CN1515411A - Piezoelectric ink-jet head ink-cavity structure and its manufacture method - Google Patents
Piezoelectric ink-jet head ink-cavity structure and its manufacture method Download PDFInfo
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- CN1515411A CN1515411A CNA031009484A CN03100948A CN1515411A CN 1515411 A CN1515411 A CN 1515411A CN A031009484 A CNA031009484 A CN A031009484A CN 03100948 A CN03100948 A CN 03100948A CN 1515411 A CN1515411 A CN 1515411A
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- inking chamber
- jet head
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Abstract
The present invention relates to an ink-cavity structure for piezoelectric ink gun and its production method. The structure includes a base plate; a recessed groove formed on the above-mentioned base plate, the sectional area of its opening is greater than the sectional area of its bottom portion, it can be used as ink cavity; a vibration layer formed on the opening of the above-mentioned recessed groove and a piezoelectric component formed on the above-mentioned vibration layer.
Description
Technical field
The present invention relates to structure of a kind of piezoelectric ink jet head inking chamber and preparation method thereof, particularly relate to a kind of can amplification piezoelectric the structure and preparation method thereof of the assembly inking chamber of being exerted pressure.
Background technology
In the main product of computer printout equipment, the printing technique of ink-jet printer is the micro-ink droplets of precise volumes to be driven with computer numerical apace be positioned over accurate ad-hoc location, high-resolution, the output of full-color picture not only can be provided, also can satisfy the electronics industry manufacturing technology to automation, microminiaturization, reduce cost, reduce time-histories, reduce the requirement and the trend of the impact etc. of environment.
The piezoelectric ink jet technology is that a kind of its principle is to utilize piezoelectric ceramics because of applying the deformation that voltage produces by business-like ink-jet technology successfully, makes the inking chamber distortion, causes producing in the inking chamber pressure, extruding intracavity liquid and liquid is sprayed.The 1st figure is a flexure type piezoelectric ink-jet head, and it shows a representational piezoelectric deforming mechanism.
Shown in the 1st figure, this piezoelectric ink-jet head is made up of a piezoelectric ceramic piece (piezoceramic) 10, vibrating reed (diaphragm) 11, pressure chamber (pressure chamber) 12, inlet (inlet) 13, pipeline (manifold) 14 and 15 at nozzle (orifice).When piezoelectric ceramic piece 10 is accepted the voltage that control circuit 16 is applied, produce distortion, but be subjected to pining down of vibrating reed 11, thereby form the liquid in lateral thrust squeeze pressure cabin 12.At the liquid at nozzle 15 places because of bearing the accelerated motion of external and internal pressure difference, the outstanding liquid level that formation speed is cumulative.Though the voltage that acts on piezoelectric ceramic piece 10 thereafter discharges between in due course, fluid pressure descends, and nozzle 15 place's drops are still because of the inertia cause, overcomes capillary impeding and breaks away from.
The method for making of inking chamber is carried by among the 10-286955 " ink-jet printer ink gun and manufacture method thereof " as Japanese patent publication, can directly make inking chamber with lithography manufacturing process on silicon substrate, and its preparation method is shown in the 2a～2f figure.At first, shown in 2a figure, provide a silicon substrate 20, and lower surface forms heat oxide film 22 respectively thereon, surperficial thereon more afterwards heat oxide film 22 tops form common electrode 23, piezoelectric patches 24 and top electrode 25 in regular turn.
Then, shown in 2b figure, above top electrode 25, form a photoresist layer 26, and utilize light shield with photoresist layer 26 according to the predetermined pattern exposure imaging, with its patterning in addition.
Then, shown in 2c figure, with photoresist layer 26 as cover curtain, with top electrode 25 and piezoelectric patches 24 in addition after the etching, stripping resistance layer 26, piezoelectric element 27.
Then, shown in 2d figure,, form photoresist layer 28 forming the opposite sides of piezoelectric element 27, and utilize light shield with photoresist layer 28 according to the predetermined pattern exposure imaging, with its patterning in addition.
Then, shown in 2e figure, as cover curtain, with silicon substrate 20 in addition after the etching, stripping resistance layer 28 forms the ink head board of inking chamber 29 grades with wet etching manufacturing process with photoresist layer 28.
At last, shown in 2f figure, the position in corresponding ink pressure chamber 29, the spray nozzle sheet 31 that will have a nozzle 30 utilizes mode such as adhesive agent and ink head board connects and, and form ink gun.
