray nozzle sheet in the pressure chamber below, is no longer write at this.
Though the present invention discloses as above in the mode of preferred embodiment; yet be not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention should be as the criterion with the scope that claims of the present invention were defined.
Claims (23)
1, a kind of piezoelectric ink jet head includes:
One silicon base, this silicon base include a macroscopic void at least;
One photoresist layer is filled in the macroscopic void of this silicon base, and includes a plurality of isolated little grooves in this photoresist layer, and this little groove is used as a pressure chamber;
One adhesion coating covers on the surface of this silicon base, this photoresist layer and this little groove, is used as the barrier layer of this little groove molding manufacture procedure; And
One silicon layer is formed on this adhesion coating surface, is used as a vibrations layer of this piezoelectric ink jet head.
2, piezoelectric ink jet head as claimed in claim 1, the thickness that it is characterized in that this silicon layer are 5～20 μ m.
3, piezoelectric ink jet head as claimed in claim 1, the little groove that it is characterized in that this photoresist layer is to be made with yellow light lithography or etching mode.
4, piezoelectric ink jet head as claimed in claim 1 is characterized in that the joint between this silicon base and this silicon layer is to adopt insulating barrier to cover silicon technology.
5, piezoelectric ink jet head as claimed in claim 1 is characterized in that this adhesion coating is made of the silica material.
6, piezoelectric ink jet head as claimed in claim 1 is characterized in that this adhesion coating is made of resin, phosphorosilicate glass, spin-coating glass or dry film.
7, piezoelectric ink jet head as claimed in claim 1 is characterized in that including a piezoceramics layer in addition, is formed on the surface of this silicon layer.
8, piezoelectric ink jet head as claimed in claim 1 is characterized in that the vibrations layer of this piezoelectric ink jet head and pressure chamber can be applied to bending-type and plug-type piezoelectric ink-jet head.
9, a kind of method of forming of pressure chamber of piezoelectric ink jet head includes the following step:
One first silicon is provided, and this first silicon includes a macroscopic void at least;
Form a photoresist layer, be filled in the macroscopic void of this first silicon; And
Carry out yellow light lithography or etch process, to form a plurality of isolated little grooves in this photoresist layer, then this little groove is used as a pressure chamber.
10, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 9, the preparation method that it is characterized in that the macroscopic void of this first silicon are to adopt wet etch process or dry-etching processing procedure.
11, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 9 is characterized in that the vibrations layer of this piezoelectric ink jet head and pressure chamber can be applied to bending-type and plug-type piezoelectric ink-jet head.
12, a kind of method of forming of pressure chamber of piezoelectric ink jet head includes the following step:
One first silicon is provided, and this first silicon includes a macroscopic void at least;
One second silicon is provided;
Carry out oxidation process,, and on this second silicon surface, form one second silicon oxide layer with formation one first silicon oxide layer on this first silicon surface;
Carry out the chip adhesive technology, this second silicon is engaged with this first silicon, and first silicon oxide layer and second silicon oxide layer that are located between this first silicon and this second silicon become an adhesion coating;
Grind processing procedure, so that this second silicon remained on surface, one silicon layer;
On this silicon surface, form a piezoceramics layer;
Form a photoresist layer, be filled in the macroscopic void of this first silicon; And
Carry out yellow light lithography or etch process, and with this adhesion coating as a barrier layer, to form a plurality of isolated little grooves in this photoresist layer, then this little groove is used as a pressure chamber.
13, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 12, the preparation method that it is characterized in that the macroscopic void of this first silicon are to adopt wet etch process or dry-etching processing procedure.
14, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 12 is characterized in that this chip adhesive technology is to adopt insulating barrier to cover silicon technology, includes the following step:
The solvent of one hydrogen bonds is provided on the composition surface of this first silicon and this second silicon; And
Carry out contraposition, the pressing technology of chip, the bottom of this second silicon is pressed together on downwards on the surface of this first silicon.
15, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 12 is characterized in that this grinding processing procedure is to adopt chemical and mechanical grinding method.
16, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 12 is characterized in that including a step in addition: grind processing procedure, make the thickness of this first silicon reach the desired depth of this pressure chamber.
17, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 12, the thickness that it is characterized in that this silicon layer are 5～20 μ m.
18, a kind of method of forming of pressure chamber of piezoelectric ink jet head includes the following step:
One first silicon is provided, and this first silicon includes a macroscopic void at least;
One second silicon is provided;
Provide an adhesive, on this first silicon surface and this second silicon surface, to form an adhesion coating;
This second silicon is engaged with this first silicon;
Grind processing procedure, so that this second silicon remained on surface, one silicon layer;
On this silicon surface, form a piezoceramics layer;
Form a photoresist layer, be filled in the macroscopic void of this first silicon; And
Carry out yellow light lithography or etch process, and with this adhesion coating as a barrier layer, to form a plurality of isolated little grooves in this photoresist layer, then this little groove is used as a pressure chamber.
19, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 18 is characterized in that the preparation method system of the macroscopic void of this first silicon adopts wet etch process or dry-etching processing procedure.
20, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 18 is characterized in that this grinding processing procedure is to adopt chemical and mechanical grinding method.
21, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 18 is characterized in that this method includes a step in addition: grind processing procedure, make the thickness of this first silicon reach the desired depth of this pressure chamber.
22, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 18, the thickness that it is characterized in that this silicon layer are 5～20 μ m.
23, the method for forming of the pressure chamber of piezoelectric ink jet head as claimed in claim 18 is characterized in that this adhesion coating is made of resin, phosphorosilicate glass, spin-coating glass or dry film.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021473471A CN1490160A (en) | 2002-10-16 | 2002-10-16 | Piezo ink-jet head and pressure cavity shaping method |
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|---|---|---|---|
| CNA021473471A CN1490160A (en) | 2002-10-16 | 2002-10-16 | Piezo ink-jet head and pressure cavity shaping method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441990A (en) * | 2013-09-23 | 2015-03-25 | 珠海纳思达企业管理有限公司 | Liquid jet device and manufacturing method thereof |
| CN105939855A (en) * | 2014-01-28 | 2016-09-14 | 惠普发展公司，有限责任合伙企业 | Printbars and methods of forming printbars |
| CN111016434A (en) * | 2019-12-25 | 2020-04-17 | 西安交通大学 | Thin film type ink-jet printing head based on extrusion mode |
-
2002
- 2002-10-16 CN CNA021473471A patent/CN1490160A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441990A (en) * | 2013-09-23 | 2015-03-25 | 珠海纳思达企业管理有限公司 | Liquid jet device and manufacturing method thereof |
| CN104441990B (en) * | 2013-09-23 | 2016-03-02 | 珠海赛纳打印科技股份有限公司 | Liquid injection apparatus and manufacture method thereof |
| CN105939855A (en) * | 2014-01-28 | 2016-09-14 | 惠普发展公司，有限责任合伙企业 | Printbars and methods of forming printbars |
| CN105939855B (en) * | 2014-01-28 | 2017-09-05 | 惠普发展公司，有限责任合伙企业 | Print bar and the method for forming print bar |
| US10226926B2 (en) | 2014-01-28 | 2019-03-12 | Hewlett-Packard Development Company, L.P. | Printbars and methods of forming printbars |
| US10421274B2 (en) | 2014-01-28 | 2019-09-24 | Hewlett-Packard Devleopment Company. L.P. | Printbars and methods of forming printbars |
| US10780696B2 (en) | 2014-01-28 | 2020-09-22 | Hewlett-Packard Development Company, L.P. | Printbars and methods of forming printbars |
| CN111016434A (en) * | 2019-12-25 | 2020-04-17 | 西安交通大学 | Thin film type ink-jet printing head based on extrusion mode |
| CN111016434B (en) * | 2019-12-25 | 2021-07-27 | 西安交通大学 | Thin film type ink-jet printing head based on extrusion mode |
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