Yet run into following point in the above-mentioned manufacturing process: in the process of etching silicon substrate 20, if consider the cost of the convenience and the production cost of manufacturing process, and the comparatively cheap wet etching mode of use cost, then because the crystal structure of silicon itself is (100) direction, reduce making its sectional area of inking chamber 29 grooves that obtains after the etching increase with etch depth, also be that its wall portion 32 can't be vertically and bottom portion of groove 33, form the angle of inclination.Because it makes that toward the sectional area that the nozzle direction enlarges the spacing between the nozzle must widen, when pursuing the resolution ratio that improves inkjet performance, this is quite disadvantageous shortcoming.Another shortcoming that causes of this phenomenon is: inking chamber 29 covers spray nozzle sheet 31 and finishes ink gun via follow-up manufacturing process after, because the sectional area that it enlarges toward nozzle 30 directions, to make piezoelectric element 27 activate the pressure that bestow inking chamber 29 back, can't effectively be passed to nozzle 30 positions by having the long-pending bottom portion of groove 33 of small cross sections.
For the silicon avoiding above-mentioned phenomenon to take place, improve one's methods selecting particular crystal plane as substrate, as have the silicon of (110) crystal face, but still formation that can't be comprehensive is perpendicular to the wall of bottom portion of groove.Other method is carried out etching manufacturing process for using the dry ecthing mode instead, yet uses the required production cost of dry ecthing manufacturing process but up to about 20～30 times of wet etching mode.
In view of this, in order effectively to address the above problem, need exploitation a kind of new inking chamber structure and manufacturing process thereof badly, piezoelectric element can not only be exerted pressure is applied to jet orifice with enlarging, and can reach the purposes such as integration that reduce cost of manufacture and improve spray orifice.
Summary of the invention
Main purpose of the present invention is to propose a kind of piezoelectric ink jet head inking chamber structure and preparation method thereof.It can not only be exerted pressure piezoelectric element and be applied to jet orifice enlargedly, and can reach the purposes such as integration that reduce cost of manufacture and improve spray orifice.
The present invention proposes a kind of piezoelectric ink jet head inking chamber structure, includes a substrate; One groove is formed on the aforesaid substrate, and the sectional area of its opening is greater than the sectional area of its bottom, in order to provide as an inking chamber; One vibration level is to be formed on the opening of above-mentioned groove; And a piezoelectric element, be to be formed on the above-mentioned vibration level.
According to said structure, of the present invention one is characterised in that, formed inking chamber has the geometric space that a sectional area varies in size, and this sectional area is bigger near piezoelectric element one end, and in that to connect spray nozzle sheet one end less.This is the geometric space of vertebra shape, because the sectional area that it dwindles toward the nozzle direction, to make piezoelectric element activate the pressure that bestow inking chamber the back, by top with larger sectional area, effectively and be passed to the nozzle position with enlarging, the bigger pressure of ink in the inking chamber is provided, and it is sprayed by nozzle.
According to said structure, an advantage of the present invention is, because inking chamber is the geometric space of vertebra shape, be contracted to connection spray nozzle sheet one end by connecting piezoelectric element one end, and owing to effectively enlarge the pressure that piezoelectric element is bestowed ink droplet, thus the required sectional area of inking chamber can reduce, and when designing ink gun, can improve the integration of spray orifice, and help to promote resolution ratio.
Another feature of the present invention is, can use the mode of wet etching silicon to make inking chamber, and the piezoelectric ink jet head inking chamber structure that not only can finish the present invention easily and carried also can be kept low production cost, meets business-like a large amount of production demand.
Description of drawings
The 1st figure shows the generalized section of existing a kind of piezoelectric ink-jet head.
2a to 2f figure shows the generalized section of the making flow process of existing a kind of piezoelectric ink-jet head.
3a to 3d figure shows the making flow process generalized section of the piezoelectric ink-jet head of the embodiment of the invention.
The specific embodiment
The present invention proposes a kind of piezoelectric ink jet head inking chamber structure and preparation method thereof, and it can not only be exerted pressure piezoelectric element and be applied to jet orifice with enlarging, and can reach the purposes such as integration that reduce cost of manufacture and improve spray orifice.Quantity, arrangement mode and size as for spray orifice are to belong to select design, and embodiments of the invention are not limited.In addition, the making of the ink-jet groove of relevant print head chip can be carried out before making the ink-jet chamber, or carry out after the ink-jet chamber pattern that completes.It below is piezoelectric ink jet head inking chamber structure to illustrate the present invention's proposition and preparation method thereof.
See also the 3a～3d figure, it shows piezoelectric ink jet head inking chamber of the present invention, and it makes the generalized section of flow process.
At first, shown in 3a figure, provide a silicon substrate 20, as be the Silicon Wafer of a crystalline texture for (100) or (110) direction.
Then, shown in 3b figure, form a photoresist layer 26 in silicon substrate 20 surface below.
Then, shown in 3c figure, with photoresist layer 26 as cover curtain, with as modes such as wet etching with silicon substrate 20 from lower to upper in addition behind the eating thrown, stripping resistance layer 26, formation inking chamber 29.And because silicon has the crystal plane structure of (100), so formed inking chamber after the etching, it has a geometric space that is the vertebra shape, its sectional area by top one end toward lower end expansion.
Then, shown in 3d figure,, carry out the applying of vibrating reed 21 in silicon substrate 20 surface below.Vibrating reed 21 can be Silicon Wafer, sheet metal, or potsherd, selects Silicon Wafer for use at this.The wafer laminating type can adopt the high-temperature pressurizing mode, at first at silicon substrate 20 surface coating hydrogen bonds solvents, uses to help the fixed position, back of fitting, utilize again afterwards pressure with silicon substrate 20 with fitted as the Silicon Wafer 21 of vibrating reed.Also can adopt in addition solid with silicon substrate 20 with fitted as the Silicon Wafer 21 of vibrating reed, employed solid is preferably inorganic serial solid, as the glass material (silicate) of inorganic series such as phosphorus glass, boron glass, the high temperature during in order to the opposing sintering.Then the above-mentioned Silicon Wafer 21 of thinning to thickness is about 5～20 μ m, in order to as vibrating reed 21.Afterwards again on vibrating reed 21, the top position of corresponding each inking chamber 29 makes piezoelectric element 27: form common electrode 23, piezoelectric patches 24 and top electrode 25 in regular turn, the material of piezoelectric patches can be plumbous zirconates-titanate (PZT), at last via sintering to form piezoelectric ceramics.
Piezoelectric ink jet head inking chamber than prior art, piezoelectric ink jet head inking chamber by the present invention's proposition, because its inking chamber is the geometric space of vertebra shape, be contracted to connection spray nozzle sheet one end by connecting piezoelectric element one end, can effectively enlarge the pressure that piezoelectric element is bestowed ink droplet, thus the required sectional area of inking chamber can reduce, and in design during ink gun, can improve the integration of spray orifice, and help to promote resolution ratio.
And owing to can use the mode of wet etching silicon to make inking chamber, the piezoelectric ink jet head inking chamber structure that not only can finish the present invention easily and carried also can be kept low production cost, meets business-like a large amount of production demand.
Though preferred embodiment of the present invention as mentioned above; but be not that any workman who has the knack of correlation technique is not in departing from the scope of the present invention in order to qualification the present invention; can do some and change and modify, therefore scope of patent protection of the present invention is as the criterion with claims of the present invention.
Description of reference numerals
10 piezoelectric ceramic pieces, 24 piezoelectric patches
11 vibrating reeds, 25 top electrodes
12 pressure chambers, 26 photoresist layers
13 inlets, 27 piezoelectric elements
14 pipelines, 28 photoresist layers
15 nozzles, 29 inking chambers
16 control circuits, 30 nozzles
20 silicon substrates, 31 spray nozzle sheets
21 vibrating reeds, 32 groove walls portions
22 heat oxide films, 33 bottom portion of groove
23 common electrodes
Claims (10)
1, a kind of piezoelectric ink jet head inking chamber structure is characterized in that, includes:
One substrate;
One groove is formed on the aforesaid substrate, and the sectional area of its opening is greater than the sectional area of its bottom, in order to provide as an inking chamber;
One vibration level is to be formed on the opening of above-mentioned groove; And
One piezoelectric element is to be formed on the above-mentioned vibration level.
2, piezoelectric ink jet head inking chamber structure as claimed in claim 1, it is further characterized in that described groove forms with the wet etching mode.
3, piezoelectric ink jet head inking chamber structure as claimed in claim 1, it is further characterized in that described vibration level is Silicon Wafer, sheet metal or potsherd.
4, piezoelectric ink jet head inking chamber structure as claimed in claim 1, it is further characterized in that described vibration level is to utilize wafer (wafer-bonding) mode of fitting to be formed on the opening of described groove.
5, piezoelectric ink jet head inking chamber structure as claimed in claim 1, it is further characterized in that the piezoceramic material of described piezoelectric element is plumbous zirconates-titanate (PZT).
6, a kind of preparation method of piezoelectric ink jet head inking chamber is characterized in that, comprises the following steps:
One substrate is provided;
Form a groove on the surface of this substrate, in order to provide as an inking chamber, wherein this groove has an opening and a bottom, and the sectional area of this opening is greater than the sectional area of this bottom;
On the opening of above-mentioned groove, form a vibration level; And
On above-mentioned vibration level, form a piezoelectric element.
7, the preparation method of piezoelectric ink jet head inking chamber as claimed in claim 6, it is further characterized in that described groove forms with the wet etching mode.
8, the preparation method of piezoelectric ink jet head inking chamber as claimed in claim 6, it is further characterized in that described vibration level is Silicon Wafer, sheet metal or potsherd.
9, the preparation method of piezoelectric ink jet head inking chamber as claimed in claim 6, it is further characterized in that described vibration level is to utilize wafer (wafer-bonding) mode of fitting to be formed on the opening of described groove.
10, the preparation method of piezoelectric ink jet head inking chamber as claimed in claim 6, it is further characterized in that the piezoceramic material of described piezoelectric element is plumbous zirconates-titanate (PZT).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031009484A CN1515411A (en) | 2003-01-07 | 2003-01-07 | Piezoelectric ink-jet head ink-cavity structure and its manufacture method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031009484A CN1515411A (en) | 2003-01-07 | 2003-01-07 | Piezoelectric ink-jet head ink-cavity structure and its manufacture method |
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| CN1515411A true CN1515411A (en) | 2004-07-28 |
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| CNA031009484A Pending CN1515411A (en) | 2003-01-07 | 2003-01-07 | Piezoelectric ink-jet head ink-cavity structure and its manufacture method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101218101B (en) * | 2005-07-07 | 2010-07-21 | Xaap科技有限公司 | Droplet deposition method and apparatus |
| CN106238256A (en) * | 2016-09-30 | 2016-12-21 | 中国地质大学（北京） | Automatic ink-jet toning system and painting methods for 3D printer model post processing |
| CN107344453A (en) * | 2016-05-06 | 2017-11-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of piezoelectric ink jet printing equipment and preparation method thereof |
| JP2018199292A (en) * | 2017-05-29 | 2018-12-20 | セイコーエプソン株式会社 | Piezoelectric device, liquid discharge head, liquid discharge device |
| JP2018199293A (en) * | 2017-05-29 | 2018-12-20 | セイコーエプソン株式会社 | Piezoelectric device, liquid discharge head, liquid discharge device |
| CN112379032A (en) * | 2020-10-26 | 2021-02-19 | 安徽皖仪科技股份有限公司 | Automatic sample injector, liquid chromatograph and sample injection method of liquid chromatograph |
-
2003
- 2003-01-07 CN CNA031009484A patent/CN1515411A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101218101B (en) * | 2005-07-07 | 2010-07-21 | Xaap科技有限公司 | Droplet deposition method and apparatus |
| CN107344453A (en) * | 2016-05-06 | 2017-11-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of piezoelectric ink jet printing equipment and preparation method thereof |
| CN106238256A (en) * | 2016-09-30 | 2016-12-21 | 中国地质大学（北京） | Automatic ink-jet toning system and painting methods for 3D printer model post processing |
| JP2018199292A (en) * | 2017-05-29 | 2018-12-20 | セイコーエプソン株式会社 | Piezoelectric device, liquid discharge head, liquid discharge device |
| JP2018199293A (en) * | 2017-05-29 | 2018-12-20 | セイコーエプソン株式会社 | Piezoelectric device, liquid discharge head, liquid discharge device |
| CN112379032A (en) * | 2020-10-26 | 2021-02-19 | 安徽皖仪科技股份有限公司 | Automatic sample injector, liquid chromatograph and sample injection method of liquid chromatograph |
| CN112379032B (en) * | 2020-10-26 | 2022-10-28 | 安徽皖仪科技股份有限公司 | Automatic sample injector, liquid chromatograph and sample injection method of liquid chromatograph |
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